Abstract: An inspection method includes a rough alignment process of acquiring optical images of first and second patterns previously set to confirm whether a position misalignment amount in a rotation direction of a sample with respect to an X or Y direction is equal to or smaller than a first acceptable value, and conforming whether the position misalignment amount is equal to or smaller than the first acceptable value on the basis of an acquisition result, and a fine alignment process of acquiring optical images of third patterns positioned on different corners of a rectangular frame constituted of four sides along the X or Y direction on an optical image of the sample and rotating a stage until a position misalignment amount detected based on the optical images of the third patterns becomes equal to or smaller than a second acceptable value being smaller than the first acceptable value.

Abstract: Imaging metrology targets and methods are provided, which combine one-dimensional (1D) elements designed to provide 1D imaging metrology signals along at least two measurement directions and two-dimensional (2D) elements designed to provide at least one 2D imaging metrology overlay signal. The target area of the 1D elements may enclose the 2D elements or the target areas of the 1D and 2D elements may be partially or fully congruent. The compound targets are small, possibly multilayered, and may be designed to be process compatible (e.g., by segmentation of the elements, interspaces between elements and element backgrounds) and possibly be produced in die. Two dimensional elements may be designed to be periodic to provide additional one dimensional metrology signals.

Abstract: A method for overlay monitoring and control is introduced in the present disclosure. The method includes selecting a group of patterned wafers from a lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot.

Abstract: A method of determining a parameter of a patterning process applied to an object comprising two features (for example an overlay of the two features) comprises: irradiating the two features of the object with a radiation beam and receiving at least a portion of the radiation beam scattered from the two features of the object. The at least a portion of the radiation beam comprises: a first portion comprising at least one diffraction order and a second portion comprising at least one diffraction order that is different to a diffraction order of the first portion. The method further comprises moderating a phase difference between the first and second portions and combining the first and second portions such that they interfere to produce a time dependent intensity signal. The method further comprises determining the parameter of the patterning process from a contrast of the time dependent intensity signal.

Abstract: Binocular augmented reality display devices and corresponding methods allow alignment calibration to be performed by an end user. According to one approach, a camera is positioned to have a field of view which includes simultaneously part of a projected image from the left-eye display and part of a projected image from the right-eye display. By projecting via each display at least part of a calibration image and identifying within the camera-sampled image right-field and left-field alignment features, an alignment correction can be derived. Alternative approaches employ correlation of images sampled by forward-looking cameras rigidly associated with the respective right-eye and left-eye display units, or require a user to input a manual adjustment for aligning transversely-swapped camera images with the real world view.

Abstract: A projection system which arranges n×m projection images and forms one composite projection image on a projection surface includes: n×m projectors; an operation unit which accepts an operation by a user; and a control unit which controls the projection by each of the n×m projectors. The control unit causes a reference image showing a reference point common to a plurality of projection areas to be projected in an overlap area where the plurality of projection areas overlap each other, and causes each of a plurality of projectors projecting the projection image in the overlap are where the reference image to be moved is projected, to execute geometric correction of the projection image in such a way that the reference image moves to a position on the projection surface designated by the user by the operation via the operation unit, and to project the projection image.

Abstract: An organic light-emitting display apparatus includes: a substrate including a display area and a peripheral area outside the display area; an alignment mark located in the peripheral area; and an insulating film located in the peripheral area and including a first opening through which at least a part of the alignment mark is exposed and a plurality of slits that extend from the first opening.

Abstract: A system is provided for correcting an error of a camera for a camera monitoring system (CMS), including a camera attached to a side of a vehicle, a memory configured to store processor-executable instructions for correcting an error of an image captured by the camera, and a processor configured with the processor-executable instructions to detect a correction point is the image captured by the camera, generate a correction parameter based on a resultant value of a comparison between the detected correction point and a preset correction point, and correct the error of the image based on the generated correction parameter.

Abstract: A probe includes a movable plate to which a stylus capable of contacting a measurable object is mounted, the movable plate displaceable in an X direction; a static plate arranged to overlap with the movable plate; a counter plate facing the movable plate and the static plate; an elastic movable side connection plate, the movable side connection plate connecting the counter plate at at least three places with each of a first end connector positioned toward a first end of the movable plate in the X direction and second end connectors positioned toward a second end in the X direction; and a static side connection plate which connects the static plate and the counter plate. An entire length of the first end connector in a Y direction orthogonal to the X direction is the same size as the entire length of the second end connectors in the Y direction.

