Pinning Patents (Class 361/234)
  • Patent number: 11398397
    Abstract: Electrostatic chucks, plasma processing apparatuses, and methods of fabricating semiconductor devices using the same are provided. The electrostatic chuck includes a chuck base, an upper plate provided on the chuck base, and an inner plate provided between the chuck base and the upper plate. A first diameter of the inner plate is less than a second diameter of the upper plate.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: July 26, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yongwoo Lee, Youngjin Noh, Myungsun Choi, Minyoung Hur, Seungbo Shim, Jaehak Lee
  • Patent number: 11396704
    Abstract: A substrate holder according to one embodiment of the present disclosure comprises a stage made of a dielectric material and configured to support a substrate; an attraction electrode provided in the stage and configured to electrostatically attract the substrate; and a heater configured to heat the stage. By applying a DC voltage to the attraction electrode, the substrate is electrostatically attached to a surface of the stage by a Johnsen-Rahbek force. The stage comprises an annular close contact area with which the substrate comes into close contact at a position corresponding to an outer periphery of the substrate on the surface of the stage; and a groove provided in an annular shape in a portion outside the close contact area, and a conductive deposition film formed by the raw material gas is accumulated in the groove.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: July 26, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Toshiaki Fujisato, Takashi Mochizuki, Daisuke Toriya, Kouki Suzuki, Hwajun Noh
  • Patent number: 11393708
    Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 19, 2022
    Assignee: Toto Ltd.
    Inventors: Masafumi Ikeguchi, Tetsuro Itoyama, Shuichiro Saigan, Jun Shiraishi
  • Patent number: 11395377
    Abstract: Disclosed is a ceramic heater and a ceramic plate for a ceramic heater, wherein, in order to prevent crack development at a ceramic surface around an electrode part and thereby improve durability, the end of a support part for an electrode rod is spaced apart from the ceramic surface opposite thereto, and a space for placing a filler mass is provided around the end of the support part for the electrode rod, whereby force or stress applied to the ceramic surface due to the expansion of the support part or by the filler mass is removed.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: July 19, 2022
    Assignee: MICo Ceramics Ltd.
    Inventors: Myoung Ha Park, Chul Ho Jung
  • Patent number: 11380573
    Abstract: A substrate support for use in a reaction chamber includes a base, and an in-situ electrostatic chuck. The chuck includes a first electrode in an upper portion of the chuck that is configured to hold a wafer to an upper surface of the upper portion by a first electrostatic attractive force under a condition of a first voltage is applied to the first electrode, and a second electrode that opposes an upper surface of the base and is configured to hold the chuck to the base by a second electrostatic attractive force under a condition that a second voltage is applied to the second electrode. Under a condition that the second voltage is not supplied to the second electrode, the second electrostatic attractive force is not present and the chuck is freed to be replaced in-situ without also removing the base and without exposing the reaction chamber to external atmosphere.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: July 5, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Daisuke Hayashi, Atsushi Kawabata
  • Patent number: 11381179
    Abstract: A method of generating an electrostatic attraction force includes an application of an insulating surface, wherein the insulating surface separates electrode arrays and the electrode arrays positioned in at least two different axes and providing an adhesion with an help of the electrostatic attraction force, wherein a matrix array is formed for an electrostatic attraction force region to provide gravity to at least one of objects, at a desired point and a number of electrodes is generated by feeding with a DC voltage and/or an AC voltage at desired points and at a desired force, wherein at least two objects adhere with the electrostatic attraction force.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: July 5, 2022
    Assignee: HIDROPAR HAREKET KONTROL TEKNOLOJILERI MERKEZI SANAYI VE TICARET ANONIM SIRKETI
    Inventors: Tolga Cankurt, Serhat Demirtas, Evren Samur
  • Patent number: 11380571
    Abstract: The present disclosure provides an electrostatic chuck for holding a wafer. The electrostatic chuck includes at least one dielectric layer, an electrode layer coupled to the dielectric layer, and a chuck base. The chuck base includes a plurality of lock holes. The dielectric layer and the electrode layer are disposed on the chuck base. Each of the lock holes of the chuck base includes a first portion and a second portion connected to the first portion. The first portion has a first opening on a bottom surface of the chuck base. The second portion has a second opening on the bottom surface of the chuck base. A width of the second opening of the second portion is smaller than a width of the first opening of the first portion.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: July 5, 2022
    Assignee: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
    Inventor: Woohyun Jeong
  • Patent number: 11373890
    Abstract: Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: June 28, 2022
    Assignee: Applied Materials, Inc.
