Special Type (e.g., "bypass" Type) Patents (Class 361/301.2)
  • Patent number: 10068710
    Abstract: A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 ?m or less.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: September 4, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro Nishisaka, Masato Kimura
  • Patent number: 9978524
    Abstract: A multilayer ceramic capacitor that includes a laminated body of multiple dielectric layers and internal electrodes laminated alternately therewith. The dielectric layers contain Ba, Sr, Ti, Ca, Zr, Mg, and R, where R represents at least one element of Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb. When Ti is 100 parts by mol, the dielectric layers contain Sr at 0.5 to 3.0 parts by mol; Ca at 3 to 15 parts by mol; Zr at 0.05 to 3.0 parts by mol; Mg at 0.01 to 0.09 parts by mol; and R at 2.5 to 8.4 parts by mol.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 22, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shinichi Yamaguchi
  • Patent number: 9698627
    Abstract: The invention includes; a sealed housing made of a plastic or metal material; a conductive plate made of a copper material, positioned in the center of the housing, and respectively connected to power lines so as to accumulate magnetic energy generated in an internal polymer-clay nanocomposite; a base insulation plate having insulation characteristics so as to fix the conductive plate; electric wires which are power lines for transmitting the magnetic energy stored on the conductive plate to the outside; the polymer-clay nano composite filled in the bottom portion of the housing such that the conductive plate is submerged therein; an upper ceramic layer coated on the inner wall of the housing so as to promote the magnetic interaction of a ceramic compound in the upper space portion of the polymer-clay nano composite.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: July 4, 2017
    Assignee: KESECO CO., LTD.
    Inventor: Eun Guk Kim
  • Patent number: 9688149
    Abstract: A voltage stabilization apparatus (1) for a motor vehicle electrical system to stabilize at least one voltage-sensitive consumer (9) is proposed. The voltage stabilization apparatus is distinguished by a DC/DC converter circuit (3), an energy storage device (5) and a changeover switch (7), which are designed and arranged so that the energy storage device (5) is changeable by the DC/DC converter circuit (3) and the changeover switch (7) enables an electrical connection between the voltage-sensitive consumer (9) and the energy storage device (5) in such a way that the energy storage device (5) in case of need supplies a stabilization voltage (USTAB) at the consumer (9).
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: June 27, 2017
    Assignee: Flextronics International Kft.
    Inventors: Vit Kocur, Martin Gerhat
  • Patent number: 9548161
    Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: January 17, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Toshiyuki Nakaiso, Yutaka Takeshima, Yutaka Ishiura, Yuji Irie, Shinsuke Tani, Jun Takagi
  • Patent number: 9530564
    Abstract: A dielectric ceramic that contains Al and Si, as well as a barium titanate-based compound having a perovskite type crystal structure as a primary component. The total molar amount of Al and Si is 2 to 4 parts by mole with respect to 100 parts by mole of Ti, and the content ratio of Al with respect to the total molar amount is 0.2 or less (excluding 0) on the molar ratio basis. The dielectric ceramic may also contain at least one specific rare earth element Re, such as Gd, Tb, or Dy.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: December 27, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takayuki Yao
  • Patent number: 9258893
    Abstract: There is provided a multilayer ceramic electronic part including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body; upper and lower cover layers formed on upper and lower portions of the active layer; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode, a first conductive layer formed on the first base electrode at a corner portion of the ceramic body, and the second external electrode includes a second base electrode, a second conductive layer formed on the second base electrode at a corner portion of the ceramic body, the first and second conductive layers being positioned outside the active layer in a thickness direction of the ceramic body.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: February 9, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joon Hwan Kwag, Jae Sung Park, Sang Huk Kim
  • Patent number: 9129959
    Abstract: A number of semiconductor chips each include a first main face and a second main face opposite from the first main face. The second main face includes at least one electrical contact element. The semiconductor chips are placed on a carrier. A material layer is applied into intermediate spaces between adjacent semiconductor chips. The carrier is removed and a first electrical contact layer is applied to the first main faces of the semiconductor chips so that the electrical contact layer is electrically connected with each one of the electrical contact elements.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: September 8, 2015