Abstract: In a board work machine that performs board work with reference to a reference mark provided on a board, in a case of performing board work with respect to a board provided with overall reference mark and local area reference mark that acts as a reference for a local area as reference marks, when recognizing the reference marks by imaging, checking is performed as to whether a recognized reference mark is recognized correctly. For this checking, when checking whether the position deviation amount from a normal position and the relative position deviation amount of an imaging target identified as a reference mark is within the range of a set tolerance, set tolerances for a local area reference mark are smaller than set tolerances for an overall reference mark.

Abstract: According to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.

Abstract: In an alignment sensor of a lithographic apparatus, position sensing radiation is delivered to a target (P1). After reflection or diffraction from the target, position sensing radiation is processed to determine a position of the target. Reference radiation interferes with the position sensing radiation) while a relative phase modulation is applied between the reference radiation and the position sensing radiation. The interfering radiation includes a time-varying component defined by the applied phase modulation. The interfering radiation is delivered to two photodetectors in such a way that each photodetector receives said time-varying component in anti-phase to that received at the other photodetector. A difference signal (i(t)) from said photodetectors contains an amplified, low noise version of said time-varying component. This is used in determining the position of the target. Mode matching enhances interference. Surface scattered radiation is rejected.

Abstract: In a method for controlling the positioning of patterns on a substrate in a manufacturing process at least one registration measurement is conducted with a registration tool on at least one pattern formed in at least one layer on the substrate by a previous process step of the manufacturing process. From the registration measurement a position of the at least one pattern in a coordinate system is determined. The determined position of the at least one pattern is fed into an automatic process control of a manufacturing system for controlling a setup of the manufacturing system for a subsequent process step of the manufacturing process. The manufacturing process may be a wafer manufacturing process with a silicon substrate. Complementary information may be collected in addition to performing the registration measurement and fed to the automatic process control. The process steps may for example include lithography steps, etching steps, layer deposition.

Abstract: An overlay mark includes a first feature of a plurality of first alignment segments extending along a first direction in a first layer, a second feature of a plurality of second alignment segments extending along a second direction in a second layer over the first layer, and a third feature of a plurality of third alignment segments extending along the first direction and a plurality of fourth alignment segments extending along the second direction in a third layer over the second layer. In a plan view, each first alignment segment of the plurality of first alignment segments is adjacent to a corresponding third alignment segment of the plurality of third alignment segments along the first direction, and each second alignment segment of the plurality of second alignment segments is adjacent to a corresponding forth alignment segment of the plurality of fourth alignment segments along the second direction.

Abstract: Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for determining a deviation between an actual position and a desired position of a laser machining head of a laser machining machine. Implementations include actions of selecting at least two different machining positions of the laser machining head, in which a laser beam emitted by the laser machining head is directed onto a desired position of a workpiece, moving the laser machining head into a first selected machining position and forming a through-opening into the workpiece at or around the desired position by operation of the laser beam, moving the laser machining head into a second selected machining position and detecting radiation generated by an interaction between the laser beam and the workpiece, and determining whether there is a deviation between an actual position of the laser machining head and the desired position based on the detected radiation.

Abstract: The present invention relates to an apparatus and a method for local anesthesia and, more specifically, to an apparatus and a method for local anesthesia, which precisely indicate an anesthesia region and enable injection to be administered around the anesthesia region through a plurality of anesthesia needles. According to the present invention, the fear and pain of a subject to be anesthetized can be reduced since the affected part of the subject to be anesthetized can be anesthetized by injecting a plurality of syringes all at once, and an injection can be precisely administered to a region at which an injection is to be administered since the affected part can be precisely indicated by a provided laser pointer.

Abstract: Aspects of the present disclosure include methods and systems for assessing alignment of a light source with a flow stream. Methods according to certain embodiments include detecting first and second light signals along a vertical axis of the a light irradiated flow stream and calculating a differential signal amplitude between the first light signal and second light signal to assess the alignment of the light source with the flow stream. Systems for practicing the subject methods are also described.

Abstract: A substrate has a plurality of overlay gratings formed thereon by a lithographic process. Each overlay grating has a known overlay bias. The values of overlay bias include for example two values in a region centered on zero and two values in a region centered on P/2, where P is the pitch of the gratings. Overlay is calculated from asymmetry measurements for the gratings using knowledge of the different overlay bias values, each of the overall asymmetry measurements being weighted by a corresponding weight factor. Each one of the weight factors represents a measure of feature asymmetry within the respective overlay grating. The calculation is used to improve subsequent performance of the measurement process, and/or the lithographic process. Some of the asymmetry measurements may additionally be weighted by a second weight factor in order to eliminate or reduce the contribution of phase asymmetry to the overlay.