    Inventor: Ramesh Gopalan
  • Patent number: 11367646
    Abstract: An electrostatic chuck that fixes a work substrate by an electrostatic force, the electrostatic chuck is disclosed. The electrostatic chuck includes a dielectric plate being configured to support the work substrate, a base plate being configured to support the dielectric plate and an adsorption electrode interposed between the dielectric plate and the base plate, and being configured to generate an electrostatic force for adsorbing the work substrate. The dielectric plate is a sapphire plate, the base plate consists of a alumina ceramic material, the adsorption electrode has a resistance change rate of 20% or less in a range of ?200° C. to 400° C., and the dielectric plate and the base plate are integrally bonded through the adsorption electrode.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: June 21, 2022
    Assignee: SEMES CO., LTD.
    Inventors: Sang Kee Lee, Yoshiaki Moriya
  • Patent number: 11355323
    Abstract: A dry etching apparatus plasma processes a wafer held by a carrier having a frame and an holding sheet. The carrier is placed on an electrode unit of a stage provided in a chamber. The electrode unit is cooled by a cooling section configured to cool the electrode unit. An upper face of the electrode unit is at least as large as the back side of the carrier. The holding sheet and the frame are cooled effectively by the heat transfer to the stage.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: June 7, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Shogo Okita
  • Patent number: 11348767
    Abstract: A plasma processing apparatus is provided. The plasma processing apparatus includes a processing chamber defining a vertical direction and a lateral direction. The plasma processing apparatus includes a pedestal disposed within the processing chamber. The pedestal is configured to support the substrate. The plasma processing apparatus includes a radio frequency (RF) disposed within the processing chamber. The RF bias electrode defines a RF zone extending between a first end of the RF bias electrode and a second end of the RF bias electrode along the lateral direction. The plasma processing apparatus includes a focus ring disposed within the processing chamber. The plasma processing apparatus further includes a focus ring adjustment assembly. The focus ring adjustment assembly includes a lift pin positioned outside of the RF zone. The lift pin is movable along the vertical direction to adjust a distance between the pedestal and the focus ring along the vertical direction.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: May 31, 2022
    Assignees: BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD, MATTSON TECHNOLOGY, INC.
    Inventors: Martin L. Zucker, Peter J. Lembesis, Ryan M. Pakulski, Shawming Ma
  • Patent number: 11349414
    Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: May 31, 2022
    Assignee: ADVANCED ION BEAM TECHNOLOGY, INC.
    Inventors: Te-Min Wang, Yu-Ho Ni, Chun-Chieh Lin, Chien-Chung Hou, Cheng-Mao Chien
  • Patent number: 11328948
    Abstract: An electrostatic chuck device (1) including: an electrostatic chuck part (2) which includes a base material (11) having a mounting surface (11a) on which a plate-like sample W is mounted, and an internal electrostatic attraction electrode (13) which electrostatically attracts the plate-like sample (W) to the mounting surface (11a); a cooling base part (3) which is configured to cool the electrostatic chuck part (2); and an adhesive layer (4) which is interposed therebetween, in which a shape of the mounting surface of the base material (11) includes a concave surface (23) or a convex surface, which is a curved surface that gradually curves from a center (11b) of the mounting surface (11a) toward an outer periphery (11c) of the mounting surface (11a) and includes no inflection point, and an absolute value of a difference between a height of a center of the concave surface (23) or the convex surface from a position of a main surface (3a) of the cooling base part (3) as a reference and a height of an outer perip
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: May 10, 2022
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Masaki Ozaki, Norito Morishita
  • Patent number: 11328907
    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has a first major surface and a second major surface. The first electrode layer is provided inside the ceramic dielectric substrate and connected to a high frequency power supply. The first electrode layer is provided between the first major surface and the second major surface. The first electrode layer has a first surface and a second surface. A surface roughness of the second surface is larger than a surface roughness of the first surface.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 10, 2022
    Assignee: Toto Ltd.
