With Registration Indicia (e.g., Scale) Patents (Class 356/401)
  • Patent number: 11104160
    Abstract: A printing device is provided comprising a camera to capture an image of at least a portion of a print substrate; a controller to determine a location of a portion of a side edge of the substrate from the image to determine a distance of the print substrate from a predetermined location; and adjustment apparatus to adjust the entire substrate laterally, relative to the direction of transport of the substrate, based on the determined location.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 31, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander Paker, Jonathan Nir, Hagay Shkalim, Eitan Kichli, Vladimir Feygelman, Shraga Friedman
  • Patent number: 11094643
    Abstract: Methods, apparatuses, and systems related to determining overlay of features of a memory array are described. An example method includes forming a plurality of contacts on a working surface and selectively forming a first portion of a layer of conductive lines and a second portion of the layer of conductive lines in contact with the contacts. The first portion of the layer of conductive lines formed over the working surface is separated from the second portion of the layer of conductive lines formed over the working surface by a gap. The method includes determining an overlay of at least one of the contacts formed over the working surface in the gap relative to one of the conductive lines formed over the working surface.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: August 17, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Kendall Smith, Kari McLaughlin, Mario J. Di Cino, Xue Chen, Lane A. Gray, Joseph G. Lindsey
  • Patent number: 11079689
    Abstract: A display device including: a substrate having display area and a non-display area; and an alignment mark disposed in the non-display area of the substrate. The alignment mark includes a quadrangular-shaped center portion and a plurality of measurement portions that surround the center portion, the plurality of measurement portions including four or more measurement portions, and each of the measurement portions including sides that are parallel with two sides of the quadrangular-shaped center portion.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: August 3, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Wook Lee, Soon Wook Hong, Seung Rae Kim, Jae-Hyun Park, Min cheol Chae
  • Patent number: 11073487
    Abstract: Methods and systems for positioning a specimen and characterizing an x-ray beam incident onto the specimen in a Transmission, Small-Angle X-ray Scatterometry (T-SAXS) metrology system are described herein. A specimen positioning system locates a wafer vertically and actively positions the wafer in six degrees of freedom with respect to the x-ray illumination beam without attenuating the transmitted radiation. In some embodiments, a cylindrically shaped occlusion element is scanned across the illumination beam while the detected intensity of the transmitted flux is measured to precisely locate the beam center. In some other embodiments, a periodic calibration target is employed to precisely locate the beam center. The periodic calibration target includes one or more spatially defined zones having different periodic structures that diffract X-ray illumination light into distinct, measurable diffraction patterns.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 27, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: Alexander Bykanov, Nikolay Artemiev, Joseph A. Di Regolo, Antonio Gellineau, Alexander Kuznetsov, Andrei Veldman, John Hench
  • Patent number: 11067904
    Abstract: Metrology targets, design files, and design and production methods thereof are provided. The targets comprise two or more parallel periodic structures at respective layers, wherein a predetermined offset is introduced between the periodic structures, for example, opposite offsets at different parts of a target. Quality metrics are designed to estimate the unintentional overlay from measurements of a same metrology parameter by two or more alternative measurement algorithms. Target parameters are configured to enable both imaging and scatterometry measurements and enhance the metrology measurements by the use of both methods on the same targets. Imaging and scatterometry target parts may share elements or have common element dimensions. Imaging and scatterometry target parts may be combined into a single target area or may be integrated into a hybrid target using a specified geometric arrangement.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: July 20, 2021
    Assignee: KLA Corporation
    Inventors: Eran Amit, Raviv Yohanan
  • Patent number: 11054741
    Abstract: An imprint apparatus performs an imprint process by bringing a mold into contact with an imprint material arranged on a shot region of a substrate and curing the imprint material. The apparatus includes a controller configured to execute, in a case where an elapsed time from the supplying of the imprint material to the shot region until the contact with the mold falls outside an allowable range of a predetermined elapsed time, adjustment processing of adjusting an amount of the imprint material on the shot region at the timing of the contact.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: July 6, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shinichi Hirano
  • Patent number: 11022900
