Significant Electrode Feature Patents (Class 361/303)
  • Patent number: 10930438
    Abstract: A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrodes that are laminated, and external electrodes disposed on side surfaces of the laminate to be connected to corresponding internal electrodes. A dimension L of the multilayer ceramic capacitor in its lengthwise direction and a dimension W in its width direction satisfy: about 0.85?W/L?about 1, and L?about 750 ?m, and a dimension T in its lamination direction satisfies: about 70 ?m?T?about 110 ?m. The laminate has a dimension t in the lamination direction, and a region in which the internal electrodes are laminated has a dimension t? in the lamination direction, and a ratio of the dimensions satisfies: t?/t?about 0.55.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: February 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Muramatsu, Yuki Koyama
  • Patent number: 10923443
    Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 16, 2021
    Assignee: Intel Corporation
    Inventors: Brandon C Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally, Jeremy D Ecton
  • Patent number: 10916794
    Abstract: A winding apparatus that produces electrical energy storage devices includes a rotatable winding core on which two electrode strips and two separator strips are wound, strip guides which guide the various strips along feeding paths, and at least one rotatable and/or slidable portion that supports at least one strip guide. The rotatable and/or slidable portion rotates and/or slides, respectively, to adjust the position of the respective strip according to an increase in the diameter of the wound product in order to have the desired insertion direction of the strip with respect to the peripheral surface of the product.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: February 9, 2021
    Assignee: Manz Italy S.r.l.
    Inventor: Massimiliano Sale
  • Patent number: 10903075
    Abstract: A method comprises depositing forming a first oxide layer comprising a bottom surface in contact with a first electrode, positioning a template at a specified position on a top surface of the first oxide, the template comprising a plurality of nanopores that extend through the template, depositing a metal material into at least a portion of the plurality of nanopores, allowing the metal material to at least partially solidify in at least the portion of the plurality of nanopores to form nanostructures in contact with the first oxide top surface, separating the template from the first oxide layer and the nanostructures, forming a second oxide layer comprising a bottom surface in contact with the first oxide top surface and the nanostructures, and forming a second electrode in electrical contact with at least a portion of a top surface of second oxide top surface.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: January 26, 2021
    Assignee: University of Massachusetts
    Inventors: Stephen Sommers Nonnenmann, Jiaying Wang
  • Patent number: 10905015
    Abstract: The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 26, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ga Young Woo, Young Su Son, Byeong Geon Kim
  • Patent number: 10892100
    Abstract: A multilayer capacitor includes a connecting electrode provided on a surface opposite to a surface on which the capacitor body is mounted, and a third external electrode and a fourth external electrode extend to cover opposing ends of the connecting electrode across a width of the capacitor body. The third and fourth external electrodes are disposed on respective side surfaces of the capacitor body opposite each other across the width, and contact respective first and second pluralities of internal electrodes disposed in the capacitor body.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hyeok Kim, Sang Soo Park, Jae Yeol Choi
  • Patent number: 10879006
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: December 29, 2020
    Assignee: SAMUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Do Young Jeong, Dong Hwi Shin, Sang Soo Park, Woo Chul Shin
  • Patent number: 10872729
    Abstract: An electrical energy storage device (1) includes several capacitors (2), and a busbar (5) for electric power distribution, wherein the busbar (5) is covered at least partially by an insulation layer (21) and the capacitors (2) are connected to the busbar (5). The capacitors can be arranged on the busbar for reducing an inductance. In particular, the capacitors can be arranged directly on the insulation layer (21) of the busbar (5).
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: December 22, 2020
    Assignee: ROGERS BVBA
    Inventors: Jan Daneels, Sebastian De Boodt
  • Patent number: 10861650
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed in a stacking direction to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode. Where a length of the first electrode layer in a length direction of the ceramic body is denoted by A and a length of the second electrode layer in a length direction of the ceramic body is denoted by B, B is shorter than A.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu, Sun Woong Kim
  • Patent number: 10847307
    Abstract: An inductor component includes an element body, a coil provided in the element body, and an outer electrode provided at the element body and electrically connected to the coil. The element body includes a bottom surface that faces the mounting substrate when the element body is mounted, the outer electrode includes an underlying layer and a coating film that covers the underlying layer. At the bottom surface of the element body, the underlying layer is embedded in the element body and does not protrude from the element body, and at least part of the coating film is embedded in the element body.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: November 24, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Tajima, Yasunari Nakashima, Yuta Shimoda
  • Patent number: 10847604
    Abstract: A capacitor includes a first metal layer over a substrate, a second metal layer over the first metal layer, and first and second cells. Each cell is electrically coupled to first and second buses. Each cell includes first plurality and second plurality of fingers in the first metal layer, and third plurality and fourth plurality of fingers in the second metal layer. The first plurality of fingers extend in a first direction parallel to a top surface of the substrate and are electrically coupled to the first bus. The second plurality of fingers extend in the first direction and are electrically coupled to the second bus. The third plurality of fingers extend in a second direction parallel to the top surface of the substrate and are electrically coupled to the first bus. The second direction is different from the first direction. The fourth plurality of fingers extend in the second direction and are electrically coupled to the second bus.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: November 24, 2020
    Assignee: XILINX, INC.