    Inventors: Yutaka Momiyama, Hitoshi Sasaki
  • Patent number: 11328893
    Abstract: A plasma processing system has been disclosed. The plasma processing system includes an electrostatic chuck (ESC) and an edge ring assembly. The edge ring assembly has a conductive ring configured to generate an electric field to adjust the direction of ions.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 10, 2022
    Assignee: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
    Inventor: Deog-Ja Koo
  • Patent number: 11328906
    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has a first major surface and a second major surface. The first electrode layer is provided inside the ceramic dielectric substrate and connected to a high frequency power supply. The first electrode layer is provided between the first major surface and the second major surface. The first electrode layer has a first surface and a second surface. The first electrode layer includes a first region including the first surface, a second region including the second surface, and a third region positioned between the first region and the second region. A porosity of the first region is lower than a porosity of the third region.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 10, 2022
    Assignee: Toto Ltd.
    Inventors: Yutaka Momiyama, Hitoshi Sasaki
  • Patent number: 11315819
    Abstract: A method may include providing a substrate on a clamp, and directing radiation from an illumination source to the substrate when the substrate is disposed on the clamp during substrate processing, wherein the radiation is characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: April 26, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Qin Chen, Julian G. Blake, Michael W. Osborne, Steven M. Anella, Jonathan D. Fischer
  • Patent number: 11309206
    Abstract: Disclosed is an electro static chuck. Disclosed is an electro static chuck which includes: a base substrate; and an electro static chuck plate fixed onto the base substrate and including a plurality of electrodes to which biases for chucking and dechucking are applied, in which the plurality of electrodes includes a spiral pattern extending from a start point of an edge of the electro static chuck plate toward an end point of a center and a rotational angle of the spiral pattern is 360°n (n is a real number of 1 to 2).
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 19, 2022
    Assignee: MiCo Ceramics Ltd.
    Inventors: Jeonghun Hwang, Hankyun Yoo, Sangbum Cho
  • Patent number: 11302536
    Abstract: A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: April 12, 2022
    Assignee: APPLIED Materials, Inc.
    Inventors: Ming Yin, Dawei Sun
  • Patent number: 11302557
    Abstract: An electrostatic clamping system including a platen, an electrostatic electrode associated with the platen, and a sealing cover having a concave lower surface defining a cavity and having a sealing ring extending about a periphery of the lower surface, the sealing cover movable relative to the platen for being moved onto, and being moved off of, a wafer disposed on the platen, the sealing cover further having an inlet valve for introducing a gas into a space between a cover body of the sealing cover and the wafer.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: April 12, 2022
    Assignee: Applied Materials, Inc.
    Inventor: James Carroll
  • Patent number: 11289356
    Abstract: Disclosed is a stage including: an electrostatic chuck having a substrate placement surface on which a substrate is placed; and an electrostatic chuck placement plate on which the electrostatic chuck is placed. The electrostatic chuck and the electrostatic chuck placement plate are fastened by a plurality of first fasteners from a side of the electrostatic chuck placement plate, and the stage is fastened to a support provided on an opposite side of the electrostatic chuck of the electrostatic chuck placement plate by a plurality of second fasteners on a radially outer side of the placement surface.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: March 29, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Daisuke Hayashi
  • Patent number: 11282733
    Abstract: There is provided a stage mechanism, including: an electrostatic chuck having a conductive film formed on a front surface thereof, the conductive film configured to make electrically contact with a rear surface of a substrate; a conductive member electrically connected to the conductive film and formed to extend to a rear surface of the electrostatic chuck; and a moving member electrically connected to the conductive member via a connecting member and configured to move between a first position connected to a ground potential and a second position not connected to the ground potential.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 22, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuuki Motomura, Hiroshi Sone, Yasuyuki Kagaya, Naoyuki Suzuki
  • Patent number: 11282726
    Abstract: A method for measuring wafer bow value comprising the following steps is provided. Place a wafer on a wafer chuck apparatus. A gas inlet process is performed on gas inlet passageways of a passageway pair of the wafer chuck apparatus. A gas outlet process is performed on gas outlet passageways of a passageway pair of the wafer chuck apparatus. A leak rate of each channel pair is measured by the control unit when the wafer is placed on the wafer chuck apparatus and during the gas inlet process and gas outlet process are performed. A wafer bow value of the wafer on the wafer chuck apparatus is estimated by the leak rate of the passageway pair. A wafer chuck apparatus is provided. A semiconductor process flow is provided.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: March 22, 2022
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Cheng-Yen Tsai, Wei-Sheng Chen
  • Patent number: 11270902
    Abstract: An electrostatic substrate holder for accommodating and holding a substrate, a method for processing a substrate, and a processing plant. The electrostatic substrate holder includes a stator having electrodes that generate an electrostatic holding force for fixing the substrate.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: March 8, 2022
    Assignee: EV Group E. Thallner GmbH
    Inventor: Christoph Flotgen
  • Patent number: 11257702
    Abstract: The power supply apparatus for the electrostatic chuck of this invention has: DC power source units for applying DC voltage to electrodes of the electrostatic chuck; and an AC power source unit for causing AC current to flow through an electrostatic capacitance of the electrostatic chuck. Provided that: a circuit for charging an electrode, from DC power source unit, with chuck voltage in order to attract and hold in position the to-be-processed substrate with the electrostatic chuck, be defined as a first circuit and that; a circuit for clearing charges of the to-be-processed substrate be defined as a second circuit, the power supply apparatus further includes switching means for switching between the first circuit and the second circuit. The second circuit is provided with an AC power source unit and a voltmeter for measuring AC voltage.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: February 22, 2022
    Assignee: ULVAC TECHNO, LTD.