    Abstract: Disclosed is an inspection apparatus for use in lithography. It comprises a support for a substrate carrying a plurality of metrology targets; an optical system for illuminating the targets under predetermined illumination conditions and for detecting predetermined portions of radiation diffracted by the targets under the illumination conditions; a processor arranged to calculate from said detected portions of diffracted radiation a measurement of asymmetry for a specific target; and a controller for causing the optical system and processor to measure asymmetry in at least two of said targets which have different known components of positional offset between structures and smaller sub-structures within a layer on the substrate and calculate from the results of said asymmetry measurements a measurement of a performance parameter of the lithographic process for structures of said smaller size. Also disclosed are substrates provided with a plurality of novel metrology targets formed by a lithographic process.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: June 1, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Simon Gijsbert Josephus Mathijssen, Stefan Hunsche, Markus Gerardus Martinus Maria Van Kraaij
  • Patent number: 11016234
    Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electrophoretic display sub-assembly for rendering content, a front light sub-assembly comprising a light guide, a light FPC, and a plurality of light sources, and a capacitive touch sensing sub-assembly for detecting touch inputs. A yellow-pigmented tape is applied over the light sources and an edge of the light guide. A stiffener member is coupled to the light FPC opposite the yellow-pigmented tape.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: May 25, 2021
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Siddharth Gupta, Jerry Yee-Ming Chung, Hany Mounir Ghali, Robert L. D. Zenner, Juho Ilkka Jalava, Sherman Shwe Win Tan
  • Patent number: 10996570
    Abstract: A method of measuring overlay uses a plurality of asymmetry measurements from locations (LOI) on a pair of sub-targets (1032, 1034) formed on a substrate (W). For each sub-target, the plurality of asymmetry measurements are fitted to at least one expected relationship (1502, 1504) between asymmetry and overlay, based on a known bias variation deigned into the sub-targets. Continuous bias variation in one example is provided by varying the pitch of top and bottom gratings (P1/P2). Bias variations between the sub-targets of the pair are equal and opposite (P2/P1). Overlay (OV) is calculated based on a relative shift (xs) between the fitted relationships for the two sub-targets. The step of fitting asymmetry measurements to at least one expected relationship includes wholly or partially discounting measurements (1506, 1508, 1510) that deviate from the expected relationship and/or fall outside a particular segment of the fitted relationship.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: May 4, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Zili Zhou, Nitesh Pandey, Olger Victor Zwier, Patrick Warnaar, Maurits Van Der Schaar, Elliott Gerard McNamara, Arie Jeffrey Den Boef, Paul Christiaan Hinnen, Murat Bozkurt, Joost Jeroen Ottens, Kaustuve Bhattacharyya, Michael Kubis
  • Patent number: 10996050
    Abstract: Provided are an apparatus and a method for measuring a three dimensional shape with improved accuracy. The apparatus includes a stage, at least one lighting unit, a plurality of image pickup units and a control unit. The stage supports an object to be measured. The lighting unit includes a light source and a grid, and radiates grid-patterned light to the object to be measured. The image pickup units capture, in different directions, grid images reflected from the object to be measured. The control unit calculates a three dimensional shape of the object from the grid images captured by the image pickup units. The present invention has advantages in capturing grid images through a main image pickup portion and sub-image pickup portions, enabling the measurement of the three dimensional shape of the object in a rapid and accurate manner.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: May 4, 2021
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Seung-Jun Lee, Kwangill Koh, Moon-Young Jeon, Sang-Kyu Yun, Hong-Min Kim, Jung Hur
  • Patent number: 10983305
    Abstract: Methods, systems and devices for automatically focusing a microscope on a specimen and collecting a focused image of the specimen are provided. Aspects of the methods include detecting the presence of a substrate in a microscope, determining whether the substrate is in a correct orientation for imaging, focusing the microscope on a specimen that is placed on the substrate, and collecting one or more images of the specimen. Systems and devices for carrying out the subject methods are also provided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: April 20, 2021
    Assignee: Abbott Laboratories
    Inventors: Trevor David Shields, Robert John Fahey, Damian J. Verdnik, Svitlana Y. Berezhna, Mahmoud Janbakhsh, Koshy T. Chacko
  • Patent number: 10983528
    Abstract: An orientation system includes a base station comprising a light emitter that projects a pattern onto a projection surface of a space, an auxiliary station including an auxiliary emitter that projects an auxiliary pattern onto the projection surface, and a robot including a moveable base supporting an imaging device. The robot detects the pattern and the auxiliary pattern with the imaging device, and determines a location of the robot within the space based on the pattern.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: April 20, 2021
    Assignee: Toyota Research Institute, Inc.
