Abstract: A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

Abstract: A method for autonomously driving a motor vehicle in a car wash to enhance comfort and safety includes detecting a passageway of the car wash and determine with vehicle sensors the vehicle position and the vehicle orientation of the vehicle relative to the passageway. The vehicle is subsequently automatically driven into the car wash based on the vehicle position and the vehicle orientation, and automatically stopped in a washing position. After washing is complete, a completion signal signaling completion of a working step of the car wash is received or detected by the motor vehicle. Finally, the motor vehicle is automatically driven out of the car wash in response to the completion signal.

Abstract: A solar panel mounting system may include a solar panel mounting assembly for mounting to a support structure. The solar panel mounting assembly may include a restraining element, a retaining element and a biasing assembly that supports the restraining and retaining elements. The support structure may include an upper surface and a lower surface spaced from the upper surface. The biasing assembly may further include a biasing element that resiliently urges the retaining element toward a securing element for supporting a solar panel that is positioned between the retaining element and the upper surface of the support structure, and resiliently urges the restraining element toward the lower surface of the support structure. A retention device may resiliently bias the solar panels of a solar panel assembly together on a support structure.

Abstract: An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

Abstract: In embodiments of an embedded light sensing component, a lens assembly includes a display component to display a user interface, such as when implemented in a wearable device. The lens assembly has a lens structure that covers the display component. The lens assembly also includes a light sensor that is implemented to sense ambient light in an environment proximate the lens structure, where the light sensor is embedded between the display component and the lens structure of the lens assembly.

Abstract: An on-axis dichroic guide system provides a telescope with an automated active control and focusing system for imaging celestial bodies. The on-axis dichroic guide system mainly comprises a system body, a scope port, a guide port, an imaging port, and an dichroic beam splitter. The scope port is positioned adjacent to the system body, and the guide port is positioned adjacent to the system body opposite to the scope port. The imaging port is positioned adjacent to the system body on an axis that is non-parallel to the axis containing the scope port and the guide port. The dichroic beam splitter is positioned with the system body. In addition, the dichroic beam splitter is arranged to reflect the visible portion of the input light towards the imaging port and to direct the infrared portion the input light towards the guide port.

Abstract: A solar panel mounting system may include a solar panel mounting assembly for mounting to a support structure. The solar panel mounting assembly may include a restraining element, a retaining element and a biasing assembly that supports the restraining and retaining elements. The support structure may include an upper surface and a lower surface spaced from the upper surface. The biasing assembly may further include a biasing element that resiliently urges the retaining element toward a securing element for supporting a solar panel that is positioned between the retaining element and the upper surface of the support structure, and resiliently urges the restraining element toward the lower surface of the support structure. A retention device may resiliently bias the solar panels of a solar panel assembly together on a support structure.

Abstract: An optical semiconductor device includes: a resonator end face; an optical waveguide; a window structure located between the resonator end face and the optical waveguide; and a vernier on the window structure and allowing measurement of length of the window structure along an optical axis direction.

Abstract: A method for determining an overlay offset may include, but is not limited to: obtaining a first anti-symmetric differential signal (?S1) associated with a first scatterometry cell; obtaining a second anti-symmetric differential signal (?S2) associated with a second scatterometry cell and computing an overlay offset from the first anti-symmetric differential (?S1) signal associated with the first scatterometry cell and the second anti-symmetric differential signal (?S2) associated with the second scatterometry cell.

Abstract: The present invention provides an imprint apparatus which performs an imprint process in which a resin on a substrate is cured, in a contact state in which a mold is kept in contact with the resin, to transfer a pattern onto the substrate, the apparatus including a stage configured to move upon holding the substrate, a detection unit configured to detect a first mark formed on the mold, and a second mark formed on the substrate, and a processing unit configured to perform alignment of the mold and the substrate in the contact state.

Abstract: A positioning system for controlling a relative position between a first component and a second component of a lithographic apparatus, wherein a position of each component is defined by a set of orthogonal coordinates, the positioning system including: a measuring device configured to determine an error in the momentary position of one of the components with respect to a setpoint position in a measurement coordinate; and a controller configured to control movement of the other component in a control coordinate based on the determined error; wherein the measurement coordinate is different from the control coordinate.

Abstract: A nozzle tip formed from a cylindrical body defining a longitudinal axis and a frustoconical body adjoining the cylindrical body on the longitudinal axis. The cylindrical body may be in fluid communication with the frustoconical body. The frustoconical body may end in a flat surface with a nozzle exit orifice which is transverse to the longitudinal axis. There may be a cutout at the edge of the frustoconical body and the flat surface. The flow cytometer system may also include a source of electromagnetic radiation for producing a beam incident upon the fluid stream and the particles and a detector for detecting light emitted or reflected from the particles within the fluid stream in response to the beam.

