Abstract: A capacitor includes a silicon substrate, a conductor layer, and a dielectric layer. The silicon substrate has a principal surface including a capacitance generation region and a non-capacitance generation region. The silicon substrate includes a porous part provided in a thickness direction in the capacitance generation region. The conductor layer includes a surface layer part at least covering part of a surface of the capacitance generation region and a filling part filled in at least part of the porous part. The dielectric layer is provided between an inner surface of the porous part and the filling part. The porous part includes a macroporous part having macro pores and a nanoporous part formed in at least part of inner surfaces of the macro pores and having nano pores smaller than the macro pores.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and first and internal electrodes disposed to be stacked with the dielectric layer interposed therebetween; a first and a second external electrode disposed on the ceramic body. The first and the second external electrodes may include a first and a second base electrode layers disposed in contact with the ceramic body and a first and a second resin electrode layers disposed on the first and the second base electrode layer respectively, a width of the ceramic body in the second direction may be less than 1.0 mm, and 0.4×ta?tb?0.5×ta in which ta is an average thickness of the first base electrode layer and tb is an average thickness of the first resin electrode layer.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, a plurality of external electrodes, an active region including a plurality of internal electrodes, and an additional electrode region including a plurality of additional electrode layers. The plurality of additional electrode layers are connected to an external electrode, among the plurality of external electrodes, different from an external electrode which a most adjacent internal electrode among the plurality of internal electrodes of the active region is connected to, and 1<d/e?5 in which e is a distance between adjacent internal electrodes among the plurality of internal electrodes and d is a distance between an internal electrode, among the plurality of internal electrodes, and an additional electrode layer, among the plurality of additional electrode layers of the additional electrode region, which are most adjacent to each other.

Abstract: An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.

Abstract: A multilayer ceramic electronic device includes a ceramic functional part having a generally rectangular shape in which a plurality of ceramic dielectric layers and a plurality of internal electrodes are laminated alternately in a vertical direction; a pair of cover parts that cover the functional part from top and bottom, respectively; and a pair of side margin parts covering side surfaces of the functional part, respectively, wherein an end portion of an uppermost internal electrode among the plurality of internal electrodes is curved downward to satisfy a?1 ?m and 0.1?a/b?0.4, where a is a dimension of the curved end portion in the vertical direction in a cross section taken along a plane perpendicular to the side surfaces, and b is a dimension of the curved end portion in a horizontal direction in said cross section.

Abstract: A method of forming a capacitor structure includes following operations. A first electrode is formed. A hafnium-zirconium oxide (HZO) layer is formed over the first electrode under a first temperature. An interface dielectric layer is formed over the HZO layer under a second temperature greater than the first temperature. A second electrode is formed over the interface dielectric layer. The HZO layer and the interface dielectric layer are annealed.

Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 ?m or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

Abstract: A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer structure opposite to each other, wherein x/y is 0.143 or less where x represents an average concentration of hydrogen in ppm in a capacitance section where the internal electrode layers exposed to one of the two edge faces and the internal electrode layers exposed to the other of the two edge faces are opposed to each other, as measured by secondary ion mass spectrometry (SIMS), and y represents an average concentration of titanium in ppm in the capacitance section, as measured by SIMS at the same time of measuring the average concentration of hydrogen.

Abstract: A multilayer capacitor includes: a capacitor body including first and second dielectric layers, internal electrodes, and including first to six surfaces; first and second external electrodes disposed on the third and fourth surfaces, respectively; and third and fourth external electrodes disposed on the fifth and sixth surfaces, respectively. The internal electrodes include: first internal electrode disposed on the first dielectric layer, having both ends connected to the first and second external electrodes, respectively, and having a hole; a second internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode and be connected to the third external electrode; and a third internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode, be spaced apart from the second internal electrode, and be connected to the fourth external electrode.

Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, first and second external electrodes provided on respective opposing end surfaces, and third and fourth external electrodes provided on any side surface. The internal electrode layers include first and second internal electrode layers connected to the first and second external electrodes, respectively, and third and fourth internal electrode layers connected to the third and fourth external electrodes, respectively. The third internal electrode layer is provided at a distance from the first internal electrode layer, and the fourth internal electrode layer is provided at a distance from the second internal electrode layer.

Abstract: A three-terminal multilayer ceramic capacitor includes a capacitor including a ceramic layer, first and second internal electrodes, first and second end surface electrodes, and first and second side surface electrodes, and has a lengthwise dimension of about 1300 ?m or more and about 1500 ?m or less, a widthwise dimension of about 1000 ?m or more and about 1200 ?m or less, a heightwise dimension of about 570 ?m or more and about 680 ?m or less, and a capacitance of about 12 ?F or more and about 32 ?F or less. The first and second end surface electrodes, and the first and second side surface electrodes include a Ni underlying electrode layer and at least one plating electrode layer. The first and second end surface electrodes have a thickness of about 0.73% or more and about 3.00% or less relative to the lengthwise dimension.

