Abstract: Method and apparatus for optically aligning, for subsequent assembly into discrete packages, opto-mechanical components, e.g., optical filters, and lenses for directing direct light to and from those opto-mechanical components. The apparatus comprises a light source for producing a beam of light emulating the light which exists in the assembled package of components during use, manipulator means for supporting a lens and a selected opto-mechanical component in tandem along the optical axis of the light beam and for moving the lens and selected opto-mechanical component along X and Y axes perpendicular to that optical axis, and a machine vision system having imaging means for recording images of the light beam and the opto-mechanical component and being adapted to control operation of the manipulator means so as to cause the latter to shift the lens and opto-mechanical component along the X and/or Y axes to achieve optical alignment.

Abstract: Disclosed herein is a light modulating apparatus comprising first and second two periodic structures each having a period smaller than the wavelength of light emitted from a light source, and a moving means for relatively moving the two periodic structures, wherein the surface of the first periodic structure is brought near to the surface of the second periodic structure to a space not longer than the wavelength to arrange them in a state opposed to each other, the light incident on the first periodic structure is converted into near-field light by the first periodic structure, the converted near-field light is transmitted through the second periodic structure and converted into propagation light by scattering the near-field light on the back surface of the second periodic structure, and the intensity of the propagation light is modulated by relatively moving the two periodic structures by the moving means.

Abstract: A wafer alignment sensor uses a microlens array for sensing the position of an alignment pattern on a semiconductor wafer. Phase interactions between adjacent microlenses are suppressed—or alternatively, enhanced—by inducing a &pgr;/2 optical phase shift on alternate microlenses and by optimizing the optical transmittance profile of the alignment system's projection aperture.

Abstract: A system for aligning a mask and a product with high precision, featuring a means for supporting a product in a fixed position and a mask adjacent to the product so that the mask is movable relative to the product. A plurality of computer controlled plungers push the surrounding mask frame into alignment. A computer is used to determine the relative position of the mask and the product prior to alignment; and that, to achieve proper alignment of the mask and the product, and determines the distance that the mask must be moved.

Abstract: Temperature control data necessary to keep the mirror figure constant is measured under the same conditions as those of actual exposure. In actual exposure, the temperature is controlled using the data, a mirror heated by irradiation of exposure light is cooled, and any figure change is suppressed. This arrangement provides an exposure apparatus capable of stable exposure while suppressing mirror deformation caused by heat generation upon absorption of exposure light.

Abstract: A positioning method and apparatus for positioning a substrate on a substrate stage which is movable in a predetermined direction (Y direction). In the positioning method, a relationship between a longitudinal direction (X′ direction) of a band-shaped light beam irradiated onto the substrate and the predetermined direction (Y direction) for determining the position of the substrate and the predetermined direction is measured and the substrate is positioned on the substrate stage based on the relationship between said longitudinal direction of the band-shaped light beam and the predetermined direction.

Abstract: The present invention aims at reducing the number of scanning exposure and at enhancing throughput. the above-mentioned objective is achieved by allowing a substrate 14 to be placed in sideways with respect to a substrate holder 15a (placing the longer sides of the substrate in parallel to the shorter sides of the substrate holder) depending on the size of the apparatus and the size of the substrate 14. It is acceptable even when areas other than an effective exposure area of the substrate 14 should project out from the substrate holder.

Abstract: Microsystems or micro-biotechnical components (1) are aligned, assembled, and dispensed onto a substrate (2). An image of a microsystem receiving region of the substrate is focused along hollow cones onto an image plane (23). The microsystem (1) is positioned within the hollow cones such that the image passes around it unaffected. A semi-transparent plate (24) permits the substrate image to pass therethrough and reflects an image of a surface of the microsystem which is facing the substrate to be reflected and pass along the same hollow conical paths to the image plane. In this manner, the images of the substrate and the micro component are superimposed. A mechanical device (11) adjusts the position of the microsystem until the images of the facing surfaces of the microsystem and the substrate are brought into preselected alignment.