Abstract: In an example embodiment, apparatus for detecting position drift in a machine operation using a robot arm, the robot arm being for operation on a semiconductor substrate, the robot arm and the semiconductor substrate being configured for relative movement therebetween, the apparatus includes an input for receiving an input signal from a sensor mounted on the robot arm; a detector for detecting, from the input signal, a detection of there being a predefined distance between the robot arm and the semiconductor substrate; wherein the apparatus is configured to determine, from the detection, whether there has been position drift.

Abstract: A portable computer may include battery indicator light structures. Battery status information in the portable computer may be presented to a user using an array of light-emitting diodes or other light emitters. Light-emitting diodes may be mounted on a printed circuit board. A stiffener may provide the printed circuit board with rigidity. The printed circuit board may include a connector that allows the board to be connected to a main logic board. A switch on the printed circuit board may be actuated by a power button on the portable computer. An opaque member with an array of holes may be used to reduce light bleed between adjacent light-emitting diodes. Diffusing plastic may be mounted within the array of holes. Bumps in the diffusing plastic may mate with corresponding holes on a portable computer housing.

Abstract: An optical transceiver includes: a first WDM filter which reflects a first optical signal from a first light source and passes a second optical signal from a second light source; a first total reflection mirror which reflects the first optical signal to make it enter the first WDM filter; a second total reflection mirror which reflects the second optical signal; and a second WDM filter which reflects the second optical signal reflected by the second total reflection mirror to make it enter the first WDM filter. The first and second WDM filters are disposed on a light path, the first and second light sources are disposed back and forth along the light path on both sides thereof, the first and second total reflection mirrors are disposed outside the light path, and an incident angle of the first optical signal to the first WDM filter is smaller than 45 degrees.

Abstract: An optical module includes a substrate including a conductor pattern formed thereon, a photoelectric conversion element mounted on the substrate, and an optical coupling member for optically coupling the photoelectric conversion element to an optical fiber. A part of the conductor pattern on the substrate defines an engagement portion that engages with the optical coupling member so as to position the optical coupling member relative to the substrate.

Abstract: An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Abstract: The pipe alignment device is a device adapted for use with an existing pipe in order to project a laser line from a distal end of the existing pipe. The pipe alignment device includes an adaptor coupling that enables a leveling laser and spirit level to attach to the distal end of the existing pipe in order to determine a level alignment of the leveling laser. The leveling laser and the spirit level are mounted on an alignment housing that is able to attach onto the adaptor coupling. The adaptor coupling includes a plurality of set screws that secure the adaptor coupling to the distal end of the existing pipe as well as to secure the alignment housing to the adaptor coupling.

Abstract: An exposure apparatus is equipped with an encoder system which measures positional information of a wafer stage by irradiating a measurement beam using four heads installed on the wafer stage on a scale plate which covers the movement range of the wafer stage except for the area right under a projection optical system. Placement distances of the heads here are each set to be larger than width of the opening of the scale plates, respectively. This allows the positional information of the wafer stage to be measured, by switching and using the three heads facing the scale plate out of the four heads according to the position of the wafer stage.

Abstract: Electronic devices may include light sensors. A light sensor may be an ambient light sensor that is mounted adjacent to an aperture in an opaque structure. An ambient light sensor may include active light sensor elements located adjacent to the aperture and inactive light sensor elements located adjacent to the opaque structure. Signal processing circuitry may be interposed between the light sensor elements and a summing circuit that sums light signals from the light sensor elements to form an ambient light signal. The signal processing circuitry may include a switch and an amplifier associated with each light sensor element. The switch associated with each element may be used to selectively activate or inactivate that element. The amplifier associated with each element may be used to amplify the light signal from that element by a gain factor that depends on the location of that element with respect to the aperture.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: A projection aligner comprises a projection optical system for radiating a luminous flux including ultraviolet rays onto a photomask, and projecting said luminous flux which has passed through the photomask onto a substrate to which photoresist is applied; a substrate table for mounting the substrate, and a light blocking means for covering the peripheral portion of the substrate to block luminous flux. The light blocking means (80) includes a first light blocking member (84) and a second light blocking member (86) each having a substantially semicircular opening, and moving means (82, 83) for moving the first light blocking means and the second light blocking means approaching each other and away from each other. As the first light blocking member and the second light blocking member are moved to approach each other, the first light blocking member and the second light blocking member form an annular shape and cover the peripheral portion of the substrate (CB).

