Abstract: A device is proposed, which makes it possible to ascertain the relative position of the reference axis BA of an object relative to a reference beam Rp of an electromagnetic radiation, in particular a laser beam. The device displays a spatially fixed radiation transmitter S and—at the object end—a splitting mirror 22 as well as two position detectors 23 and 25. The splitting mirror branches a partial beam Rp′ off from the reference beam. The reference beam passing rectilinearly through the splitting mirror impinges on the one position detector and the partial beam on the other. The position detectors supply electrical signals, from which the position of the reference axis is ascertainable by means of a computer. The known devices of this species have an appreciable space requirement. This defect is eliminated by a particular structuring of the beam conduction and the additional use of special optical means.

Abstract: A method of operating a lithographic projection apparatus comprises forming a spot of radiation at the wafer level using a pinhole at reticle level. A sensor is defocused with respect to said spot such that it is spaced apart from said wafer level. The sensor is scanned beneath the spot to measure the angular intensity distribution of radiation at the spot and to determine the intensity distribution at the pupil plane of the projection lens system.

Abstract: The first exposure stage is performed after the numerical aperture NA of a lens and a coherence factor &sgr; have been set at 0.6 and 0.3 respectively, while respective mechanisms for adjusting an illuminating system, a lens system and a stage system have been fixed. Next, the numerical aperture NA of the lens and the coherence factor &sgr; are changed into 0.5 and 0.8 respectively, without shifting the exposure position of a target to be exposed while the illuminating, lens and stage system are adjusted in such a manner that the aberration is minimized under these conditions. Then, the second exposure stage is performed after the mechanisms for adjusting the illuminating, lens and stage system have been fixed. An exposure process is carried out under several combinations of exposure conditions and the illuminating, lens and stage systems are adjusted in accordance with those combinations of exposure conditions.

Abstract: Disclosed is an exposure system having an exposure apparatus for transferring a pattern of a first object onto a second object, which includes an exposure apparatus having a detecting system for performing relative alignment of the first object and the second object, a transmitting system for transmitting, to a remote location and through a public data line, a mark detection signal obtained by detection of a mark of the second object made by use of the detecting system and shape information obtained by measurement of a shape of the mark on the second object, and a calculating system for performing calculation of an offset of the exposure apparatus, at the remote location, wherein the calculating system transmits information, including the offset, to the exposure apparatus and through the public data line, and wherein, on the basis of the information including the offset, alignment of the first and second objects is executed by using the detecting system and an exposure process is performed in the exposure app

Abstract: A projection exposure apparatus for transferring, by projection exposure, a pattern of a first object onto a second object while scanning the first and second objects in synchronism with each other, includes an illumination optical system having a secondary light source forming system for forming a secondary light source and a slit disposed with a space from the first object or a plane conjugate thereto, the illumination optical system being operable to illuminate the first object with light supplied from a light source of a pulse light emission type and having a slit-like irradiation region defined through the slit on a light path of the illumination optical system, a projection optical system for projecting the pattern of the first object onto the second object, and a control system for controlling an exposure parameter so that an integrated exposure intensity upon the first object and in the scan direction in accordance with a change in size of the secondary light source.

Abstract: A projection exposure apparatus includes an illumination system, a projection optical system for projecting a pattern on a substrate, a holding portion for holding a first mask having a first transmission portion between the illumination system and the projection optical system, a second mask which is arranged near the image-side focal position of the projection optical system and has a second transmission portion, and an actuator for driving the second mask in a plane perpendicular to the optical axis of the projection optical system.

Abstract: An exposure method includes first through third steps. In the first step, respective first and second illumination regions of a mask having a predetermined pattern are illuminated with an illumination light having a predetermined wavelength. In the second step, an image of the mask is formed, respectively, in first and second exposure regions (formed on a substrate) based on the illumination that passes through the first and second illumination regions. The first and second exposure regions each have a substantially polygonal shape defined by two parallel sides and two sides other than the two parallel sides. In the third step, the first and second exposure regions and the substrate are moved relatively in a first direction such that the first and second exposure regions are formed in different positions in a second direction which crosses the first direction.