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Irmgard Escher-Poeppel, Gottfried Beer
  • Patent number: 9042081
    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body having first and second side surfaces opposite to each other, and third and fourth end surfaces connecting the first and second side surfaces; a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third or fourth end surface; and first and second side margin parts formed from the first and second side surfaces to respective edges of the internal electrodes, the first and second side margin parts having an average thickness of 18 ?m or less, wherein when a boundary surface between a cover layer and the first or second side margin part in the ceramic body is divided into two regions in a thickness direction of the ceramic body, a region adjacent to the internal electrode is S1, and a porosity of S1 is P1, 1?P1?20 is satisfied.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Hyung Joon Kim
  • Patent number: 9042079
    Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: May 26, 2015
    Assignee: TDK CORPORATION
    Inventors: Sunao Masuda, Katsumi Kobayashi, Akitoshi Yoshii, Kazuyuki Hasebe, Takashi Komatsu, Kayou Kusano
  • Patent number: 9042080
    Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (Dc) of ceramic grains in a cover area is smaller than an average diameter (Da) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um?Tc?25 um and Tc/Dc?55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: May 26, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyo Jung Kim, Seok Hyun Yoon, Chang Hoon Kim, Byoung Hwa Lee, Sang Hoon Kwon
  • Publication number: 20150138689
    Abstract: A direct current (DC) link capacitor operable within an electrically drivable vehicle having a high-voltage battery is provided configured to facilitate output of a DC voltage to an inverter configured to process the DC voltage to facilitate powering an electric motor used to drive the vehicle. Thee DC link capacitor includes a housing enclosing capacitive elements configured to facilitate capacitive processing between an input and an output, at least a first pair of terminals configured to deliver the DC voltage to the input, the capacitive elements processing the DC voltage received at the input into a capacitive DC voltage, and at least a second pair of terminals configured to output the capacitive DC voltage to the inverter, the inverter relying on the capacitive DC voltage to facilitate powering the electric motor.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Inventors: Nadir Sharaf, Yu Qin, Reshma Rathod, Richard J. Hampo
  • Patent number: 9030801
    Abstract: There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces facing each other, and third and fourth end surfaces connecting the first and second side surfaces, a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third end surface or the fourth end surface, and a first side margin part and a second side margin part formed such that an average thickness thereof from the first and second side surfaces to edges of the internal electrodes is 18 ?m or less.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 12, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Hyung Joon Kim
  • Patent number: 9025310
    Abstract: There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces and third and fourth end surfaces, a plurality of internal electrodes and having one ends exposed to the third or fourth end surface, and first and second side margin parts formed so that an average thickness from the first and second side surfaces to edges of the internal electrodes is 18 ?m or less, wherein when the first or second side margin part is divided into two regions by a virtual line obtained by connecting mid points of distances between the edges of the internal electrodes and points at which lines extended from the internal electrodes contact the first or second side surface, when a region adjacent to the internal electrodes is defined as S1 and a porosity of S1 is defined as P1, P1 is in a range of 1 to 20 (1?P1?20).
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 5, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Hyung Joon Kim
  • Patent number: 9019690
    Abstract: There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: April 28, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung Pyo Hong, Hyun Hee Gu, Byoung Jin Chun, Jae Hwan Han
  • Patent number: 9007741
    Abstract: A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and an adsorbing portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The adsorbing portion adsorbs the first external electrode layer and the second external electrode layer, the adsorbing portion being provided on a third through-hole portion.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: April 14, 2015
    Assignee: Taiyo Yuden Co., ltd.