Abstract: An exclusion region of interest imaging overlay target includes a self-symmetric target structure including two or more pattern elements, and an additional target structure including two or more pattern elements, wherein each of pattern elements of the additional target structure is contained within a boundary defined by one of the pattern elements of the self-symmetric target structure, wherein the self-symmetric target structure is characterized by a composite exterior region of interest, wherein the composite exterior region of interest is formed by removing two or more exclusion zones corresponding with the pattern elements of the additional target structure from an exterior region of interest encompassing the self-symmetric target structure, wherein each of the pattern elements of the additional target structure is characterized by an interior region of interest, wherein the self-symmetric target structure and the additional target structure are configured to have a common center of symmetry upon alignme

Abstract: A plurality of overlay errors in a structure is determined using a target that includes a plurality of diffraction based overlay pads. Each diffraction based overlay pad has the same number of periodic patterns as the structure under test. Additionally, each diffraction based overlay pad includes a programmed shift between each pair of periodic patterns. The pads are illuminated and the resulting light is detected and used to simultaneously determine the plurality of overlay errors in the structure based on the programmed shifts. The overlay errors may be determined using a subset of elements of the Mueller matrix or by using the resulting spectra from the pads.

Abstract: In a method of determining the focus of a lithographic apparatus used in a lithographic process on a substrate, the lithographic process is used to form a structure on the substrate, the structure having at least one feature which has an asymmetry in the printed profile which varies as a function of the focus of the lithographic apparatus on the substrate. A first image of the periodic structure is formed and detected while illuminating the structure with a first beam of radiation. The first image is formed using a first part of non-zero order diffracted radiation. A second image of the periodic structure is formed and detected while illuminating the structure with a second beam of radiation. The second image is formed using a second part of the non-zero order diffracted radiation which is symmetrically opposite to the first part in a diffraction spectrum.

Abstract: A double-sided maskless exposure system and method consists of light sources which includes two light wavelength segments, maskless optical engines in which a 2D spatial light modulation (spatial light modulator) device, such as DMD, is generating a plurality of pixel array of the pattern, vision system, moving substrate and computer control system. The double-sided maskless exposure system at least includes two maskless optical engines with auto-calibration function which can correct any alignment error in-line. Each optical engine is for each side of the substrate. The optical engines are aligned each other in pairs and are simultaneously patterning on each side of the moving substrate. The system also includes a manipulator for moving, stepping or scanning the optical engines, relative to the substrate so that it can create a contiguous whole image on the both sides of the subject.

Abstract: A drive system drives a movable body, based on measurement results of a first measurement system which measures the position of the movable body in an XY plane by irradiating a measurement beam from an arm member on a grating placed on a surface parallel to the XY plane of the movable body. In this case, because a configuration in which the arm member irradiates a measurement beam on the grating is employed, there is no adverse effect due to the drive of the moving body, unlike the case when an encoder system is arranged on a stage surface plate. Accordingly, it becomes possible to drive the movable body with good precision.

Abstract: The invention relates to detecting targets located within patterns. The invention operates in the pupil plane by filtering the fourier transform from the surrounding pattern. In particular the method includes performing a fourier transform on reflected radiation data to form fourier transform data; removing portions of the fourier transform data which correspond to the target to form reduced fourier transform data; interpolating the portions of the reduced fourier transform data which were removed, to form product fourier transform data; and subtracting the product fourier transform data from the fourier transform data.

Abstract: A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation.

Abstract: A method of measurement of at-resolution overlay offset may be implemented in a scatterometer. At least three targets are provided on a wafer, each target comprising a first marker grating and a second interleaved marker grating and each target having a different overlay bias between its first and second marker. The first and second markers are provided by subsequent lithography steps in a double patterning lithographic process. The targets are measured with a scatterometer and for each target a measured CD of at least one of the markers is determined using reconstruction. The CD of the first marker may be fixed in the reconstruction. The measured CDs and at least one of the overlay biases is used to determine an overlay result corresponding to a minimum measured CD. The overlay result may be determined by fitting a function such as a parabola to the measured CDs and the overlay biases and determining the overlay at the minimum of the fitted function.

Abstract: According to one embodiment, a measurement mark includes: a first line pattern, first lines extending in a first direction, the first lines arranged in a second direction in the first line pattern, the first line pattern capable of forming a first moire pattern by overlapping with an arrangement pattern including a pattern, and a first polymer and a second polymer being alternately arranged in the pattern; a second line pattern, second lines extending in the first direction, the second lines being arranged in the second direction in the second line pattern, the second line pattern capable of forming a second moire pattern by overlapping with the arrangement pattern; and a reference pattern with a reference position configured to assess a first shift amount from the reference position of the first moire pattern and a second shift amount from the reference position of the second moire pattern.

