Abstract: Resolution means: The multilayer ceramic capacitor includes an effective dielectric portion and cover layers. The effective dielectric portion includes dielectric ceramic layers and internal electrode layers that are alternately stacked. The cover layers are made of ceramic material and disposed on top and bottom surfaces of the effective dielectric portion. The cover layers include ceramic particles, which constitute the majority of the cover layers, and include glass particles. Some of the glass particles are present in gaps, which are formed between the ceramic particles.

Abstract: A multilayer ceramic capacitor has a capacitor body of laminate structure and a pair of external electrodes, and shaped roughly as a rectangular solid defined by length L, width W, and height H. This multilayer ceramic capacitor is such that the width W and height H meet the condition of “1.10?H/W?1.70.

Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface of the base substrate; and an electronic component disposed on the mounting surface and including a plurality of terminals. At least one of the terminals is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion is inserted. A first insertion portion is provided in the component connecting end portion. The terminal is inserted through the first insertion portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface positioned closer to a rear surface of the base substrate than the component mounting surface. The soldering surface is on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes.

Abstract: An electrical ceramic capacitor, in particular a multilayer ceramic capacitor, comprising a ceramic body including a stack of parallel metallic layers of opposing polarity separated by a dielectric material arranged in an active zone of the ceramic body enclosed between outer surfaces, wherein at one or more surfaces a shock-absorbing region is arranged.

Abstract: A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, and length-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A Si content ratio is higher in a boundary portion between the outer portion and the inner portion. The inner portion has a higher composition ratio of Mn to Ti than the outer portion. Both of minimum dimensions in the length direction of the length-direction first and second outer layer sections are greater than a dimension in the thickness direction of the thickness-direction first outer layer section.

Abstract: A ceramic electronic component includes a dielectric layer and an electrode layer. The dielectric layer contains barium titanate and yttrium. The dielectric layer contains dielectric particles and Y—Ti segregation particles. An area ratio occupied by the Y—Ti segregation particles is 1.3% or less on a cross section of the dielectric layer.

Abstract: A microelectronic assembly includes a stack of microelectronic elements, e.g., semiconductor chips, each having a front surface defining a respective plane of a plurality of planes. A leadframe interconnect joined to a contact at a front surface of each chip may extend to a position beyond the edge surface of the respective microelectronic element. The chip stack is mounted to support element at an angle such that edge surfaces of the chips face a major surface of the support element that defines a second plane that is transverse to, i.e., not parallel to the plurality of parallel planes. The leadframe interconnects are electrically coupled at ends thereof to corresponding contacts at a surface of the support element.

Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.

Abstract: A flexible cable includes an elongated flexible substrate including first and second surfaces on opposite sides thereof, a first capacitor electrode provided on the first surface side of the flexible substrate, the first capacitor electrode extending from a first end of the flexible substrate toward a second end of the flexible substrate, a second capacitor electrode provided on the second surface side of the flexible substrate, the second capacitor electrode extending from the second end of the flexible substrate toward the first end of the flexible substrate, a first connection portion provided at an end of the first capacitor electrode located at the first end of the flexible substrate, and a second connection portion provided at an end of the second capacitor electrode located at the second end of the flexible substrate.

Abstract: A monolithic ceramic electronic component having outer electrodes that include an inorganic substance containing at least Si, a crystal phase C containing at least Si, Ti, and Ba at the interfaces to a ceramic layer in peripheral end portions of the outer electrodes. A value of the crystal phase area ratio indicating the relationship between the area of the crystal phase C and the area of a glass phase G, which are formed at the interface to the ceramic layer, in a region within 5 ?m from the peripheral end portion of the outer electrode is within a range of 75% to 98%.

Abstract: A ceramic body includes outer layer portions of about 15 ?m or more and about 25 ?m or less in thickness outside an inner layer portion where internal electrodes are stacked with dielectric ceramic layers interposed therebetween, the inner layer portion includes inner cover electrodes opposed to the internal electrode located outermost in the stacking direction with the dielectric ceramic layers interposed therebetween, the outer layer portions include outer cover electrodes opposed to the inner cover electrodes with the dielectric ceramic layers interposed therebetween, the inner cover electrodes have a coverage of about 75% or more and about 100% or less, the outer cover electrodes have a coverage of about 50% or more and about 70% or less, and boundary layers containing Mg and Mn are provided at the boundaries between the outer cover electrodes and the dielectric ceramic layers located outside the electrodes.