Abstract: A semiconductor body having an alignment mark comprising a pair of sets of parallel lines disposed on the semiconductor body, the parallel lines in one of the sets being disposed orthogonal to the parallel lines in the other one of the set, the two sets of parallel lines being in an overlaying relationship. Also, a method and apparatus for detecting an alignment mark on a semiconductor body. The method and apparatus provide an alignment illumination comprising a pair of orthogonal, lines of impinging light which is scanned over the surface of the alignment mark, one of such pair of impinging light lines being orthogonal to, and laterally displaced from, the other one of such pair of impinging light lines, impinging light being reflected by the alignment lines in the surface of the semiconductor when such impinging light is over to provide a pair of laterally displaced beams of reflected light.

Abstract: In an alignment method, in order to expose a pattern of a first object onto a second object, a plurality of marks on the second object are detected with a mark detection unit, and the first and second objects are aligned with each other. Before this process, the shape of a mark on the second object is measured, thereby obtaining an offset that should be reflected in a detection result of the mark detection unit. The shape of the mark is measured with a shape measurement unit (63) with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement unit (64) with a possibility of coming into contact with the mark. The shape of the mark can be measured without contaminating or damaging the mark.

Abstract: A system for precisely locating an absolute position of a target structure disposed at a known relative position on a substrate, where the substrate has devices in a pattern. Input means receive information, including a substrate size, a pattern offset, a device size, the known relative position of the target structure, and a target structure shape. Staging means receive the substrate in a known orientation. Processing means are used to locate several positions. A center position of the substrate is located from the substrate size and the known orientation of the substrate. A first intermediate position is located by combining the center position of the substrate with the pattern offset. A second intermediate position is located by combining the first intermediate position with at least a first component of the device size. A third intermediate position is located by combining the second intermediate position with the known relative position of the target structure.

Abstract: In a system for locating and measuring an index mark on an edge of a wafer, a wafer to be examined is positioned and centered on a chuck in a horizontal chuck position such that an index mark is oriented within first and second index mark orientation features disposed on the chuck. The chuck is translatable, tiltable between horizontal and vertical positions, and rotatable over an angle subtended by the index mark orientation features of the chuck. A laser beam from a laser beam optical profiler is focussed on the surface of the wafer at a distance proximate the wafer edge and proximate the first index mark orientation feature of the chuck. The chuck is rotated in a direction from the first to the second index mark orientation feature whereby a reflected portion of the laser beam generates data corresponding to the angular location of index mark edges. An index mark center location is computed.

Abstract: An automatic light-coupling system for optical components suitable for coupling and packaging an optical assembly, comprising: a light-coupling device comprising: a coupling media installer comprising a horizontal table for moving a coupling media along a horizontal direction; a vertical table for moving a coupling media along a vertical direction; and a coupling media table for clipping a connector of the coupling media; and an optical component installer comprising a focus-control table for controlling the focusing and withdrawing of the optical components; a horizontal turntable for controlling the horizontal rotation of the optical components; a vertical turntable for controlling the vertical rotation of the optical components; an adapter of the optical component for holding the optical component, in which a pinhole is placed in front of the optical component so that the light emitted from the optical component passes through the pinhole and forms a light beam that is rotated to correct the assembly incli

Abstract: A projection exposure apparatus includes projection optics for projecting a pattern, which has been formed on a mask or reticle, onto a wafer placed on a stage; an XYZ stage on which the substrate is placed and which is movable along the direction of the optic axis of the projection optics and in a direction orthogonal to the direction of the optic axis; a surface position measurement unit capable of measuring a predetermined position along the optic axis of the projection optics and the relative position of the surface of the substrate on the state; and a vibration measurement unit capable of measuring vibration of the projection optics. The XYZ stage is driven and controlled based upon results of measurement from the surface position measurement unit and vibration measurement unit, thereby reducing deviation between the wafer surface and imaging plane and improving contrast and resolving power.

Abstract: The method of correcting a residual aberration of a projection optical system, which is used for projecting a pattern of a photo mask onto a photosensitive film located on a substrate, the method includes calculating an effect of a residual aberration on a given pattern on the basis of the residual aberration of the projection optical system obtained by measurement, calculating a moving amount of an adjustable aberration in the projection optical system such that the effect of the residual aberration becomes minimum in a given area, and moving the adjustable aberration in accordance with the calculated moving amount.