    Inventors: Konstantine Mushegian, Matthew Amacker
  • Patent number: 10983143
    Abstract: A method of assembling a group of devices, the method comprising the steps of: evacuating a space between each component of a first group of two or more components on a source device and a transfer device thereby to create a temporary bond between each component of the first group of two or more components and the transfer device; selectively removing the first group of two or more components from the source device whilst the transfer device is temporarily bonded to each component of the first group of two or more components on the source device; positioning the first group of two or more components on a host device; and decoupling the first group of two or more components from the transfer device, thereby to form a first group of assembled devices.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: April 20, 2021
    Assignee: NU NANO LTD
    Inventor: James Vicary
  • Patent number: 10929145
    Abstract: Novel instructions, their format, and support thereof are described. For example, an instruction including a field for an opcode to indicate a reduction-based mask generation operation is to be performed, a field to identify a first packed data source operand, a field to identify a second packed data source operand, and a field to identify a destination operand to store reduction-based generated mask and its hardware support is described.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventor: Elmoustapha Ould-Ahmed-Vall
  • Patent number: 10915665
    Abstract: Position data may gradually pseudonymized by a method, comprising: generating a sequence of relative positions from a sequence of absolute positions of a moving object; randomizing the sequence of relative positions using at least a sequence of random numbers generated from at least one seed; in response to receiving an analytical job comprising the at least one seed, restoring the sequence of relative positions from the randomized sequence of relative positions; and in response to receiving an analytical job comprising both the at least one seed and at least one absolute position derived from the sequence of absolute positions, restoring the sequence of absolute positions from the randomized sequence of relative positions.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yasutaka Nishimura, Mari Abe Fukuda, Shoichiro Watanabe
  • Patent number: 10915686
    Abstract: Disclosed are mask definition tools, apparatus, methods, systems and computer program products configured to process data representing a semiconductor fabrication mask. A non-limiting example of a method includes performing a decomposition process on a full Transmission Cross Coefficient (TCC) using coherent optimal coherent systems (OCS) kernels; isolating a residual TCC that remains after some number of coherent kernels are extracted from the full TCC; and performing at least one decomposition process on the residual TCC using at least one loxicoherent system. The loxicoherent system uses a plurality of distinct non-coherent kernel functions and is a compound system containing a paired coherent system and an incoherent system that act in sequence. An output of the coherent system is input as a self-luminous quantity to the incoherent system, and the output of the incoherent system is an output of the loxicoherent system.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: February 9, 2021
    Assignee: International Business Machines Corporation
    Inventor: Alan E. Rosenbluth
  • Patent number: 10895452
    Abstract: A metrology apparatus for determining a characteristic of interest of a structure on a substrate, the apparatus comprising: a radiation source for generating illumination radiation; at least two illumination branches for illuminating the structure on the substrate, the illumination branches being configured to illuminate the structure from different angles; and a radiation switch configured to receive the illumination radiation and transfer at least part of the radiation to a selectable one of the at least two illumination branches.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: January 19, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Marinus Johannes Maria Van Dam, Arie Jeffrey Den Boef, Nitesh Pandey
  • Patent number: 10897566
    Abstract: Focusing methods and modules are provided for metrology tools and systems. Methods comprise capturing image(s) of at least two layers of a ROI in an imaging target, binning the captured image(s), deriving a focus shift from the binned captured image(s) by comparing the layers, and calculating a focus position from the derived focus shift. Disclosed methods are direct, may be carried out in parallel to a part of the overlay measurement process and provide fast and simple focus measurements that improve metrology performance.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: January 19, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: Nadav Gutman, Boris Golovanevsky, Noam Gluzer
  • Patent number: 10879407
    Abstract: In order to provide an optical sensor that is capable of obtaining both an optical trap effect and a moth eye effect with a single texture structure, a semiconductor optical sensor according to the present invention includes a light absorption medium that has a refractive index n and a thickness sufficiently less than a light transmission length, wherein the center wavelength to be observed is defined as ?. The semiconductor optical sensor is characterized by: having, in a light incident surface, a texture structure having a random surface direction and a typical structure scale d defined as in (?/n).