Abstract: There is provided a dielectric ceramic composition including a base powder, wherein the base powder includes: a first major component represented by BaTiO3, a second major component represented by (Na, K)NbO3, and a third major component represented by (Bi, Na)TiO3. The base powder is represented by xBaTiO3-y(Na, K)NbO3-z(Bi, Na)TiO3, where x+y+z=1, and x, y, and z are represented by mol, and x, y and z satisfy 0.5?x?0.97, 0.01?y?0.48, and 0.02?z?0.2, respectively. In certain embodiments, the base powder is be represented by xBaTiO3-y(Na0.5K0.5)NbO3-z(Bi0.5Na0.5)TiO3.

Abstract: A capacitor includes a dielectric layer, a first conductive layer, a second conductive layer, first inner electrodes, second inner electrodes, a first external power electrode layer, a second external power electrode layer, a first outer electrode, and a second outer electrode. The first and second inner electrodes and first and second second outer electrodes are a conductive material. The dielectric layer has through-holes connecting with a first main surface and a second main surface. The first inner electrodes are in a first set of the through-holes and connected to the first conductive layer. The second inner electrodes are in a second set of the through-holes and connected to the second conductive layer. The first outer electrode is on the first external power electrode layer and some side-faces of the dielectric layer. The second outer electrode is on the second external power electrode layer and some side-faces of the dielectric layer.

Abstract: In a multilayer ceramic capacitor, a ceramic body includes dielectric layers and inner electrodes stacked in a stacking direction, outer electrodes on the ceramic body and connected to the plurality of inner electrodes. When viewing a first cross section of the ceramic body parallel or substantially parallel to first and second side surfaces of the ceramic body and having the plurality of inner electrodes exposed, a connection proportion is about 30% to about 70% and is a proportion of a number of the inner electrodes connected to the outer electrodes to a number of all of the plurality of inner electrodes exposed at the first cross section, and when the first cross section is viewed, glass is present between one of the inner electrodes not connected to each of the outer electrodes, and each of the outer electrodes.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween, and external electrodes disposed on outer surfaces of the ceramic body. Opposite edge portions of at least one or more of the first and second internal electrodes in a width direction of the ceramic body are thicker than a central portion thereof, and a ratio (T2/T1) of a thickness (T2) of the edge portion to a thickness (T1) of the central portion satisfies 1.0<T2/T1?2.0.

Abstract: The present invention relates to a capacitor. The capacitor includes a substrate; a dielectric layer formed on the substrate; and an electrode layer comprising a first electrode layer and a second electrode layer formed on the dielectric layer, wherein the first electrode layer and the second electrode layer are separated from each other, and at least a portion of the first electrode layer and at least a portion of the second electrode layer are disposed on a same surface. With this configuration, applying the electricity becomes easy, and since the first and the second electrode layers function as the electrodes being charged with different polarity electrical charges respectively, manufacturing thereof becomes easy, and the structure thereof is simple.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film.

Abstract: A resistive random access memory device and a method for fabricating the same are presented. The resistive random access memory device includes a first electrode having a first dopant within. A second electrode is disposed on the first electrode. A resistive switching layer is disposed between the first electrode and the second electrode.

Abstract: A multi-layer piezoelectric element includes: a stacked body comprising an active section, and inactive sections disposed at opposite ends in a stacking direction of the active section; an electrically-conductive bonding material disposed on a side surface of the stacked body from the active section to the inactive sections; and an external electrode plate attached, through the electrically-conductive bonding material, to the side surface of the stacked body, a spacing between a side surface of at least one of the inactive sections and the external electrode plate being wider than a spacing between a side surface of the active section and the external electrode plate, and the electrically-conductive bonding material situated between the side surface of at least one of the inactive sections and the external electrode plate being larger in thickness than the electrically-conductive bonding material situated between the side surface of the active section and the external electrode plate.

Abstract: The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.

Abstract: A multilayer ceramic capacitor may include: a ceramic body; a plurality of first internal electrodes disposed in the ceramic body; a plurality of second internal electrodes stacked alternately with the first internal electrodes in the ceramic body; first and second external electrodes connected to the first internal electrodes, respectively; a third external electrode extended from one side surface of the ceramic body to a portion of a surface opposing a mounting surface of the ceramic body and connected to the second internal electrodes; a fourth external electrode extended from the other side surface of the ceramic body to a portion of the surface opposing the mounting surface of the ceramic body; and an intermitting part disposed on the surface opposing the mounting surface of the ceramic body and connecting the third and fourth external electrodes to each other.

Abstract: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided.

Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

Abstract: A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and second surfaces of the multilayer body. The first capacitor electrode includes a capacitor portion opposed to the second capacitor electrode with the dielectric layer interposed therebetween, a lead portion connected to one outer electrode, and an intermediate portion not opposed to the second outer electrode. The second capacitor electrode includes a capacitor portion opposed to the first capacitor electrode with the dielectric layer interposed therebetween, and a lead portion connected to the other outer electrode.

