Abstract: For a photolithography apparatus, an adjustment method is provided which comprises first and second processes. In the first process, a semiconductor wafer is successively set in one of cell positions. In each of the cell positions, a laser beam is directed to the surface of the wafer and light reflecting off the wafer surface is detected and analyzed to determine a vertical offset position of the wafer at each cell position. Data representing the vertical offset position is stored in a memory and the first process is repeated until the offset position data are derived from all cell positions. In the second process, tilt angles of the wafer at all cell positions are determined from the stored offset position data, and angle data representing the determined tilt angles are stored in a memory. The wafer is then set in one of the cell positions, and the angle data is read from the memory corresponding to the set cell position and the wafer surface is horizontally aligned.

Abstract: A micro-positioning apparatus enables stable and rapid positioning of a stage on which a specimen is placed. The apparatus has a stage for placing a specimen to be radiated with a beam, actuators for levitating the stage and controlling a movement of the stage, a first position sensor for measuring a relative displacement between the stage and the actuators, a second position sensor for measuring a relative displacement between an actual radiation position of the beam on the specimen and a target radiation position, and a controller for positioning the stage so as to decrease the relative displacement detected by the second sensor.

Abstract: Exposure method and scanning-type exposure apparatus expose a substrate with a pattern formed on a mask by synchronously moving the mask and the substrate. The exposure apparatus comprises a detection device and a correction mechanism. The detection device detects a change in a shape of the substrate. The correction mechanism approximates at least two straight lines or curves in accordance with the result of the detection by the detection device to correct the relative position of the mask and the substrate during the synchronous movements.

Abstract: A method is described for exposing both sides of a light sensitive sheet such as a printed circuit board panel according to imaging data. The method uses a device that has an optical system for scanning the sensitive sheet by one or more beams. The optical system scans both sides with the scan lines on one side mutually positioned with respect to the scan lines on the other side. According to one implementation, the optical system includes two optical scanning units driven by a single source, with a switch alternating the beam from the source to one then the other optical scanning unit.

Abstract: A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer.

Abstract: A method and system to determine an alignment of a workpiece, with respect to a tool, by backlighting the workpiece. The workpiece includes fiducials, and the backlighting results in electromagnetic radiation passing through the fiducial. The electromagnetic energy emerging from the fiducial defines an emergent flux. A circumference of the emergent flux is ascertained, and the alignment is determined as a function of the circumference.

Abstract: An apparatus for exposing a pattern, formed on a mask, on each of a plurality of partitioned areas on a photosensitive substrate by a step-and-repeat scheme includes a projection optical system for projecting the pattern of the mask on the photosensitive substrate, a substrate stage for holding the photosensitive substrate and two-dimensionally moving the photosensitive substrate within a plane perpendicular to the optical axis of the projection optical system, a detection unit for projecting a pattern image having a predetermined shape on the photosensitive substrate and photoelectrically detecting light reflected by the photosensitive substrate to detect a position at each of a plurality of points on the photosensitive substrate along the optical axis of the projection optical system, and a measurement unit for, when each of a plurality of measurement points in a partitioned area on which a pattern of the mask is to be exposed next coincides with or approaches the pattern image, detecting an offset amount b

Abstract: A health examination card and its explainer wherein the health examination card can be used to test the biochemical items of blood (BLD), bilirubin (BIL), urobilinogen (URO), protein (PRO), nitrite (NIT), glucose (GLU), free calcium (Ca), etc and the card explainer can be used to analyze the test results of the above items so as to inspect the health status and provide the early indication of the diseases for finding diseases early. Besides, said examination card and its explainer is easy to use.

Abstract: A fabrication method for a projection optical system is capable of easily determining the corrected surface form as a desired continuous surface provided to a correcting member for correcting residual aberration. The fabrication includes: a measurement step of measuring aberration remaining in the projection optical system; a hypothesis step of hypothesizing a corrected surface form to be provided to the correcting member based on predetermined functions; a calculation step of calculating wavefront information of a light beam which passes through each of a plurality of regions on the correcting member having the corrected surface form hypothesized in the hypothesis step; and an evaluation step of evaluating the remaining aberration in the projection optical system when the hypothesized corrected surface form hypothesized in the hypothesis step is provided to the correcting member based on the measurement result in the measurement step and on the wavefront information calculated in the calculation step.