Abstract: An oscillation mechanism includes a measuring device for measuring a position of an object, a movable stage being arranged so as to be positioned with respect to the object, a driving mechanism for moving the stage, a control unit for controlling the driving mechanism on the basis of an output of the measuring device, an oscillation element mounted on the stage, which is arranged to be oscillated with respect to the stage, and an intermediate element having a predetermined mass, which is disposed between the stage and the oscillation element. The intermediate element is (i) connected to the oscillation element through a first spring element having a predetermined spring constant, and (ii) connected to the stage through a second spring element having a predetermined spring constant. The oscillation mechanism also includes an oscillation unit for oscillating the oscillation element by oscillating the intermediate element at a predetermined frequency.

Abstract: An image forming apparatus for sequentially superimposes images formed by a plurality of image forming stations for forming images of different colors, respectively, on a transferring material born and transported by a transferring material transporting member, which forms a misregister detection mark on the transferring material transporting member, illuminates to read the mark, calculates a misregister amount of the read misregister detection mark, and corrects the misregister of an image based on calculated results, wherein the apparatus adjusts an illuminating light amount according to a color of a misregister detection mark.

Abstract: An exposure method according to the present invention includes a first step of forming on a substrate an alignment mark including a concave and convex pattern; a second step of forming a coat over said alignment mark and the other area on said substrate; a third step of flattening said coat; and a fourth step of applying a photosensitive material on said coat flattened by said third step and projecting a mask pattern thereto. The alignment mark is formed by said concave and convex pattern arranged with a pitch which is smaller than the predetermined value between adjacent convex portions having a width of not less than a predetermined value.

Abstract: A method and illumination optical system forms a modified illumination configuration on an optical integrator so that a secondary light source having a desired modified illumination configuration is formed and light loss is minimized. A light beam shape changing element that diffuses illumination in a plurality of directions, and an angular light beam forming element that forms a plurality of light source images operate together to create a modified illumination configuration on the optical integrator. Since the secondary light source has a desired modified illumination configuration, an aperture stop used to restrict the size and/or shape of the secondary light source blocks only a small amount of illumination, or can be eliminated altogether.

Abstract: An apparatus for exposing a pattern, formed on a mask, on each of a plurality of partitioned areas on a photosensitive substrate by a step-and-repeat scheme includes a projection optical system for projecting the pattern of the mask on the photosensitive substrate, a substrate stage for holding the photosensitive substrate and two-dimensionally moving the photosensitive substrate within a plane perpendicular to the optical axis of the projection optical system, a detection unit for projecting a pattern image having a predetermined shape on the photosensitive substrate and photoelectrically detecting light reflected by the photosensitive substrate to detect a position at each of a plurality of points on the photosensitive substrate along the optical axis of the projection optical system, and a measurement unit for, when each of a plurality of measurement points in a partitioned area on which a pattern of the mask is to be exposed next coincides with or approaches the pattern image, detecting an offset amount b

Abstract: A control system adjusts the exposure of a wafer according to the transfer error of a pattern line width caused when a certain integrated exposure over the whole shot areas is made a desired value when a pattern is transferred to a wafer and according to information corresponding to the desired value of the integrated exposure stored in a storage device, then performing scanning exposure. As a result, influences such as of fog exposure due to flare are mitigated, and the uniformity of line width distribution with high precision is ensure over the shot regions on the wafer, achieving pattern transfer to each shot region.

Abstract: An illuminance measurement apparatus of the present invention is comprised of a chassis (20) having a detection surface (22) formed with a light receiving aperture (21) and a light receiving element having a light receiving surface arranged at a position corresponding to the light receiving aperture (21) in the chassis (20), wherein the chassis (20) is provided with a reflection surface (23) for detection light for detecting at least one of the position and posture of the detection surface (22).

Abstract: A recovery system for recovering alignment marks obscured by a deposited obscuring layer. The system includes an imaging system to locate the obscured alignment marks. The located alignment marks are recovered through the obscuring layer to use the alignment marks to align patterned layers of a fabricated structure.

Abstract: A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.

Abstract: Disclosed herein is a light modulating apparatus comprising first and second two periodic structures each having a period smaller than the wavelength of light emitted from a light source, and a moving means for relatively moving the two periodic structures, wherein the surface of the first periodic structure is brought near to the surface of the second periodic structure to a space not longer than the wavelength to arrange them in a state opposed to each other, the light incident on the first periodic structure is converted into near-field light by the first periodic structure, the converted near-field light is transmitted through the second periodic structure and converted into propagation light by scattering the near-field light on the back surface of the second periodic structure, and the intensity of the propagation light is modulated by relatively moving the two periodic structures by the moving means.

