With Registration Indicia (e.g., Scale) Patents (Class 356/401)
  • Patent number: 11422476
    Abstract: A method for monitoring a lithographic process, and associated lithographic apparatus. The method includes obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression through the height variation data, the regression approximating the shape of the substrate; residual data between the height variation data and the regression is determined; and variation of the residual data is monitored over time. The residual data may be deconvolved based on known features of the substrate support.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: August 23, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Emil Peter Schmitt-Weaver, Kaustuve Bhattacharyya, Wim Tjibbo Tel, Frank Staals, Leon Martin Levasier
  • Patent number: 11409206
    Abstract: A method of determining a position of a feature (for example an alignment mark) on an object (for example a silicon wafer) is disclosed. The method comprises determining an offset parameter, determining the second position; and determining a first position from the second position and the offset parameter, the position of the mark being the first position. The offset parameter is a measure of a difference in: a first position that is indicative of the position of the feature; and a second position that is indicative of the position of the feature. The offset parameter may be determined using a first measurement apparatus and the second position may be determined using a second, different measurement apparatus.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: August 9, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Sebastianus Adrianus Goorden, Simon Reinald Huisman
  • Patent number: 11404296
    Abstract: Embodiments disclosed herein include a method of determining the position of a sensor wafer relative to a pedestal. In an embodiment, the method comprises placing a sensor wafer onto the pedestal, wherein the sensor wafer comprises a first surface that is supported by the pedestal, a second surface opposite the first surface, and an edge surface connecting the first surface to the second surface, wherein a plurality of sensor regions are formed on the edge surface, and wherein the pedestal comprises a major surface and an annular wall surrounding the sensor wafer. In an embodiment, the method further comprises determining a gap distance between each of the plurality of sensor regions and the annular wall. In an embodiment, the method may further comprise determining a center-point offset of a center-point of the sensor wafer relative to a center point of the annular wall from the gap distances.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: August 2, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Charles G. Potter, Anthony D. Vaughan
  • Patent number: 11378394
    Abstract: A metrology target is disclosed, in accordance with one or more embodiments of the present disclosure. The metrology target includes a first set of pattern elements having a first pitch, where the first set of pattern elements includes segmented pattern elements. The metrology target includes a second set of pattern elements having a second pitch, where the second set of pattern elements includes segmented pattern elements. The metrology target includes a third set of pattern elements having a third pitch, where the third set of pattern elements includes segmented pattern elements.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: July 5, 2022
    Assignee: KLA Corporation
    Inventors: Yuri Paskover, Itay Gdor, Yuval Lubashevksy, Vladimir Levinski, Alexander Volfman, Yoram Uziel
  • Patent number: 11372342
    Abstract: Provided is a position measurement apparatus in which a measurement error in a target is reduced. A position measurement apparatus measuring a position of a target includes an illumination unit configured to illuminate the target with illumination light including light of a first wavelength and light of a second wavelength different from the first wavelength, a measurement unit configured to measure the position of the target by detecting light from the target illuminated with the illumination light, and a control unit configured to adjust a ratio of a light intensity of the first wavelength to a light intensity of the second wavelength such that a measurement error varying depending on the position of the target in the measurement unit is reduced.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: June 28, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Toshiki Iwai, Takamitsu Komaki, Tomokazu Taki
  • Patent number: 11360397
    Abstract: An image-based overlay metrology system is disclosed. The system includes a controller couplable to a metrology sub-system. The controller is configured to receive a set of image signals of a first metrology target disposed on the sample from the metrology sub-system and determine a plurality of harmonic detectivity metric values by calculating a harmonic detectivity metric value for each of the plurality of image signals. The controller is also configured to identify a set of optical measurement conditions of the metrology sub-system based on the plurality of harmonic detectivity metric values, wherein the set of optical measurement conditions define a recipe for optical metrology measurements of the metrology sub-system. The controller then provides the recipe to the metrology sub-system for execution of one or more optical metrology measurements of one or more additional metrology targets.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: June 14, 2022