Abstract: An exposure apparatus transfers an image of a pattern on a reticle onto a wafer W by synchronously scanning the reticle and the wafer with respect to a projection optical system in a state in which the reticle is illuminated with an exposure light beam from an exposure light source subjected to pulse light emission via a fly's eye lens, a movable blind, a main condenser lens system, and a fixed blind. First and second uneven illuminance-correcting plates, on which shielding line groups for correcting convex and concave uneven illuminance are depicted, are arranged at a position defocused from a conjugate plane with respect to a pattern plane of the reticle. A third correcting plate for roughly correcting uneven illuminance is arranged at a position further defocused therefrom. It is possible to enhance the uniformity of the totalized exposure amount on the wafer or the telecentricity when the exposure is performed in accordance with the scanning exposure system.

Abstract: An illuminating device of a projection-microlithographic device includes a light source, an objective, and a device which produces a particular image field configuration. The device has fields which, in the direction of scanning movement, are separated at least in parts by a free zone, and are located in a peripheral region of the circular image field of a downstream projection objective in a manner at least approximating rotation symmetry. The integral of the quantity of light passing through the fields in the scanning direction are constant over the entire extent of the image field configuration in the direction at right angles to the scanning direction. Such an image field configuration replaces a conventional rectangular scanner slot formation whose width in the scanning direction corresponds to the forementioned integral of the image field configuration. The design of the image field configuration permits an approximately rotationally symmetric illumination of the projection objective.

Abstract: An apparatus for assembling a semiconductor device including a stage having a substrate support surface for supporting a substrate, and a support member for carrying a semiconductor element to a position on or near the substrate supported by the stage. A microscope unit having a coaxial illuminating unit is arranged inclined to the substrate support surface of the stage, and a counter illuminating unit is arranged inclined on the opposite side from the microscope unit with respect to a normal to the substrate support surface of the stage. A camera is arranged at an image forming position of the microscope unit 1 and an image processing unit is connected to the camera. The substrate has a positioning mark, and the camera acquires an image of the positioning mark and an image of a reflection of the positioning mark reflected by the side surface of the semiconductor element.

Abstract: An exposure apparatus has a triangular shaped stage which is movable in a two-dimensional plane while holding a substrate. The stage has a reflecting surface provided on a side face of the stage so that the surface extends in a specific direction intersecting Y axis and X axis. An interferometer radiates a beam onto the reflecting surface to measure a position of the stage in a direction perpendicular to the specific direction. Using the measured position and an angle of the specific direction, a calculator can calculate the position of the stage on rectangular coordinate system defined by X and Y axes. The size and weight of the stage can be reduced, and the throughput of the exposure apparatus is improved.

Abstract: Lithography processes that use multiple layers require registration between layers. The accuracy requirement depends on the application of the lithograph. For microlithography, the registration requirement could be less than one micron. Systems that use lenses for imaging such as optical steppers can image conventional alignment marks through those lenses. A unique microlithography system that employs holograms has properties that are not compatible with known alignment techniques. The present invention is a new system for alignment of holographic microlithography elements.

Abstract: A system for aligning a mask and a product with high precision, featuring a means for supporting a product in a fixed position and a mask adjacent to the product so that the mask is movable relative to the product. The mask is surrounded by a rectangular mask frame. At least one movable first plunger presses against a first edge of the mask frame, while two movable second plungers press against a second edge of the mask frame, where the first and second edges are perpendicular. A first computer-controlled movable push plate is designed to push the mask frame against said at least one movable first plunger; pushing the mask frame in a first direction. Two second movable computer-controlled plates are designed to move the mask frame in a second direction by pushing the mask frame against the two movable second plungers.

Abstract: A metrology apparatus for determining bias and overlay errors in a substrate formed by a lithographic process includes an aperture between the objective lens and the image plane adapted to set the effective numerical aperture of the apparatus. The aperture is adjustable to vary the effective numerical aperture of the apparatus and the aperture may be non-circular, to individually vary the effective numerical aperture of the apparatus in horizontal and vertical directions. To determine bias and overlay error there is provided a target having an array of elements on the substrate, the array comprising a plurality of spaced, substantially parallel elements having a length and a width, the sum of the width of an element and the spacing of adjacent elements defining a pitch of the elements, edges of the elements being aligned along a line forming opposite array edges, the distance between array edges comprising the array width.