Abstract: An alignment apparatus for aligning a substrate, and a substrate processing system including such alignment apparatus. The alignment apparatus includes an alignment base for supporting the substrate and/or a substrate support member. A force generating device applies a contact force on the substrate. The force generating device includes an arm including a rigid proximal end and a rigid distal end. The distal end is provided with a contact section for contacting an edge of the substrate and an elastically deformable arm section extending between the proximal and distal ends. The connection part connects the proximal end to the alignment base. The arm is movable with respect to the alignment base via the connection part. The alignment apparatus also includes an actuator for causing a displacement of the proximal end, whereby the contact force, defined by the elastically deformable arm section, is applied to the substrate by the contact section.

Abstract: Automatically correcting for rotational misalignment of a wafer improperly mounted on a film frame includes capturing an image of portions of the wafer using an image capture device, prior to initiation of a wafer inspection procedure by an inspection system; digitally determining a rotational misalignment angle and a rotational misalignment direction of the wafer relative to the film frame and/or a set of reference axes of a field of view of the image capture device; and correcting for the rotational misalignment of the wafer by way of a film frame handling apparatus separate from the inspection system, which is configured for rotating the film frame across the rotational misalignment angle in a direction opposite to the rotational misalignment direction. Such film frame rotation can occur prior to placement of the film frame on the wafer table, without decreasing film frame handling throughput or inspection process throughput.

Abstract: An inventory system includes an inventory holder that may be moved by a mobile drive unit. The inventory holder may hold inventory items. The mobile drive unit may move in a manner for facilitating a shift of position of at least one inventory item relative to the inventory holder. Such movement may be accomplished, for example, by accelerating, decelerating, turning while driving, spinning, dropping the inventory holder, or by causing at least one of the mobile drive unit or the inventory holder to at least one of interact with or engage an obstacle such as a bump over which the mobile drive unit drives, a bar positioned above a floor on which the mobile drive unit drives, a wall, another mobile drive unit, or another inventory holder.

Abstract: A method including determining a position of a first pattern in each of a plurality of target portions on a substrate, based on a fitted mathematical model, wherein the first pattern includes at least one alignment mark, wherein the mathematical model is fitted to a plurality of alignment mark displacements (dx, dy) for the alignment marks in the target portions, and wherein the alignment mark displacements are a difference between a respective nominal position of the alignment mark and measured position of the alignment mark; and transferring a second pattern onto each of the target portions, using the determined position of the first pattern in each of the plurality of target portions, wherein the mathematical model includes polynomials Z1 and Z2: Z1=r2 cos(2?) and Z2=r2 sin(2?) in polar coordinates (r, ?) or Z1=x2?y2 and Z2=xy in Cartesian coordinates (x, y).

Abstract: Systems and methods are described for characterizing the location of optical components relative to one another for optimizing the performance of the optical module. In particular, a mechanism is provided for a user to visually determine, from a fiber point of view, the alignment and relative positioning of a lens assembly of the optical module with an optoelectronic transceiver, such as a VCSEL or a photodiode. By characterizing a location of the lens assembly with respect to the optoelectronic transceiver in an x-y plane and/or determining a spacing of the components in a z-direction, the user can compensate for expected signal losses through the optical module due to inaccuracies in the relative positioning of the components, adjust the relative positioning of the components in the optical module being examined, or modify manufacturing parameters to improve the accuracy of positioning in the modules and PCBAs yet to be built.

Abstract: A mounting device that, during movement of a mounting head, captures a first image that includes components that are collected in the mounting head and first fiducial marks, captures a second image that includes the components that are collected in the mounting head and second fiducial marks, and generates an image of the components that are collected in the mounting head using the first image and the second image based on the positional relationship of the first fiducial marks and the second fiducial marks. At this time, the mounting device captures the first image after the components and the first fiducial marks enter the same imaging range prior to the second fiducial marks entering the imaging range, and after that, captures the second image after the first fiducial marks come out from the imaging range and the components and the second fiducial marks enter the same imaging range.

Abstract: Methods and systems for finding patterns in a design for a specimen are provided. One system includes one or more computer subsystems configured for searching for a target pattern in a design for a specimen to thereby find multiple instances of the target pattern in the design. The one or more computer subsystems are also configured for separating the multiple instances of the target pattern into different groups based on information for surrounding patterns within a predefined window around the target pattern such that each of the different groups corresponds to a different combination of the target pattern and the surrounding patterns.

