Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of a plurality of internal electrode layers having pores are alternately stacked. A continuity modulus of at least one of the plurality of internal electrode layers is 80% or less. An average pore diameter of the pores of the at least one of the plurality of internal electrode layers is equal to or less than each thickness of the plurality of dielectric layers.

Abstract: A multilayer ceramic electronic component includes an end surface of a second external electrode and an end surface of a fourth external electrode that face a mounting surface of a mounting substrate on which a first multilayer ceramic electronic component body and a second multilayer ceramic electronic component body are mounted. A first metal terminal is connected to the second external electrode, a second metal terminal is connected to the fourth external electrode, and a connection terminal is connected across a first external electrode and a third external electrode. An insulator is disposed between the first multilayer ceramic electronic component body and the second multilayer ceramic electronic component body.

Abstract: A thin film capacitor comprises a first electrode, a second electrode, and a dielectric substance disposed between the first electrode 10 and the second electrode. The second electrode has a first metallic layer, an intermediate layer, and a second metallic layer in sequence in this order from the side of the dielectric substance. The first metallic layer contains a metal element M1 as a main component, and the second metallic layer contains a metal element M2 different from the metal element M1 as a main component. The intermediate layer has one or more laminate structures each having a second metal sublayer containing the metal element M2 as a main component and a first metal sublayer containing the metal element M1 as a main component in sequence from the side of the first metallic layer toward the side of the second metallic layer.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes and including main surfaces facing each other in a stacking direction, lateral surfaces facing each other in a width direction, and end surfaces facing each other in a length direction, and an external electrode electrically connected with the internal electrodes on the end surfaces. The external electrode includes an end surface covering portion covering each of the end surfaces, and a main surface covering portion covering portions of the main surfaces. The end surface and main surface covering portions each include a base electrode layer covering the ceramic body, and a plating layer covering the base electrode layer. The end surface covering portion further includes, between the base electrode layer and the plating layer, a sintered metal layer including a component different from that of the base electrode layer.

Abstract: A capacitor is provided that includes an electrostatic capacitance forming portion with a first electrode/dielectric layer/second electrode structure, and a silicon portion. Moreover, the silicon portion is disposed on at least a part of a side of the electrostatic capacitance forming portion. When the capacitor is viewed in a thickness direction thereof, a region occupied by the silicon portion in a lower portion of the electrostatic capacitance forming portion is 50% or less.

Abstract: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as ?td, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as ?te, a ratio (?te/?td) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10??te/?td?1.35.

Abstract: An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.

Abstract: A multilayer ceramic capacitor that includes a laminate having a plurality of dielectric layers and a plurality of internal electrodes that are alternately stacked, and external electrodes. Each of the dielectric layers contains first crystal grains and second crystal grains that each contain Ba, Ti, and a rare-earth element. A first mole ratio M1 of the rare-earth element to the Ti in a range from an interface to 50 nm inclusive of the first crystal grains and a second mole ratio M2 of the rare-earth element to the Ti in a range of 50 nm to 100 nm inclusive from the interface satisfy 0.95?M1/M2?1.05. A third mole ratio M3 of the rare-earth element to the Ti in the second crystal grains is half or less of a fourth mole ratio M4 of the rare-earth element to the Ti in the first crystal grains.

Abstract: A novel method of depositing grit particles onto a fan blade tip coating is provided. The method enhances grit capture by presenting a softened coating surface for the impinging particles. The softened surface is achieved without high substrate temperatures that could degrade the base metal properties in the fan blade. An auxiliary heat source is used to establish a locally heated and softened surface where the grit deposition takes place. The softened surface greatly increases the probability of grit capture.

Abstract: A method includes producing a ceramic body including a stack of a dielectric layer and an internal electrode, applying a conductive paste including metal powder and glass frit to an outer surface of the ceramic body and baking the conductive paste to form a base external electrode layer, forming a crack in glass exposed to an outer surface of the base external electrode layer, after the formation of the crack, applying a water repellent to the base external electrode layer, and forming a Ni plating layer and a Sn plating layer on the base external electrode layer.

Abstract: A multilayer ceramic capacitor includes a ceramic main body including dielectric layers and internal electrodes, principal surfaces, side surfaces, and end surfaces, and an external electrode electrically connected to the internal electrode on both end surfaces. The dielectric layer includes at least one element of Si and Mg. In a section defined by the width and lamination directions at a position of a central portion in the length direction of the ceramic main body, an outside in the width direction is higher than a central portion in the width direction in an amount of at least one element existing in a rectangular region of about 10 ?m×about 10 ?m of the dielectric layer in planar view, and continuity of the internal electrodes within a range of about 10 ?m from an end in the width direction of the internal electrodes is greater than or equal to about 95%.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes: forming a multilayer body by alternately stacking a green sheet and a conductive paste for forming an internal electrode layer, the green sheet being mainly composed of a ceramic material having a perovskite structure that includes Ca and Zr and is expressed by a general expression ABO3 and containing an alkali metal, the conductive paste being mainly composed of Cu, containing a ceramic co-material and no alkali metal; and baking the multilayer body to obtain a ceramic multilayer body.