Abstract: A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125° C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body.

Abstract: A laminated ceramic electronic component that includes a laminated body formed by laminating a ceramic layer and an internal electrode, and forming an external electrode on an outer surface of the laminated body so as to be electrically connected to the internal electrode. The external electrode includes a conducting layer that is in contact with the internal electrode, and the internal electrode contains Ni. The conducting layer contains metal particles containing a Cu3Sn alloy, and a thermosetting resin. The internal electrode and the conducting layer are bonded to each other with a CuSnNi alloy phase interposed therebetween.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film.

Abstract: A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, length-direction first and second outer layer sections, and width-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A boundary portion between the outer portion and the inner portion has a larger Si content than the outer portion. The inner portion has a higher composition ratio of Mn to Ti than the outer portion.

Abstract: According to a power semiconductor device of the present invention, it comprises a plurality of lead frames formed into like a wiring pattern, a power semiconductor element joined onto the lead frame, and a capacitor placed between mutually adjacent two lead frames, and is encapsulated with a mold resin. The capacitor is characterized in that external electrodes of that capacitor are connected to the lead frames each through a stress-relaxation structure portion that is lower in rigidity than the capacitor.

Abstract: A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, and length-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A Si content ratio is higher in a boundary portion between the outer portion and the inner portion. The inner portion has a higher composition ratio of Mn to Ti than the outer portion. Both of minimum dimensions in the length direction of the length-direction first and second outer layer sections are greater than a dimension in the thickness direction of the thickness-direction first outer layer section.

Abstract: There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W1.0 when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers interposed therebetween.

Abstract: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided.

Abstract: There is provided a multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the double side surfaces facing each other in a width direction, having the dielectric layers therebetween, and first and second external electrodes formed on the surfaces of the ceramic body in the width and thickness directions and electrically connected to the first and second internal electrodes, wherein when a length of the ceramic body is defined as L and a width of the ceramic body is defined as W, a ratio L/W of the length L to the width W of the ceramic body satisfies 1.39?L/W?2.12.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including a plurality of dielectric layers and a plurality of first and second internal electrodes stacked in a width direction; a pair of first external electrodes disposed on a mounting surface of the ceramic body to be spaced apart from one another and connected to the plurality of first internal electrodes; a second external electrode disposed between the pair of first external electrodes on the mounting surface of the ceramic body and connected to the plurality of second internal electrodes; and a dummy electrode disposed on a surface of the ceramic body opposing the mounting surface of the ceramic body.

Abstract: A multi-layer ceramic capacitor is made by alternately layering a dielectric layer constituted by a sintered body of a ceramic powder, and an internal electrode layer. The ceramic powder contains, as a main composition, barium titanate powder having a perovskite structure with a median size of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the percentage of barium titanate particle having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal lattice c/a is 1.0075 or more.

Abstract: The present invention aims to suppress the cracks and delamination to improve the bending strength of multilayer ceramic electronic component with internal electrode layers wherein the thickness of the internal electrode layer is 0.5 ?m or less. The multilayer ceramic electronic component is a laminated body having internal electrode layers and dielectric ceramic layers which are laminated alternately. The internal electrode layers have electrode discontinuity portion. In a part of the electrode discontinuity portion, a dielectric ceramic particle bigger than the thickness of the dielectric ceramic layer is contained when the cross section is observed from the direction perpendicular to the laminating plane of the laminated body.

Abstract: Disclosed is a heat dissipating component for a semiconductor element, having a tabular body 0.4-6 mm in thickness containing 40-70 volume % of diamond particles, with the balance comprising metal of which the principal component is aluminum, and coated on both surfaces by a coating layer comprising metal of which the principal component is aluminum, or an aluminum-ceramic based composite material, to form an aluminum-diamond based composite body. On at least the two major surfaces thereof are formed, in order from the major surface side, (1) an amorphous Ni alloy layer 0.1-1 ?m in film thickness, (2) an Ni layer 1-5 ?m in film thickness, and (3) an Au layer 0.05-4 ?m in film thickness, the ratio of the Ni alloy layer and the Ni layer (Ni alloy layer thickness/Ni layer thickness) being 0.3 or less.

Abstract: A multilayer ceramic capacitor may include a capacitance forming layer including dielectric layers and internal electrodes disposed on the dielectric layers; a lower cover layer disposed below the capacitance forming layer; an upper cover layer disposed above the capacitance forming layer; and a plurality of crack inducing air gaps disposed in the lower cover layer.