Abstract: An exposure apparatus has a triangular shaped stage which is movable in a two-dimensional plane while holding a substrate. The stage has a reflecting surface provided on a side face of the stage so that the surface extends in a specific direction intersecting Y axis and X axis. An interferometer radiates a beam onto the reflecting surface to measure a position of the stage in a direction perpendicular to the specific direction. Using the measured position and an angle of the specific direction, a calculator can calculate the position of the stage on rectangular coordinate system defined by X and Y axes. The size and weight of the stage can be reduced, and the throughput of the exposure apparatus is improved.

Abstract: An optical alignment system is provided for aligning an optical module of the type which is suitable for use in an optical device. The system includes a reference base having a registration feature that aligns with a registration feature of the optical module. An optical sensor senses an optical characteristic of the optical element and optical element manipulator moves the optical element relative to the registration features of the optical module. A controller operates the optical element manipulator.

Abstract: A technique for dynamic optical alignment precisely adjusts the relative position of a first linear arrangement with respect to a second linear arrangement by correcting rotational misalignment about the vertical axis, establishing an optimal displacement therebetween along an optical axis, correcting rotational misalignment about the optical axis, and setting an optimum displacement therebetween on the vertical axis. The technique is carried out semiautomatically using a computer to operate actuators to control movement of the first linear arrangement, while the second linear arrangement is fixedly disposed on a substrate. When optimal alignment has been established, the first linear arrangement is fixedly attached to the substrate.

Abstract: A device for exposing a peripheral area of a wafer having a photoresist applied thereon is provided in which an irradiation area is prevented from moving in a V-shape in a notch area of the wafer and unnecessary exposure of the wafer is prevented. The device includes an edge determination device, a device for moving the edge determination device, a irradiation moving device and a controller to control the edge determination moving device such that the amount of light received by the light receiving part becomes constant. The controller stops operation of the irradiation moving device when receiving a signal from the edge determination device showing the start of the notch and restarts operation after a given time has passed, or upon receiving a signal indicating the end of the notch.

Abstract: To provide a package structure for securing a satisfactory optical coupling between an optical device arranged beforehand on a printed board and an optical device newly mounted on the particular printed board. Positioning LDs 41a and 41b are arranged on a printed board 1. A sensing PD 42a for receiving the optical signal emitted from the positioning LD 41a and a sensing PD 42b for receiving the optical signal emitted from the positioning LD 41b are arranged in an OEIC package 11 mounted on the printed board.

Abstract: A method for determining the alignment of a rotational body. The method includes the steps of locating a sensor on an outer surface of a rotational body, targeting a reference laser beam at the sensor such that the reference laser beam intersects the sensor at a reference coordinate, and recording the reference coordinate. The method further includes rotating the rotational body about the axis of rotation of the rotational body, targeting a measurement laser beam at the sensor such that the measurement laser beam intersects the sensor at a measurement coordinate, and comparing the reference coordinate and the measurement coordinate.

Abstract: A laser level with a housing composed of two parts for storing the laser level in a protected manner, wherein the laser level is composed of an instrument body, bubble levels in the instrument body, a laser beam generator with lens system and a fixed leg and two vertically adjustable legs. One of the housing parts is provided with receptacles for the legs, wherein the receptacles are integrally formed at an inner side of the bottom of the housing part. The other housing part has receptacles for the legs, wherein the receptacles are integrally formed in an outer side of a cover of the housing part. At least one stand thread is provided at an inner side of the outer housing part.

Abstract: An exposure method for forming on a wafer coated with a photo resist device patterns comprised of dense patterns and isolated patterns as components, including a first step of transferring first patterns comprised of dense patterns of shapes corresponding to the device patterns and dense patterns formed by patterns of shapes corresponding to the isolated patterns of the device patterns plus a plurality of auxiliary patterns on the wafer by ½ of the appropriate amount of exposure as determined by the sensitivity of the photo resist, and a second step of transferring second patterns comprised of dense patterns of shapes corresponding to the dense patterns of the device patterns and isolated patterns of shapes corresponding to the isolated patterns of the device patterns on the photosensitive substrate by ½ of the appropriate amount of exposure.