    Assignee: KLA Corporation
    Inventors: Gil Drachuck, Tom Leviant, David Gready
  • Patent number: 11307024
    Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: April 19, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Henricus Petrus Maria Pellemans, Arie Jeffrey Den Boef
  • Patent number: 11300405
    Abstract: An overlay metrology system may include, an illumination sub-system, a collection sub-system and a controller. The illumination sub-system may include one or more illumination optics configured to direct an illumination beam to an overlay target on a sample as the sample is scanned along a stage-scan direction by a translation stage, where the overlay target includes one or more cells having a grating-over-grating structure with periodicity along the stage-scan direction. The collection sub-system may include an objective lens, a first photodetector located in a pupil plane at a location of overlap between 0-order diffraction and +1-order diffraction, and a second photodetector located in a pupil plane at a location of overlap between 0-order diffraction and ?1-order diffraction. The controller may receive time-varying interference signals from the first and second photodetectors and determine an overlay error between the first and second layers of the sample along the stage-scan direction.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: April 12, 2022
    Assignee: KLA Corporation
    Inventors: Amnon Manassen, Andrew V. Hill
  • Patent number: 11281111
    Abstract: Metrology methods and tools are provided, which enhance the accuracy of the measurements and enable simplification of the measurement process as well as improving the correspondence between the metrology targets and the semiconductor devices. Methods comprise illuminating the target in a Littrow configuration to yield a first measurement signal comprising a ?1st diffraction order and a 0th diffraction order and a second measurement signal comprising a +1st distraction order and a 0th diffraction order, wherein the ?1st diffraction order of the first measurement signal and the +1st diffraction order of the second measurement signal are diffracted at 180° to a direction of the illumination, performing a first measurement of the first measurement signal and a second measurement of the second measurement signal, and deriving metrology metric(s) therefrom. Optionally, a reflected 0th diffraction order may be split to yield components which interact with the ?1st and +1st diffraction orders.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: March 22, 2022
    Assignee: KLA-TENCOR CORPORATION
    Inventors: Yoni Shalibo, Yuri Paskover, Vladimir Levinski, Amnon Manassen, Shlomo Eisenbach, Gilad Laredo, Ariel Hildesheim
  • Patent number: 11249401
    Abstract: A position detection apparatus configured to detect a pattern including a plurality of pattern elements formed on an object includes a control unit configured to detect the pattern by performing pattern matching between a template including a plurality of feature points and the plurality of pattern elements. While, performing pattern matching, the control unit changes positions of the plurality of feature points such that a correlation between an image and the template is within a predetermined allowable range.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 15, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventor: Genki Murayama
  • Patent number: 11222851
    Abstract: A back alignment mark on a surface of a semiconductor substrate is detected and a resist mask patterned into a circuit pattern corresponding to a surface element structure is formed on a back of the semiconductor substrate. Detection of the back alignment mark is performed by using a detector opposing the back of the semiconductor substrate and measuring contrast based on the intensity of reflected infrared light irradiated from the back of the semiconductor substrate. The back alignment mark is configured by a step formed by the surface of the semiconductor substrate and bottoms of trenches formed from the surface of the semiconductor substrate. A polysilicon film is embedded in the trenches. The back alignment mark has, for example, a cross-shaped planar layout in which three or more trenches are disposed in a direction parallel to the surface of the semiconductor substrate.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: January 11, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Naoko Kodama
  • Patent number: 11187883
    Abstract: An acquiring unit of a structured illuminating microscopy apparatus acquires at least two modulated images having the same wave number vector and the different phases; and a calculating unit of the structured illuminating microscopy apparatus, in a spatial frequency spectrum of each of at least the two modulated images acquired by the acquiring unit, separates a 0th-order modulating component and ±first-order modulating components of observational light fluxes superimposed on arbitrary two observation points based on at least four observation values regarding the two observation points which are mutually displaced by an amount of the wave number vector.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 30, 2021
    Assignee: NIKON CORPORATION
    Inventors: Hiroshi Ohki, Tomoya Noda, Yosuke Okudaira
  • Patent number: 11175489