    Inventors: Hidetoshi Masuda, Yoshinari Take
  • Patent number: 8982534
    Abstract: There is provided a multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed on outer surfaces of the ceramic main body and second external electrodes formed outwardly of the first external electrodes, and protective layers including one or more of an oxide layer and a glass layer are formed between the first external electrodes and the second external electrodes.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 17, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joon Hwan Kwag, Sang Huk Kim
  • Patent number: 8963015
    Abstract: Shielding performance and protection from radiated RF energy at a cable's point of entry to an enclosure are improved when a shield of the cable is AC coupled around an entire opening of the enclosure using a discoidal capacitor. The capacitor may be electrically coupled to the shield and the enclosure around the entire inner and outer circumferences of the discoidal capacitor. Compared to traditional DC coupling or the use of a drain wire and traditional capacitor, using the discoidal capacitor lowers inductance and improves shielding of the opening itself while improving AC filtering characteristics and preventing ground loops.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: February 24, 2015
    Assignee: Fisher Controls International LLC
    Inventor: Adam Joseph Wittkop
  • Patent number: 8941972
    Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: January 27, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Jun Park, Sang Hoon Kwon, Chang Hoon Kim, Hyun Hee Gu, Jae Young Park, Da Young Choi, Kyu Ha Lee, Byung Jun Jeon
  • Patent number: 8917491
    Abstract: One object is to provide a porous capacitor having increased insulation reliability. In accordance with one aspect, the porous capacitor includes: a first conductor layer and a second conductor layer opposed to each other at a predetermined distance; a dielectric layer made of an oxidized valve metal and disposed between the first conductor layer and the second conductor layer; a large number of holes formed through the dielectric layer and oriented substantially orthogonal to the first conductor layer and the second conductor layer; and first electrodes and second electrodes formed of a conductive material filled in the holes; and insulation parts insulating the first electrodes from the second conductor layer and insulating the second electrodes from the first conductor layer. The thicknesses of the first conductor layer and the second conductor layer are equal to or greater than half of the inner diameter of the holes.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: December 23, 2014
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Hidetoshi Masuda, Kenichi Ota
  • Patent number: 8917490
    Abstract: There is provided a multi-layered ceramic capacitor having a dual layer-electrode structure formed by applying a dual layer of electrode paste to the multi-layered ceramic capacitor. The multi-layered ceramic capacitor having a dual layer-electrode structure includes a capacitor body having a preset length and width and having a plurality dielectric layers stacked therein, an internal electrode unit formed on the plurality of dielectric layers and having a preset capacitance, and an external electrode unit including first external electrodes respectively formed on both sides of the capacitor body to be electrically connected to internal electrodes, and second external electrodes formed on the first external electrodes.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: December 23, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Tae Kim, Jin Ju Park, Se Hyun Kim, Doo Young Kim, Kyung Nam Hwang
  • Publication number: 20140368966
    Abstract: A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.
    Type: Application
    Filed: September 3, 2014
    Publication date: December 18, 2014
    Inventors: Keith Bryan Hardin, John Thomas Fessler, Paul Kevin Hall, Robert Aaron Oglesbee
  • Patent number: 8908352
    Abstract: There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 ?m or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 ?m or less.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: December 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Min Cheol Park, Young Hoon Song, Mi Hee Lee
  • Patent number: 8908351
    Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic electronic component including the same, and a method of manufacturing the same, the conductive paste composition including: a metal powder; and an additive including at least one selected from glutamic acid, amino acids, thiols, and hydrocarbons.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: December 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ro Woon Lee, Young Ho Kim, Yoon Hee Lee, Kyung Jin Choi
  • Patent number: 8891226
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: November 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chung Eun Lee, Jae Yeol Choi, Doo Young Kim, Wi Heon Kim
  • Patent number: 8885321
    Abstract: Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes a laminate which has a plurality of laminated ceramic layers and internal electrodes formed along at a plurality of specific interface between the ceramic layers and having an Al/Ti alloy as a component; and an external electrode formed on the outer surface of the laminate. The Al/Ti ratio of the Al/Ti alloy is 91/9 or more.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: November 11, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Taisuke Kanzaki, Koichi Banno, Masahiro Otsuka, Shoichiro Suzuki, Akihiro Shiota, Masanori Nakamura
  • Patent number: 8885323
    Abstract: There is provided a multilayered ceramic electronic component including: a multilayered body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on the dielectric layers so as to be alternately exposed through end surfaces; a minimum margin indicating part formed on an L-direction margin part on which the first or second internal electrode is not formed on the dielectric layer and indicating a minimum size of the L-direction margin part, the L-direction minimum margin indicating part being inserted on the ceramic sheet, whereby a multilayered ceramic electronic component having high capacitance while reducing a defect and having excellent reliability may be implemented.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: November 11, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok Joon Hwang, Je Jung Kim
  • Patent number: 8885318
    Abstract: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 11, 2014
    Assignee: American Radionic Company, Inc.