Abstract: An electronic component includes an element main body and at least a pair of outer electrodes on the element main body. The outer electrodes each include an underlying electrode layer positioned so as to be in contact with the element main body and a plating layer positioned so as to be in contact with the underlying electrode layer. The plating layer includes a Ni—Sn alloy plating layer positioned so as to be in contact with the underlying electrode layer.

Abstract: A material comprising an ionically conducting polymer (ICP) positioned between and in direct contact with two electronically conducting polymers (ECP).

Abstract: A device includes a leadframe and an electronic component. The leadframe includes a first leadframe element having a first surface and a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface. A first flange extends from a first outer edge of the first leadframe element and extends away from the first surface of the first leadframe element. A second flange extends from a second outer edge of the second leadframe element and extends away from the second surface of the second leadframe element. The electronic component is coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.

Abstract: An electronic component includes a body having an internal electrode disposed therein, and an external electrode disposed on the body and connected to the internal electrode, wherein in a cross section of the body cut in length and thickness directions, the external electrode includes a first electrode layer disposed below the body and a second electrode layer covering at least the first electrode layer and a side portion of the body, and the internal electrode is connected to the second electrode layer through the side portion of the body.

Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate comprising an array region and a peripheral region surrounding the array region, a plurality of capacitor structures positioned above the peripheral region of the substrate, a first semiconductor element positioned above the peripheral region and having a first threshold voltage, and a second semiconductor element positioned above the peripheral region and having a second threshold voltage. The first threshold voltage of the first semiconductor element is different from the second threshold voltage of the second semiconductor element.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes: preparing a dielectric magnetic composition including base material powder particles including BaTi2O5 or (Ba(1-x)Cax)Ti2O5 (0?x<0.1), the base material powder particles having surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheets using dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet laminate by stacking the ceramic green sheets to which the internal electrode paste is applied; and preparing a ceramic body including dielectric layers and a plurality of first and second internal electrodes arranged to face each other with each of the dielectric layers interposed therebetween by sintering the green sheet laminate.

Abstract: An electronic component includes a laminate and an external electrode provided on an end surface of the laminate. The external electrode includes a Ni layer provided on the end surface, a Ni—Sn alloy layer provided on the Ni layer, and a resin layer that is provided on the Ni—Sn alloy layer and includes metal grains including Sn grains. The Ni layer and the Ni—Sn alloy layer reduce or prevent intrusion of moisture from the external electrode into an interior of the laminate, and the resin layer reduces or prevents generation of cracks when a bending stress is applied to the external electrode.

Abstract: A multi-layered ceramic electronic component has a ceramic body including a dielectric layer and an internal electrode, and an external electrode formed outside of the ceramic body and electrically connected to the internal electrode. The internal electrode includes a conductive metal and a fiber-shaped ceramic additive. For example, the fiber-shaped ceramic additive can include barium titanate (BaTiO3) and, optionally, dysprosium (Dy) and/or barium (Ba). The fiber-shaped ceramic additive may have a diameter of 10 to 200 nm, and a ratio of length to diameter of 10 to 100.

Abstract: A battery comprising a high capacity electrode construction may include layering of the electrode and/or low active material loading.

Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.

Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.

Abstract: An electronic component includes an electronic component body and an external electrode. The external electrode is disposed on the electronic component body. The external electrode includes a Pd plating layer and a Ni plating layer. The Pd plating layer defines an outermost layer. The Ni plating layer is disposed inside the Pd plating layer. The Ni plating layer is partly exposed from the Pd plating layer.

Abstract: A wet electrolytic capacitor that contains a cathode, fluidic working electrolyte, and anode that includes a sintered porous pellet is provided. A dielectric layer is also formed on a surface of the pellet and within its pores through anodic oxidation. The present inventors have discovered that through selective control over the anodic oxidation process, a substantially amorphous, low crystalline dielectric layer can be formed which, among other things, exhibits a leakage current that is smaller than previously thought possible for the high voltage capacitors employed in implantable medical devices.

Abstract: A capacitor includes a body including dielectric layers and internal electrodes; and external electrodes disposed on the body. The capacitor includes Sn, the Sn having an alpha particle emission rate equal to or less than 0.02 cph/cm2.

Abstract: A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.