    Abstract: The present invention provides a method for performing high dynamic range low inter-pixel spatial and wavelength crosstalk optical image detection in a camera comprising an Optical Array Device (OAD), a point Photo Detector (PD) and a Photo Detector Array (PDA) sensor. The method comprises imaging incident light from an object onto an image plane of the Optical Array Device (OAD) to form an incident image map; selecting by the OAD and the Point Photo Detector and by the OAD and the Photo Detector Array a plurality of pixels on the incident image map for time-frequency coding; time-frequency coding the selected pixels by the OAD; detecting by the point PD the optical irradiance values of the time-frequency coded pixels output from the OAD; and performing signal processing on the detected optical irradiance values to determine the light intensity of each of the selected pixels.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: November 16, 2021
    Assignee: University College Cork—National University of Ireland, Cork
    Inventor: Nabeel Riza
  • Patent number: 11137695
    Abstract: Method of measuring a height profile of one or more substrates is provided comprising measuring a first height profile of one or more fields on a substrate using a first sensor arrangement, the first height profile being the sum of a first interfield part and a first intrafield part, measuring a second height profile of one or more further fields on the substrate or on a further substrate using a second sensor arrangement, the second height profile being the sum of a second interfield part and a second intrafield part, determining from the measurements with the first sensor arrangement an average first intrafield part, and determining the height profile of the further fields from the second interfield part and the average first intrafield part thereby correcting the measurements of the second sensor arrangement.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: October 5, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Arend Johannes Donkerbroek, Jeroen Cottaar, Thomas Theeuwes, Erik Johan Koop
  • Patent number: 11104160
    Abstract: A printing device is provided comprising a camera to capture an image of at least a portion of a print substrate; a controller to determine a location of a portion of a side edge of the substrate from the image to determine a distance of the print substrate from a predetermined location; and adjustment apparatus to adjust the entire substrate laterally, relative to the direction of transport of the substrate, based on the determined location.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 31, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander Paker, Jonathan Nir, Hagay Shkalim, Eitan Kichli, Vladimir Feygelman, Shraga Friedman
  • Patent number: 11094643
    Abstract: Methods, apparatuses, and systems related to determining overlay of features of a memory array are described. An example method includes forming a plurality of contacts on a working surface and selectively forming a first portion of a layer of conductive lines and a second portion of the layer of conductive lines in contact with the contacts. The first portion of the layer of conductive lines formed over the working surface is separated from the second portion of the layer of conductive lines formed over the working surface by a gap. The method includes determining an overlay of at least one of the contacts formed over the working surface in the gap relative to one of the conductive lines formed over the working surface.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: August 17, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Kendall Smith, Kari McLaughlin, Mario J. Di Cino, Xue Chen, Lane A. Gray, Joseph G. Lindsey
  • Patent number: 11079689
    Abstract: A display device including: a substrate having display area and a non-display area; and an alignment mark disposed in the non-display area of the substrate. The alignment mark includes a quadrangular-shaped center portion and a plurality of measurement portions that surround the center portion, the plurality of measurement portions including four or more measurement portions, and each of the measurement portions including sides that are parallel with two sides of the quadrangular-shaped center portion.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: August 3, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Wook Lee, Soon Wook Hong, Seung Rae Kim, Jae-Hyun Park, Min cheol Chae
  • Patent number: 11073487
    Abstract: Methods and systems for positioning a specimen and characterizing an x-ray beam incident onto the specimen in a Transmission, Small-Angle X-ray Scatterometry (T-SAXS) metrology system are described herein. A specimen positioning system locates a wafer vertically and actively positions the wafer in six degrees of freedom with respect to the x-ray illumination beam without attenuating the transmitted radiation. In some embodiments, a cylindrically shaped occlusion element is scanned across the illumination beam while the detected intensity of the transmitted flux is measured to precisely locate the beam center. In some other embodiments, a periodic calibration target is employed to precisely locate the beam center. The periodic calibration target includes one or more spatially defined zones having different periodic structures that diffract X-ray illumination light into distinct, measurable diffraction patterns.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 27, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: Alexander Bykanov, Nikolay Artemiev, Joseph A. Di Regolo, Antonio Gellineau, Alexander Kuznetsov, Andrei Veldman, John Hench