    Inventor: Richard Stockman
  • Patent number: 8879237
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: November 4, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Woo Lee, Chi Hyoun Ro, Yoon Hee Lee
  • Patent number: 8879238
    Abstract: There is provided a multilayer ceramic capacitor, and a method of manufacturing the same, the multilayer ceramic capacitor including: a ceramic body; a first internal electrode; a second internal electrode; a first external electrode; a second external electrode; and an insulating layer.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: November 4, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Eung Soo Kim, Jong Ho Lee, Jae Yeol Choi, Doo Young Kim, Yu Na Kim, Sung Woo Kim
  • Patent number: 8879236
    Abstract: Provided is a laminated ceramic electronic component having excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and internal electrodes at a plurality of specific interfaces between the ceramic layers and having an Al/Ni alloy as a component; and an external electrode formed on the outer surface of the laminate, wherein the Al/Ni ratio of the Al/Ni alloy is 85/15 or more.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: November 4, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masahiro Otsuka, Koichi Banno, Akihiro Shiota, Shoichiro Suzuki, Taisuke Kanzaki, Masanori Nakamura
  • Patent number: 8867189
    Abstract: Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrate material using a metal organic deposition or chemical solution deposition process, depositing a second layer of ferroelectric material on top of the first layer using a high temperature sputter process and depositing a metal interconnect layer to provide electric connections to layers of the capacitor.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: October 21, 2014
    Assignee: BlackBerry Limited
    Inventors: Marina Zelner, Mircea Capanu, Susan C. Nagy
  • Patent number: 8861178
    Abstract: A film capacitor element including a base dielectric film layer 12, a vapor-deposition metal film layer 14 formed on the base dielectric film layer 12 and consisting of a first film portion 20 and a second film portion 22 that are spaced apart from each other by a margin portion 18, and a dielectric covering film layer 16 which is formed integrally on the second film portion 22 by vapor-deposition polymerization or coating and which has a covering portion 30 which fills the margin portion 18 and covers an entire area of an end face of the second film portion 22 on the side of the margin portion 18. The first film portion 20 including a non-covered portion 34 which is not covered by the dielectric covering film layer 16.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: October 14, 2014
    Assignee: Kojima Press Industry Co., Ltd.
    Inventors: Akito Terashima, Munetaka Hayakawa, Kaoru Ito
  • Patent number: 8861181
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T1 is a thickness of the first layer, and T2 is a thickness of the second layer, Tc?70 ?m, T2?(1.5)T1, and L1<(1.5)Tc are satisfied, thus providing excellent reliability.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: October 14, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ho Lee, Dong Hwan Seo, Sang Hyun Park
  • Patent number: 8861180
    Abstract: A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, L1 is length from either end of the ceramic main body in the length direction in a region in which the cover layer adjoins a margin part of the ceramic main body to an end of the first layer formed on an upper or lower surface of the ceramic main body, and Lm is length of the margin part, Tc?70 ?m and L1<Lm+Tc×cot 50° are satisfied.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: October 14, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ho Lee, Dong Hwan Seo, Sang Hyun Park
  • Patent number: 8842412
    Abstract: A chip capacitor and interconnecting wiring is described incorporating a metal insulator metal (MIM) capacitor, tapered vias and vias coupled to one or both of the top and bottom electrodes of the capacitor in an integrated circuit. A design structure tangibly embodied in a machine readable medium is described incorporating computer readable code defining a MIM capacitor, tapered vias, vias and wiring levels in an integrated circuit.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: September 23, 2014
    Assignee: International Business Machines Corporation
    Inventors: James S. Dunn, Zhong-Xiang He, Anthony K. Stamper
  • Publication number: 20140266508
    Abstract: A planar capacitor includes, in part, a first metal line forming spiral-shaped loops around one of its end point, and a second metal line forming spiral-shaped loops between the loops of the first metal line. The first and second metal lines are coplanar, formed on an insulating layer, and form the first and second plates of the planar capacitor. The planar capacitor may be used to form a filter. Such a filter includes a first metal line forming first spiral-shaped loops, a second metal line forming second spiral-shaped loops, and a third metal line—coplanar with the first and second metal lines—forming loops between the loops of the first and second metal lines. The filter further includes a first inductor coupled between the first and third metal lines, and a second inductor coupled between the second and third metal lines.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Young Kyu Song, Kyu-Pyung Hwang, Changhan Hobie Yun, Dong Wook Kim