Abstract: A secondary battery made by laminating a separator layer and a second electrode to insides of a plurality of through holes of a first electrode, the first electrode having one face, an opposite face, a side face, and the through holes that penetrate from the one face to the opposite face, makes it possible to stably collect currents for the second electrode, and gives good cycle characteristics as a secondary battery.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body.

Abstract: A capacitor component includes a laminate including dielectric layers and internal electrode layers, first and second external electrodes respectively provided on first and second end surfaces of the laminate, and a third external electrode provided on at least one of first and second lateral surfaces of the laminate. The internal electrode layers include a first internal electrode layer connected to the first external electrode and not connected to either the second or the third external electrode; a second internal electrode layer connected to the second external electrode and not connected to either the first or the third external electrode; a third internal electrode layer not connected to any of the first, the second, or the third external electrode; and a fourth internal electrode layer connected to the third external electrode and not connected to either the first or the second external electrode.

Abstract: By controlling shapes of internal electrodes, when short-circuit occurs between the internal electrodes, a short-circuited portion may be opened by an overcurrent, to serve as a fuse. Also, by controlling shapes of internal electrodes, equivalent series inductance (ESL) at a high frequency may be reduced.

Abstract: A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m3 or more, or the dielectric resin film has a storage elastic modulus at 125° C. of 1.1 GPa or more.

Abstract: A multilayer capacitor may include a monolithic body including a plurality of dielectric layers. A first external terminal may be disposed along a first end, and a second external terminal may be disposed along a second end of the capacitor. The external terminals may include respective bottom portions that extend along a bottom surface of the capacitor. The bottom portions of the external terminals may be spaced apart by a bottom external terminal spacing distance. A bottom shield electrode may be arranged within the monolithic body between a plurality of active electrodes and the bottom surface of the capacitor. The bottom shield electrode may be spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance that may range from about 3 microns to about 100 microns. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be less than about 4.

Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.

Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.

Abstract: A film capacitor includes a main body portion. A dielectric film of the main body portion includes an insulation margin in a first direction. A first metal film and a second metal film are each separated by first slits which each includes a first end which is at an angle of ?1 to the second side face, and second slits. The second slit is connected at a contact point to the first slit, and includes a second end which is located on a negative side in the first direction relative to the contact point. The second end is positioned in alignment with a first end of a first slit which is continuous with the second slit adjacent thereto on the negative side in the first direction. A value of tan (?1) is in a range of 0.15 or more and 0.35 or less.

Abstract: A multilayer ceramic capacitor includes a laminate including ceramic layers and internal electrode layers arranged in a stacking direction, and two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed. The laminate has a rectangular parallelepiped configuration or shape and includes two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces. On at least one of the four surfaces, the laminate includes a protrusion in which the exposure region protrudes outward.

Abstract: A coil component includes a magnetic body portion that includes metallic particles and a resin material, a coil conductor that is embedded in the magnetic body portion, and a first outer electrode and a second outer electrode each of which is electrically connected to the coil conductor. At least a portion of an outer layer of the magnetic body portion forms an electrically conductive layer that includes a second metallic material having a specific resistance lower than a specific resistance of a first metallic material forming the metallic particles. The electrically conductive layer includes a first electrically conductive layer that is electrically connected to the first outer electrode and a second electrically conductive layer that is electrically connected to the second outer electrode. The first electrically conductive layer and the second electrically conductive layer are electrically isolated from each other.

Abstract: A ceramic electronic device including a ceramic body having ceramic layers and internal electrode layers stacked in alternating manner and a terminal electrode formed at an end face of the ceramic body. The terminal electrode includes a base electrode including a metal component and a glass component, an intermediate electrode layer including Ni and formed at an outer face of the base electrode layer, and an upper electrode layer including Pd or Au and formed at an outer face of the intermediate electrode layer. Also, a surface roughness Ra1 of the base electrode layer in the terminal electrode is 5.0 ?m or less; or the surface roughness Ra1 of the base electrode layer, a surface roughness Ra2 of the intermediate electrode layer, and a surface roughness Ra3 of the upper electrode layer satisfy a relationship of Ra1>Ra3?Ra2.

Abstract: A multilayer ceramic capacitor includes a laminate including a plurality of dielectric layers laminated one on the other, the laminate being in a cuboid or substantially cuboid shape. The multilayer ceramic capacitor includes external electrodes on the end surfaces of the laminate. A first inner electrode layer exposed through the first end surface and a second inner electrode layer exposed through the second end surface are provided on the dielectric layer. A first region and a second region are defined in the first inner electrode layer and the second inner electrode layer, in which coverages of the first inner electrode layer and the second inner electrode layer to the dielectric layer are greater in the first region than in the second region.

Abstract: A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

Abstract: A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

Abstract: An electronic component includes a laminate including internal electrodes alternately laminated in a lamination direction with dielectric layers interposed therebetween. The laminate includes main surfaces opposite to each other in the lamination direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction, and external electrodes provided on surfaces of the laminate and electrically connected to the internal electrodes. Each of the dielectric layers includes Ti and Mg. When a cross section including the length direction and the width direction of the laminate is viewed from the lamination direction, side margin portions in which the internal electrodes do not exist each include a dielectric including Ti and Mg with a molar ratio in each of the side margin portions smaller than a molar ratio of Mg to Ti included in each of the dielectric layers.

Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 ?m or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

Abstract: A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

Abstract: A ceramic electronic component includes a pair of electrodes facing each other and a dielectric layer disposed between the pair of electrodes and including a plurality of ceramic nanosheets, where the plurality of ceramic nanosheets has a multimodal lateral size distribution expressed by at least two separated peaks, a method of manufacturing the same, and an electronic device including the ceramic electronic component.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.

Abstract: A multilayer ceramic capacitor includes a stacked body including dielectric layers and internal electrodes. External electrodes are provided on end surfaces of the stacked body. The internal electrodes include a first internal electrode, a second internal electrode, a third internal electrode, a fourth internal electrode, a fifth internal electrode, and a sixth internal electrode. The first internal electrode and the second internal electrode, and the third internal electrode and the fourth internal electrode are provided on a dielectric layer in a same plane, and the fifth internal electrode and the sixth internal electrode are provided on a dielectric layer in a same plane different from the dielectric layer on which the first internal electrode and the second internal electrode, and the third internal electrode and the fourth internal electrode are provided.

Abstract: The present disclosure provides a plasma electric propulsion device comprising a capacitive energy storage device as a power source for an engine configured to heat and/or ionize and/or accelerate a propellant due to action of an electric field and/or magnetic field. The energy storage device comprises: a first electrically conductive electrode, a second electrically conductive electrode; and at least one metadielectric layer located between the first and second conductive electrodes. The metadielectric layer comprises at least one organic compound with at least one electrically resistive substituent and at least one polarizable unit. The polarizable unit is selected from intramolecular and intermolecular polarizable units.

Abstract: A capacitor includes a dielectric structure formed of a sintered dielectric, and a first electrode and a second electrode each formed of a conductor. The dielectric structure includes a wall. The first electrode and the second electrode are insulated from each other by the wall. The wall has a height which is a dimension in a first direction, and a thickness which is a dimension in a second direction orthogonal to the first direction, the height being greater than the thickness. The wall has a non-straight shape when seen in the first direction. A manufacturing method for the capacitor includes forming the dielectric structure, and forming the first electrode and the second electrode simultaneously after the formation of the dielectric structure.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A ceramic electronic device includes: a multilayer chip in which dielectric layers are stacked, the multilayer chip having two end faces, an upper face, a lower face and two side faces; a plurality of first internal electrode layers that are provided inside of the multilayer chip, each of the plurality of first internal electrode layers having projection portions extracted to the two side faces; and external electrodes that are provided on the two side faces between the two end faces and are connected to the projection portions, wherein each of the external electrodes has a smaller thickness in a region not connected to the projection portions, has an inflection point toward the projection portions, and has a larger thickness in a region connected to the projection portions, in a direction connecting the two end faces.

Abstract: A laminated secondary battery that houses an electrode assembly and an electrolyte in an exterior body. In the electrode assembly, a positive and negative electrode laminate body including an electrode current collector and electrode multi-units having two or more electrode material layers formed on the electrode current collector with non-forming regions interposed between them is bent on the non-forming regions.

Abstract: A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction; and a pair of metal frames disposed on opposing side surfaces of the capacitor array, respectively, and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively, wherein the metal frames include: support portions bonded to head portions of the external electrodes; and a mounting portion extending in a second direction perpendicular to the first direction from lower ends of the support portions, and one or more cutting portions are formed in portions of lower sides of the support portions and the mounting portion.

Abstract: A multilayer electronic component includes first and second external electrodes disposed on one surface of the body, the first internal electrode and the first external electrode being connected by a first via disposed within the body, the second internal electrode and the second external electrode being connected by a second via disposed within the body, the first internal electrode including first and second through portions, and the second internal electrode including third and fourth through portions, the first via penetrating alternately through the first through portion and the third through portion, the second via penetrating alternately through the second through portion and the fourth through portion, and a lead portion of the first via being connected to one end portion of the first external electrode, and a lead portion of the second via being connected to one end portion of the second external electrode.

Abstract: A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrodes that are laminated, and external electrodes disposed on side surfaces of the laminate to be connected to corresponding internal electrodes. A dimension L of the multilayer ceramic capacitor in its lengthwise direction and a dimension W in its width direction satisfy: about 0.85?W/L?about 1, and L?about 750 ?m, and a dimension T in its lamination direction satisfies: about 70 ?m?T?about 110 ?m. The laminate has a dimension t in the lamination direction, and a region in which the internal electrodes are laminated has a dimension t? in the lamination direction, and a ratio of the dimensions satisfies: t?/t?about 0.55.

Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.

Abstract: A winding apparatus that produces electrical energy storage devices includes a rotatable winding core on which two electrode strips and two separator strips are wound, strip guides which guide the various strips along feeding paths, and at least one rotatable and/or slidable portion that supports at least one strip guide. The rotatable and/or slidable portion rotates and/or slides, respectively, to adjust the position of the respective strip according to an increase in the diameter of the wound product in order to have the desired insertion direction of the strip with respect to the peripheral surface of the product.

Abstract: The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.