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: December 29, 2020
    Assignee: NEC CORPORATION
    Inventor: Yoshihiro Nambu
  • Patent number: 10859929
    Abstract: A position detection device for adjusting positions of a mold and a substrate using a mold mark formed on the mold and a substrate mark formed on the substrate includes a detection unit configured to detect light from the mold mark and the substrate mark, and a processing unit configured to obtain a positional relationship between the substrate and the mold based on a detection result of the detection unit, wherein the processing unit obtains the positional relationship between the substrate and the mold based on a corrected signal obtained by removing a noise component based on the light from the mold mark from a detected signal based on the light from the mold mark and the substrate mark.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: December 8, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Iino, Hiroshi Sato
  • Patent number: 10837919
    Abstract: Scatterometry overlay (SCOL) single cell targets are provided, along with target design methods and measurement methods which employ the single cell SCOL targets for in-die metrology measurements, utilizing the small size of the target along with maintained optical performance due to the design of the target. Disclosed single cell targets comprise a lattice of elements at two or more layers which is periodic two or more measurement directions. Elements in different layers are offset with respect to each other and may have the same pitch along the measurement directions. Measurement algorithms are also provided to derive metrology measurements such as overlays from the single cell targets, possibly simultaneously in both (or more) measurement directions, reducing measurement time and enhancing the metrology throughput. Positioning the small targets in-die provides more accurate metrology results which are less sensitive to process variation.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: November 17, 2020
    Assignee: KLA Corporation
    Inventor: Eitan Hajaj
  • Patent number: 10832385
    Abstract: A method for determining the position of an optical boundary surface along a first direction includes a) imaging a pattern in a plane transverse to the first direction, and recording a two-dimensional image of the pattern imaged in the plane; b) repeating step a) for different positions in the first direction, wherein the different positions cover an area in the first direction in which the optical boundary surface lies; c) averaging each image from step a) along a direction transverse to the second direction such that in each case a one-dimensional data set is produced; d) transforming each data set from step c) into a frequency domain; e) determining the frequency of the greatest amplitude of all data sets transformed in step d); and f) determining the position along the first direction by evaluating the data sets transformed in step d) at the frequency determined in step e).
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: November 10, 2020
    Assignee: Carl Zeiss Microscopy GmbH
    Inventor: Lutz Schaefer
  • Patent number: 10788362
    Abstract: A light detection device includes a diffraction element and a light detection element. The diffraction element diffracts a beam of light that is incident on the diffraction element. The light detection element includes light receivers to receive diffracted light. The diffraction element generates beams of the diffracted light by dividing the beam of light. The light detection element determines a displacement of the beam of light relative to the diffraction element on the basis of quantities of light of the beams of the diffracted light. The light detection element determines an angle change of the beam of light relative to the diffraction element by dividing the quantity of light of one of the beams of the diffracted light.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: September 29, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masayuki Omaki, Kenya Nakai
  • Patent number: 10783625
    Abstract: A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 22, 2020
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Minoru Harada, Ryo Nakagaki, Fumihiko Fukunaga, Yuji Takagi
  • Patent number: 10775637
    Abstract: A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: September 15, 2020
    Assignee: Google LLC
    Inventors: Ryohei Urata, Lieven Verslegers, Hong Liu, Daoyi Wang
  • Patent number: 10777440
    Abstract: A detection device includes an illumination optical system and a detection optical system. The illumination optical system is configured to illuminate a first diffraction grating having a first period in a first direction and a second diffraction grating having a second period different from the first period. The detection optical system is configured to detect light diffracted by the first and second diffraction gratings. The illumination optical system includes an optical member configured to form, on a pupil plane, a first pole and a second pole opposite to the first pole. The illumination optical system causes lights from the first and second poles to obliquely enter the first and second diffraction gratings from the first direction to illuminate the first and second diffraction gratings. The detection optical system detects diffracted light diffracted by one of the first and second diffraction gratings and by an other diffraction grating.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: September 15, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Toshiki Iwai, Takamitsu Komaki, Yasuyuki Unno, Nozomu Hayashi