Abstract: In an irradiance photometer comprising a chassis having a light receiving opening formed thereon, and a light detector having a light receiving surface 3a installed in the chassis corresponding to the light receiving opening, a cylindrical portion (shading portion) for intercepting oblique incident radiation to the light receiving opening is provided on the chassis.

Abstract: A wavelength shift generated by the manufacturing error of an alignment scope is corrected and adjusted to minimize generation of another aberration and enable high-precision position detection. The alignment scope has a detection system (4) for detecting a position detection mark on a wafer (6) to be detected at a predetermined magnification by using light emitted by a light source (401). The detection system (4) incorporates two wedge optical members (410a, 410b) which constitute a wedge optical member group (410). The two wedge optical members are arranged such that their adjacent wedge surfaces are inclined at a predetermined angle in a direction perpendicular to the detection optical axis, and these adjacent wedge surfaces become parallel to each other. The interval between the wedge optical members (410a, 410b) is adjusted to correct the wavelength-dependent position shift amount of the detection system (4).

Abstract: An illumination system and exposure apparatus and method involving illuminating a surface over an illumination field (IF) having an arcuate shape. The illumination system comprises a light source (54) for providing a light beam (100), and an optical integrator (56). The optical integrator comprises a first reflective element group (60) having an array of first optical elements (E) each having an arcuate profile corresponding to the arcuate shape of the illumination field. Each of the first optical elements has an eccentric reflecting surface (RSE) comprising an off-axis section of either a spherical surface (S) or an aspherical surface (ASE). The array of first optical elements is designed so as to form a plurality of arcuate light beams (108) capable of forming a plurality of light source images (1).

Abstract: A method for determining the relative motion of a surface with respect to a measurement device comprising: illuminating the surface with incident illumination; detecting illumination reflected from the surface to form at least one detected signal; and determining the amount of relative motion parallel to the surface from said at least one detected signal, characterized in that said determining includes correcting for the effects of relative motion perpendicular to the surface.

Abstract: A surface position detection apparatus of this invention includes a position detection section having a plurality of electrodes opposing the object surface to be measured, and a measurement device for selecting at least one electrode of the plurality of electrodes in accordance with the shape of the object surface, supplying an AC current to the selected electrode, and measuring the current flowing to the electrode, thereby measuring the distance between the electrode and object surface.

Abstract: Illuminating light at a pupil plane of an illumination optical system for illuminating a position detection mark on a substrate is limited to an annular area centered at an optical axis, and a member substantially blocks an image-forming light beam distributed over an area on a pupil plane of an image-forming optical system for forming an image of the position detection mark on an imaging device by receiving light generated from the mark, the area being in image-forming relation to the annular area on the pupil plane of the illumination optical system. Alternatively, a member gives a phase difference of approximately &pgr;/2 [rad] between the image-forming light beam distributed over the area which is in image-forming relation to the annular area on the pupil lane of the illumination optical system and the image-forming light beam distributed over the area other than that area.

Abstract: An alignment device, for use in a lithographic apparatus, for aligning a first object, provided with a first alignment mark relative to a second object, provided with a second alignment mark, employs as a radiation source a laser which emits an alignment beam having a wavelength which is of the order of 1000 nm and to the order of 1100 nm.

Abstract: An exposure apparatus for transferring a pattern formed on a mask to a photosensitive substrate is provided with an illumination optical system for illuminating a local area on the mask with a light beam, a projection optical system for projecting the pattern of the mask to the photosensitive substrate and a scanning device for scanning synchronously the mask and the photosensitive substrate, and a device for setting a width of an exposure area in a scan direction of the photosensitive substrate conjugate with an illumination area on the mask with respect to the projection optical system, to integer times as large as a distance which the photosensitive substrate moves during an interval between pulse emissions from the light source.

Abstract: A method, apparatus for executing the method, and computer program products for use in such an apparatus. The method includes scanning an interrogating light across multiple sites on an array package including an addressable array of multiple features of different moieties, which scanned sites include multiple array features. Signals from respective scanned sites emitted in response to the interrogating light are detected. The interrogating light power is altered for a first site on the array package during the array scan, based on location of the first site or on a determination that the emitted signal from the first site will be outside a predetermined value absent the altering (which allows for protecting a detector against expected overly bright sites), or is altered during the array scan based on the detected interrogating light power (which allows for compensating for light source drift during an array scan).

