Abstract: An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.

Abstract: An integrated circuit connector is extendable for a variety of applications. In connection with various embodiments, an electrical connector has first and second ends connected to respective circuit nodes in an integrated circuit device. The connector is bundled between the circuit nodes (e.g., substantially all of the connector is located between nodes), and is extended from such a bundled state in which the first and second connected ends are separated by a first proximate distance. The connector is applied in an extended state in which the first and second connected ends are separated by a second distance that is greater than the first proximate distance by at least two orders of magnitude.

Abstract: A high reliable electric double layer capacitor is provided by increasing a sealing ability and strength of given portions of collecting terminals. In an electric double layer capacitor including a capacitor proper 1a produced by a plurality of stacked cells and an aluminum laminate film covering the exterior of the capacitor proper, a pair of collecting terminals 12 and 13 are provided at opposed portions of the capacitor proper 1a. Each collecting terminal 12 or 13 includes a first bent portion 12b or 13b that is bent to extend along a side surface 1b of the capacitor proper 1a and a second bent portion 12c or 13c that is bent to extend outward from a vertically middle position of the side surface 1b of the capacitor proper 1a.

Abstract: A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.

Abstract: A filament post used in plasma-enhanced chemical vapor deposition has an outer shell and an inner post. An electrical potential is applied only to the inner post to ensure that there is no impact on the plasma density and the carbon film properties. The inner post and the outer shell are electrically insulated by ceramic insulators, such that no electrical potential is applied to outer shell. The stress generated in the carbon film is directly related to the electrical potential of the surface to which the film is deposited. The carbon film deposited on the outer shell of the post is not highly stressed, which significantly reduces film delamination from the filament post surfaces.

Abstract: There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.

Abstract: The electromagnetic relay of the present invention comprises a base (10), an electromagnet (20) disposed on the base, an armature (30) supported rotatably by the base, a movable spring (40) whose one end has a movable contact (41) and the opposite end is secured to the base, a fixed contact (51) disposed opposite to the movable contact, and a card (60). The card has a coupling part (61) to be coupled to the armature and an insertion hole (62) to which the one end of the movable spring is inserted, and it deforms the movable spring elastically in conjunction with a swing motion of the armature to selectively open or close a connection between the movable contact and the fixed contact. The movable spring has a U-shaped hook formed by bending the one end of the movable spring toward the opposite end side, and the hook can pass through the insertion hole while being pushed by an inner surface of the insertion hole and being deformed elastically, and an end of the hook is engaged with the card.

Abstract: A multi-layer micro-printed circuit board (PCB) is disclosed, which defines a magnetic component, such as a transformer, using planar technology. Instead of using the traditional twelve-layer PCB incorporating both a primary and a secondary winding, this invention stacks multiple PCBs, each having four or six layers and each including a single winding (either the primary or the secondary). The PCBs are stacked in an offset arrangement such that the pins penetrating the PCB or PCBs including the primary winding or windings do not penetrate the PCB or PCBs including the secondary winding or windings. Additionally, this offset arrangement prevents the pins penetrating the secondary PCBs from penetrating the primary PCBs in the same manner. This offset configuration thereby avoids significant flashover problems associated with current planar components.

Abstract: A capacitive transducer apparatus converts mechanical force to electrical signal parameters by change of spacing between plates of a plurality of capacitors. The apparatus has two mechanical components. The first component includes an articulating member such as a post surrounded by a first capacitive plate. Means are provided for causing the articulating member to articulate responsive to user manipulation thereof, and thereafter, to return to a quiescent position. The second component includes a second capacitive plate made up of a plurality of printed metalized members disposed about the articulating member substantially parallel to the first capacitive plate. A circuit is provided for detecting respective signals from a plurality of capacitors formed by the plates, the respective signals varying in value depending on articulation of the articulating member which alters the capacitance of the respective capacitors depending on the direction and magnitude of an applied force.

Abstract: A multilayer type electronic part includes a laminated structure formed by stacking a plurality of first and second ceramic layers, the first ceramic layers being provided with internal electrode patterns on top thereof, the second ceramic layers having no internal electrode pattern and being located at a top and a bottom portions of the laminated structure, respectively, the internal electrode patterns being connected to each other to form a coil inside the laminated structure, a pair of external electrodes provided at two opposing sides of the laminated structure and connected to the coil. The multilayer type electronic part further includes one or more third ceramic layers, each of the third ceramic layers not including internal electrode pattern and being interposed between the first ceramic layers, and means for connecting the internal electrode patterns formed on the first ceramic layers to form the coil.