Abstract: A method and apparatus is provided to identify material boundaries and assist in the alignment of pattern masks in semiconductor fabrication. The invention probes a layer step or feature edge of an individual wafer using spectroscopic reflectance to detect a change in the reflectance spectral response. In integrated circuit fabrication, a wafer is subjected to wafer fabrication processes to produce a number of individual layers on a semiconductor substrate. During processing a reflectometer, a light emitting and collecting device, emits a specific range of electromagnetic wavelengths which are reflected from the wafer surface. The intensity of the reflected light is monitored for changes which signify the detection of a feature edge. The use of a specific range of electromagnetic wavelengths with the reflectometer allows the apparatus to detect feature edges covered by visibly-opaque material.

Abstract: When scanning exposure is performed by illuminating an illumination area on a mask with a pulse light from a pulse light source, synchronously moving the mask and a photosensitive object, and transferring a pattern of the mask onto the photosensitive object, a main controller performs dose control on a high sensitivity range where scanning velocity of the mask and the photosensitive object is set at a maximum so as to maintain an exposure pulse number at a minimum exposure pulse number. A pulse light source, which pulse energy is variable within a predetermined range, maintains the exposure pulse number at the minimum exposure pulse number within the variable range. The pulse light source comprises a housing in which an outgoing opening that emits a light is formed, a plurality of units housed in the housing, and a drive unit that moves the plurality of units, partially or in total inside the housing.

Abstract: The projection exposure apparatus can include an illumination optical system for illuminating a portion of a mask pattern on a mask with an exposing radiation flux of a predetermined shape, a fixed support, a projection optical system fixed to the fixed support for projecting the image of the illuminated portion of the mask pattern onto a substrate, and a carriage for integrally holding the mask and the substrate, the carriage being movable in a predetermined direction with respect to the projection optical system successively exposing the substrate with the image of the mask pattern formed by the exposing radiation flux.

Abstract: In a lithographic apparatus having a movable object table in vacuum, an interferometer-based alignment system for detecting the position of that object table has a passive part in vacuum and an active part outside the vacuum chamber. The active part contains the beam generator, e.g. a laser, and the electronic detectors whilst the passive part contains the illumination and imaging optics. The two parts are coupled by optical fibers. The interferometer may make use of different diffraction orders from measurement and reference gratings and the order separation may be included in the passive part.

Abstract: A variable transmission focal mask to compensate lens heating is disclosed. A semiconductor fabrication alignment and exposure equipment includes an exposure and alignment unit, a variable transmission mask, and a stage. The unit has a light source and a lens. The mask is under the lens, and at least indirectly measures focus. The mask further can adjust the focus in real time in response to determining that the focus is out of specification. A wafer is placed on the stage for exposure to the light source through a mask or a reticle. The variable transmission mask normally has a substantially high transmission of light rating that can be adjusted downward to adjust the focus. For example, the mask can be a liquid crystal display (LCD) that can be darkened to so reduce its transmission of light rating.

Abstract: To provide a package structure for securing a satisfactory optical coupling between an optical device arranged beforehand on a printed board and an optical device newly mounted on the particular printed board. Positioning LDs 41a and 41b are arranged on a printed board 1. A sensing PD 42a for receiving the optical signal emitted from the positioning LD 41a and a sensing PD 42b for receiving the optical signal emitted from the positioning LD 41b are arranged in an OEIC package 11 mounted on the printed board.

Abstract: An alignment system for aligning a reticle having a pattern and an alignment mark with a photosensitive substrate to which the pattern of the reticle is to be transferred, is disclosed. The alignment system includes a movable substrate stage for holding the substrate, and a light-transparent plate having a mark for relative positioning with respect to at least one of the reticle and the substrate stage, wherein positioning of at least one of the reticle and the substrate stage is performed on the basis of the mark provided on the light-transparent plate.

Abstract: A lithographic projection apparatus including at least one of a radiation system and a projection system having at least one optical member, wherein the optical member is supported by and connected to a mounting frame which at least partially encloses the optical member and which is connected to at least one other component of at least one of the radiation system and the projection system.