Abstract: A positioning stage system includes a first stage movable at least in one of a rotational direction and a tilt direction, a second stage movable at least in X and Y directions, a measurement mirror system fixed to the second stage, a reference mirror system disposed on the first stage, and a measuring system for measuring displacement of the measurement mirror system in the X or Y direction, while using the reference mirror system as a positional reference, wherein the reference mirror system is arranged so that laser light incident on the reference mirror system is reflected in the same direction as the incidence direction, substantially constantly.

Abstract: A lithographic projection apparatus has a correction device for lithographic projection. The lithographic projection apparatus has a projection system that projects a beam of radiation onto a mask. The correction device has a filter unit placed in the path of the beam for varying the spatial intensity of the beam along at least one direction of its cross-section so that the integrated intensity of radiation of mask level is substantially uniform across the entire length or the cross-section.

Abstract: Methods and apparatus for improving the efficiency of using optical sensors with component placement machines for the placement of components onto a circuit board. One of the improved methods involves the placement of a projection or notch at a selected position on the quill. The projection or notch is detected by the light based component sensor system on the placement head to indicate that it is safe to begin moving the placement head. A second improved method uses a constant, high angular velocity to rotate the component when the sensor is using the shadow cast by the body of the component to align the component. The use of a constant angular velocity allows for the correction for the rotation in determining the orientation to give very accurate results even though the velocity is relatively high.

Abstract: An apparatus and method for semi-automatic focusing and assembling of a light beam modifier, such as a lens, relative to a light beam source to optimize the light beam characteristics at one or more locations along the beam path using one or more light beam analyzers (27, 28, 29). A host computer compares the measurements and axially adjusts the light beam modifier. The apparatus may include two focusing stations (21, 22) for alternately focusing and assembling two light source assemblies, two beam splitters (25, 26) for splitting the light beam emitted from either focusing station into three components, and three light beam analyzers for measuring the beam characteristics at three locations. The apparatus may also include a video camera for automated or manual pointing of the laser beam, a semi-automatic glue dispensing system for fixing the light beam modifier relative to the light source and an automatic laser power-up circuit.

Abstract: A device is described for exposing both sides of a light sensitive sheet such as a printed circuit board panel according to imaging data. The device comprises an optical system for scanning the sensitive sheet by one or more beams. The optical system scans both sides with the scan lines on one side mutually positioned with respect to the scan lines on the other side. According to one implementation, the optical system includes two optical scanning units driven by a single source, with a switch alternating the beam from the source to one then the other optical scanning unit.

Abstract: An optical position displacement measuring device comprises an illumination optical system for illuminating a measurement mark, an image formation optical system for forming an image of the measurement mark by converging light reflected from the measurement mark, a CDD camera for capturing the image of the measurement mark formed by the image formation optical system, an image processing device for measuring positional displacement of the measurement mark from obtained image signals, an auto focus device for carrying out auto focus adjustment, and a controller.

Abstract: A projection exposure apparatus transferring a pattern from a reticle to a wafer includes at least three vibration isolating pads, a vibration isolating stand on the vibration stand, a plurality of actuators driving the vibration isolating stand in a vertical direction, at least two stages over the vibration isolating stand, the stages mounting the wafer and the reticle, at least one displacement sensor at the vibration isolating stand and detecting a displacement of the vibration isolating stand, at least one acceleration sensor at the vibration isolating stand and detecting an acceleration and deceleration of the vibration isolating stand, a vibration control system coupled to the displacement sensors and the acceleration sensors, and controlling the actuators based on outputs of the displacement sensors and the acceleration sensor, a position measuring device positioned on the vibration isolating pads and measuring a position of the stages, and a vibration compensating system coupled to the vibration contr

Abstract: This invention relates to a loose draw detector for a paper machine wet press. Such structure of this type, generally, use laser triangulation displacement sensors mounted and positioned to measure the point of web release from the center roll and measure paper web wrinkles in the form of rapid fluctuations/decreases in the standoff distance between sensors and the web passing over the leadout roll to determine loose draw.

