Abstract: A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the first polymer layer, patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist, forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line, and forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line.

Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

Abstract: A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area.

Abstract: A feedthrough device for protecting a system from an electrical transient may include a housing having a first end and a second end spaced apart from the first end in a longitudinal direction. A conductive line may extend through the housing from the first end to the second end of the housing. The conductive line may define an input end proximate the first end of the housing and an output end proximate the second end of the housing for connecting the feedthrough device with the system to be protected. A filter may be disposed within the housing and coupled with the conductive line at a first location. A gas discharge tube may be disposed within the housing and coupled with the conductive line at a second location on the conductive line that is proximate the filter and between the input end of the conductive line and the first location.

Abstract: A method for manufacturing a capacitive deionization electrode exhibits enhanced ionic material adsorption efficiency. The method includes (a) kneading an electrode active material while adding a solvent to the electrode active material; (b) adding a solvent to the mixture obtained after (a) and stirring the result; and (c) preparing an electrode slurry by adding a binder to the mixture obtained after (b) and stirring the result. According to the method, a problem of a binder blocking electrode pores, which used to occur when using existing methods, is resolved by increasing mixing efficiency of the binder while using an electrode active material having a high specific surface area. A capacitive deionization electrode having very superior ionic material adsorption efficiency may be manufactured using the method.

Abstract: A capacitor includes a capacitor element, a bus bar, and a case. The bus bar is electrically connected to the capacitor element. The capacitor element and the bus bar are accommodated in the case. The case has a protrusion. The bus bar includes a fitting part into which the protrusion is fitted, and has a first surface facing the case and a second surface opposite to the first surface. The fitting part includes a through hole that passes through from the first surface to the second surface, and a cylindrical flange part surrounding the through hole. The cylindrical flange part is disposed on the second surface so as to rise from a peripheral edge of the through hole.

Abstract: A hermetic terminal for a hard disk device (HDD device) that has an excellent gas barrier property and can be assembled in a small number of man-hours, and a hard disk device are provided. The hermetic terminal for an HDD device includes a metal eyelet, insulating glass which seals the metal eyelet on a side of an inner diameter of the metal eyelet, and a lead sealed by the insulating glass to pass therethrough. The lead includes a contact made of a conductive elastic material.

Abstract: One aspect relates to a component comprising i. a base body having a first component surface and a further component surface, the base body comprising a ceramic at least to an extent of 50 wt %, based on the total weight of the base body; ii. at least one electrical conduction element, the at least one electrical conduction element comprising a metal at least to an extent of 51 wt %, based on the electrical conduction element, and the at least one electrical conduction element passing through the entire base body from the first component surface to the further component surface; iii. at least one fastening element having a contact area, the at least one fastening element comprising a metal at least to an extent of 51 wt %, based on the fastening element, and the fastening element being surrounded at least in part by the base body.

Abstract: The invention relates to a capacitive block, notably for an electrical equipment, comprising a case, a capacitive element housed in the case, a substance filling the space between the case and the capacitive element so as to ensure leak tightness of the capacitive element, a heat sink against which the capacitive element is in direct contact. In the capacitive block, the heat sink is different from the filling substance, a face of said heat sink, designated free face, forming an outer face of the capacitive block and being devoid of said filling substance.

Abstract: Disclosed herein are embodiments of a microscale-based device suitable for purifying fluid, and method of using the device. In particular disclosed embodiments, an electrode layer comprising an enhanced surface area electrode material that has multiple extensions covered in a conductive material are used within the device. The device comprises one or more main flow pathways and one or more side channels. The flow dynamics of the device may be controlled in order to remove contaminants from the fluid. The extensions of the enhanced surface area electrode material are positioned on the surface of the pathways and also may be positioned within the side channels.

Abstract: Disclosed herein is an electrode feedthru assembly for an electronic device and method of manufacturing. The feedthru assembly includes a ferrule, an electrode assembly, and an elastomer. The ferrule includes a bore through which the electrode assembly is positioned. The electrode assembly includes an electrode wire attached to a crimp pin. The crimp pin includes a crimp terminal portion and a pin terminal portion, the crimp terminal portion being crimped to a portion of the electrode wire to form a connected portion of the electrode assembly. The elastomer is disposed in the bore of the ferrule between the ferrule and the electrode assembly. The elastomer electrically isolates the ferrule from the electrode assembly and encapsulates at least the connected portion of the electrode assembly.