  • Patent number: 11067904
    Abstract: Metrology targets, design files, and design and production methods thereof are provided. The targets comprise two or more parallel periodic structures at respective layers, wherein a predetermined offset is introduced between the periodic structures, for example, opposite offsets at different parts of a target. Quality metrics are designed to estimate the unintentional overlay from measurements of a same metrology parameter by two or more alternative measurement algorithms. Target parameters are configured to enable both imaging and scatterometry measurements and enhance the metrology measurements by the use of both methods on the same targets. Imaging and scatterometry target parts may share elements or have common element dimensions. Imaging and scatterometry target parts may be combined into a single target area or may be integrated into a hybrid target using a specified geometric arrangement.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: July 20, 2021
    Assignee: KLA Corporation
    Inventors: Eran Amit, Raviv Yohanan
  • Patent number: 11054741
    Abstract: An imprint apparatus performs an imprint process by bringing a mold into contact with an imprint material arranged on a shot region of a substrate and curing the imprint material. The apparatus includes a controller configured to execute, in a case where an elapsed time from the supplying of the imprint material to the shot region until the contact with the mold falls outside an allowable range of a predetermined elapsed time, adjustment processing of adjusting an amount of the imprint material on the shot region at the timing of the contact.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: July 6, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shinichi Hirano
  • Patent number: 11022900
    Abstract: Disclosed is an inspection apparatus for use in lithography. It comprises a support for a substrate carrying a plurality of metrology targets; an optical system for illuminating the targets under predetermined illumination conditions and for detecting predetermined portions of radiation diffracted by the targets under the illumination conditions; a processor arranged to calculate from said detected portions of diffracted radiation a measurement of asymmetry for a specific target; and a controller for causing the optical system and processor to measure asymmetry in at least two of said targets which have different known components of positional offset between structures and smaller sub-structures within a layer on the substrate and calculate from the results of said asymmetry measurements a measurement of a performance parameter of the lithographic process for structures of said smaller size. Also disclosed are substrates provided with a plurality of novel metrology targets formed by a lithographic process.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: June 1, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Simon Gijsbert Josephus Mathijssen, Stefan Hunsche, Markus Gerardus Martinus Maria Van Kraaij
  • Patent number: 11016234
    Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electrophoretic display sub-assembly for rendering content, a front light sub-assembly comprising a light guide, a light FPC, and a plurality of light sources, and a capacitive touch sensing sub-assembly for detecting touch inputs. A yellow-pigmented tape is applied over the light sources and an edge of the light guide. A stiffener member is coupled to the light FPC opposite the yellow-pigmented tape.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: May 25, 2021
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Siddharth Gupta, Jerry Yee-Ming Chung, Hany Mounir Ghali, Robert L. D. Zenner, Juho Ilkka Jalava, Sherman Shwe Win Tan
  • Patent number: 10996050
    Abstract: Provided are an apparatus and a method for measuring a three dimensional shape with improved accuracy. The apparatus includes a stage, at least one lighting unit, a plurality of image pickup units and a control unit. The stage supports an object to be measured. The lighting unit includes a light source and a grid, and radiates grid-patterned light to the object to be measured. The image pickup units capture, in different directions, grid images reflected from the object to be measured. The control unit calculates a three dimensional shape of the object from the grid images captured by the image pickup units. The present invention has advantages in capturing grid images through a main image pickup portion and sub-image pickup portions, enabling the measurement of the three dimensional shape of the object in a rapid and accurate manner.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: May 4, 2021
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Seung-Jun Lee, Kwangill Koh, Moon-Young Jeon, Sang-Kyu Yun, Hong-Min Kim, Jung Hur
  • Patent number: 10996570