Abstract: A projection exposure apparatus is provided. The projection exposure apparatus includes an illumination optical system for illuminating a portion of a mask pattern on a mask with an exposing radiation flux of a predetermined shape, a fixed support, a projection optical system fixed to the fixed support for projecting the image of the illuminated portion of the mask pattern onto a substrate, and a carriage for integrally holding the mask and the substrate, the carriage being movable in a predetermined direction with respect to the projection optical system to successively exposing the substrate with the image of the mask pattern formed by the exposing radiation flux.

Abstract: The invention provides an apparatus and a method for defining a pattern on a substrate using a shadow masking technique. Said apparatus comprises a flexible member having a movable portion and at least one aperture. The flexible member is positioned in operation above the substrate thereby acting as a shadow mask. The apparatus further comprises a support for the substrate, distance-controlling means for controlling the distance between said movable portion and said substrate, and an actuator for moving the flexible member and substrate relative to each other parallel to a surface of the substrate. The apparatus further comprises an emission source which emits materials, electrons or light and which aims through the shadow mask at the substrate where the pattern is defined. Such a pattern might be employed in micromechanic, microoptic or microelectronic devices, for example. The described apparatus may be implemented using the AFM principal.

Abstract: A semiconductor alignment tool has a housing that has a number of registration pins for mating with a standard semiconductor cassette. A plurality of x-y axis sensors are embedded in a first surface of the housing.

Abstract: This invention relates to an optical exposure system that is useful for exposing optical alignment layers with light in order to align liquid crystal. The exposure system comprises at least one source of optical radiation, means for partially collimating the optical radiation, means for partially polarizing the optical radiation, means for adjusting the degree of polarization, and means for transporting a substrate and radiation relative to one another. Other embodiments include means for partially filtering the optical radiation and means for some portion of said optical radiation to be incident at an oblique angle relative to the substrate. Another embodiment is a novel optical module and processes for aligning liquid crystals using the optical exposure systems.

Abstract: A system for aligning a mask and a product with high precision, featuring a means for supporting a product in a fixed position and a mask adjacent to the product so that the mask is movable relative to the product. The mask is surrounded by a rectangular mask frame. At least one movable first plunger presses against a first edge of the mask frame, while two movable second plungers press against a second edge of the mask frame, where the first and second edges are perpendicular. A first computer-controlled movable push plate is designed to push the mask frame against said at least one movable first plunger; pushing the mask frame in a first direction. Two second movable computer-controlled push plates are designed to move the mask frame in a second direction by pushing the mask frame against the two movable second plungers.

Abstract: Optical exposure apparatus and methods of using same, for patterning a workpiece and photo-cleaning the optical components in the apparatus, which can be contaminated by moisture and organic compounds in the atmosphere. The apparatus comprises an illumination optical system having a light source and one or more optical components, and a projection lens having an object plane and an image plane and one or more optical components. The optical exposure apparatus includes an exposure optical path or an exposure light beam through a predetermined space in the optical exposure system. An optical path deflection member for deflecting light is introduced into the exposure optical path so as to create a second optical path that differs from the exposure optical path. Also disclosed is a method of photo-cleaning the aforementioned optical components, including the steps of forming an exposure optical path and then changing this path to create a second optical path that differs from the exposure optical path.

Abstract: An exposure apparatus for exposing a substrate with an exposure light beam passing through a mask comprises a movable stage for moving the substrate, a stage chamber for accommodating the movable stage, a transport system for transporting the substrate into the stage chamber, and a first alignment system for performing positional adjustment for the substrate with respect to the movable stage in the stage chamber. The position of an exposure objective delivered from the transport system into the stage chamber can be subjected to positional adjustment by using the first alignment system. The stage chamber and the movable stage can be assembled to a frame of the exposure apparatus in accordance with the module system. The exposure apparatus includes a second alignment system for performing positional adjustment for the substrate installed on the movable stage at an exposure position.

