Abstract: A lidar system includes one or more light sources configured to generate a first beam of light and a second beam of light, a scanner configured to scan the first and second beams of light across a field of regard of the lidar system, and a receiver configured to detect the first beam of light and the second beam of light scattered by one or more remote targets. The scanner includes a rotatable polygon mirror that includes multiple reflective surfaces angularly offset from one another along a periphery of the polygon mirror, the reflective surfaces configured to reflect the first and second beams of light to produce a series of scan lines as the polygon mirror rotates. The scanner also includes a pivotable scan mirror configured to (i) reflect the first and second beams of light and (ii) pivot to distribute the scan lines across the field of regard.

Abstract: A space optical coupling apparatus, including M first couplers, a phase adjustment apparatus, N beam splitters, M second couplers, a coupling apparatus, and a controller. The first coupler receives a beam, and couples the beam to the phase adjustment apparatus. The phase adjustment apparatus includes M phase adjusters, N beam splitters, and N detectors. Each beam splitter is configured to split a received beam into two beams, one sent to a corresponding detector and the other sent to a corresponding phase adjuster. The second coupler receives output light from the coupling apparatus, and transmits the output light into the space. The coupling apparatus is configured to couple a beam onto a single-mode fiber. The controller is configured to control, based on the beam intensity detected by the detector and the beam intensity on the single-mode fiber, the M phase adjusters to adjust the phases of the received beams.

Abstract: An overlay metrology system may include a controller for receiving metrology data associated with a plurality of overlay targets on one or more samples; generating a reference metric for at least some of the plurality of overlay targets based on the metrology data, where the reference metric is associated with one or more properties of the respective overlay targets that contributes to overlay error; classifying the plurality of overlay targets into one or more groups based on the reference metrics calculated for the plurality of overlay targets; generating a reference image for at least some of the one or more groups; generating corrected metrology data using the associated reference image for at least some of the one or more groups; and generating overlay measurements for the plurality of overlay targets based on the corrected metrology data.

Abstract: The present disclosure provides a target and a method of performing overlay measurements on a target. The target includes an array of cells comprising a first cell, a second cell, a third cell, and a fourth cell. Each cell includes a periodic structure with a pitch. The periodic structure includes a first section and a second section, separated by a first gap. The target further includes an electron beam overlay target, such that electron beam overlay measurements, advanced imaging metrology, and/or scatterometry measurements can be performed on the target.

Abstract: Disclosed herein is a method for depth-profiling of samples including a target region including a lateral structural feature. The method includes projecting an optical pump pulse on a semiconductor device comprising a target region, such as to produce an acoustic pulse which propagates within the target region of the semiconductor device, wherein a wavelength of the pump pulse is at least two times greater than a lateral extent of a lateral structural feature of the semiconductor device along at least one lateral direction, projecting an optical probe pulse on the semiconductor device, such that the probe pulse undergoes Brillouin scattering off the acoustic pulse within the target region, detecting a scattered component of the probe pulse to obtain a measured signal, and analyzing the measured signal to obtain a depth-dependence of at least one parameter characterizing the lateral structural feature.

Abstract: A method for calibrating the alignment of a wafer is provided. A plurality of alignment position deviation (APD) simulation results are obtained form a plurality of mark profiles. An alignment analysis is performed on a mark region of the wafer with a light beam. A measured APD of the mark region of the wafer is obtained in response to the light beam. The measured APD is compared with the APD simulation results to obtain alignment calibration data. An exposure process is performed on the wafer with a mask according to the alignment calibration data.

Abstract: Provided is a detection apparatus having a high detection accuracy. A detection apparatus comprises an optical element arranged at a position optically conjugate to a target surface, including a first region for forming illumination light that illuminates the target surface with a first angle distribution and a second region for forming illumination light that illuminates the target surface with a second angle distribution, a measurement mark arranged at the target surface; and a detector for detecting a deviation direction and a deviation amount of the optical element based on reflection light from the measurement mark illuminated by the first region and the second region of the optical element.

Abstract: Methods, apparatus, and articles of manufacture for actuating control surfaces of an aircraft are disclosed. An example apparatus to control a control surface of an aerodynamic body includes a track rotatable about a pivot of a support structure of the aerodynamic body, the control surface slidably coupled to the track, a first actuator operatively coupled to the track, the first actuator to cause rotation of the track and the flaperon about the pivot, and a second actuator operatively coupled to the control surface, the second actuator to cause translation of the control surface along the track.