    Abstract: A method of measuring overlay uses a plurality of asymmetry measurements from locations (LOI) on a pair of sub-targets (1032, 1034) formed on a substrate (W). For each sub-target, the plurality of asymmetry measurements are fitted to at least one expected relationship (1502, 1504) between asymmetry and overlay, based on a known bias variation deigned into the sub-targets. Continuous bias variation in one example is provided by varying the pitch of top and bottom gratings (P1/P2). Bias variations between the sub-targets of the pair are equal and opposite (P2/P1). Overlay (OV) is calculated based on a relative shift (xs) between the fitted relationships for the two sub-targets. The step of fitting asymmetry measurements to at least one expected relationship includes wholly or partially discounting measurements (1506, 1508, 1510) that deviate from the expected relationship and/or fall outside a particular segment of the fitted relationship.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: May 4, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Zili Zhou, Nitesh Pandey, Olger Victor Zwier, Patrick Warnaar, Maurits Van Der Schaar, Elliott Gerard McNamara, Arie Jeffrey Den Boef, Paul Christiaan Hinnen, Murat Bozkurt, Joost Jeroen Ottens, Kaustuve Bhattacharyya, Michael Kubis
  • Patent number: 10983305
    Abstract: Methods, systems and devices for automatically focusing a microscope on a specimen and collecting a focused image of the specimen are provided. Aspects of the methods include detecting the presence of a substrate in a microscope, determining whether the substrate is in a correct orientation for imaging, focusing the microscope on a specimen that is placed on the substrate, and collecting one or more images of the specimen. Systems and devices for carrying out the subject methods are also provided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: April 20, 2021
    Assignee: Abbott Laboratories
    Inventors: Trevor David Shields, Robert John Fahey, Damian J. Verdnik, Svitlana Y. Berezhna, Mahmoud Janbakhsh, Koshy T. Chacko
  • Patent number: 10983143
    Abstract: A method of assembling a group of devices, the method comprising the steps of: evacuating a space between each component of a first group of two or more components on a source device and a transfer device thereby to create a temporary bond between each component of the first group of two or more components and the transfer device; selectively removing the first group of two or more components from the source device whilst the transfer device is temporarily bonded to each component of the first group of two or more components on the source device; positioning the first group of two or more components on a host device; and decoupling the first group of two or more components from the transfer device, thereby to form a first group of assembled devices.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: April 20, 2021
    Assignee: NU NANO LTD
    Inventor: James Vicary
  • Patent number: 10983528
    Abstract: An orientation system includes a base station comprising a light emitter that projects a pattern onto a projection surface of a space, an auxiliary station including an auxiliary emitter that projects an auxiliary pattern onto the projection surface, and a robot including a moveable base supporting an imaging device. The robot detects the pattern and the auxiliary pattern with the imaging device, and determines a location of the robot within the space based on the pattern.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: April 20, 2021
    Assignee: Toyota Research Institute, Inc.
    Inventors: Konstantine Mushegian, Matthew Amacker
  • Patent number: 10929145
    Abstract: Novel instructions, their format, and support thereof are described. For example, an instruction including a field for an opcode to indicate a reduction-based mask generation operation is to be performed, a field to identify a first packed data source operand, a field to identify a second packed data source operand, and a field to identify a destination operand to store reduction-based generated mask and its hardware support is described.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventor: Elmoustapha Ould-Ahmed-Vall
  • Patent number: 10915665
    Abstract: Position data may gradually pseudonymized by a method, comprising: generating a sequence of relative positions from a sequence of absolute positions of a moving object; randomizing the sequence of relative positions using at least a sequence of random numbers generated from at least one seed; in response to receiving an analytical job comprising the at least one seed, restoring the sequence of relative positions from the randomized sequence of relative positions; and in response to receiving an analytical job comprising both the at least one seed and at least one absolute position derived from the sequence of absolute positions, restoring the sequence of absolute positions from the randomized sequence of relative positions.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yasutaka Nishimura, Mari Abe Fukuda, Shoichiro Watanabe
  • Patent number: 10915686
    Abstract: Disclosed are mask definition tools, apparatus, methods, systems and computer program products configured to process data representing a semiconductor fabrication mask. A non-limiting example of a method includes performing a decomposition process on a full Transmission Cross Coefficient (TCC) using coherent optimal coherent systems (OCS) kernels; isolating a residual TCC that remains after some number of coherent kernels are extracted from the full TCC; and performing at least one decomposition process on the residual TCC using at least one loxicoherent system. The loxicoherent system uses a plurality of distinct non-coherent kernel functions and is a compound system containing a paired coherent system and an incoherent system that act in sequence. An output of the coherent system is input as a self-luminous quantity to the incoherent system, and the output of the incoherent system is an output of the loxicoherent system.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: February 9, 2021