Abstract: An exposure apparatus has an illuminating optical system for illuminating a mask with illuminating light from a light source, a projection optical system for projecting a pattern image, which has been formed on the mask, onto a wafer constituting a photosensitive substrate, and an alignment sensor constructing a position detection system for detecting an alignment mark on the wafer. The pattern region on the wafer is formed at a position offset toward the side of the alignment sensor from the projection center of the projection optical system, and the alignment sensor is disposed on the side near the pattern region formed on the wafer off-centered from the optic axis. By thus shortening baseline distance, the effects of measurement error due to baseline fluctuation can be reduced and it is possible to achieve highly precise detection of the position of an object to be detected (a position detection mark) and highly precise alignment.

Abstract: A projection exposure system for printing the pattern formed on a reticle onto a wafer includes a reticle stage (5) and a wafer stage. A first reference plate (9) having a first reference pattern (MM1) formed thereon is mounted on the reticle stage (5), and a second reference plate (25) having a second reference pattern (WM1) formed thereon is mounted on the wafer stage. The first reference pattern (MM1) comprises two cross-marks (60a, 60b) spaced apart from each other in X-direction, and the second reference pattern (WM1) comprises two cross-marks (61a, 61b) spaced apart from each other in X-direction. Images of the cross-marks (61a, 61b) of the second reference pattern (WM1) are formed through a projection optical system (2) on the reticle stage (5) and superimposed with the cross-marks (60a, 60b) of the first reference pattern (MM1).

Abstract: An exposure apparatus exposes a transfer pattern of a mask onto a photosensitive substrate in an overlapping manner. The exposure apparatus comprises an illumination optical system for guiding illumination light to the mask. An imaging optical system in the illumination optical system forms an illumination area on the mask. The exposure apparatus comprises a lens driving apparatus. The lens driving apparatus moves at least one of lenses constituting the imaging optical system along the optical axis and so forth, thereby correcting an optical characteristic of the imaging optical system.

Abstract: Various options for improving throughput in an e-beam lithography apparatus are described. A slider lens moves in synchronism with the scanning motion of the electron beam.

Abstract: A projection exposure apparatus including an irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing

Abstract: A method for performing optical adjustments of an exposure apparatus is based on an exposure apparatus having a light source for generating illumination light for exposure, and illumination optics for irradiating a mask with the illumination light generated from the exposure light source so as to imprint a mask pattern on a substrate base.

Abstract: A light-transmissive support disk supports a tube for attracting an LED chip, and a light-transmissive electrically conductive film is disposed on the support base. The LED chip is electrically connected to a negative terminal of a DC power supply by the light-transmissive electrically conductive film. An imaging unit is disposed coaxially with the tube and has a CCD camera for capturing an image of a light-emitting state of the LED chip via the support disk and a cover member when the LED chip attracted by the tube emits light. The light-emitting center of the LED chip can be detected accurately, and bonded easily and highly accurately on a board at a desired position thereon.

Abstract: The invention is directed to a projection exposure apparatus for the flat panel display manufacture having an objective array and magnifying objectives (O1 to O5).

Abstract: A substrate holder is mounted on a stage moving within a two-dimensional plane, and the substrate holder holds the substrate and is capable of rotating substantially through 180° around a predetermined rotation axis by a drive unit. Accordingly, in measuring a TIS of an alignment scope, laborious operation that the substrate is removed from the substrate holder and mounted again on the substrate holder after the substrate has been rotated will not be necessary. In this case, since the rotation of the substrate is performed while the substrate is held on the substrate holder, there is no possibility of occurrence of shift of the central position and the like of the substrate before and after the rotation. Therefore, the TIS measurement of the alignment scope can be performed in a short time and with high accuracy.

Abstract: According to one embodiment of the invention, there is provided a method of aligning substrates in an apparatus for bonding a flat panel display device having a plurality of substrates, the method for aligning the substrates involving the steps of providing an optical path through each substrate, wherein alignment of the optical paths corresponds a desired alignment of the substrates. In another aspect, the invention involves the steps of directing a light into the optical path of a first substrate and detecting the light exiting the optical path of a second substrate and positioning the substrates relative to each other such that the amount of detected light is optimized.