  • Patent number: 8837112
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 16, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hee Gu, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
  • Patent number: 8830651
    Abstract: A laminated ceramic capacitor having high electrostatic capacitance and excellent lifetime characteristics, even when in a high electric field intensity employs a dielectric ceramic including crystal grains and crystal grain boundaries which contains, as its main constituent, a perovskite-type compound including Ba, Ca, and Ti, and further contains Mg, R (Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and/or Yb), and Zr, such that when the laminated body is dissolved, the contents in terms of parts by mol are Ca: 3 to 15 parts by mol, Mg: 0.01 to 0.09 parts by mol, R: 2.5 to 8.4 parts by mol, and Zr: 0.05 to 3.0 parts by mol with respect to 100 parts by mol of Ti, and there is Ca at least at the centers of the crystal grains.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: September 9, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Shinichi Yamaguchi
  • Patent number: 8760843
    Abstract: A capacitive device includes a first capacitor including a first wiring layer, a first dielectric film, a first conductive layer, a first insulating layer on the first capacitor, a second capacitor on the first insulating layer including a second conductive layer, a second dielectric film, and a third conductive layer, a second insulating layer on the second capacitor, a second wiring layer on the second insulating layer including first and second connection wires, a first via connecting the first wiring layer to the second conductive layer, a second via connecting the third conductive layer to the second wiring layer, a third via connecting the first connection wire to the first conductive layer, and a fourth via connecting the second connection wire to the first wiring layer.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: June 24, 2014
    Assignee: Dongbu Hitek Co., Ltd.
    Inventors: Jong Taek Hwang, Han Choon Lee, Oh Jin Jung, Jin Youn Cho
  • Patent number: 8760841
    Abstract: A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: June 24, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Mark W. Kiehlbauch
  • Patent number: 8724290
    Abstract: A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate (110, 210, 310), nanolithographically forming a first section (121, 221, 321) of the embedded passive device over the substrate, and nanolithographically forming subsequent sections (122, 222, 322) the embedded passive device adjacent to the first section. The resulting embedded passive device may contain features less than approximately 100 nm in size.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: May 13, 2014
    Assignee: Intel Corporation
    Inventors: Nachiket R. Raravikar, Rahul Panat
  • Patent number: 8699204
    Abstract: An element array and a footprint layout for an element array are disclosed. The element array can have a rectangular configuration defining two side surfaces and two end surfaces. The element array can include a plurality of stacked dielectric-electrode layers. One dielectric-electrode layer can include a plurality of element electrodes, such as eight element electrodes. Each of the plurality of element electrodes forms a part of an individual element for the element array. The element array device can further include a common electrode. The common electrode is used as part of each of the individual elements for the element array. The common electrode can include a lead for termination to one of the two end surfaces of the element array or, in a particular embodiment, to one of the two side surfaces of the element array.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: April 15, 2014
    Assignee: AVX Corporation
    Inventors: Ronald S. Demcko, Jeff Cheng, Michael Kirk
  • Patent number: 8693164
    Abstract: An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode (8) extending from an opposite end surface. At least a third internal electrode extends from an end surface.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: April 8, 2014
    Assignee: Epcos AG
    Inventors: Thomas Feichtinger, Georg Krenn
  • Patent number: 8681475
    Abstract: Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, the multi-layered ceramic capacitor including dielectric sheets laminated thereon and external terminal electrodes formed at both ends thereof, the dielectric sheets having internal electrodes formed thereon, and the external terminal electrodes being connected in parallel with the internal electrode, wherein the internal electrodes are disposed to be in parallel with the circuit board, the external terminal electrodes are bonded to lands of the circuit board by a conductive material, and a bonding height (Ts) of the conductive material is lower than a sum of a gap (Ta) between the circuit board and a bottom surface of the multi-layered ceramic capacitor and a thickness (Tc) of a cover layer on a lower portion of the multi-layered ceramic capacitor, whereby vibration noise can be greatly reduced.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: March 25, 2014
    Assignee: Samsung Electro-Mechancis Co., Ltd.