Abstract: Machine tools can be accurately measured and positioned on manufacturing machines within very small tolerances by use of an autocollimator on a 3-axis mount on a manufacturing machine and positioned so as to focus on a reference tooling ball or a machine tool, a digital camera connected to the viewing end of the autocollimator, and a marker and measure generator for receiving digital images from the camera, then displaying or measuring distances between the projection reticle and the reference reticle on the monitoring screen, and relating the distances to the actual position of the autocollimator relative to the reference tooling ball. The images and measurements are used to set the position of the machine tool and to measure the size and shape of the machine tool tip, and examine cutting edge wear.

Abstract: A tool for aligning a robot arm to a cassette for holding semiconductor wafers has a housing having a slot one position for holding a semiconductor wafer. A z-axis non-intrusive detector is attached to the housing and senses if the semiconductor wafer is aligned in the slot one position. An indicator is connected to the z-axis detector and provides a signal indicating when the semiconductor wafer is aligned in the slot one position.

Abstract: A semiconductor fabrication process permits for narrowing linewidths using Optical End of Line Metrology (OELM). OELM involves measuring relative line shortening effects that are inherent in many semiconductor fabrication processes using optical overlay instruments. According to one embodiment, the process involves a frame that has two adjacent sides which are constructed of lines and spaces. The frame is imaged onto a wafer, but the optical line measurements used to implement the frame over-predict actual shortening of the lines.

Abstract: In a method for mutually aligning a mask pattern formed in a mask 1 and a substrate 2, on which the mask pattern is to be imaged, by using setting marks 12a, 12b and 13a or 13b in the mask 1 and in the substrate 2, the alignment is performed with the aid of an imaging system and a light beam with polarized light 9. A phase shift for the first diffraction orders 20 is undertaken in the beam path 9a, 9b. Higher diffraction orders 21 and unwanted light are filtered out after the phase shift, and after the filtering out the light beams of the first diffraction orders 20 are detected, and the result is evaluated for the purpose of alignment.

Abstract: In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating fine pitch conductors and pads for bonding is achieved by observation of the reflection of one conductor or pad in the surface of the opposite substrate and relatively moving the substrates to eliminate the reflection.

Abstract: In a scanning type exposure apparatus, a reticle coarse movement stage 22 and a wafer stage 20 are simultaneously scanned in a predetermined scanning direction or directions, in which a position control system 44 for a reticle fine movement stage detects a positional discrepancy amount between the wafer stage 20 and the reticle fine movement stage 24, and calculates a vibration amount of a vibration-preventive pedestal 12. The both stages 20, 22 are driven and controlled so that positional discrepancy is corrected on the basis of the detected positional discrepancy amount and the calculated vibration amount. Accordingly, even if a vibration occurs on the vibration-preventive pedestal 12 during acceleration for scanning for the stages 20, 22, an error affected by the vibration is taken into consideration, and correction is made at a predetermined time interval so that the positional relationship between the stages 20, 24 becomes a predetermined synchronized relationship.

Abstract: An illumination optical apparatus (14-40) and exposure apparatus (10) provided with the illumination apparatus, capable of employing a high-output light source. The illumination apparatus comprises, in order along an optical axis, a light source (14) capable of providing a primary light beam (B) having a cross-section, a condenser optical system (30) to condense the primary light beam so as to form a convergence point (F) adjacent the condenser optical system, a light-pipe optical integrator (160) having a rectangular cross-sectional shape with a first side of length dx, a second side of length dy, and a most light-source-wise incident surface (160a) axially spaced from the convergence point by a spacing (L2). The integrator is capable of forming a plurality of secondary light sources and corresponding secondary light beams (B′) from the primary light beam. Adjacent the integrator is an imaging optical system (40) to converge the primary and secondary light beams to illuminate the illumination surface.

Abstract: A microlithography projection apparatus comprises an illuminator, for supplying a beam of radiation for illuminating a pattern on a mask, and a projection system for forming an image of the illuminated portion of the mask on a resist-coated substrate. The image is projected off-axis with respect to the optical axis of the projection system and the aperture of the illuminator is minimized to that of the illuminated portion of the mask. The illuminator is provided with a compensator, such as a tiltable mirror or wedge-like transmissive optical element for compensating for telecentricity errors intrinsic to the projection system.

