Abstract: Described are quality control methods and devices for the reproducible manufacturing and integrity monitoring of polymers on electrochemical synthesis and detection chips. The devices and methods allow for simultaneous manufacturing and synthesis of polymers.

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA comprises a non-conductive block having a top side, a bottom side, a front side and a back side. A plurality of conductive strips are coupled to the non-conductive block. Each conductive strip possesses a front side and a back side. The back side of each conductive strip extends from the front side across the top side and over to back side of the non-conductive block.

Abstract: A capacitor structure including a dielectric material layer and at least two metal layers is provided. The metal layers are disposed at intervals in the dielectric material layer. Each of the metal layers includes a zigzaging electrode, a first finger-shaped electrode and a second finger-shaped electrode. The zigzaging electrode forms a plurality of first concave parts disposed at one side of the zigzaging electrode and a plurality of second concave parts disposed at the other side of the zigzaging electrode. The first finger-shaped electrode includes a plurality of first extension parts. The first extension parts are respectively disposed in the first concave parts. The second finger-shaped electrode includes a plurality of second extension parts. The second extension parts are respectively disposed in the second concave parts. The zigzaging electrode in each of the metal layers is electrically coupled to the first and second finger-shaped electrodes of adjacent metal layers.

Abstract: Feedthrough and method for making a feedthrough. The feedthrough has a ferrule forming a ferrule lumen, an electrically conductive pin extending longitudinally through at least a portion of the ferrule lumen, a filter capacitor surrounding the electrically conductive pin within the ferrule lumen, the filter capacitor having a bonding surface, and a ceramic seal positioned within the ferrule lumen directly abutting the filter capacitor sealing a space between the electrically conductive pin and the ferrule. The ceramic seal adheres to and creates an adhesive bond with the bonding surface of the capacitor and substantially inhibits fluid flow through the ferrule lumen.

Abstract: An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.

Abstract: An electrical feedthrough, in particular for use in an electro-medical implant, having a flange enclosing at least one feedthrough bushing and at least one terminal pin enclosed by the at least one feedthrough bushing, the terminal pin having at least one section which can be joined at a lower energy in the interior of the implant.

Abstract: A conducting portion includes a plurality of conducting inner electrodes. Each of a pair of capacitance portions includes a plurality of signal inner electrodes while adjacently opposing each other in the laminating direction, a plurality of first grounding inner electrodes while adjacently opposing each other in the laminating direction, and a plurality of second grounding inner electrodes while adjacently opposing each other in the laminating direction. The plurality of first grounding inner electrodes are located between the conducting portion and the plurality of signal inner electrodes, while one of the first grounding inner electrodes adjacently opposes one of the first signal inner electrodes in the laminating direction. The plurality of second grounding inner electrodes are located between principal faces opposing each other in the laminating direction in the outer surface and the plurality of signal inner electrodes.

Abstract: An electrical feed-through includes an electrically conductive connection pin and an elastic insulation member coupled to the connection pin by vulcanizing the insulation member, wherein the coupled connection pin and insulation member are arranged in an opening of a casing and pressure-tightly clamped in the opening by a fastening element.

Abstract: A feedthrough, in particular for use in a medical-electronic implant, is provided having a terminal pin which has a section which can be soft soldered at least in the interior of the implant, a flange enclosing the terminal pin, and a glass solder plug which hermetically seals the terminal pin in relation to the flange.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Abstract: A hermetic feed-through includes a housing body defining a hollow space, a plurality of conductive pins and a seal structure. The plurality of conductive pins extend through the hollow space. The seal structure is provided in the hollow space and includes a single-piece glass component. The single-piece glass component hermetically seals at least two conductive pins to the housing body and electrically insulates the at least two conductive pins from the housing body.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.

Abstract: An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.

Abstract: An improved electrical lead-through, particularly for safety tanks, is provided that includes at least one electrical conductor which is guided through a rigid insulation material, wherein a silicone insulation is introduced over at least one segment of the conductor projecting on one side of the insulation material.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the ferrule, and a plurality of chip capacitors. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. In some examples, respective ones of the plurality of chip capacitors are electrically connected to respective ones of the plurality of feedthrough conductive pathways and electrically connected to the ferrule.

Abstract: A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed remote from the first feedthrough passageway, and a second lead disposed within the second feedthrough passageway and conductively coupled to the first set of electrode plates. The second set of electrode plates are typically conductively coupled to a ground. An EMI shield may be provided to electromagnetically isolate the first lead from the second lead.

Abstract: A high-pressure-resistant hermetic seal terminal includes an eyelet which has a through hole and a lead which is electrically insulated and hermetically sealed via a glass material in the through hole. The glass material is welded in a manner to extend on a lower surface of the eyelet from an end of the through hole to surroundings of the end of the through hole. Preferably, the eyelet has a counterbore, in the lower surface, extending in a region around and surrounding the through hole, and the glass material is welded to the inside of the counterbore.