    Assignee: International Business Machines Corporation
    Inventor: Alan E. Rosenbluth
  • Patent number: 10897566
    Abstract: Focusing methods and modules are provided for metrology tools and systems. Methods comprise capturing image(s) of at least two layers of a ROI in an imaging target, binning the captured image(s), deriving a focus shift from the binned captured image(s) by comparing the layers, and calculating a focus position from the derived focus shift. Disclosed methods are direct, may be carried out in parallel to a part of the overlay measurement process and provide fast and simple focus measurements that improve metrology performance.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: January 19, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: Nadav Gutman, Boris Golovanevsky, Noam Gluzer
  • Patent number: 10895452
    Abstract: A metrology apparatus for determining a characteristic of interest of a structure on a substrate, the apparatus comprising: a radiation source for generating illumination radiation; at least two illumination branches for illuminating the structure on the substrate, the illumination branches being configured to illuminate the structure from different angles; and a radiation switch configured to receive the illumination radiation and transfer at least part of the radiation to a selectable one of the at least two illumination branches.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: January 19, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Marinus Johannes Maria Van Dam, Arie Jeffrey Den Boef, Nitesh Pandey
  • Patent number: 10879407
    Abstract: In order to provide an optical sensor that is capable of obtaining both an optical trap effect and a moth eye effect with a single texture structure, a semiconductor optical sensor according to the present invention includes a light absorption medium that has a refractive index n and a thickness sufficiently less than a light transmission length, wherein the center wavelength to be observed is defined as ?. The semiconductor optical sensor is characterized by: having, in a light incident surface, a texture structure having a random surface direction and a typical structure scale d defined as in (?/n).
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: December 29, 2020
    Assignee: NEC CORPORATION
    Inventor: Yoshihiro Nambu
  • Patent number: 10859929
    Abstract: A position detection device for adjusting positions of a mold and a substrate using a mold mark formed on the mold and a substrate mark formed on the substrate includes a detection unit configured to detect light from the mold mark and the substrate mark, and a processing unit configured to obtain a positional relationship between the substrate and the mold based on a detection result of the detection unit, wherein the processing unit obtains the positional relationship between the substrate and the mold based on a corrected signal obtained by removing a noise component based on the light from the mold mark from a detected signal based on the light from the mold mark and the substrate mark.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: December 8, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Iino, Hiroshi Sato
  • Patent number: 10837919
    Abstract: Scatterometry overlay (SCOL) single cell targets are provided, along with target design methods and measurement methods which employ the single cell SCOL targets for in-die metrology measurements, utilizing the small size of the target along with maintained optical performance due to the design of the target. Disclosed single cell targets comprise a lattice of elements at two or more layers which is periodic two or more measurement directions. Elements in different layers are offset with respect to each other and may have the same pitch along the measurement directions. Measurement algorithms are also provided to derive metrology measurements such as overlays from the single cell targets, possibly simultaneously in both (or more) measurement directions, reducing measurement time and enhancing the metrology throughput. Positioning the small targets in-die provides more accurate metrology results which are less sensitive to process variation.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: November 17, 2020
    Assignee: KLA Corporation
    Inventor: Eitan Hajaj
  • Patent number: 10832385
    Abstract: A method for determining the position of an optical boundary surface along a first direction includes a) imaging a pattern in a plane transverse to the first direction, and recording a two-dimensional image of the pattern imaged in the plane; b) repeating step a) for different positions in the first direction, wherein the different positions cover an area in the first direction in which the optical boundary surface lies; c) averaging each image from step a) along a direction transverse to the second direction such that in each case a one-dimensional data set is produced; d) transforming each data set from step c) into a frequency domain; e) determining the frequency of the greatest amplitude of all data sets transformed in step d); and f) determining the position along the first direction by evaluating the data sets transformed in step d) at the frequency determined in step e).