Abstract: In a semiconductor device having first alignment marks formed on a first layer and second alignment marks formed on a second layer, the first alignment marks and second alignment marks are disposed so as to be approximately as close to each other as a diffraction grating distance X.

Abstract: A position detecting system and method, wherein a wavefront that provides an optical path length distribution opposite to an optical pat length distribution to be defined in accordance with a shape of a light transmissive film on a mark provided on an object to be inspected, is produced, wherein the mark is illuminated with the produced wavefront, and an image of the illuminated mark is taken, such that positional information related to the mark is produced in response to the image taking.

Abstract: A laser apparatus and method for aligning a horizontal metal extrusion press. The apparatus comprises a scanning laser and scanning laser target, one or more spindle lasers and spindle laser targets, a data acquisition station and adapters for mounting the lasers and targets. The method comprises the steps of leveling and aligning the components of the horizontal extrusion press in parallel, square and aligned relationship with respect to each other. Alignments are preferably performed with the extrusion press at its operating temperature. The selections as to which press members are used for locating the lasers and targets are necessary requirements for proper alignment of the press members.

Abstract: A system and method for efficient coupling between optical elements comprises a memory containing an alignment module configured to align a light beam with an optical element to maximize coupling efficiency, and a processor coupled to the memory to control the alignment module. A position sensitive device indirectly senses a position of the light beam on the optical element and sends the position to the processor. The alignment module directly measures coupling efficiency where the light beam contacts the optical element. The alignment module identifies a direction of increasing coupling efficiency and aligns the light beam with the optical element along that direction until maximum coupling efficiency is achieved.

Abstract: A projection exposure system for printing the pattern formed on a reticle onto a wafer includes a reticle stage (5) and a wafer stage. A first reference plate (9) having a first reference pattern (MM1) formed thereon is mounted on the reticle stage (5), and a second reference plate (25) having a second reference pattern (WM1) formed thereon is mounted on the wafer stage. The first reference pattern (MM1) comprises two cross-marks (60a, 60b) spaced apart from each other in X-direction, and the second reference pattern (WM1) comprises two cross-marks (61a, 61b) spaced apart from each other in X-direction. Images of the cross-marks (61a, 61b) of the second reference pattern (WM1) are formed through a projection optical system (2) on the reticle stage (5) and superimposed with the cross-marks (60a, 60b) of the first reference pattern (MM1).

Abstract: The present invention is generally directed to a system for taking displacement measurements of an object. The invention is realized by various embodiments. In one embodiment, the invention utilizes the Moiré effect to take precise displacement measurements of an object. In this regard, a visible pattern is disposed on an object, and a plurality of photosensors are uniformly spaced apart from the visible pattern. Importantly, the spacing between the photosensors is slightly different than the spacing of lines forming a projection or image of the visible pattern. This allows the invention to utilize the Moiré effect to accurately compute precise displacements or movements of the object. In this respect, electrical signal generated by the photosensor array will embody a repeating envelope pattern resulting from the difference in the pitch of the photosensors and the pitch of the projection or image of the visible pattern.

Abstract: A projection exposure system for printing the pattern formed on a reticle onto a wafer includes a reticle stage (5) and a wafer stage. A first reference plate (9) having a first reference pattern (MM1) formed thereon is mounted on the reticle stage (5), and a second reference plate (25) having a second reference pattern (WM1) formed thereon is mounted on the wafer stage. The first reference pattern (MM1) comprises two cross-marks (60a, 60b) spaced apart from each other in X-direction, and the second reference pattern (WM1) comprises two cross-marks (61a, 61b) spaced apart from each other in X-direction. Images of the cross-marks (61a, 61b) of the second reference pattern (WM1) are formed through a projection optical system (2) on the reticle stage (5) and superimposed with the cross-marks (60a, 60b) of the first reference pattern (MM1).