Abstract: A method and an apparatus are provided to measure a position of a mark with a less measurement error caused by a variation in a wafer process condition. The mark is illuminated with light and an image of the mark is formed, via an optical system, in a light receiving surface of a sensor. The image of the mark is sensed and image data thereof is acquired by the sensor. Correction data of a fundamental frequency and a high harmonic of the image data is set based on information associated with a shape of the mark, an imaging magnification of the optical system, and an imaging area of the sensor. The image data is corrected using the correction data, and the position of the mark is calculated using the corrected image data.

Abstract: A maskless exposure apparatus which precisely and rapidly measures positions of spot beams of a plurality of optical systems by calculating positions of respective BMSs using a plurality of FMs engraved on an FBA on a movable table. The centers of the respective BMSs are aligned with the centers of random FMs of the plurality of FMs. Thereafter, positions of spot beams irradiated from the plurality of optical systems are quickly and precisely measured using the positions of the respective BMSs and the positions of the FMs measured by the BMSs, thereby more quickly generating mask data to execute maskless exposures.

Abstract: The throughput of the alignment in an alignment apparatus is improved. There is provided an alignment apparatus for aligning a substrate having an alignment mark, including a first aligner that aligns the substrate to a first reference position, a second aligner that aligns a substrate holder to a second reference position before the substrate holder holds the substrate, and a position detector that detects a position of the alignment mark of the substrate after the substrate holder holds the substrate.

Abstract: Among other things, one or more systems and techniques for scanner alignment sampling are provided. A set of scan region pairs are defined along a periphery of a sampling area associated with a semiconductor wafer. Alignment marks are formed within scan regions of the set of scan region pairs, but are not formed within other regions of the sampling area. In this way, scan region pairs are scanned to determine alignment factors for respective scan region pairs. An alignment for the sampling area, such as layers or masks used to form patterns onto such layers, is determined based upon alignment factors determined for the scan region pairs.

Abstract: An exposure apparatus according to an embodiment controls the positioning between layers using an alignment correction value calculated on the basis of lower layer position information of a lower-layer-side pattern and upper layer position information of an upper-layer-side pattern. The lower layer position information includes alignment data, a focus map, and a correction value which is set on the basis of the previous substrate. The upper layer position information includes alignment data, a focus map, and a correction value which is a correction value for the positioning and is used when the upper-layer-side pattern is transferred.

Abstract: The present disclosure provides a telecentric optical assembly comprising a first portion of a telecentric optical link including a first kinematic mount having alignment structures, where the first kinematic mount can be attached to a first substrate having a first array of active optical elements; and a second portion of the telecentric optical link including a second kinematic mount having recesses configured to mate with the alignment structures, where the second kinematic mount can be attached to a second substrate having a second array of active optical elements. Additionally, the first and second kinematic mounts, when mated, can align optical beams between the first array of active optical elements and the second array of active optical elements.

Abstract: In a lithographic apparatus, a slip of a patterning device relative to a support, the support constructed to support the patterning device, may be provided by measuring a position of the support relative to a first structure of the lithographic apparatus; measuring a position of the patterning device relative to a second structure of the lithographic apparatus; determining a correlation between the position of the patterning device and the position of the support from the measured position of the support, the measured position of the patterning device, and the mutual positions of the first and second structures; and deriving from the correlation a slip of the patterning device relative to the support. The structure may include a projection system to project a radiation beam patterned by the patterning device. The projection system may be connected to a frame, such as a metrology frame of the lithographic apparatus.

Abstract: To perform high-speed and highly accurate measurement by setting desired measuring conditions for each measuring object. In an alignment sensor of exposure apparatus, in the case of performing position measurement for a plurality of sample shots, measurement is performed by changing the measuring conditions, in response to a measuring axis direction, a mark or a layer whereupon a mark to be measured exists. At that time, for the measuring objects to be measured under the same measuring conditions, for example, a position in a Y axis direction and a position in an X axis direction, measurement is continuously performed. When the measuring condition is changed, a baseline value is remeasured. The changeable measuring conditions are wavelength of measuring light, use and selection of a retarder, NA and ? of an optical system, a light quantity of measuring light, illumination shape, signal processing algorithm, etc.