Abstract: Generally discussed herein are systems, devices, and methods for providing a therapy (e.g., stimulation) and/or data signal using an implantable device. Systems, devices and methods for interacting with (e.g., communicating with, receiving power from) an external device are also provided.

Abstract: A power conversion apparatus or system can be configured to receive a high voltage alternating current (AC) signal at an input and to provide in dependence thereon a low voltage direct current (DC) signal from an output stage. The power conversion apparatus can include a main path comprising a high voltage capacitor in series with the input. In an example, the capacitor comprises a portion of an electric field energy harvesting system.

Abstract: Discrete cofired feedthrough filters are provided for medical implanted device applications. A plurality of discrete vertical feedthrough filter elements are respectively associated with a plurality of signal wires or pins otherwise supported by an insulating feedthrough and a ferrule. The resulting discrete device comprises a single-element device which is cheaper to make, and which reduces cross-talk between adjacent signal wires/pins while otherwise accommodating changes in feedthrough pitch without having to redesign the filter.

Abstract: A method of recovering carbon black includes the step of providing a carbonaceous source material containing carbon black. The carbonaceous source material is contacted with a sulfonation bath to produce a sulfonated material. The sulfonated material is pyrolyzed to produce a carbon black containing product comprising a glassy carbon matrix phase having carbon black dispersed therein. The pyrolysis can be conducted at a temperature from 1100° C. to 1490° C. A method of making a battery electrode and a lithium ion or sodium ion battery is also disclosed.

Abstract: A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Abstract: The polarized electrode flow through capacitor comprises at least one each electrode material, with a pore volume that includes meso and micropores, with contained anionic or cationic groups. The polarized electrodes are in opposite polarity facing pairs, separated by a flow path or flow spacer. Both polarities of the particular attached ionic groups used are ionized at the working pH or composition of the particular feed solution supplied to inlet of the flow through capacitor. The contained groups cause the electrodes to be polarized so that they are selective to anions or cations. The polarized electrode flow through capacitor has better performance compared to identical flow through capacitors made from non-derivitized carbon. The capacitor electrode materials so derivitized provide this polarization function directly without need for a separate charge barrier material.

Abstract: One aspect relates to an apparatus includes a ceramic body including a first surface and a further surface. The first surface is opposite the further surface, the first surface includes a first opening. The further surface includes a further opening. The first opening and the further opening are connected by a tunnel, which at least partly includes a tunnel filling and is occluded by the tunnel filling. The tunnel filling includes a first constituent, including a cermet, and a second constituent. The first and second constituents are electroconductingly connected to one another. The first constituent has a first electrical conductivity and the second constituent has a second electrical conductivity, which differs from the first by at least 5·10?4 Siemens per meter (S/m). The ceramic body is characterized by a further electrical conductivity. The first electrical conductivity is more by at least 1·105 Siemens per meter (S/m) than the 15 further electrical conductivity.

Abstract: An analysis device constructs an analytical model with a circuit board and a medium, and applies a concentrated load grouping composed of concentrated loads to the circuit board. In this case, the concentrated loads are established such that the sum of the respective vectors is zero, and such that the torque is zero with respect to the center of gravity. The analysis device applies a finite element method to the analytical model to figure out the vibration of the circuit board, which is caused when the concentrated loads vibrate with a constant period. The change in the pressure of the medium is computed from the vibration of the circuit board, and the change in the pressure is converted to a sound pressure.

Abstract: A multilayer capacitor may include a capacitor stack having pluralities of first and second plate electrodes connected to respective stack face terminals. Two face terminals on different stack sides are connected to the first plate electrodes. Two different face terminals also on different stack sides are connected to the second plate electrodes. Respective base conductors connect to the two sets of face terminals for connecting the capacitor to an external circuit. Three face terminals may be connected to the first or second plate electrodes. The base conductors may connect to the face terminals at the same relative position of the capacitor stack, at different relative positions of the capacitor stack. A capacitor stack may be positioned with a stack end facing a base substrate. Two multilayer capacitors may be mounted electrically in parallel with one or more lossy elements spanning a gap between the capacitors.

Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.

Abstract: Disclosed herein is a thin film type capacitor element, including: a body part formed by stacking a plurality of dielectric layers; a first internal electrode provided in the body part and including a first non-plated region; a second internal electrode including a second non-plated region; a first via formed in the first non-plated region; and a second via formed in the second non-plated region.