Abstract: A metrology target is designed for monitoring variations in a multiple patterning process, such as a self-aligned doubled patterning (SADP) or self-aligned quadruple patterning (SAQP) process. The metrology target may include a plurality of sub-patterns. For example, the metrology target may be a three-dimensional (3D) target rather than a conventional two-dimensional line-space target design. The 3D target design includes multiple sub-patterns arranged with a pitch in a direction that is different than the pitch of the lines and trenches. The pitch of the sub-patterns is sufficient so that multiple sub-patterns are simultaneously within the field of measurement.

Abstract: Disclosed is a method of measuring a target, associated substrate comprising a target and computer program. The target comprises overlapping first and second periodic structures. The method comprising illuminating the target with measurement radiation and detecting the resultant scattered radiation. The pitch of the second periodic structure is such, relative to a wavelength of the measurement radiation and its angle of incidence on the target, that there is no propagative non-zeroth diffraction at the second periodic structure resultant from said measurement radiation being initially incident on said second periodic structure. There may be propagative non-zeroth diffraction at the second periodic structure which comprises further diffraction of one or more non-zero diffraction orders resultant from diffraction by the first periodic structure.

Abstract: One aspect of the present invention relates to a mask inspection system for inspecting lithography masks, including a placement table for placing a lithography mask to be inspected, a first optical unit with a first beam path for examining structures of the lithography mask, and a second optical unit with a second beam path for establishing a position of at least one edge of the lithography mask. Here, the second beam path of the second optical unit passes at least once through a plane defined by the placement table.

Abstract: Disclosed are a control apparatus for dynamically adjusting a phase switching of a DC motor and a method thereof. A rotor in the DC motor is divided into 2 M pole areas, wherein M is a positive integer not less than 1. The control apparatus comprises a phase detector, a current detector, a control circuit and a driving circuit. The phase detector detects the phase switching state of the pole areas to generate a standard phase signal. The current detector detects a current flowing through the DC motor in one of switching points of the standard phase signal to generate a current detection value. The control circuit periodically outputs 2 M drive signals, and determines to perform dynamically adjusting operation on the timing sequence of the drive signals according to the current detection value. The driving circuit receives the drive signals to perform the phase switching for driving the DC motor.

Abstract: This disclosure describes techniques and apparatuses for rotational alignment of a circular display and a circular lens. In one or more implementations, a display device, such as a smart watch, includes a circular lens assembly that overlays a circular display assembly. The display device includes at least two alignment points positioned along the perimeter of the circular display assembly that enable a machine vision system to rotationally align the circular display assembly to the circular lens assembly. At least one of the alignment points includes a target mark on the perimeter of the circular lens assembly that is viewable by the machine vision system through a corresponding alignment hole on the perimeter of the circular display assembly. The alignment hole is within a border region of the circular display assembly, but is sized and positioned so that it does not impact the structure of the circular display assembly.

Abstract: A mask inspection apparatus includes an optical image acquisition unit configured to acquire an optical image by irradiating light on a mask, a reference image generation unit configured to generate a reference image from design data of the mask, a comparison circuit configured to compare the optical image with the reference image, a pattern data extraction unit configured to obtain coordinates of a defective portion determined to be defective by the comparison unit and to extract, from the design data, pattern data of a predetermined dimension range including the coordinates, and an interface unit configured to supply an aerial image measurement apparatus with information associated with the defect, the information including the defect coordinates and the extracted pattern data.

Abstract: A lithography system includes an illumination source including two illumination poles separated along a first direction and symmetrically distributed around an optical axis, a pattern mask to receive illumination from the illumination source, and a set of projection optics to generate an image corresponding to the pattern mask onto a sample. The pattern mask includes a metrology target pattern mask and device pattern mask elements. The device pattern mask elements are distributed along the first direction with a device separation distance. The metrology target pattern mask includes a set of metrology target pattern mask elements having a diffraction pattern corresponding to that of the device pattern mask elements. A metrology target generated on the sample associated with the metrology target pattern mask is characterizable along a second direction and has printing characteristics corresponding to those of device pattern elements generated on the sample associated with the device pattern mask elements.