Abstract: A capacitor that includes a conductive metal substrate having a high porosity portion and a low porosity portion with a porosity lower than that of the high porosity portion; a dielectric layer on the conductive metal substrate; an upper electrode on the dielectric layer; an upper extended electrode on one principal face of the conductive metal substrate and electrically connected to the upper electrode; a lower extended electrode on the other principal face of the conductive metal substrate and electrically connected to the conductive metal substrate; and insulating layer on the upper electrode at a position overlapping with the low porosity portion through the dielectric layer and the upper electrode.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and having first and second surfaces opposing each other in a width direction, third and fourth surfaces connecting the first and second surfaces in a length direction, and fifth and sixth surfaces opposing each other in a thickness direction, internal electrodes disposed inside the ceramic body, exposed through the first and second surfaces, and having one end portion exposed through the third or fourth surface, and first and second side margin portions disposed on edges of the internal electrodes, exposed through the first and second surfaces. In a cross-section cut along a width-thickness plane of the ceramic body, an area of an oxide region disposed on the edges of the internal electrodes is less than 10% of an overall area of the internal electrodes exposed through the first and second surfaces.

Abstract: Methods and systems for operating a hybrid driveline that includes an engine and an electric machine are presented. In one non-limiting example, the engine and electric machine are operated according to a solution of a Hamiltonian that includes a first co-state and a second co-state, an engine fuel flow parameter, a rate of change of battery state of charge parameter, and an emissions flow rate parameter.

Abstract: Provided is a capacitor structure including a substrate, a cup-shaped lower electrode, a top supporting layer, a capacitor dielectric layer, and an upper electrode. The cup-shaped lower electrode is located on the substrate. The top supporting layer surrounds the upper portion of the cup-shaped lower electrode. The top supporting layer includes a high-k material. Surfaces of the cup-shaped lower electrode and the top supporting layer are covered by the capacitor dielectric layer. A surface of the capacitor dielectric layer is covered by the upper electrode.

Abstract: Solvents for macromolecules generally believed to be insoluble in their pristine form are identified by generation of a “solvent resonance” in the relationship between solvent quality (deduced by Rayleigh scattering) and an intrinsic property of solvents. A local extreme of the solvent resonance identifies the ideal intrinsic property of an ideal solvent which may then be used to select a particular solvent or solvent combination. A solvent for graphene is used in the production of transparent conductive electrodes.

Abstract: A temperature detector is configured to detect the temperature of a housing while in contact with the housing, and a spring pin is in contact with the temperature detector in a separable manner. Thus, at mounting of the temperature detecting device on an electronic device, it is possible to fix the temperature detector to the housing, and the spring pin to a circuit board of the electronic device. At disassembly of the electronic device, it is easy to separate the spring pin from the temperature detector by removing, from the housing, the spring pin together with the circuit board. At assembly of the electronic device, it is easy for the spring pin to contact the temperature detector by attaching, to the housing, the spring pin together with the circuit board.

Abstract: A semiconductor device including a plurality of pillars on a semiconductor substrate; and a support pattern in contact with some lateral surfaces of the pillars and connecting the pillars with one another, wherein the support pattern includes openings that expose other lateral surfaces of the pillars, each of the pillars includes a first pillar upper portion in contact with the support pattern and a second pillar upper portion spaced apart from the support pattern, and the second pillar upper portion has a concave slope.

Abstract: An electrode for a secondary battery including an electrode laminated assembly that has a configuration in which electrodes and a separator are laminated, includes current collector 3 and active material layer 2 formed on a surface of current collector 3. Active material layer 2 includes a thick-layer portion and a thin-layer portion that is positioned at an edge portion of the active material layer and that is smaller in thickness than the thick-layer portion, and is formed by discharging slurry containing an active material from discharge port 12a of die head 12 toward the surface of current collector 3, the slurry being supplied to die head 12 through coating valve 13.

Abstract: A capacitor component includes a body, and first and second external electrodes formed on external surfaces of the body. The body includes a first connection electrode connected to the first external electrode, a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, and a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes.

Abstract: In a multilayer ceramic capacitor, A>B is satisfied by an atomic concentration ratio B of Si to Cu in a first organic layer disposed on a first base electrode layer located on a first end surface, an atomic concentration ratio A of Si to Cu in the first organic layer disposed on the first base electrode layer located on a first principal surface and a second principal surface, and an atomic concentration ratio A of Si to Cu in the first organic layer located directly on the first principal surface and the second principal surface.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

Abstract: A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 ?m or less.

Abstract: An element body includes first and second end surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and first and second principal surfaces opposing each other in a third direction. The length of the element body in the third direction is shorter than that of the element body in the first direction and is shorter than that of the element body in the second direction. A pair of first external electrodes is disposed at both ends of the element body in the first direction. Each of the first external electrodes includes a first conductor part disposed on one main surface and a second conductor part disposed on the end surface and coupled to the first conductor part. The porosity of the first conductor part is smaller than that of the second conductor part.