Abstract: In an embodiment, with a capacitor mounting structure 200, series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in such a way that signals flow through them in the opposite directions, respectively. In addition, the series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in such a way that their respective internal electrode layers 211c, 212c face each other. The capacitor mounting structure can prevent the overall ESL value from increasing even when multilayer capacitors are connected in series.

Abstract: One aspect is a capacitor, having a multitude of parallel insulator layers in one stack direction, made of an electrically non-conducting material, a multitude of conductor layers alternatingly stacked with the insulator layers in the direction of the stack made from a conductive material and at least one contact body. At least some of the conductor layers are connected to one another in a conductive manner via the contact body. The contact body extends through breaks form several insulator layers, where at least the insulator layers are made of a sintered material; the contact body is manufactured at least partially from a sintered material, which is introduced into the breaks in the insulator layers in an unsintered, malleable state.

Abstract: A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.

Abstract: Disclosed herein is a thin film type capacitor element, including: a body part formed by stacking a plurality of dielectric layers; a first internal electrode provided in the body part and including a first non-plated region; a second internal electrode including a second non-plated region; a first via formed in the first non-plated region; and a second via formed in the second non-plated region.

Abstract: A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.

Abstract: This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module.

Abstract: A thin film capacitor comprises: a laminated body that has a base electrode, a dielectric layer and an upper electrode layer; a protective layer covering the base electrode, the dielectric layer and the upper electrode layer, and includes a first through-hole that reaches the base electrode, and a second through-hole that reaches the upper electrode layer; a first extraction electrode in the first through-hole and electrically connected with the base electrode; a second extraction electrode in the second through-hole and electrically connected with the upper electrode layer; a first terminal electrode on the protective layer, and connected with the base electrode through the first extraction electrode; and a second terminal electrode on the protective layer, and connected with the upper electrode layer through the second extraction electrode. Young's modulus of the protective layer is equal to or higher than 0.1 GPa and equal to or lower than 2.0 GPa.

Abstract: A thin film capacitor includes a pair of electrode layers, a dielectric layer existing between the pair of electrode layers, and a ceramic layer disposed on a surface opposite to the dielectric layer of at least one of the electrode layers.

Abstract: Provided is a granular activated carbon having many mesopores that can be used for applications similar to sine chloride-activated carbons, and also provided is a method for manufacturing the same. The granular activated carbon is obtained by bringing an activated carbon into contact with a calcium component, followed by activation and washing.

Abstract: Feedthrough assemblies for medical devices having various embodiments of strain relief members extending around portions of the feed through pin are described.

Abstract: An integrable electrochemical capacitor and methods for manufacturing the same are disclosed. The electrochemical capacitor comprises a first electrode comprising a first rigid piece having a first porous portion, a second electrode comprising a second rigid piece having a second porous portion, and an electrolyte in contact with the first porous portion and the second porous portion. The structure allows the electrochemical capacitor to be manufactured without a separator film between the electrodes and is compatible with semiconductor manufacturing technologies. The electrochemical capacitor can also be manufactured within a SOI layer 8.

Abstract: According to various embodiments, a semiconductor device may include: a layer stack formed at a surface of the semiconductor device, the layer stack including: a metallization layer including a first metal or metal alloy; a protection layer covering the metallization layer, the protection layer including a second metal or metal alloy, wherein the second metal or metal alloy is less noble than the first metal or metal alloy.

Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

Abstract: A carbonaceous composition usable to constitute a supercapacitor cell electrode, a porous electrode usable to equip such a cell, a process for manufacturing this electrode and one such cell incorporating at least one such electrode, for example in order to equip an electric vehicle. This composition is usable to be in contact with an aqueous ionic electrolyte, is based on a carbonaceous powder and comprises a hydrophilic binder-forming system. The system may include between 3% and 10% by weight a first crosslinked polymer having a number-average molecular weight Mn of greater than 1000 g/mol and having alcohol groups, and between 0.3% and 3% by weight a second polymer of at least one acid and which has a pKa of between 0 and 6 and a number-average molecular weight Mn of greater than 500 g/mol, the first polymer being crosslinked thermally in the presence of the second polymer.

Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

Abstract: There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a capacitor part including first and second internal electrodes formed in the ceramic body; a resistor part including a first internal connection conductor, a third internal connection conductor formed on one dielectric layer in the ceramic body and a second internal connection conductor, a fourth internal connection conductor formed on another dielectric layer in the ceramic body; first to fourth external electrodes formed on first and second main surfaces of the ceramic body; and a first connection terminal formed on first end surface of the ceramic body and a second connection terminal formed on second end surface of the ceramic body, wherein the capacitor part and the resistor part are connected to each other in series.

Abstract: One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case.

Abstract: A cochlear implant includes a sealed housing containing electronics for at least stimulation or collection of data and at least one antenna for communicating with an external device and a magnet configured to hold the external device in proximity to the sealed housing. The sealed housing includes an upper cover being closest to the skin when the device is implanted, and a lower cover that is hermetically connected to the upper cover. The lower cover includes an elevated region, a recessed region, and at least one feedthrough element formed in the recessed region of the lower cover. The recessed region provides space for a lead to connect to the feedthrough element and protects it from shock and other environmental risks.

Abstract: The present invention relates in particular to a conductive electrode for an electrical energy storage system (1) having an aqueous electrolyte solution, said electrode comprising a metallic current collector (3) and an active material (7), said metallic current collector (3) comprising a protective conductive layer (5) placed between said metallic current collector (3) and said active material (7), characterized in that said protective conductive layer (5) comprises: —between 30% and 85% as a proportion by weight of dry matter of a copolymer matrix, —between 70% and 15% as a proportion by weight of dry matter of conductive fillers, in addition to the proportion by weight of dry matter of copolymer in order to achieve a total of 100%.

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract: Embodiments of MIM capacitors may be embedded into a thick IMD layer with enough thickness (e.g., 10 K?˜30 K?) to get high capacitance, which may be on top of a thinner IMD layer. MIM capacitors may be formed among three adjacent metal layers which have two thick IMD layers separating the three adjacent metal layers. Materials such as TaN or TiN are used as bottom/top electrodes & Cu barrier. The metal layer above the thick IMD layer may act as the top electrode connection. The metal layer under the thick IMD layer may act as the bottom electrode connection. The capacitor may be of different shapes such as cylindrical shape, or a concave shape. Many kinds of materials (Si3N4, ZrO2, HfO2, BST . . . etc.) can be used as the dielectric material. The MIM capacitors are formed by one or two extra masks while forming other non-capacitor logic of the circuit.

Abstract: A multipolar feedthrough filter capacitor assembly for an active implantable medical device includes a feedthrough filter capacitor including a first active electrode plate, a second active electrode plate and a plurality of ground electrode plates. The plates are in spaced parallel relation disposed within a monolithic dielectric substrate where the first and second active electrode plates are disposed between the plurality of ground electrode plates. A first conductive terminal pin is disposed through the feedthrough filter capacitor electrically coupled to the first active electrode plate and in non-conductive relation to both the second active electrode plate and ground electrode plate. A second conductive terminal pin may be disposed through the feedthrough filter capacitor electrically coupled to the second active electrode plate and in non-conductive relation to both the first active electrode plate and ground electrode plate.

Abstract: Disclosed are a Ti alloy having an excellent hydrogen absorption inhibition effect, a Ti alloy member using the Ti alloy, and a manufacturing thereof. A Ti alloy is characterized in that it contains 0.1 to 5.0% by mass in total of at least one of Zr and Hf, and a residue comprising Ti and impurities.

Abstract: A capacitor for an implantable medical device is presented. The capacitor includes an anode, a cathode, a separator therebetween, and an electrolyte over the anode, cathode, and separator. The electrolyte includes ingredients comprising acetic acid, ammonium acetate, phosphoric acid, and tetraethylene glycol dimethyl ether. The capacitor has an operating voltage ninety percent or greater of its formation voltage.

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

Abstract: A feedthrough filter capacitor assembly includes a conductive terminal pin which extends through a first passageway of a capacitor in conductive relation with a first set of electrode plates, and through a conductive ferrule and an insulator in non-conductive relation. The insulator includes ground plates conductively coupled to the ferrule. A second set of electrode plates of the capacitor are conductively coupled to the insulator ground plates, such as by a ground pin extending through the capacitor in relation with the second set of electrode plates, and at least partially extending through a second passageway of the insulator in conductive relation with the ground plates. In this manner, the exterior electrical/mechanical connection between the capacitor and ferrule or other ground member is eliminated.