Abstract: A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.

Abstract: A target droplet source for an extreme ultraviolet (EUV) source includes a droplet generator configured to generate target droplets of a given material. The droplet generator includes a nozzle configured to supply the target droplets in a space enclosed by a chamber. The target droplet source further includes a sleeve disposed in the chamber distal to the nozzle. The sleeve is configured to provide a path for the target droplets in the chamber.

Abstract: A light detection and ranging system includes synchronously scanning transmit and receive mirrors that scan a pulsed fanned laser beam in two dimensions. Imaging optics image a receive aperture onto an arrayed receiver that includes a plurality of light sensitive devices. Scanning mirror offsets may be applied to modify a fan angle of the pulsed fanned laser beam. Adaptive methods dynamically modify the size and location of the field of view, laser pulse properties, and/or fan angle in response to internal and external sensors data.

Abstract: Methods and systems for setting up alignment of a specimen are provided. One system includes computer subsystem(s) configured for acquiring two-dimensional (2D) images generated from output of a detector of an output acquisition subsystem at template locations in corresponding areas of printed instances on a specimen. The computer subsystem(s) determine offsets in x and y directions between the template locations using the 2D images and determine an angle of the specimen with respect to the output acquisition subsystem based on the offsets. If the angle is greater than a predetermined value, the computer subsystem(s) rotate the specimen and repeat the steps described above. If the angle is less than the predetermined value, the computer subsystem(s) store one of the 2D images for alignment of the specimen in a process performed on a specimen. The 2D images may include multi-mode images, which may be fused prior to determining the offsets.

Abstract: A method includes scanning a probe laterally across a surface so that the probe follows a scanning motion across the surface and steering a detection beam onto the probe via a steering mirror, the detection beam reflecting from the probe in the form of a return beam. The method also includes moving the steering mirror so that the detection beam follows a tracking motion which is synchronous with the scanning motion and the detection beam remains steered onto the probe by the steering mirror and using the return beam to obtain image measurements, each indicative of a measured height of a respective point on the surface. An associated height error measurement is obtained for each point on the surface, each measurement being indicative of a respective error in the measured height. The height error measurements are used to correct the image measurements so as to generate corrected image measurements.

Abstract: A method including: determining recipe consistencies between one substrate measurement recipe of a plurality of substrate measurement recipes and each other substrate measurement recipe of the plurality of substrate measurement recipes; calculating a function of the recipe consistencies; eliminating the one substrate measurement recipe from the plurality of substrate measurement recipes if the function meets a criterion; and reiterating the determining, calculating and eliminating until a termination condition is met. Also disclosed herein is a substrate measurement apparatus, including a storage configured to store a plurality of substrate measurement recipes, and a processor configured to select one or more substrate measurement recipes from the plurality of substrate measurement recipes based on recipe consistencies among the plurality of substrate measurement recipes.

Abstract: A dual camera module including a hyperspectral camera module, an apparatus including the same, and a method of operating the apparatus are provided. The dual camera module includes a hyperspectral camera module configured to provide a hyperspectral image of a subject; and an RGB camera module configured to provide an image of the subject, and obtain an RGB correction value applied to correction of the hyperspectral image.

Abstract: A dual camera module including a hyperspectral camera module, an apparatus including the same, and a method of operating the apparatus are provided. The dual camera module includes a hyperspectral camera module configured to provide a hyperspectral image of a subject; and an RGB camera module configured to provide an image of the subject, and obtain an RGB correction value applied to correction of the hyperspectral image.

Abstract: Methods of forming structures using a neutral beam, structures formed using a neutral beam, and reactor systems for forming the structures are disclosed. The neutral beam can be used to provide activated species during deposition of a layer and/or to provide activated species to treat a deposited layer.

Abstract: There is provided a mechanism that enables a camera apparatus to record an appropriate video image relating to circumstances in which radiation imaging is performed in an imaging room. A radiation imaging system includes a radiation generating apparatus configured to generate radiation toward an object, a radiation detecting apparatus configured to detect, as an image signal, the radiation incident thereto, a camera apparatus configured to record a video image relating to circumstances in which radiation imaging is performed using the radiation in an imaging room, and a camera control apparatus configured to control the camera apparatus. The camera control apparatus recognizes an imaging location at which the radiation imaging is performed in the imaging room, and sets a parameter of the camera apparatus in accordance with the recognized imaging location.