Abstract: Highly accurate focus adjustment is realized at a high throughput irrelevant to reflection characteristics of a mask. A second optical system observes a first object and it is capable of observing a second object via the first object and a first optical system. A focusing position of the second optical system is adjusted to a predetermined plane on the first object. In Step S8, a predetermined plane on the second object is adjusted to a position which is optically conjugate with the predetermined plane on the first object with respect to the first optical system. In Step S10, the focusing position of the second optical system is adjusted to the predetermined plane on the second object via the first optical system.

Abstract: A multipass cavity system employs a beam of light that is reflected back and forth between reflective surfaces a plurality of times, illuminating a different portion of the field of view with each pass until the light exits the reflection cavity. The “recycling” of the light beam substantially improves the SNR of the detection system. The present invention is a beam alignment system for use in such a multipass cavity, correcting misalignment in four degrees of freedom; the horizontal and vertical axes, and angle in each of the vertical and horizontal axes. Angular or positional errors lateral to the direction of the beam can dramatically affect performance. The present invention enables the measurement and adjustment of each degree of freedom independently, in order to make beam steering corrections and maintain optical alignment. This is accomplished in an automated, closed-loop feedback control system.

Abstract: An illumination optical system includes an optical integrator for forming a secondary light source by use of light from a light source, an optical system for directing light from the light source toward the integrator, and a condensing optical system for condensing light from the optical integrator upon a surface to be illuminated.

Abstract: An apparatus for measuring rectilinear motion and rotation angle errors of a rectilinearly moving body having a horizontal, parallel two-surface mirror positioned in a horizontal plane and including two reflection mirrors whose reflection surfaces face each other and are spaced by a distance (2)d and a vertical, parallel two-surface mirror positioned in a vertical plane and including two reflection mirrors whose reflection surfaces face each other and are spaced by a distance (2)d, and also has a light source for generating a laser beam, semi-transparent mirrors for splitting the laser beam into two laser beams, optical path changing reflection mirrors for changing a direction of each laser beam, and position sensors for detecting positions of the laser beam reflected from the horizontal, parallel two-surface mirror and the vertical, parallel two-surface mirror, respectively fixed to positions outside of the rectilinearly moving body.

Abstract: An alignment method includes the steps of (i) in order to expose a pattern of a first object onto a second object, measuring positions of a plurality of marks on the second object with a mark detection device and aligning the first and second objects with each other, and (ii) measuring shapes of the plurality of marks on the second object, thereby obtaining offsets that should be reflected in the measured values of the mark detection device. The shapes of the plurality of the marks are measured with a shape measurement device with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement device with a possibility of coming into contact with the mark.

Abstract: A lithographic tool system for generating an interferometric pattern of light using a plurality of exposure beams includes a processor coupled to a positioning device. The processor receives a selected period for the interferometric pattern of light, and generates an angular control signal and a translational control signal in response to the selected period. The positioning device translates an exposure beam in response to the translational control signal, and rotates the exposure beam in response to the angular control signal.

Abstract: A system and method of determining alignment error between lithographically produced integrated circuit fields on the same and different lithographic levels comprises creating a first and second level field layers each having a plurality of integrated circuit fields and associated set of metrology structures adjacent and outside each integrated circuit field. In each level, a metrology structure associated with one integrated circuit field is located to nest with another metrology structure associated with an adjacent circuit field when the both are properly aligned on the same lithographic level.

Abstract: The present invention relates to wafer alignment. A reticle is employed which includes, a design, and a first and second set of scribe marks. The first and second sets of scribe marks have an associated symmetry relative to the reticle design. The design and scribe marks are printed at selected field locations on a surface layer of the wafer. The first and second sets of scribe marks as printed at adjacent fields on the surface layer of wafer form a composite set of scribe marks. The symmetric relationship between the first and second sets of scribe marks results in the composite set of scribe marks substantially negating print errors of the marks due to reticle rotation and/or lens magnification with respect to a geometric reference point of the composite set of scribe marks. The employment of the composite set of scribe marks, such as to locate a corresponding virtual alignment mark, substantially facilitates mitigation of overlay error in wafer alignment.