Abstract: A projection exposure apparatus includes projection optics for projecting a pattern, which has been formed on a mask or reticle, onto a wafer placed on a stage; an XYZ stage on which the substrate is placed and which is movable along the direction of the optic axis of the projection optics and in a direction orthogonal to the direction of the optic axis; a surface position measurement unit capable of measuring a predetermined position along the optic axis of the projection optics and the relative position of the surface of the substrate on the state; and a vibration measurement unit capable of measuring vibration of the projection optics. The XYZ stage is driven and controlled based upon results of measurement from the surface position measurement unit and vibration measurement unit, thereby reducing deviation between the wafer surface and imaging plane and improving contrast and resolving power.

Abstract: A device is proposed, which makes it possible to ascertain the relative position of the reference axis BA of an object relative to a reference beam Rp of an electromagnetic radiation, in particular a laser beam. The device displays a spatially fixed radiation transmitter S and—at the object end—a splitting mirror 22 as well as two position detectors 23 and 25. The splitting mirror branches a partial beam Rp′ off from the reference beam. The reference beam passing rectilinearly through the splitting mirror impinges on the one position detector and the partial beam on the other. The position detectors supply electrical signals, from which the position of the reference axis is ascertainable by means of a computer. The known devices of this species have an appreciable space requirement. This defect is eliminated by a particular structuring of the beam conduction and the additional use of special optical means.

Abstract: A method of operating a lithographic projection apparatus comprises forming a spot of radiation at the wafer level using a pinhole at reticle level. A sensor is defocused with respect to said spot such that it is spaced apart from said wafer level. The sensor is scanned beneath the spot to measure the angular intensity distribution of radiation at the spot and to determine the intensity distribution at the pupil plane of the projection lens system.

Abstract: A projection exposure apparatus for transferring, by projection exposure, a pattern of a first object onto a second object while scanning the first and second objects in synchronism with each other, includes an illumination optical system having a secondary light source forming system for forming a secondary light source and a slit disposed with a space from the first object or a plane conjugate thereto, the illumination optical system being operable to illuminate the first object with light supplied from a light source of a pulse light emission type and having a slit-like irradiation region defined through the slit on a light path of the illumination optical system, a projection optical system for projecting the pattern of the first object onto the second object, and a control system for controlling an exposure parameter so that an integrated exposure intensity upon the first object and in the scan direction in accordance with a change in size of the secondary light source.

Abstract: The first exposure stage is performed after the numerical aperture NA of a lens and a coherence factor &sgr; have been set at 0.6 and 0.3 respectively, while respective mechanisms for adjusting an illuminating system, a lens system and a stage system have been fixed. Next, the numerical aperture NA of the lens and the coherence factor &sgr; are changed into 0.5 and 0.8 respectively, without shifting the exposure position of a target to be exposed while the illuminating, lens and stage system are adjusted in such a manner that the aberration is minimized under these conditions. Then, the second exposure stage is performed after the mechanisms for adjusting the illuminating, lens and stage system have been fixed. An exposure process is carried out under several combinations of exposure conditions and the illuminating, lens and stage systems are adjusted in accordance with those combinations of exposure conditions.

Abstract: A projection exposure apparatus includes an illumination system, a projection optical system for projecting a pattern on a substrate, a holding portion for holding a first mask having a first transmission portion between the illumination system and the projection optical system, a second mask which is arranged near the image-side focal position of the projection optical system and has a second transmission portion, and an actuator for driving the second mask in a plane perpendicular to the optical axis of the projection optical system.

Abstract: Disclosed is an exposure system having an exposure apparatus for transferring a pattern of a first object onto a second object, which includes an exposure apparatus having a detecting system for performing relative alignment of the first object and the second object, a transmitting system for transmitting, to a remote location and through a public data line, a mark detection signal obtained by detection of a mark of the second object made by use of the detecting system and shape information obtained by measurement of a shape of the mark on the second object, and a calculating system for performing calculation of an offset of the exposure apparatus, at the remote location, wherein the calculating system transmits information, including the offset, to the exposure apparatus and through the public data line, and wherein, on the basis of the information including the offset, alignment of the first and second objects is executed by using the detecting system and an exposure process is performed in the exposure app

Abstract: An exposure method includes first through third steps. In the first step, respective first and second illumination regions of a mask having a predetermined pattern are illuminated with an illumination light having a predetermined wavelength. In the second step, an image of the mask is formed, respectively, in first and second exposure regions (formed on a substrate) based on the illumination that passes through the first and second illumination regions. The first and second exposure regions each have a substantially polygonal shape defined by two parallel sides and two sides other than the two parallel sides. In the third step, the first and second exposure regions and the substrate are moved relatively in a first direction such that the first and second exposure regions are formed in different positions in a second direction which crosses the first direction.