Abstract: A control system, for example for an optical system, includes: an actuating element; a measuring element for acquiring actuating element measurement data of the actuating element; a regulating unit for generating a regulating signal for regulating the actuating element depending on the acquired actuating element meas-urement data; and a state monitoring unit for monitoring a state of the control system depending on the acquired actuating element measurement data. The state monitoring unit includes: a first processing unit for generating preprocessed state data depending on (i) the acquired actuating element measurement data and a physical model and/or a mathematical model of the actuating element, or (ii) the acquired actuating element measurement data, a physical model and/or a mathematical model of the actuating element and the generated regulating signal; and a second processing unit for determining the state of the control system depending on the preprocessed state data.

Abstract: A machining system includes: a jig retaining a plurality of workpieces; a measurement device measuring the retained plurality of workpieces; and a machining device machining the retained plurality of workpieces. The jig has a reference part positioned or position detected by the machining device. The measurement device has: a measurement unit measuring a positional relationship of the retained plurality of workpieces relative to the reference part, and an input unit using a recording medium or communication to input measured positional information of the plurality of workpieces to the machining device. The machining device has: a jig coordinate system specifying unit specifying a coordinate system of the jig, by positioning or position measuring the reference part, and a workpiece coordinate system setting unit individually setting coordinate systems of each of the plurality of workpieces, based on the specified coordinate system, and the inputted positional information.

Abstract: A metrology apparatus for determining a characteristic of interest of a structure on a substrate, the apparatus comprising: a radiation source configured to generate illumination radiation; at least two illumination branches comprising at least one optical fiber and configured to illuminate a structure on a substrate from different angles; and a radiation switch configured to receive the illumination radiation and transfer at least part of the radiation to a selectable one of the at least two illumination branches.

Abstract: A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

Abstract: A LIDAR 1 includes: a scanner 55 that emits outgoing light Lo while changing the outgoing direction thereof; a reflection member 8 that is arranged in a first outgoing direction and reflects the outgoing light Lo; an absorption member 7 that is arranged in a second outgoing direction and absorbs the outgoing light Lo; an APD 41 that receives return light Lr; and a DSP16. The DSP 16 generates replica u representing a component reflected by the absorption member 7 on the basis of output signals of the APD 41 obtained at each time when the outgoing light Lo is emitted in the first outgoing direction and in the second outgoing direction.

Abstract: A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.

Abstract: In accordance with some embodiments, a lithography method in semiconductor manufacturing is provided. The lithography method includes transmitting a main pulse laser to a zone of excitation through a first optic assembly. The lithography method further includes supplying a coolant to the first optic assembly and detecting a temperature of the coolant with a use of at least one sensor. The lithography method also includes adjusting a heat transfer rate between the coolant and the first optic assembly based on the temperature of the first optic assembly. In addition, the lithography method includes generating a droplet of a target material into the zone of excitation. The lithography method further includes exciting the droplet of the target material into plasma with the main pulse laser in the zone of excitation.

Abstract: A state monitoring system for monitoring a state of a robot configured to perform work on a workpiece executes: a step of obtaining state data from a sensor and deriving a deterioration index parameter based on the obtained state data; a step of determining whether or not the deterioration index parameter is greater than a first threshold that is preset to a level lower than a level at which corrective maintenance is required; a step of further determining whether or not a frequency of having determined that the deterioration index parameter is greater than the first threshold is greater than a preset frequency threshold; and a step of suppressing an operation of the robot without stopping the robot if it is determined that the frequency is greater than the frequency threshold.

Abstract: A lens assembly is separated into a first lens module including at least one lens element and a second lens module including at least one other lens element during alignment of its lens elements. Coarse alignment is conducted by aligning an optical axis of at least one lens element within the first lens module with an optical axis of at least one lens element within the second lens module. For conducting fine alignment, an image sensor views a test chart while the first and second lens modules are positioned between the test chart and the image sensor. Image quality indices are obtained from the image sensor of the test chart at different relative alignments between the first and second lens modules, before the first lens module is fixed to the second lens module at a relative alignment therebetween where the image quality indices are optimized.