Abstract: Disclosed is a method of monitoring a lithographic process parameter, such as focus and/or dose, of a lithographic process. The method comprises acquiring a first and a second target measurement using respectively a first measurement configuration and a second measurement configuration, and determining the lithographic process parameter from a first metric derived from said first target measurement and said second target measurement. The first metric may be difference. Also disclosed are corresponding measurement and lithographic apparatuses, a computer program and a method of manufacturing devices.

Abstract: A light scanning microscope with an illumination module switchable between an illumination with m number of spots and an illumination with n number of spots, a deflecting unit which moves the m or n spots in a predetermined sample region, and a detector module for confocal and spectrally resolved detection of the sample radiation. The detector module has a confocal diaphragm unit, a splitting unit which is arranged downstream of the confocal diaphragm unit, a detector, and an imaging unit which images the partial beams on the detector in a spatially separated manner. The confocal diaphragm unit is switchable between a confocal diaphragm with exactly m apertures for m-spot illumination and a confocal diaphragm with n apertures for n-spot illumination. The splitting unit has a first beam path for m-spot illumination and a second beam path for n-spot illumination. The splitting unit is switchable between the two beam paths.

Abstract: Systems, methods, and apparatus for living object protection in wireless power transfer applications are provided. In one aspect, an apparatus for detecting objects in a detection area of a wireless power transfer system is provided. The apparatus comprises a plurality of radar transceivers. The apparatus comprises at least one processor configured to receive radar data from the plurality of radar transceivers, detect an object in the detection area based on the received radar data, and adjust the detection area. The apparatus is configured to adjust the detection area based on at least one of a type of chargeable vehicle present, an amount of power being wirelessly transferred by the wireless power transfer system, an alignment of a vehicle with the wireless power transfer system, or a speed of the object approaching the detection area.

Abstract: Described is a medicament delivery device comprising a case, a container slidably disposed in the case between a first position and a second position, a needle coupled to the container, and a needle alignment detection mechanism disposed on the case and adapted to receive the needle. The needle alignment detection mechanism determines whether the needle is aligned with a longitudinal axis (L) when the needle is in the first position, the second position or translating between the first position and the second position.

Abstract: An inventory system includes an inventory holder that may be moved by a mobile drive unit. The inventory holder may hold inventory items. The mobile drive unit may move in a manner for facilitating a shift of position of at least one inventory item relative to the inventory holder. Such movement may be accomplished, for example, by accelerating, decelerating, turning while driving, spinning, dropping the inventory holder, or by causing at least one of the mobile drive unit or the inventory holder to at least one of interact with or engage an obstacle such as a bump over which the mobile drive unit drives, a bar positioned above a floor on which the mobile drive unit drives, a wall, another mobile drive unit, or another inventory holder.

Abstract: Apparatus and methods for navigation of a robotic device configured to operate in an environment comprising objects and/or persons. Location of objects and/or persons may changed prior and/or during operation of the robot. In one embodiment, a bistatic sensor comprises a transmitter and a receiver. The receiver may be spatially displaced from the transmitter. The transmitter may project a pattern on a surface in the direction of robot movement. In one variant, the pattern comprises an encoded portion and an information portion. The information portion may be used to communicate information related to robot movement to one or more persons. The encoded portion may be used to determine presence of one or more object in the path of the robot. The receiver may sample a reflected pattern and compare it with the transmitted pattern. Based on a similarity measure breaching a threshold, indication of object present may be produced.

Abstract: A method and system to measure misalignment error between two overlying or interlaced periodic structures are proposed. The overlying or interlaced periodic structures are illuminated by incident radiation, and the diffracted radiation of the incident radiation by the overlying or interlaced periodic structures are detected to provide an output signal. The misalignment between the overlying or interlaced periodic structures may then be determined from the output signal.

Abstract: An apparatus is described. The apparatus includes a camera comprising a beam splitter to impose different optical paths for visible light and infra red light received by the camera. The camera also includes an infra red light detector to detect the infra red light and a visible light detector to detect the visible light, wherein, the different optical paths include an optical path having more than one internal reflection within the beam splitter.

Abstract: A measuring apparatus includes an input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus which inspects a defect of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, and to input reference image data generated from design data of the pattern by the pattern inspection apparatus to be compared with the optical image data, from the pattern inspection apparatus, a positional deviation distribution generation unit to generate positional deviation distribution by measuring positional deviation of the pattern on the target object, by using the optical image data and the reference image data input from the pattern inspection apparatus, and an output unit to output generated positional deviation distribution of the pattern on the target object, wherein the measuring apparatus is arranged independently from the pattern inspection apparatus.