Abstract: A semiconductor body having an alignment mark comprising a pair of sets of parallel lines disposed on the semiconductor body, the parallel lines in one of the sets being disposed orthogonal to the parallel lines in the other one of the set, the two sets of parallel lines being in an overlaying relationship. Also, a method and apparatus for detecting an alignment mark on a semiconductor body. The method and apparatus provide an alignment illumination comprising a pair of orthogonal, lines of impinging light which is scanned over the surface of the alignment mark, one of such pair of impinging light lines being orthogonal to, and laterally displaced from, the other one of such pair of impinging light lines, impinging light being reflected by the alignment lines in the surface of the semiconductor when such impinging light is over to provide a pair of laterally displaced beams of reflected light.

Abstract: In an alignment method, in order to expose a pattern of a first object onto a second object, a plurality of marks on the second object are detected with a mark detection unit, and the first and second objects are aligned with each other. Before this process, the shape of a mark on the second object is measured, thereby obtaining an offset that should be reflected in a detection result of the mark detection unit. The shape of the mark is measured with a shape measurement unit (63) with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement unit (64) with a possibility of coming into contact with the mark. The shape of the mark can be measured without contaminating or damaging the mark.

Abstract: A system for precisely locating an absolute position of a target structure disposed at a known relative position on a substrate, where the substrate has devices in a pattern. Input means receive information, including a substrate size, a pattern offset, a device size, the known relative position of the target structure, and a target structure shape. Staging means receive the substrate in a known orientation. Processing means are used to locate several positions. A center position of the substrate is located from the substrate size and the known orientation of the substrate. A first intermediate position is located by combining the center position of the substrate with the pattern offset. A second intermediate position is located by combining the first intermediate position with at least a first component of the device size. A third intermediate position is located by combining the second intermediate position with the known relative position of the target structure.

Abstract: In a system for locating and measuring an index mark on an edge of a wafer, a wafer to be examined is positioned and centered on a chuck in a horizontal chuck position such that an index mark is oriented within first and second index mark orientation features disposed on the chuck. The chuck is translatable, tiltable between horizontal and vertical positions, and rotatable over an angle subtended by the index mark orientation features of the chuck. A laser beam from a laser beam optical profiler is focussed on the surface of the wafer at a distance proximate the wafer edge and proximate the first index mark orientation feature of the chuck. The chuck is rotated in a direction from the first to the second index mark orientation feature whereby a reflected portion of the laser beam generates data corresponding to the angular location of index mark edges. An index mark center location is computed.

Abstract: An automatic light-coupling system for optical components suitable for coupling and packaging an optical assembly, comprising: a light-coupling device comprising: a coupling media installer comprising a horizontal table for moving a coupling media along a horizontal direction; a vertical table for moving a coupling media along a vertical direction; and a coupling media table for clipping a connector of the coupling media; and an optical component installer comprising a focus-control table for controlling the focusing and withdrawing of the optical components; a horizontal turntable for controlling the horizontal rotation of the optical components; a vertical turntable for controlling the vertical rotation of the optical components; an adapter of the optical component for holding the optical component, in which a pinhole is placed in front of the optical component so that the light emitted from the optical component passes through the pinhole and forms a light beam that is rotated to correct the assembly incli

Abstract: The present invention is directed to scanning exposure apparatus and exposure method to achieve simultaneous projection of images of plural regions on a mask onto a photosensitive substrate with correcting an orthogonality error of a pattern on the mask or photosensitive substrate. If the pattern on the mask or photosensitive substrate has an orthogonality error causing a deviation of a certain angle in a first direction perpendicular to a scanning direction as it goes in the scanning direction, the mask and the photosensitive substrate are rotated relative to each other in the plane thereof to align one coordinate axis in a coordinate system of each pattern with the first direction.