Abstract: An optical reader for interrogating an optical analyte sensor includes a housing, comprising in its interior: at least one light source, a detector, and a programmable logic device. The housing has a registration feature configured to align the optical reader with an optical analyte sensor. Methods for confirming alignment of such optical readers are also disclosed.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: Methods and algorithms are provided, as well as new metrics for misalignment of apertures with respect to the optical axis of a metrology system. The methods comprise aligning aperture(s) to an optical axis of a scatterometry metrology tool using correction term(s) derived by minimizing an overlay variation measure calculated with respect to overlay measurements of a periodic structure. These methods result in highly sensitive misalignment metrics, which may be used in calibration stages or on the fly to align the system's apertures, and enable reducing target size due to the resulting enhanced alignment accuracy.

Abstract: An apparatus detects a pre-aligning element at a wafer. The wafer has the pre-aligning element at a wafer edge. The apparatus includes a sensor arrangement and an evaluation unit. The sensor arrangement is configured to illuminate subsequent edge portions of the wafer edge, to receive transmitted fractions and reflected fractions of the illumination from the illuminated edge portions with an illumination sensor, and to output a first and a second sensor signal. The first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination. The evaluation unit is configured to evaluate the first sensor signal and to determine a first position information with respect to a coarse position of the pre-aligning element if the first sensor signal indicates that the transmitted fractions of the illumination has reached a predetermined threshold value.

Abstract: An exposure apparatus for forming a predetermined pattern on a substrate by using exposure light, includes a stage apparatus which is movable with respect to an optical axis of the exposure light; a light-transmissive member provided at the stage apparatus, wherein a liquid is supplied on an upper surface of the light-transmissive member; and a measurement device which is settable below the light-transmissive member when measurement using the measurement device is performed. Leakage or entrance of a liquid used for exposure into an optical measurement device such as a wavefront aberration measurement device can be prevented, thereby enabling preferable optical adjustment such as imaging performance or optical characteristics.

Abstract: A position measurement system includes a first part and a second part for determining a position of a first member relative to a second member by providing a position signal representing a position of the first part relative to the second part, and a computational unit comprising an input terminal for receiving the position signal. The computational unit is configured to, in use, apply a conversion to the position signal to obtain a signal representing a position of the first member relative to the second member; and apply an adjustment to the conversion to at least partly compensate for a drift of the first part or the second part or both. The adjustment is based on a predetermined drift characteristic of the first part or the second part or both respectively. The predetermined drift characteristic includes one or more base shapes of the first part and/or the second part.

Abstract: A semiconductor device includes: a semiconductor chip that has a first connection terminal for wiring connection; a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.

Abstract: An exposure method comprises: a first detection step of detecting a position of a first mark by a first scope; a second detection step of detecting a position of a second mark by a second scope having a magnification higher than the first scope; a first calculation step of calculating a first correction value based on the detection results obtained in the first and second detection steps; a third detection step of detecting a position of a third mark by the second scope after the substrate is aligned based on the first correction value calculated in the first calculation step; a second calculation step of calculating a second correction value based on the detection results obtained in the second and third detection steps; and an exposure step of exposing the substrate after the substrate is aligned based on the second correction value calculated in the second calculation step.

Abstract: Various metrology systems and methods are provided. One metrology system includes a light source configured to produce a diffraction-limited light beam, an apodizer configured to shape the light beam in the entrance pupil of illumination optics, and optical elements configured to direct the diffraction-limited light beam from the apodizer to an illumination spot on a grating target on a wafer and to collect scattered light from the grating target. The metrology system further includes a field stop and a detector configured to detect the scattered light that passes through the field stop. In addition, the metrology system includes a computer system configured to determine a characteristic of the grating target using output of the detector.

Abstract: Catadioptric projection objective (1) for microlithography for imaging an object field (3) in an object plane (5) onto an image field (7) in an image plane (9). The objective includes a first partial objective (11) imaging the object field onto a first real intermediate image (13), a second partial objective (15) imaging the first intermediate image onto a second real intermediate image (17), and a third partial objective (19) imaging the second intermediate image onto the image field. The second partial objective is a catadioptric objective having exactly one concave mirror and having at least one lens (L21, L22). A first folding mirror (23) deflects the radiation from the object plane toward the concave mirror and a second folding mirror (25) deflects the radiation from the concave mirror toward the image plane. At least one surface of a lens (L21, L22) of the second partial objective has an antireflection coating having a reflectivity of less than 0.

Abstract: A method, apparatus, and system for controlling from a first location a laser at a second location are disclosed. Laser orientation data is determined at a first location. The laser orientation data is communicated to the second location. Video data is received from the second location that includes imagery of a laser beam emitted by a laser, and the imagery is presented on a display at the first location.