Abstract: An apparatus has a pulse light source for emitting light pulses with varying light quantities, an illumination optical system for radiating the light pulses from the source onto a predetermined illumination region on a mask on which a transfer pattern is formed, and a projection optical system for projecting an image of the pattern onto a predetermined exposure region on a substrate, and which synchronously scans the mask and the substrate during the projection. The apparatus includes a measuring device for detecting intensities of the light pulses radiated onto the substrate during the scanning and measuring an integrated light quantity on each of a plurality of partial regions in the exposure region on the substrate on the basis of a detection signal of the intensities, wherein the partial regions are defined by a scanning speed of the photosensitive substrate and an oscillation interval of the light pulses.

Abstract: A position detecting apparatus is used with an exposure apparatus for projecting a mask pattern onto a substrate. The position detecting apparatus detects a position of an alignment mark formed on the substrate by sending light through a film having a wavelength-selective feature. The position detecting apparatus comprises a light sending system for emitting the position detecting light, a wavelength changing means for adjusting a wavelength band of the position detecting light directed onto the alignment mark, on the basis of the wavelength transmittance of the film having the wavelength-selective feature, and a light receiving system for detecting the light from the alignment mark. The position of the alignment mark can be determined on the basis of a photoelectric conversion signal outputted from the light receiving system.

Abstract: A method and apparatus for aligning and connecting objects, such as semiconductor components and substrates, are provided. The apparatus includes a hexapod with a moving platform for holding an object for movement in six degrees of freedom. The apparatus also includes a chuck assembly for holding a mating object in a stationary position. A camera and a height gauge are mounted on the moving platform to allow determination of the position and orientation of the object on the chuck assembly. Likewise, a camera and a height gauge are mounted on the chuck assembly to allow determination of the position and orientation of the object on the moving platform. The hexapod includes linear actuators operable by a controller upon signal input from the cameras and height gauges. The apparatus can be used to electrically connect semiconductor dice and chip scale packages to interconnects for testing.

Abstract: A bonding apparatus has a probe for causing an LED chip to emit light before the LED chip is bonded on a board, an imaging system for recognizing the center of a light-emitting area of the LED chip and recognizing coordinates of a contour reference point of the LED chip with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism for positioning the LED chip in a bonding position on the board based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip can be positioned highly accurately in a desired position on the board without being adversely affected by variations in the contour dimensions of the LED chip.

Abstract: The present invention relates to a system for determining the alignment of an object, whose image is to be recorded, with a coupling eyepiece and an image capture apparatus that defines an image plane (Pi), comprising: an image capture apparatus (2) equipped with the ability for adjusting its own position; a light source (1) that emits at least two non-focused luminous dots (1a, 1b); eyepiece coupling lens(es) or element(s) (3) that focus on an object plane (Po); an opaque mask (4) that is perforated with at least two holes (5a, 5b) and that is positioned in front of light source (1) such that it transmits at least part of the light emitted by the light source; and calculating mechanism for determining whether alignment exists and, in the case of non-alignment, for quantifying the non-alignment.

Abstract: A scanning unit for an optical position measuring system is disclosed which, besides periodic incremental signals, also provides at least one reference pulse signal at a defined reference position of a scale and a scanning unit which is movable relative to it. For scanning a reference mark on the scale, the scanning unit comprises a scanning plate with at least one reference mark scanning field and/or at least one reference pulse detector element. A filtering effect results either from the design of the reference mark scanning field or by the design of one or several reference mark detector elements in such a way that the periodic incremental signal portion of the reference pulse signal next to the reference position can be eliminated to a great extent.

Abstract: A projection exposure apparatus comprises a projection optical system for projecting a pattern of a mask on a photosensitive substrate, a stage, for holding the photosensitive substrate, movable in an optical-axis direction of the projection optical system and in a direction perpendicular to the optical axis, a position detection system for outputting a detection signal corresponding to a deviation of the projection optical system in the optical-axis direction between an imaging plane of the projection optical system and the surface of the photosensitive substrate by projecting a beam of light assuming a predetermined shape on the photosensitive substrate and, at the same time, photoelectrically detecting the reflected light from the photosensitive substrate, a fiducial member provided on the stage and having a fiducial pattern assuming a predetermined shape, and a device for detecting an irradiation position of the light beam within a plane perpendicular to the optical axis of the projection optical system o