  • Patent number: 10761432
    Abstract: Disclosed is an inspection apparatus for use in lithography. It comprises a support for a substrate carrying a plurality of metrology targets; an optical system for illuminating the targets under predetermined illumination conditions and for detecting predetermined portions of radiation diffracted by the targets under the illumination conditions; a processor arranged to calculate from said detected portions of diffracted radiation a measurement of asymmetry for a specific target; and a controller for causing the optical system and processor to measure asymmetry in at least two of said targets which have different known components of positional offset between structures and smaller sub-structures within a layer on the substrate and calculate from the results of said asymmetry measurements a measurement of a performance parameter of the lithographic process for structures of said smaller size. Also disclosed are substrates provided with a plurality of novel metrology targets formed by a lithographic process.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 1, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Simon Gijsbert Josephus Mathijssen, Stefan Hunsche, Markus Gerardus Martinus Maria Van Kraaij
  • Patent number: 10712673
    Abstract: An optical system and detector capture a distribution of radiation modified by interaction with a target structure. The observed distribution is used to calculate a property of the structure (e.g. CD or overlay). A condition error (e.g. focus error) associated with the optical system is variable between observations. The actual condition error specific to each capture is recorded and used to apply a correction for a deviation of the observed distribution due to the condition error specific to the observation. The correction in one practical example is based on a unit correction previously defined with respect to a unit focus error. This unit correction can be scaled linearly, in accordance with a focus error specific to the observation.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: July 14, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Sietse Thijmen Van Der Post, Koos Van Berkel
  • Patent number: 10692738
    Abstract: A management device that, when a component is mounted on a substrate, acquires pickup source information that includes pickup position information of the mounted component and mounting destination information that includes mounting position information of the mounted component and memorizes mounting result information that links both the above information on an HDD. By referencing the mounting result information memorized on the HDD and obtaining the pickup source information from the mounting destination information of the mounted component, it is possible to identify the pickup position at the wafer from which the mounted component was picked up.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: June 23, 2020
    Assignee: FUJI CORPORATION
    Inventor: Kimio Fujii
  • Patent number: 10671052
    Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Daniel Beylkin, Kenneth L. Ho, Sagar Vinodbhai Trivedi, Fangbo Xu, Junjiang Lei, Danping Peng
  • Patent number: 10622238
    Abstract: Methods and systems are disclosed for determining overlay in a semiconductor manufacturing process. Radiation reflected from a diffraction pattern in a metrology target may include +1 and ?1 diffraction patterns at different wavelengths and focal positions. The different wavelengths of radiation may be in a waveband where the sensitivity of contrast to wavelength is at a maximum. The reflected radiation may be analysed to obtain measured values of overlay as well as amplitude and/or phase corresponding to points distributed over the target, for different wavelengths and focal positions. The measured values of overlay may undergo a series of operations to determine the overlay. The determination may use an assumption that the amplitude and phase are unequal in the +1 and ?1 diffraction orders.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: April 14, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Nadav Gutman, Moran Zaberchik, Eran Amit
  • Patent number: 10614275
    Abstract: A measurement apparatus includes an image acquisition part that acquires a captured image obtained by imaging a partial area on a two-dimensional scale on which a plurality of two-dimensional codes having a first code, which is specified by a combination pattern of a first pixel value image and a second pixel value image, and a second code, which is specified by a pattern of a type different from the combination pattern, are arranged, a code specification part that specifies the first code and the second code corresponding to the two-dimensional code included in the captured image, and a position specification part that specifies position information on the two-dimensional scale of the two-dimensional code including the first code and the second code on the basis of the first code and the second code.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: April 7, 2020
    Assignee: MITUTOYO CORPORATION
    Inventor: Yuto Inoue
  • Patent number: 10599056