Abstract: A multilayer ceramic electronic component includes a ceramic element body including internal electrodes and external electrodes electrically connected to respective internal electrodes. Each of the external electrodes includes a sintered metal layer including glass and metal and a conductive resin layer including resin and metal particles. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and L1/L2 is about 0.2 or more and about 1.5 or less, where L1 is a length along the interface at which the glass of the sintered metal layer is exposed at the interface, and L2 is a length along the interface at which the metal of the sintered metal layer is exposed at the interface.

Abstract: A metallized film composed of a dielectric film, a metal thin film layer and a dielectric layer, the metal thin film layer being formed on at least one surface of the dielectric film, the dielectric layer being formed on the metal thin film layer, and the dielectric layer being composed of acrylic acid ester resin as a main component being composed of dimethylol tricyclodecane diacrylate and monoacrylate containing a heterocycle.

Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers, first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; a capacitor part including first internal electrodes and second internal electrodes; a resistor part including first internal connection conductors and second internal connection conductors; first dummy electrodes and second dummy electrodes; first to fourth external electrodes electrically connected to the first and second internal electrodes and the first and second internal connection conductors; and a first connection terminal and a second connection terminal. The capacitor part and the resistor part are connected in series to each other.

Abstract: A multilayer ceramic capacitor may include: three external electrodes disposed on amounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044?LG*log [1/AT]?0.00150.

Abstract: A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, and length-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A Si content ratio is higher in a boundary portion between the outer portion and the inner portion. A relationship expressed by T1/(L0?L1)?5.98 is satisfied when a minimum dimension in the length direction of the body is denoted by L0, a minimum dimension in the thickness direction of the multilayer unit is denoted by T1, and a minimum dimension in the length direction of the multilayer unit is denoted by L1.

Abstract: Techniques and structure are disclosed for providing a MIM capacitor having a generally corrugated profile. The corrugated topography is provisioned using sacrificial, self-organizing materials that effectively create a pattern in response to treatment (heat or other suitable stimulus), which is transferred to a dielectric material in which the MIM capacitor is formed. The self-organizing material may be, for example, a layer of directed self-assembly material that segregates into two alternating phases in response to heat or other stimulus, wherein one of the phases then can be selectively etched with respect to the other phase to provide the desired pattern. In another example case, the self-organizing material is a layer of material that coalesces into isolated islands when heated. As will be appreciated in light of this disclosure, the disclosed techniques can be used, for example, to increase capacitance per unit area, which can be scaled by etching deeper capacitor trenches/holes.

Abstract: An embedded multilayer ceramic electronic component includes a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal.

Abstract: A packaged capacitor component such as a surface mount technology capacitor component may be formed with multiple self-resonant frequencies. The capacitor component may include multiple capacitor portions separated by dielectric layers. The capacitor portions may each be formed from interleaving conductive layers. Additional dielectric layers may be interposed between the interleaving conductive layers. Each capacitor portion may be characterized by a corresponding self-resonance frequency. If desired, a packaged capacitor component having multiple self-resonant frequencies may be formed by stacking multiple surface-mount capacitor components. Each of the stacked surface-mount capacitor components may include interleaving conductive layers that are centered between top and bottom surfaces of that component. Packaged capacitor components having multiple self-resonance frequencies may be used as direct-current blocking capacitors or decoupling capacitors.

Abstract: A multilayer ceramic electronic component may include a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor containing carbon nanotubes, and a base resin. When the multilayer ceramic electronic component is heat-tested by raising a temperature of the multilayer ceramic electronic component from room temperature to about 900° C. at a rate of about 10° C./min, a weight of the multilayer ceramic electronic component decreases by about 0.33% to about 2.19%.

Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.

Abstract: Disclosed herein is a multilayer ceramic device including: a device body having side surfaces spaced apart from each other and circumferential surfaces connecting the side surfaces to each other; internal electrodes disposed in a length direction of the device body in the device body; external electrodes having a front surface portion covering the side surfaces and a band portion extended from the front surface portion and covering portions of the circumferential surfaces; and crack guide patterns disposed in the device body and guiding a progress direction of a crack generated from the circumferential surfaces so that the crack is directed toward the side surface, wherein the crack guide pattern includes: a first metal pattern; and a second metal pattern disposed to be closer to the circumferential surface as compared with the first metal pattern and having gaps.

Abstract: A multilayer ceramic capacitor may include: a ceramic body; a first internal electrode is spaced apart from first and second end surfaces by a predetermined distance and includes first and second lead portions which are spaced apart from each other and exposed to a first main surface; and a second internal electrode is spaced apart from the first and second end surfaces by a predetermined distance and includes a third lead portion positioned between the first and second lead portions and exposed to the first main surface. The ceramic body may further include first and second dummy electrodes, a first dummy electrode being disposed on a dielectric layer on which the first internal electrode is disposed, and a second dummy electrode being disposed on a dielectric layer on which the second internal electrode is disposed.