Abstract: A multipolar feedthrough filter capacitor assembly for an active implantable medical device includes a feedthrough filter capacitor including a first active electrode plate, a second active electrode plate and a plurality of ground electrode plates. The plates are in spaced parallel relation disposed within a monolithic dielectric substrate where the first and second active electrode plates are disposed between the plurality of ground electrode plates. A first conductive terminal pin is disposed through the feedthrough filter capacitor electrically coupled to the first active electrode plate and in non-conductive relation to both the second active electrode plate and ground electrode plate. A second conductive terminal pin may be disposed through the feedthrough filter capacitor electrically coupled to the second active electrode plate and in non-conductive relation to both the first active electrode plate and ground electrode plate.

Abstract: In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.

Abstract: A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a lead frame assembly. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. The lead frame assembly may include an electrically conductive lead electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and an electrically insulating material disposed between an externally-facing filter array side and an internally-facing feedthrough side. In some examples, the feedthrough includes at least one feedthrough conductive pathway extending between an internally-facing feedthrough side and an externally-facing feedthrough side. In some examples, the capacitive filter array includes at least one filter array conductive pathway extending between an internally-facing filter array side and an externally-facing filter array side. In some examples, at least one of the ferrule, the feedthrough, or the capacitive filter array defines an underfill access channel through which the electrically insulating material is introduced.

Abstract: A power terminal feed-through includes a housing body, a plurality of conductive pins, and a seal structure that hermetically seals the conductive pins to the housing body and electrically insulates the conductive pins from the housing body. The seal structure includes a first material fused to one of the housing body and the conductive pin, and a second material fused to the other one of the housing body and the conductive pin. The first and second materials may be properly chosen to match thermal expansion of the housing body and the conductive pins, respectively.

Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.

Abstract: An apparatus and production method for a watertight capacitive sensor unit is provided. Accordingly, a carrier, approximately U-shaped in cross section, is made from a water-impermeable material. At least one electrode strip is placed in an interior space of the carrier along the longitudinal extension of the carrier. The interior space is filled with a hardening filler material in such a way that the electrode strip is sealed outwardly watertight.

Abstract: A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. A conductive annular member is placed onto the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.

Abstract: In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor.

Abstract: A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes.

Abstract: The present invention relates to a tantalum wire for anode lead of tantalum capacitors, characterized in that the cross section of the tantalum wire is approximate rectangular or regular rectangular. The present invention also relates to a process for manufacturing the tantalum wire, comprising the steps of: providing feedstock tantalum wire; subjecting the feedstock tantalum wire to heat treatment; subjecting the heat treated tantalum wire to surface pretreatment to form an oxide membrane on the surface-pretreated tantalum wire; rolling the surface-pretreated tantalum wire by lubricating with lubricant oil to make the cross section of the rolled tantalum wire being approximate rectangular or regular rectangular; subjecting the tantalum wire to final annealing.

Abstract: A feedthrough capacitor includes an inner electrode that extends coaxially within a grounded outer electrode. A non-conductive, epoxy-based potting material insulates and adhesively joins opposing roughened portions of the inner and outer electrodes. A capacitor assembly extends between the inner and outer electrode and serves to bypass relatively high frequency signals carried by the inner electrode to the grounded outer electrode. The capacitor assembly includes a plurality of monolithic multilayer ceramic capacitors, each capacitor having first and second terminals that are respectively surface mounted onto inner and outer concentric conductive rings. A plurality of deflectable tines project radially inward from the inner ring and resiliently circumferentially contact the exterior of the inner electrode. Similarly, a plurality of deflectable tines project radially outward from the outer ring and resiliently circumferentially contact the interior of the outer electrode.

Abstract: An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

Abstract: A conducting portion includes a plurality of conducting inner electrodes. Each of a pair of capacitance portions includes a plurality of signal inner electrodes while adjacently opposing each other in the laminating direction, a plurality of first grounding inner electrodes while adjacently opposing each other in the laminating direction, and a plurality of second grounding inner electrodes while adjacently opposing each other in the laminating direction. The plurality of first grounding inner electrodes are located between the conducting portion and the plurality of signal inner electrodes, while one of the first grounding inner electrodes adjacently opposes one of the first signal inner electrodes in the laminating direction. The plurality of second grounding inner electrodes are located between principal faces opposing each other in the laminating direction in the outer surface and the plurality of signal inner electrodes.

Abstract: The capacitor material of the present invention is comprised by laminating a titanium dioxide layer and a titanate compound layer having perovskite crystals.

Abstract: A multi-layer capacitor includes a first capacitor layer and a second capacitor layer adjacent and substantially parallel to the first capacitor layer. The second capacitor layer has a surface area that is less than the surface area of the first capacitor layer.

Abstract: A millimeter wave transmission line filter having a plurality of filter pole determining coupled cavities fabricated with a multiple lithographic layer micromachining process. The filter cavities are oriented perpendicular to an underlying substrate element in order to achieve micromachining, fabrication and accuracy advantages. Multiple filters can be used in a frequency multiplex arrangement as in a duplexer. Radio frequencies in the 15 to 300 gigahertz range are contemplated.