    Abstract: According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of ?1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of ?1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of ?2 shorter than the wavelength of ?1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: March 24, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Miki Toshima, Osamu Yamane, Yosuke Okamoto
  • Patent number: 10563978
    Abstract: Provided are an apparatus and a method for measuring a three dimensional shape with improved accuracy. The apparatus includes a stage, at least one lighting unit, a plurality of image pickup units and a control unit. The stage supports an object to be measured. The lighting unit includes a light source and a grid, and radiates grid-patterned light to the object to be measured. The image pickup units capture, in different directions, grid images reflected from the object to be measured. The control unit calculates a three dimensional shape of the object from the grid images captured by the image pickup units. The present invention has advantages in capturing grid images through a main image pickup portion and sub-image pickup portions, enabling the measurement of the three dimensional shape of the object in a rapid and accurate manner.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: February 18, 2020
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Seung-Jun Lee, Kwangill Koh, Moon-Young Jeon, Sang-Kyu Yun, Hong-Min Kim, Jung Hur
  • Patent number: 10551749
    Abstract: Metrology targets, production processes and optical systems are provided, which enable metrology of device-like targets. Supplementary structure(s) may be introduced in the target to interact optically with the bottom layer and/or with the top layer of the target and target cells configurations enable deriving measurements of device-characteristic features. For example, supplementary structure(s) may be designed to yield Moiré patterns with one or both layers, and metrology parameters may be derived from these patterns. Device production processes were adapted to enable production of corresponding targets, which may be measured by standard or by provided modified optical systems, configured to enable phase measurements of the Moiré patterns.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: February 4, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Vladimir Levinski, Amnon Manassen, Eran Amit, Nuriel Amir, Liran Yerushalmi, Amit Shaked
  • Patent number: 10545104
    Abstract: Methods and systems for performing overlay and edge placement errors of device structures based on x-ray diffraction measurement data are presented. Overlay error between different layers of a metrology target is estimated based on the intensity variation within each x-ray diffraction order measured at multiple, different angles of incidence and azimuth angles. The estimation of overlay involves a parameterization of the intensity modulations of common orders such that a low frequency shape modulation is described by a set of basis functions and a high frequency overlay modulation is described by an affine-circular function including a parameter indicative of overlay. In addition to overlay, a shape parameter of the metrology target is estimated based on a fitting analysis of a measurement model to the intensities of the measured diffraction orders. In some examples, the estimation of overlay and the estimation of one or more shape parameter values are performed simultaneously.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: January 28, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: John Hench, Andrei V. Shchegrov, Michael S. Bakeman
  • Patent number: 10520451
    Abstract: Systems, methods, and apparatus are provided for determining overlay of a pattern on a substrate with a mask pattern defined in a resist layer on top of the pattern on the substrate. A first grating is provided under a second grating, each having substantially identical pitch to the other, together forming a composite grating. A first illumination beam is provided under an angle of incidence along a first horizontal direction. The intensity of a diffracted beam from the composite grating is measured. A second illumination beam is provided under the angle of incidence along a second horizontal direction. The second horizontal direction is opposite to the first horizontal direction. The intensity of the diffracted beam from the composite grating is measured. The difference between the diffracted beam from the first illumination beam and the diffracted beam from the second illumination beam, linearly scaled, results in the overlay error.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: December 31, 2019
    Assignee: ASML Netherlands B.V.
    Inventor: Arie Jeffrey Den Boef
  • Patent number: 10514620
    Abstract: A method of determining the position of an alignment mark on a substrate, the alignment mark having first and second segment, the method including illuminating the alignment mark with radiation, detecting radiation diffracted by the alignment mark and generating a resulting alignment signal. The alignment signal has a first component received during illumination of the first segment only, a second component received during illumination of the second segment only, and a third component received during simultaneous illumination of both segments. The positions of the segments are determined using the first component, the second component and the third component of the alignment signal.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: December 24, 2019
    Assignees: ASML Holding N.V., ASML Netherlands B.V.