Abstract: A test object for measuring the point spread function (PSF) of an optical system having a given Airy diameter (dAiry) comprises a structure to be imaged having a plurality of structure elements to be imaged, wherein the structure elements are embodied and arranged in such a way that the structure has at least two axes of symmetry.

Abstract: A projection system includes a plurality of projection units configured to project an image as a whole; a receiver configured to receive an instruction for shifting reference points that define a projection target area onto which the plurality of projection units project the whole image on an occasion of an initial calibration processing; a storage unit configured to store the reference points of the projection target area used in the initial calibration processing; a controller configured to start a recalibration processing in response to an event; a setting unit configured to reset the projection target area based on the reference points stored in the storage unit on an occasion of the recalibration processing; and a correction coefficient calculator configured to calculate correction coefficients for the plurality of projection units based on the projection target area that is reset by the setting unit.

Abstract: Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations. In particular, some embodiments of the present technology determine the center locations of individual vias on a wafer and average them together to obtain an average center location of the set of vias. Based on a comparison of the average center location to a desired center location, the present technology adjusts the wafer position. Additionally, in some embodiments, the present technology compares wafer via patterns to a template and adjusts the position of the wafer based on the comparison.

Abstract: Embodiments of the invention provide methods and systems for analyzing the ophthalmic anatomy of a patient posterior to the cornea. The method may include scanning a focus of a femtosecond laser beam along a path within the patient's eye. A portion of the path may be disposed posterior to the patient's cornea. The method may also include acquiring a first reflectance image and a second reflectance image associated with the focus disposed respectively at a first location of the path and a second location of the path. The method may further include determining the presence or absence of an ophthalmic anatomical feature of the eye based on a comparison between the first reflectance image and the second reflectance image.

Abstract: A method for hernia mesh placement during in-situ surgical applications. The method includes the step of positioning a mesh having a center mark within an abdominal cavity near a site of repair. A light assembly projecting a light beam through a free end is provided. Next, the free end of the light assembly is inserted through a central location of the site of repair. Finally, the center mark of the mesh is aligned with the light beam of the light assembly to position the mesh at the central location of the site of repair.

Abstract: A charged particle beam writing apparatus includes a reading unit to read an identifier from a substrate where an absorber film which absorbs extreme ultraviolet light is formed and the identifier which can be optically read is formed, a storage unit to store defect position information indicating a position of a defect on the substrate based on reference marks, defect size information indicating a size of the defect, which are corresponding to the identifier, and pattern data for writing, an examination unit to input partial pattern data corresponding to a region including at least the defect in the pattern data, the defect position information based on reference marks, and the defect size information, and to examine whether a pattern layout is formed such that the defect is located in a region where the absorber film remains after patterning, and a writing unit to write a pattern on the substrate.

Abstract: An apparatus, includes first and second measurement devices configured to measure a position in a first direction of a moving body; a drive unit configured to drive the moving body in the first direction; a controller configured to generate a control input for driving the drive unit, based on a control deviation in accordance with position command information in the first direction of the moving body and position measurement information from the first or second measurement device, and a control parameter set to a certain value.

Abstract: In a lithography tool used in fabricating microelectronic devices, autofocus (AF) systems provide automatic image focusing before making exposures. To reduce production of erroneous results based on interaction of a beam of AF light with certain regions on lithographic substrates, a subject AF device has a sending unit and a receiving unit. The sending unit directs an AF light beam to the substrate, and the receiving unit receives AF light reflected from the substrate. The receiving unit has a system photodetector and a patterned optical element that receives AF light from the substrate and transmits a selected diffraction order(s) of said light. The system photodetector senses light of the selected diffraction order of reflected AF light while at least one additional photodetector detects divergent reflected AF light. Substrate areas exhibiting unusual amounts of divergent light may indicate a focus-error condition. The AF systems can be configured as fringe-projection or slit-projection AF systems.

Abstract: An apparatus comprising a first photonic device comprising a waveguide loop configured to guide a first light from a first location of a surface to a second location of the surface, and a second photonic device comprising a light source configured to provide the first light, and a first alignment coupler optically coupled to the light source and configured to optically couple to the waveguide loop at the first location, a second alignment coupler configured to optically couple to the waveguide loop at the second location, and a photodetector optically coupled to the second alignment coupler and configured to detect the first light when the waveguide loop is aligned with the first alignment coupler and the second alignment coupler, and generate, based on the detection and on the received light, an electrical signal.