Abstract: A composite positive active material includes: a composite including a first metal oxide represented by Formula 1 and having a layered structure, and a second metal oxide having at least one crystal structure selected from a layer structure, a perovskite structure, a rock salt structure, and a spinel structure, wherein a content of the second metal oxide is greater than 0 and equal to or less than 0.2 moles, per mole of the composite, LiNixM11-xO2-eM2e??Formula 1 wherein, in Formula 1, M1 is at least one element selected from Group 4 to Group 14 of the Periodic Table of the Elements; Ma is at least one element selected from F, S, Cl, and Br; 0.7?x<1; and 0?e<1. Also, a positive electrode including the composite positive active material, and a lithium battery including the positive electrode.

Abstract: An inductor-capacitor (LC) filter includes an inductor having an asymmetric shape including at least one turn. The LC filter also includes serial capacitors coupled to the inductor at only one end of a continuous portion of the inductor. The serial capacitors continues the shape of the inductor. The capacitors are outside of a footprint of the continuous portion of the inductor.

Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes: a ceramic body including dielectric layers; and internal electrodes disposed on the dielectric layers within the ceramic body and containing a ceramic material trapped therein. The ceramic material is a dielectric material doped with an additive.

Abstract: A capacitor that includes a porous metallic base material; a phosphorus-containing layer on the porous metallic base material; a dielectric layer on the phosphorus-containing layer; and an electrode on the dielectric layer.

Abstract: A multilayer ceramic capacitor includes: a pair of external electrodes; a first internal electrode containing a base metal and coupled to one of the external electrodes; a dielectric layer stacked on the first internal electrode and containing a ceramic material and the base metal; and a second internal electrode stacked on the dielectric layer, containing the base metal, and coupled to another one of the external electrodes, wherein a concentration of the base metal in each of five regions is within ±20% of an average of the concentrations of the base metal in the five regions, the five regions being obtained by dividing a region from a location 50 nm away from the first internal electrode of the dielectric layer to a location 50 nm away from the second internal electrode of the dielectric layer in a stacking direction between the first and second internal electrodes equally into five.

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

Abstract: A multilayer ceramic electronic component has a dimension in a longitudinal direction of no less than about 0.12 mm and no more than about 0.27 mm, a dimension in a width direction of no less than about 0.06 mm and no more than about 0.14 mm, and a dimension in a lamination direction of no less than about 0.06 mm and no more than about 0.14 mm, for example. Each of a first outer electrode and a second outer electrode includes an underlying electrode layer disposed on a surface of a multilayer body, a nickel-plated layer covering the underlying electrode layer, and a tin-plated layer covering the nickel-plated layer. The nickel-plated layer in each of the first outer electrode and second outer electrode has surface roughness of no less than about 3 ?m and no more than about 6 ?m, for example.

Abstract: A multilayer ceramic electronic component includes a ceramic element body including internal electrodes and external electrodes electrically connected to respective internal electrodes. Each of the external electrodes includes a sintered metal layer including glass and metal and a conductive resin layer including resin and metal particles. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and L1/L2 is about 0.2 or more and about 1.5 or less, where L1 is a length along the interface at which the glass of the sintered metal layer is exposed at the interface, and L2 is a length along the interface at which the metal of the sintered metal layer is exposed at the interface.

Abstract: A multilayer ceramic electronic component in which an interface of an edge region of an external electrode that extends around to a side surface of a ceramic body and the ceramic configuring a surface of the ceramic body, an inorganic matter is present containing 26 mol % or more and less than 45 mol % of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.154 or more, or an inorganic matter is present containing 45 mol % or more of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.022 or more. Furthermore, the inorganic matter may contain B2O3 having a molar ratio relative to SiO2 within 0.25?B2O3/SiO2?0.5.

Abstract: An integrated circuit includes a high-voltage MOS (HV) transistor and a capacitor supported by a semiconductor substrate. A gate stack of the HV transistor includes a first insulating layer over the semiconductor layer and a gate electrode formed from a first polysilicon. The capacitor includes a first electrode made of the first polysilicon and a second electrode made of a second polysilicon and at least partly resting over the first electrode. A first polysilicon layer deposited over the semiconductor substrate is patterned to form the first polysilicon of the gate electrode and first electrode, respectively. A second polysilicon layer deposited over the semiconductor substrate is patterned to form the second polysilicon of the second electrode. Silicon oxide spacers laterally border the second electrode and the gate stack of the HV transistor. Silicon nitride spacers border the silicon oxide spacers.