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: November 10, 2020
    Assignee: Carl Zeiss Microscopy GmbH
    Inventor: Lutz Schaefer
  • Patent number: 10788362
    Abstract: A light detection device includes a diffraction element and a light detection element. The diffraction element diffracts a beam of light that is incident on the diffraction element. The light detection element includes light receivers to receive diffracted light. The diffraction element generates beams of the diffracted light by dividing the beam of light. The light detection element determines a displacement of the beam of light relative to the diffraction element on the basis of quantities of light of the beams of the diffracted light. The light detection element determines an angle change of the beam of light relative to the diffraction element by dividing the quantity of light of one of the beams of the diffracted light.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: September 29, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masayuki Omaki, Kenya Nakai
  • Patent number: 10783625
    Abstract: A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 22, 2020
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Minoru Harada, Ryo Nakagaki, Fumihiko Fukunaga, Yuji Takagi
  • Patent number: 10775637
    Abstract: A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: September 15, 2020
    Assignee: Google LLC
    Inventors: Ryohei Urata, Lieven Verslegers, Hong Liu, Daoyi Wang
  • Patent number: 10777440
    Abstract: A detection device includes an illumination optical system and a detection optical system. The illumination optical system is configured to illuminate a first diffraction grating having a first period in a first direction and a second diffraction grating having a second period different from the first period. The detection optical system is configured to detect light diffracted by the first and second diffraction gratings. The illumination optical system includes an optical member configured to form, on a pupil plane, a first pole and a second pole opposite to the first pole. The illumination optical system causes lights from the first and second poles to obliquely enter the first and second diffraction gratings from the first direction to illuminate the first and second diffraction gratings. The detection optical system detects diffracted light diffracted by one of the first and second diffraction gratings and by an other diffraction grating.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: September 15, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Toshiki Iwai, Takamitsu Komaki, Yasuyuki Unno, Nozomu Hayashi
  • Patent number: 10761432
    Abstract: Disclosed is an inspection apparatus for use in lithography. It comprises a support for a substrate carrying a plurality of metrology targets; an optical system for illuminating the targets under predetermined illumination conditions and for detecting predetermined portions of radiation diffracted by the targets under the illumination conditions; a processor arranged to calculate from said detected portions of diffracted radiation a measurement of asymmetry for a specific target; and a controller for causing the optical system and processor to measure asymmetry in at least two of said targets which have different known components of positional offset between structures and smaller sub-structures within a layer on the substrate and calculate from the results of said asymmetry measurements a measurement of a performance parameter of the lithographic process for structures of said smaller size. Also disclosed are substrates provided with a plurality of novel metrology targets formed by a lithographic process.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 1, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Simon Gijsbert Josephus Mathijssen, Stefan Hunsche, Markus Gerardus Martinus Maria Van Kraaij
  • Patent number: 10712673
    Abstract: An optical system and detector capture a distribution of radiation modified by interaction with a target structure. The observed distribution is used to calculate a property of the structure (e.g. CD or overlay). A condition error (e.g. focus error) associated with the optical system is variable between observations. The actual condition error specific to each capture is recorded and used to apply a correction for a deviation of the observed distribution due to the condition error specific to the observation. The correction in one practical example is based on a unit correction previously defined with respect to a unit focus error. This unit correction can be scaled linearly, in accordance with a focus error specific to the observation.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: July 14, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Sietse Thijmen Van Der Post, Koos Van Berkel
  • Patent number: 10692738
    Abstract: A management device that, when a component is mounted on a substrate, acquires pickup source information that includes pickup position information of the mounted component and mounting destination information that includes mounting position information of the mounted component and memorizes mounting result information that links both the above information on an HDD. By referencing the mounting result information memorized on the HDD and obtaining the pickup source information from the mounting destination information of the mounted component, it is possible to identify the pickup position at the wafer from which the mounted component was picked up.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: June 23, 2020
    Assignee: FUJI CORPORATION
    Inventor: Kimio Fujii
  • Patent number: 10671052
    Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Daniel Beylkin, Kenneth L. Ho, Sagar Vinodbhai Trivedi, Fangbo Xu, Junjiang Lei, Danping Peng
  • Patent number: 10622238
    Abstract: Methods and systems are disclosed for determining overlay in a semiconductor manufacturing process. Radiation reflected from a diffraction pattern in a metrology target may include +1 and ?1 diffraction patterns at different wavelengths and focal positions. The different wavelengths of radiation may be in a waveband where the sensitivity of contrast to wavelength is at a maximum. The reflected radiation may be analysed to obtain measured values of overlay as well as amplitude and/or phase corresponding to points distributed over the target, for different wavelengths and focal positions. The measured values of overlay may undergo a series of operations to determine the overlay. The determination may use an assumption that the amplitude and phase are unequal in the +1 and ?1 diffraction orders.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: April 14, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Nadav Gutman, Moran Zaberchik, Eran Amit
  • Patent number: 10614275
    Abstract: A measurement apparatus includes an image acquisition part that acquires a captured image obtained by imaging a partial area on a two-dimensional scale on which a plurality of two-dimensional codes having a first code, which is specified by a combination pattern of a first pixel value image and a second pixel value image, and a second code, which is specified by a pattern of a type different from the combination pattern, are arranged, a code specification part that specifies the first code and the second code corresponding to the two-dimensional code included in the captured image, and a position specification part that specifies position information on the two-dimensional scale of the two-dimensional code including the first code and the second code on the basis of the first code and the second code.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: April 7, 2020
    Assignee: MITUTOYO CORPORATION
    Inventor: Yuto Inoue
  • Patent number: 10599056
    Abstract: According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of ?1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of ?1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of ?2 shorter than the wavelength of ?1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: March 24, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Miki Toshima, Osamu Yamane, Yosuke Okamoto
  • Patent number: 10563978
    Abstract: Provided are an apparatus and a method for measuring a three dimensional shape with improved accuracy. The apparatus includes a stage, at least one lighting unit, a plurality of image pickup units and a control unit. The stage supports an object to be measured. The lighting unit includes a light source and a grid, and radiates grid-patterned light to the object to be measured. The image pickup units capture, in different directions, grid images reflected from the object to be measured. The control unit calculates a three dimensional shape of the object from the grid images captured by the image pickup units. The present invention has advantages in capturing grid images through a main image pickup portion and sub-image pickup portions, enabling the measurement of the three dimensional shape of the object in a rapid and accurate manner.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: February 18, 2020
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Seung-Jun Lee, Kwangill Koh, Moon-Young Jeon, Sang-Kyu Yun, Hong-Min Kim, Jung Hur
  • Patent number: 10551749
    Abstract: Metrology targets, production processes and optical systems are provided, which enable metrology of device-like targets. Supplementary structure(s) may be introduced in the target to interact optically with the bottom layer and/or with the top layer of the target and target cells configurations enable deriving measurements of device-characteristic features. For example, supplementary structure(s) may be designed to yield Moiré patterns with one or both layers, and metrology parameters may be derived from these patterns. Device production processes were adapted to enable production of corresponding targets, which may be measured by standard or by provided modified optical systems, configured to enable phase measurements of the Moiré patterns.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: February 4, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Vladimir Levinski, Amnon Manassen, Eran Amit, Nuriel Amir, Liran Yerushalmi, Amit Shaked
  • Patent number: 10545104
    Abstract: Methods and systems for performing overlay and edge placement errors of device structures based on x-ray diffraction measurement data are presented. Overlay error between different layers of a metrology target is estimated based on the intensity variation within each x-ray diffraction order measured at multiple, different angles of incidence and azimuth angles. The estimation of overlay involves a parameterization of the intensity modulations of common orders such that a low frequency shape modulation is described by a set of basis functions and a high frequency overlay modulation is described by an affine-circular function including a parameter indicative of overlay. In addition to overlay, a shape parameter of the metrology target is estimated based on a fitting analysis of a measurement model to the intensities of the measured diffraction orders. In some examples, the estimation of overlay and the estimation of one or more shape parameter values are performed simultaneously.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: January 28, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: John Hench, Andrei V. Shchegrov, Michael S. Bakeman