    Inventors: Franciscus Godefridus Casper Bijnen, Simon Gijsbert Josephus Mathijssen, Vassili Demergis, Edo Maria Hulsebos
  • Patent number: 10488699
    Abstract: Disclosed is a method for manufacturing black matrix and spacer, which includes steps of: providing a base substrate and coating the base substrate with a black photoresist layer; coating a transparent photoresist layer on black photoresist layer; providing a multi-tone mask plate including a first light-transmitting area and a second light-transmitting area, in which the transparent photoresist layer and the black photoresist layer both include a first section aligning with first light-transmitting area and a second section aligning with second light-transmitting area; using the multi-tone mask plate to expose transparent photoresist layer and black photoresist layer, in which the transparent photoresist layer in the first section forms a main spacer, and the black photoresist layer in the first section forms a first black matrix, the transparent photoresist layer in the second section forms an auxiliary spacer, and the black photoresist layer in the second section forms a second black matrix.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: November 26, 2019
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Chengzhong Yu
  • Patent number: 10483214
    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to overlay structures and methods of manufacture. The method includes locating a first plurality of offset dummy features in a first layer; locating a second plurality of offset dummy features in a second layer; measuring a distance between the first plurality of offset dummy features and the second plurality of offset dummy features; and determining that the first layer or the second layer is shifted with respect to one another based on the measurement.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: November 19, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Xintuo Dai, Dongsuk Park, Guoxiang Ning, Mert Karakoy
  • Patent number: 10466601
    Abstract: A lithographic apparatus includes an alignment sensor configured to determine the position of an alignment target having a periodic structure. The alignment sensor includes a demultiplexer to demultiplex a number of intensity channels. The demultiplexer includes a number of stages arranged in series and a number of demultiplexing components, each demultiplexing component operable to divide an input radiation beam into two radiation beam portions. The first stage has a first demultiplexing component that is arranged to receive as an input radiation beam an incident radiation beam. Each successive stage is arranged such that it has twice the number of demultiplexing components as a preceding stage, each demultiplexing component of each stage after the first stage receiving as an input one of the radiation beam portions output from a demultiplexing component of the preceding stage.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: November 5, 2019
    Assignees: ASML Netherlands B.V., ASML Holding N.V.
    Inventors: Alessandro Polo, Simon Gijsbert Josephus Mathijssen, Patricius Aloysius Jacobus Tinnemans, Scott Douglas Coston, Ronan James Havelin
  • Patent number: 10437950
    Abstract: Disclosed are mask definition tools, apparatus, methods, systems and computer program products configured to process data representing a semiconductor fabrication mask. A non-limiting example of a method includes performing a decomposition process on a full Transmission Cross Coefficient (TCC) using coherent optimal coherent systems (OCS) kernels; isolating a residual TCC that remains after some number of coherent kernels are extracted from the full TCC; and performing at least one decomposition process on the residual TCC using at least one loxicoherent system. The loxicoherent system uses a plurality of distinct non-coherent kernel functions and is a compound system containing a paired coherent system and an incoherent system that act in sequence. An output of the coherent system is input as a self-luminous quantity to the incoherent system, and the output of the incoherent system is an output of the loxicoherent system.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: October 8, 2019
    Assignee: International Business Machines Corporation
    Inventor: Alan E. Rosenbluth
  • Patent number: 10429744
    Abstract: Methods and apparatuses are provided that determine an offset between actual feature/mark locations and the designed feature/mark locations in a maskless lithography system. For example, in one embodiment, a method is provided that includes opening a camera shutter in a maskless lithography system. Light is directed from a configuration of non-adjacent mirrors in a mirror array towards a first substrate layer. An image of the first substrate layer on a camera is captured and accumulated. Light is directed and images are captured repeatedly using different configurations of non-adjacent mirrors to cover an entire field-of-view (FOV) of the camera on the first substrate layer. Thereafter, the camera shutter is closed and the accumulated image is stored in memory.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: October 1, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tamer Coskun, Hwan J. Jeong
  • Patent number: 10427243
    Abstract: A method is provided for producing a weld seam on or at a first component, or in the region of a first component, from which at least one spherical or sphere-like element projects. The position of the at least one spherical or sphere-like element is detected using an optoelectronic detection device and corresponding position data are generated. The weld seam is produced contact free using an electronically-controlled laser welding device that is arranged at a distance from the first component and said at least one spherical or sphere-like element. The laser welding device is controlled on the basis of, or using, the position data of the spherical or sphere-like element.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: October 1, 2019