    Inventors: Katsunori Fujii, Masanori Ito, Yasushi Iwata
  • Patent number: 11253163
    Abstract: Systems and methods are provided for detecting and analyzing changes in a body. A system includes an electric field generator, an external sensor device, a quadrature demodulator, and a controller. The electric field generator is configured to generate an electric field that associates with a body. The external sensor device sends information to the electric field generator and is configured to detect a physical change in the body in the electric field, where the physical change causes a frequency change of the electric field. The quadrature demodulator receives the electric field from the electric field generator and is configured to detect the frequency change of the electric field and to produce a detected response. The controller, coupled to the electric field generator, is configured to output a frequency control signal to the electric field generator and to modify the frequency of the electric field by adjusting the frequency control signal.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: February 22, 2022
    Assignee: Life Detection Technologies, Inc.
    Inventors: John B. Langley, II, Guy McIlroy
  • Patent number: 11257661
    Abstract: A plasma processing apparatus includes: a plasma processing chamber; a radio frequency power source; a sample stage on which a sample is mounted; an electrode which is arranged inside the sample stage and electrostatically chucks the sample; a DC power source which applies a DC voltage to the electrode; and a control device which controls an output voltage of the DC power source so that an electric potential difference between an electric potential of the sample and an electric potential of an inner wall of the plasma processing chamber is reduced to an electric potential difference within a predetermined range during interruption of plasma discharge.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: February 22, 2022
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Masaki Ishiguro, Masahiro Sumiya, Shigeru Shirayone, Kazuyuki Ikenaga, Tomoyuki Tamura
  • Patent number: 11257703
    Abstract: A semiconductor manufacturing apparatus includes: a metal base member fixed to a surface, on the opposite side of a wafer mounting surface, of an electrostatic chuck; an electrode terminal connected to an electrode embedded in the electrostatic chuck; a through hole provided at a position of the base member, the position being opposed to the electrode terminal; an insulating sleeve fixed to the inner circumferential surface of the through hole; a chuck-side terminal which is connected to the electrode terminal via a flexible cable, and fixed to the insulating sleeve with arranged in the insulating sleeve; a flexible insulating tube that covers the cable, the flexible insulating tube having one end fixed to the electrode terminal and the other end fixed to the chuck-side terminal; and an insulating resin member that covers at least part of the electrode terminal, the part being not covered by the insulating tube.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: February 22, 2022
    Assignee: NGK Insulators, Ltd.
    Inventor: Shinpei Kunita
  • Patent number: 11250995
    Abstract: An ultracapacitor that includes an energy storage cell immersed in an advanced electrolyte system and disposed within a hermetically sealed housing, the cell electrically coupled to a positive contact and a negative contact, wherein the ultracapacitor is configured to output electrical energy within a temperature range between about ?40 degrees Celsius to about 210 degrees Celsius. Methods of fabrication and use are provided.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: February 15, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Fabrizio Martini, Riccardo Signorelli, John J. Cooley, Christopher John Sibbald Deane, James Epstein, Padmanaban Sasthan Kuttipillai, Lindsay A. Wilhelmus
  • Patent number: 11241720
    Abstract: The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber. control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: February 8, 2022
    Assignee: TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC.