Abstract: In a feedthrough capacitor, a signal internal electrode layer is so arranged that an opposed portion opposed to a ground internal electrode layer is provided with a projection projecting toward a ground electrode, when viewed from a direction of a stack of dielectric layers. Therefore, if a gap amount G is abnormal between an end face with the ground electrode thereon and the signal internal electrode layer, the projection comes in contact with the ground electrode and a short circuit occurs between the ground electrode and terminal electrodes. This feedthrough capacitor thus permits easy detection of abnormality of the gap amount G, based on the presence/absence of a short-circuit failure.

Abstract: An improved DC and/or audio-frequency output for RF paths has the following features: an earth connection is provided, in particular in the form of an electrically conductive housing (17), an output path (13) branches off from a connection point (117, 117?) on an RF path (3, 5), the output path (13) comprises a branch line (7, 9), originating from the connection point (117, 117?), in the form of a ?/4 line, where ? represents a wavelength which corresponds to a wavelength within the RF band to be transmitted on the RF path (3, 5), and having a capacitor device (27a, 27b), which is connected to the branch line (7, 9), in the form of a low-pass filter and/or an RF short, with at least one sealed dipole connection (127a, 127h) also being provided on the output path (13), in addition to the at least one capacitor device (27a, 27b).

Abstract: A shielded three-terminal flat-through EMI/energy dissipating filter includes an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and a second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. In preferred embodiments, the active electrode plate and the shield plates are at least partially disposed with a hybrid flat-through substrate that may include a flex cable section, a rigid cable section, or both.

Abstract: A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup.

Abstract: In a feed-through capacitor, a conduction unit having a plurality of conduction inner electrodes can fully secure a tolerable level of DC. A capacitor unit is formed on the mount surface side in a capacitor body, so that high-frequency noise components can be removed by the capacitor unit before reaching the conduction unit. The distance between the grounding inner electrode located closest to the conduction unit and the conduction inner electrode in the conduction unit is greater than that between the signal inner electrode and grounding inner electrode in the capacitor unit. This enhances the impedance between the capacitor unit and the conduction unit, so as to inhibit the high-frequency noise components from flowing into the conduction unit.

Abstract: A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface.

Abstract: A feedthrough assembly for use with implantable medical devices having a shield structure, the feedthrough assembly engaging with the remainder of the associated implantable medical device to form a seal with the medical device to inhibit unwanted gas, liquid, or solid exchange into or from the device. One or more feedthrough wires extend through the feedthrough assembly to facilitate transceiving of the electrical signals with one or more implantable patient leads. The feedthrough assembly is connected to a mechanical support which houses one or more filtering capacitors that are configured to filter and remove undesired frequencies from the electrical signals received via the feedthrough wires before the signals reach the electrical circuitry inside the implantable medical device.

Abstract: A feedthrough capacitor assembly for attachment to a mount having an opening is disclosed. The assembly includes a feedthrough terminal adapted for insertion through said opening for coupling a signal from a first side of the mount to a second side of the mount. The assembly includes a first conductive region extending about and electrically coupled to the feedthrough terminal and a second conductive region extending about the first conductive region. A plurality of capacitors are electrically coupled between the first conductive region and the second conductive region. The plurality of capacitors are arranged about the feedthrough terminal with each capacitor having about the same capacitance as each of the other capacitors.

Abstract: An electronic component includes an electronic component main body including opposed first and second main surfaces, opposed first and second side surfaces, and opposed first and second end surfaces and also includes first and second external terminal electrodes disposed on the first main surface. The first and second external terminal electrodes are spaced apart by a gap region. When a dimension in a longitudinal direction being a direction linking the first and second end surfaces of the electronic component main body is L, a dimension in a width direction being a direction linking the first and second side surfaces is W, and a dimension of the gap region along the longitudinal direction is g, W<L?g<2W and L?g+W?{2(L?g)W}1/2>(L?g)/2 are satisfied.

Abstract: A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface.

Abstract: A first signal internal electrode is connected to a first signal terminal electrode and a signal connection conductor. A second signal internal electrode is connected to a second signal terminal electrode and the signal connection conductor. A first ground internal electrode is connected to a first ground terminal electrode and a ground connection conductor. A second ground internal electrode is connected to a second ground terminal electrode and the ground connection conductor. The first signal internal electrode and the first ground internal electrode have their respective regions opposed to each other. The second signal internal electrode and the second ground internal electrode have their respective regions opposed to each other. The first signal internal electrode and the second ground internal electrode are not opposed to each other. The second signal internal electrode and the first ground internal electrode are not opposed to each other.

Abstract: This invention provides navel capacitors comprising nanofiber enhanced surface area substrates and structures comprising such capacitors, as well as methods and uses for such capacitors.