Abstract: A device for moving an object comprises a base and a platform able to receive the object; six supports each having an upper end connected to the platform and a lower end connected to the base and an actuation device connected to at least three of the supports. The upper end and lower end of each support in combination have at least five degrees of freedom. The actuation device is suited for giving predefined periodic movements to said at least three of the six supports, these three supports being called controlled supports, thus giving a periodic movement to the platform relative to the base with at least three degrees of freedom.

Abstract: An illumination source, comprising: (a) at least one coherent light emitting device (CLED) configured for emitting coherent light having an optical path; (b) at least one optical element in said optical path for converting at least a portion of said coherent light to incoherent light, said optical element being configured to emit said incoherent light in a direction; and (c) a light control mechanism (LCM) for altering said direction of said incoherent light.

Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.

Abstract: A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.

Abstract: An orientation characteristic measurement system includes an irradiation optical system, a detection optical system, a light detector, a rotation mechanism changing an angle (?) between a surface of the sample and an optical axis (L2) of the detection optical system, and a computer, and the computer includes a rotation mechanism control unit controlling the rotation mechanism, a distribution acquisition unit normalizing an angle-dependent distribution of light intensity to acquire an angle-dependent distribution of light intensity, an area specifying unit specifying light intensity in a maximum area on the basis of the angle-dependent distribution of the light intensity, and a parameter calculation unit calculating the orientation parameter (S) on the basis of a linear relationship determined using the film thickness and refractive index of the sample and the light intensity in the maximum area.

Abstract: The present invention relates to an apparatus for detecting relative positioning information between rolls, and a method for measuring a roll alignment state by using same, and to an apparatus for detecting relative positioning information between rolls, and a method for measuring a roll alignment state by using same, the apparatus outputting a measurement result in real time so that a measurer can easily recognize the degree of parallelism and the degree of horizontality of a roll when a roll process line is formed, and thus an inter-roll alignment state can be checked or a measurement roll can be corrected according to the alignment state.

Abstract: A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.

Abstract: A test structure for use in metrology measurements of a sample pattern formed by periodicity of unit cells, each formed of pattern features arranged in a spaced-apart relationship along a pattern axis, the test structure comprising a test pattern, which is formed by a main pattern which includes main pattern features of one or more of the unit cells and has a symmetry plane, and a predetermined auxiliary pattern including at least two spaced apart auxiliary features located within at least some of those features of the main pattern, parameters of which are to be controlled during metrology measurements.

Abstract: Scatterometry overlay (SCOL) measurement methods, systems and targets are provided to enable efficient SCOL metrology with in-die targets. Methods comprise generating a signal matrix by: illuminating a SCOL target at multiple values of at least one illumination parameter, and at multiple spot locations on the target, wherein the illumination is at a NA (numerical aperture) >? yielding a spot diameter <1?, measuring interference signals of zeroth and first diffraction orders, and constructing the signal matrix from the measured signals with respect to the illumination parameters and the spot locations on the target; and deriving a target overlay by analyzing the signal matrix. The SCOL targets may be reduced to be a tenth in size with respect to prior art targets, as less and smaller target cells are required, and be easily set in-die to improve the accuracy and fidelity of the metrology measurements.

Abstract: A method for determining a reference focal position of a laser beam for processing a plate-like member, the method comprising producing at least two incisions in the plate-like member with the laser beam set at different focal positions, irradiating the plate-like member with the laser beam, detecting edges of the incisions by measuring one or more parameters relating to the irradiation of the plate-like member, and establishing a width of the at least two incisions using the detected one or more parameters.

Abstract: Embodiments of the present disclosure generally relate to an optically transparent substrate, comprising a major surface having a peripheral edge region with an orientation feature formed therein, and a texture formed on the peripheral edge region, the texture having an opacity that is greater than an opacity of the major surface.

Abstract: A substrate processing apparatus is provided. The apparatus includes an imaging unit that images a mark on a substrate, and a processor that aligns the substrate based on an image of the mark obtained by the imaging unit. If the alignment has failed, the processor identifies a factor of the failure based on information including the image and executes at least one of a plurality of recovery processes based on the identified factor. The processor includes an output unit that outputs a condition for the at least one of recovery processes in accordance with an inference model, and a learning unit that learns the inference model based on an execution result of the at least one of the recovery processes under the condition output from the output unit.