Abstract: A method of determining overlay error comprises creating a first and second layers of an integrated circuit, each having an active circuit feature and an adjacent kerf area. Each kerf area includes a first measurement feature separated from and corresponding substantially to the layer's active circuit feature. The circuit and kerf areas of the layers are substantially superimposed. The distance of separation between the active circuit feature and the layer kerf measurement feature in each layer in the direction of overlay error is the same. The second layer kerf measurement feature is displaced from the first layer kerf measurement feature in a direction perpendicular to the direction that the overlay error is to be determined. Overlay error is determined by measuring distance of separation in the direction of overlay error between the common points of reference of each of the first and second layer kerf measurement features.

Abstract: An illumination optical system, exposure apparatus, and microdevice manufacturing method where the illumination optical system has provided in one or more optical paths of actinic light IL emitted from one or more actinic light sources two or more filter members having transmittance distributions substantially definable by one or more functions comprising one or more functions of order three or higher with respect to transmittance as a function of position in one or more directions substantially transverse to one or more optical axes.

Abstract: An interferometer measuring system comprising two moveable members and a reference member that may have significantly less movement, the group having a number of attached measurement mirrors, interferometers for measuring position and two optical support blocks for the interferometers. The interferometers are used to determine the measured optical path lengths to each of the moveable members and reference member and these positions are used to calculate the misalignment, or error in the relative positions of the moveable members with respect to the reference member. This calculated error is then used to correct the misalignment by moving the appropriate members in the manner directed by the calculation.

Abstract: It is an object to make it possible to easily carry out alignment of an exposure apparatus. A process for forming a latent image, which comprises irradiating a master plate having a pattern with exposure light and irradiating a substrate coated with a resist with the exposure light transmitted through said master plate or reflected on said master plate via a projection optical system, thereby forming the image of the pattern on the substrate, wherein the image of said pattern is formed on said substrate by making use of a change in color of a predetermined substance, included in said resist, that changes color upon irradiation with said exposure light.

Abstract: An optical system for detecting and coupling light to optical devices, and a method for aligning and calibrating the system. The system includes positioning stages and fiber sensors. The fiber sensors are used to detect the positions of calibration pieces and other sensors in a variety of configurations. From these detected positions, any misalignment of the sensors or positioning stages may be calculated and corrected for. The fiber sensors calibrate the system.

Abstract: There is provided a method for aligning a semiconductor wafer and a mask. A semiconductor wafer is provided having an alignment mark formed thereon. A mask is provided having a pattern formed thereon. The mask is illuminated so as to create a bright spot thereon by a 0_&pgr; phase conflict. The alignment mark is aligned with the bright spot, so as to align the semiconductor wafer with the mask. Preferably, the method includes the step of creating the alignment mark on the semiconductor wafer in a form of a frame. Moreover, preferably, the creating step includes the step of creating the frame to minimize an impact of film stack variations.

Abstract: An apparatus and a method for calibrating the position of a cassette indexer in a semiconductor process machine are described. The apparatus is constructed by a base plate, a top plate and at least two support members rigidly attaching the top plate to the base plate in a parallel relationship. On the bottom side of the top plate, is mounted at least two spaced-apart rows of distance sensors each having at least five sensors capable of sensing a distance in the cavity of the calibration apparatus. After a wafer blade is extended into the cavity of the apparatus, a sensor in the front row and a sensor in the back row can be used to sense a front-to-back tilt of the wafer blade, while two adjacent sensors in the same row can be used to sense a side-to-side tilt of the wafer blade.

Abstract: In a scanning-type projection exposure system, curvature of a movable mirror that is used to measure mask stage coordinate positions is determined while the mask stage is moved in the scanning direction, by measuring coordinate positions, perpendicular to the scan direction, of the mask stage and of a mask mark elongated in the scan direction. The results of the measurements are used for correcting or compensating positional deviation during scanning. Rotational deviation of a mask pattern area is determined and is corrected or compensated. Also, a mask is aligned with respect to a coordinate system of the mask stage as pre-processing for exposure, using a mask alignment mark having two crossing linear patterns and determining a coordinate position of the crossing point by moving the mask relative to an observation area.