    Inventors: Kevin Siefering, Edward Hanzlik
  • Patent number: 11232967
    Abstract: Disclosed is a stage including: an electrostatic chuck having a substrate placement surface on which a substrate is placed; and an electrostatic chuck placement plate on which the electrostatic chuck is placed. The electrostatic chuck and the electrostatic chuck placement plate are fastened by a plurality of first fasteners from a side of the electrostatic chuck placement plate, and the stage is fastened to a support provided on an opposite side of the electrostatic chuck of the electrostatic chuck placement plate by a plurality of second fasteners on a radially outer side of the placement surface.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: January 25, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Daisuke Hayashi
  • Patent number: 11224353
    Abstract: Systems and methods are provided for detecting and analyzing changes in a body. A system includes an electric field generator, an external sensor device, a quadrature demodulator, and a controller. The electric field generator is configured to generate an electric field that associates with a body. The external sensor device sends information to the electric field generator and is configured to detect a physical change in the body in the electric field, where the physical change causes a frequency change of the electric field. The quadrature demodulator receives the electric field from the electric field generator and is configured to detect the frequency change of the electric field and to produce a detected response. The controller, coupled to the electric field generator, is configured to output a frequency control signal to the electric field generator and to modify the frequency of the electric field by adjusting the frequency control signal.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: January 18, 2022
    Assignee: Life Detection Technologies, Inc.
    Inventors: John B. Langley, II, Guy McIlroy
  • Patent number: 11214721
    Abstract: Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: January 4, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takanori Ito, Akihiro Endo, Yasuhisa Ishihara
  • Patent number: 11205978
    Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Wayne McMillan, Visweswaren Sivaramakrishnan, Joseph C. Olson, Ludovic Godet, Rutger Meyer Timmerman Thijssen, Naamah Argaman
  • Patent number: 11179965
    Abstract: An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: November 23, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Vijay D. Parkhe, Kadthala Ramaya Narendrnath
  • Patent number: 11177151
    Abstract: A sample holder includes an insulating substrate including a ceramic material and having a sample holding surface on one main surface thereof, a heat-generating resistor located on another main surface of the insulating substrate, a metal member facing the another main surface, and an adhesive layer covering the another main surface, the adhesive layer including a first layer which is in contact with the insulating substrate, and a second layer which is in contact with the metal member and having an elastic modulus that is smaller than an elastic modulus of the first layer, the second layer including a layered portion positioned between the first layer and the metal member, and an annular portion surrounding the first layer.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: November 16, 2021
    Assignee: KYOCERA CORPORATION
    Inventor: Youhei Hori
  • Patent number: 11171030
    Abstract: Methods and apparatus for dechucking a wafer from a surface of an electrostatic chuck (ESC). In some embodiments, a method comprises reducing a pressure of a gas applied to a backside of the wafer to approximately zero psi; reducing a downward pressure in a cylinder bore of a lifting actuator to approximately atmospheric pressure while a processing volume of the processing chamber is in a vacuum state to create a constant upward force on the wafer, the constant upward force less than a breaking force of the wafer; and sweeping a voltage applied to the ESC to dechuck the wafer; and monitoring a sensor on the lifting actuator that is interposed between a chucking position of the lifting actuator and a transfer position of the lifting actuator to detect when the wafer is dechucked.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: November 9, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Hamid Noorbakhsh, Anwar Husain, Haitao Wang, Sergio F Shoji
  • Patent number: 11145531
    Abstract: A substrate fixing device includes a baseplate, an adhesive layer on the baseplate, and an electrostatic chuck on the adhesive layer. The adhesive layer includes a first layer and a second layer. The second layer is between the first layer and the electrostatic chuck. The thermal conductivity of the first layer is higher in a stacking direction in which the baseplate, the adhesive layer, and the electrostatic chuck are stacked than in a plane direction perpendicular to the stacking direction. The thermal conductivity of the second layer is higher in the plane direction than in the stacking direction.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 12, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kazuhiro Fujita
  • Patent number: 11136662
    Abstract: An apparatus for adsorbing a mask includes an adsorbing member and a controller connected to the adsorbing member. The adsorbing member is configured to adsorb the mask during evaporation and is capable of simultaneously producing different or a same adsorption force to different regions of the mask. The controller is configured to control the adsorbing member to start adsorption from at least one initial adsorption region of the mask, and then control the adsorbing member to gradually expand an adsorption range from the at least one initial adsorption region until the mask is entirely attached to a base substrate.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 5, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chang Luo, Jianpeng Wu
  • Patent number: 11133212