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Min Cheol Park, Sang Soo Park, Dong Seok Park
  • Patent number: 8675342
    Abstract: Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: March 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Beom Shin, Hyun Woo Kim, Doo Young Kim, Hyung Kyu Shim, Hyun Kyu Im, Youn Sik Jin, Dong Gun Kim
  • Publication number: 20140070903
    Abstract: The present disclosure discloses a structural capacitor, a connector comprising the structural capacitor and a communication apparatus using the connector. The structural capacitor comprises a rod and a holder. The rod comprises a first section and a second section connected with the first section, and the holder comprises a through hole. The first section and the second section are fitted into the through hole to accomplish the connection between the first section and the second section in an axial direction. The connector of the present disclosure features a simple structure, a convenient manufacturing process and a low cost. The communication apparatus of the present disclosure has advantages such as a simple manufacturing process, parameters that can be easily guaranteed, a low processing cost and a stable product performance.
    Type: Application
    Filed: September 11, 2012
    Publication date: March 13, 2014
    Applicant: Shenzhen Tatfook Technology Co., LTD.
    Inventor: WENJING WU
  • Publication number: 20140071585
    Abstract: A vertical semiconductor charge storage structure includes a substrate, at least one lower electrode, a dielectric layer and an upper electrode. The lower electrode includes a lower conductor, and a first side conductor and a second side conductor connected to the lower conductor. The first side conductor and the second side conductor are parallel to each other and form an included angle with the lower conductor. A height of the first side conductor from the substrate is greater than a height of the second side conductor from the substrate. The dielectric layer and the upper electrode are sequentially formed on surfaces of the substrate and the lower electrode. Accordingly, by forming the first side conductor and the second side conductor at different heights, an aperture ratio is increased to reduce difficulty in filling or deposition in subsequent processes to further enhance an overall yield rate.
    Type: Application
    Filed: September 11, 2012
    Publication date: March 13, 2014
    Inventors: Pin-Yuan Yu, Yi-Chun Shao, Chien-Hua Chu
  • Patent number: 8644000
    Abstract: A multilayer ceramic capacitor, having a plurality of electrode layers and a plurality of substantially titanium dioxide dielectric layers, wherein each respective titanium dioxide dielectric layer is substantially free of porosity, wherein each respective substantially titanium dioxide dielectric layer is positioned between two respective electrode layers, wherein each respective substantially titanium dioxide dielectric layer has an average grain size of between about 200 and about 400 nanometers, wherein each respective substantially titanium dioxide dielectric layer has maximum particle size of less than about 500 nanometers. Typically, each respective substantially titanium dioxide dielectric layer further includes at least one dopant selected from the group including P, V, Nb, Ta, Mo, W, and combinations thereof, and the included dopant is typically present in amounts of less than about 0.01 atomic percent.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: February 4, 2014
    Inventors: Fatih Dogan, Alan Devoe, Ian Burn
  • Patent number: 8605409
    Abstract: An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode (8) extending from an opposite end surface. At least a third internal electrode extends from an end surface.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: December 10, 2013
    Assignee: Epcos AG
    Inventors: Thomas Feichtinger, Georg Krenn