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Johann Van Niekerk, Hans Langrieger
  • Patent number: 10423078
    Abstract: A method to address overlay accuracy compensation using finFET cut isolation revisions is disclosed. For an integrated circuit (IC) layout including at least a portion of an active region including a plurality of gates extending over a plurality of fins, prior to optical proximity correction of the IC layout: the method determines a number of fins to be cut with same source/drain connection by a fin cut isolation opening, and determines a fin cut isolation pitch in the gate length direction of the plurality of gates. The method revises a size of a fin cut isolation opening in the IC layout based on a number of fins to be cut with same source/drain connection by the fin cut isolation opening and the fin cut isolation pitch in the gate length direction. The revision in size of the fin cut isolation compensates for overlay inaccuracy.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 24, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hongliang Shen, Erfeng Ding, Guoxiang Ning
  • Patent number: 10408607
    Abstract: An apparatus for checking whether a table is at tilt is provided, which is capable of checking whether a table is at tilt from an initially-set position or not even during an operation of an inspecting apparatus. Accordingly, the apparatus for checking whether a table is at tilt, which is for use in a camera module inspecting apparatus is provided, in which the camera module inspecting apparatus includes a fixing part; a plurality of test zones provided above the fixing part; a table movable to sequentially guide a camera module sequentially to the respective test zones; and a chart respectively provided in one or more of the test zones among the plurality of test zones, and the table tilt checking apparatus includes a first position mark marked on the table and a first mark photographer provided on the fixing part, facing toward the first position mark.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: September 10, 2019
    Assignee: ISMEDIA CO., LTD.
    Inventors: Jong Won Kim, Yong Woo Han
  • Patent number: 10401739
    Abstract: A method of aligning a pair of complementary diffraction patterns having a first complementary diffraction pattern and a second complementary diffraction pattern, the pair of complementary diffraction patterns obtained from performance of a metrology process on a structure formed by a lithographic process. The method includes performing at least a fine alignment stage to align the pair of complementary diffraction patterns. The alignment stage includes: interpolating measured values of the first complementary diffraction pattern over at least a portion of a detector area; and minimizing a residual between measured values in the second complementary diffraction pattern and corresponding interpolated values from the interpolation of the first complementary diffraction pattern, by one or both of translation and rotation of the second complementary diffraction pattern.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: September 3, 2019
    Assignee: ASML Netherlands B.V.
    Inventor: Niels Geypen
  • Patent number: 10401228
    Abstract: Metrology methods and systems are provided, in which the detected image is split at a field plane of the collection path of the metrology system's optical system into at least two pupil plane images. Optical elements such as prisms may be used to split the field plane images, and multiple targets or target cells may be measured simultaneously by spatially splitting the field plane and/or the illumination sources and/or by using two polarization types. The simultaneous capturing of multiple targets or target cells increases the throughput of the disclosed metrology systems.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: September 3, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Andrew V. Hill, Amnon Manassen, Yuri Paskover, Yuval Lubashevsky
  • Patent number: 10394984
    Abstract: Disclosed are mask definition tools, apparatus, methods, systems and computer program products configured to process data representing a semiconductor fabrication mask. A non-limiting example of a method includes performing a decomposition process on a full Transmission Cross Coefficient (TCC) using coherent optimal coherent systems (OCS) kernels; isolating a residual TCC that remains after some number of coherent kernels are extracted from the full TCC; and performing at least one decomposition process on the residual TCC using at least one loxicoherent system. The loxicoherent system uses a plurality of distinct non-coherent kernel functions and is a compound system containing a paired coherent system and an incoherent system that act in sequence. An output of the coherent system is input as a self-luminous quantity to the incoherent system, and the output of the incoherent system is an output of the loxicoherent system.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventor: Alan E. Rosenbluth
  • Patent number: 10387608
    Abstract: A semiconductor fabrication system includes a target design device and a multi-stage fabrication tool configured to fabricate one or more layers of a sample using the fabrication process. The target design device receives metrology design rules associated with a metrology tool in which the metrology design rules include criteria for one or more physical attributes of metrology targets measurable with the metrology tool. The target design device may further receive process design rules associated with a fabrication process in which the process design rules include criteria for determining process stages of the fabrication process required to fabricate structures with selected physical attributes.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: August 20, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Michael Adel, Tal Shusterman, Chen Dror, Ellis Chang