    Abstract: A substrate support is disclosed. The substrate support has a dielectric body with a plurality of features formed thereon. A ledge surrounds the plurality of features about a periphery thereof. The features increase in number from a central region of the substrate support towards the ledge. A seasoning layer is optionally disposed on the dielectric body.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: September 28, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abdul Aziz Khaja, Jun Ma, Hyung Je Woo, Fei Wu, Jian Li
  • Patent number: 11114411
    Abstract: A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: September 7, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Thomas Schwarz, Jürgen Moosburger, Frank Singer
  • Patent number: 11111583
    Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 7, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sriskantharajah Thirunavukarasu, Karthik Elumalai, Jen Sern Lew, Mingwei Zhu
  • Patent number: 11107719
    Abstract: An electrostatic chuck device includes: a base having one principal surface which is a placing surface on which a plate-shaped sample is placed, wherein the base is made from a sintered compact of ceramic particles, which include silicon carbide particles and aluminum oxide particles, as a forming material; and an electrostatic attraction electrode which is provided on a surface of the base on the side opposite to the placing surface of the base, or in the interior of the base, in which the volume resistivity value of the sintered compact is 0.5×1015 ?cm or more in the entire range from 24° C. to 300° C., a graph which shows the relationship of the volume resistivity value of the sintered compact to a temperature at which the volume resistivity value of the sintered compact is measured has a maximum value in the range from 24° C. to 300° C., and the amount of metal impurities in the sintered compact other than aluminum and silicon in the sintered compact is 100 ppm or less.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: August 31, 2021
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Nobuhiro Hidaka, Hironori Kugimoto, Mamoru Kosakai
  • Patent number: 11107694
    Abstract: A sample releasing method for releasing a sample subjected to plasma processing from a sample stage on which the sample is electrostatically attracted by applying DC voltage to an electrostatic chuck electrode, and the method includes: moving the sample subjected to the plasma processing upward above the sample stage; and after moving the sample, controlling the DC voltage such that an electric potential of the sample is to be smaller.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: August 31, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Masaki Ishiguro, Masahiro Sumiya, Shigeru Shirayone, Tomoyuki Tamura, Kazuyuki Ikenaga
  • Patent number: 11094577
    Abstract: Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 17, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Joseph Yudovsky, Kaushal Gangakhedkar
  • Patent number: 11094566
    Abstract: A substrate heating apparatus includes: a substrate support configured to substantially horizontally support a substrate; a heater provided below the substrate support substantially parallel to the substrate, and having a predetermined planar shape; and a side portion extending downward from an outer peripheral portion of the heater.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: August 17, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Satoshi Oikawa
  • Patent number: 11088005
    Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a thermally managed material embedded in the thermally conductive base at the upper surface of the thermally conductive base in one or more of the plurality of thermal zones. The thermally managed material has different thermal conductive properties along a first direction and a second direction. The thermally conductive base further includes a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base between two or more of the plurality of thermal zones without contacting the lower surface of the thermally conductive base. Each of the plurality of thermal isolators provides a degree of thermal isolation.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: August 10, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Vijay D. Parkhe, Konstantin Makhratchev, Jason Della Rosa, Hamid Noobakhsh, Brad L. Mays, Douglas A. Buchberger, Jr.
  • Patent number: 11075104
    Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 27, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
  • Patent number: 11069554
    Abstract: A platen having improved thermal conductivity and reduced friction is disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivity, thus improving the transfer of heat between the platen and the workpiece. Furthermore, the friction between the carbon nanotubes and the workpiece is much lower than that with conventional embossments, reducing particle generation. In another embodiment, a support plate is disposed on the platen, wherein the carbon nanotubes are disposed on the top surface of the support plate.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: July 20, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Dawei Sun, Steven M. Anella, Qin Chen, Ron Serisky, Julian G. Blake, David J. Chipman
  • Patent number: 11062926
    Abstract: Apparatus and method for monitoring wafer charges are proposed. A conductive pin, a conductive spring and a conductive line are configured in series to connect the backside surface of the wafer and the sample conductor so that the backside surface of the wafer and the surface of the sample conductor have identical charge density. Hence, by using a static electricity sensor positioned close to the surface of the sample conductor, the charges on the wafer may be monitored. Note that the charges appeared on the frontside surface of the wafer induces charges on the backside surface of the wafer. The sample conductor is a sheet conductor and properly insulated from the surrounding environment. As usual, the sample conductor and the static electricity sensor are positioned outside the chamber where the wafer is placed and processed, so as to simplify the apparatus inside the chamber and reduce the contamination risk.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: July 13, 2021
    Assignee: ADVANCED ION BEAM TECHNOLOGY, INC.
    Inventors: Chih-Chiang Wu, Chun-Chin Kang, Yu-Ho Ni, Chien-Ta Feng