Abstract: The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).

Abstract: A substrate processing device for processing a substrate, comprising an image sensor configured to detect positions of two corners on at least one diagonal of a substrate when the substrate is transferred to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position relative to the image sensor; and a control device configured to determine the position of the substrate on the basis of the positions of the two corners, which are detected by the image sensor, the control device being configured to be capable of changing at least either light quantity or wavelength of output light of the illuminating device.

Abstract: A method of manufacturing a silicon-carbon composite electrode assembly for an electrochemical cell includes forming an electrode by pyrolyzing at least a portion of a polymer in an assembly to form pyrolyzed carbon. The assembly includes an electrode precursor in electrical contact with a current collector. The electrode precursor includes a polymer and an electroactive material. The electroactive material includes silicon. The current collector includes an electrically-conductive material. The pyrolyzing includes directing an energy stream toward a surface of the electrode precursor. The surface is disposed opposite the current collector. The silicon-carbon composite electrode assembly includes the electrode and the current collector. In certain variations, the energy stream includes a laser beam or a plasma jet. In certain aspects, the electrode defines a concentration gradient between a first surface and a second surface.

Abstract: A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.

Abstract: A non-contact displacement sensor includes a focus timing calculator that, calculates a measurement-side focus timing at which measurement light is focused on a surface of a measurable object, a first reference-side focus timing at which reference light is focused on a first reference surface, and a second reference-side focus timing at which the reference light is focused on a second reference surface; a characteristics calculator that calculates the refractive index characteristics of a liquid lens apparatus based on the first reference-side focus timing, the second reference-side focus timing, and an optical path length difference; and a position calculator that calculates a position of the measurable object based on the refractive index characteristics and a phase of the measurement-side focus timing relative to a period of a drive signal.

Abstract: A method of determining electromagnetic scattering properties of a finite periodic structure has the steps: 1002: Calculating a single-cell contrast current density, within a unit-cell supporting domain of a single one of a finite collection of unit cells. 1004: Calculating a scattered electric field outside the finite collection of unit cells, by integrating, over the single unit cell's supporting domain, a Green's function with the determined single-cell contrast current density. 1006: The Green's function is obtained for observation points outside the finite collection of unit cells by summation across the finite collection of unit cells. The Green's function integrated with the determined single-cell contrast current density is obtained for observation points above the supporting domain with respect to a substrate underlying the finite periodic structure.

Abstract: The present invention provides an evaluation method of evaluating a measurement condition of a position of a mark formed on a substrate, the method comprising: obtaining a mark signal representing an intensity distribution of reflected light by detecting the reflected light from the mark under the measurement condition; generating a plurality of signals from the mark signal by changing a first signal component of a first frequency included in the mark signal obtained in the obtaining; and estimating a position of the mark from each of the plurality of signals obtained in the generating, and obtaining a variation in estimated position of the mark as an evaluation index of the measurement condition.

Abstract: Aspects of the disclosure provide for a method of aligning a tracking system of a communication device. The method includes receiving an optical beam at the communication device. A first beam portion is received at the tracking system, and a second beam portion is received at an optical fiber of the communication device. Using one or more processors, an first signal and an second signal is received from the tracking system. The one or more processors are also used to determine a phase difference related to the first signal and a second phase difference related to the second signal. An offset for the first signal and an offset for the second signal are determined based on the respective phase difference. The one or more processors then track the optical beam using the tracking system and the determined offsets.

Abstract: A method including: determining recipe consistencies between one substrate measurement recipe of a plurality of substrate measurement recipes and each other substrate measurement recipe of the plurality of substrate measurement recipes; calculating a function of the recipe consistencies; eliminating the one substrate measurement recipe from the plurality of substrate measurement recipes if the function meets a criterion; and reiterating the determining, calculating and eliminating until a termination condition is met. Also disclosed herein is a substrate measurement apparatus, including a storage configured to store a plurality of substrate measurement recipes, and a processor configured to select one or more substrate measurement recipes from the plurality of substrate measurement recipes based on recipe consistencies among the plurality of substrate measurement recipes.

Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.

Abstract: The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.