    Inventors: Jing Jing, Shuxian Wu, Parag Upadhyaya
  • Patent number: 10847321
    Abstract: A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Hyung Soon Kwon, Ji Hong Jo
  • Patent number: 10843972
    Abstract: A ceramic electronic device includes: a ceramic body that has a first face and a second face facing with the first face and has an internal electrode layer inside thereof; a pair of external electrodes that cover the first face and the second face; and a spot that is formed on a third face of the ceramic body that is different from the first face and the second face and is an amorphous phase including Ba, Si and O.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: November 24, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Kazumi Kaneda
  • Patent number: 10840498
    Abstract: Disclosed is a secondary battery, which can minimize occurrence of a short-circuit between a cap plate and an electrode assembly while maximizing the size of an electrolyte injection hole of an inner case. The secondary battery includes at least one electrode assembly, an insulating inner case accommodating the electrode assembly, an outer case accommodating the electrode assembly and the inner case, and a cap plate sealing an opening of the outer case, wherein the inner case has a top surface corresponding to the cap plate and an injection hole for electrolyte injection located in the top surface.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: November 17, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Minhyung Guen
  • Patent number: 10840211
    Abstract: A packaged semiconductor device includes at least one semiconductor die having circuitry with circuit nodes coupled to bond pads that have bonding features thereon. A plurality of leads or lead terminals include at least metal bars, wherein the plurality of leads or lead terminals are exclusive of any saw marks. The semiconductor die is flipchip attached with a bonded connection between respective bonding features and respective leads or lead terminals.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: November 17, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bradley Andrew Glasscock, Michael Todd Wyant, Christopher Daniel Manack
  • Patent number: 10832869
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: November 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Do Young Jeong, Dong Hwi Shin, Sang Soo Park, Woo Chul Shin
  • Patent number: 10804016
    Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: October 13, 2020
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
  • Patent number: 10796851
    Abstract: A capacitor component includes a body including a plurality of dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the body and connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, cover portions disposed above and below the capacitance forming portion, respectively, and margin portions disposed on both side surfaces of the capacitance forming portion, respectively. At least one selected from the cover portions and the margin portions includes a plurality of graphene platelets.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Du Won Choi, Ji Hong Jo, Seok Kyoon Woo, Hae Suk Chung
  • Patent number: 10790089
    Abstract: A stacked capacitor includes a laminate; first to fourth external electrodes; a first capacitor portion, a second capacitor portion, and a third capacitor portion which are arrayed in the laminate from a first surface toward a second surface along a laminating direction. The first capacitor portion and the third capacitor portion each have a capacitance larger than that of the second capacitor portion. Inductor components of the first capacitor portion and the third capacitor portion are different in physical length from each other and are connected in parallel between the first external electrode disposed on a first end surface and the third external electrode disposed on a first side surface and between the first external electrode and the fourth external electrode disposed on a second side surface.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: September 29, 2020
    Assignee: Kyocera Corporation
    Inventor: Takafumi Nogi
  • Patent number: 10777357
    Abstract: A multilayer capacitor includes a capacitor body including an active region, and upper and lower cover regions; and first and second external electrodes. The active region includes first and second internal electrodes exposed through the third and fourth surfaces of the capacitor body; and first and second auxiliary electrodes spaced apart from the first and second internal electrodes and exposed through the fourth and third surfaces of the capacitor body, respectively. The upper and lower cover regions each include at least one dummy electrode. A first margin portion between the first internal electrode and the first auxiliary electrode and a second margin portion between the second internal electrode and the second auxiliary electrode are located in a position deviating from ends of the first and second band portions in a first direction from the third surface to the fourth surface of the capacitor body.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Do Young Jeong, Do Yeon Kim
  • Patent number: 10770235
    Abstract: A multilayer capacitor in which acoustic noise is reduced has an area of overlap between internal electrodes in an active region of a lower portion of a capacitor body that is smaller than an area of overlap between internal electrodes in an active region of an upper portion of the capacitor body. The multilayer capacitor can be bonded to a board by relatively small solders such that the lower portion is adjacent the board. Deviations between areas of overlap of adjacent internal electrodes in the upper and lower portions of the active region are minimized to reduce piezoelectric deformation of the capacitor body.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Young Ghyu Ahn, Heung Kil Park, Soo Hwan Son
  • Patent number: 10755856
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: August 25, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Yeon Kim, Je Jung Kim, Do Young Jeong
  • Patent number: 10741485
    Abstract: A nanostructure energy storage device comprising: at least a first plurality of conductive nanostructures provided on an electrically insulating surface portion of a substrate; a conduction controlling material embedding each nanostructure in said first plurality of conductive nanostructures; a first electrode connected to each nanostructure in said first plurality of nanostructures; and a second electrode separated from each nanostructure in said first plurality of nanostructures by said conduction controlling material, wherein said first electrode and said second electrode are configured to allow electrical connection of said nanostructure energy storage device to an integrated circuit.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: August 11, 2020
    Assignee: SMOLTEK AB
    Inventors: M Shafiqul Kabir, Anders Johansson, Muhammad Amin Saleem, Peter Enoksson, Vincent Desmaris, Rickard Andersson
  • Patent number: 10699849
    Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping each other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the cross-section is greater than 27%.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeong Ju Choe, Min Woo Kim, Eun Jung Lee, Ki Pyo Hong
  • Patent number: 10692654
    Abstract: A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Hyung Soon Kwon, Ji Hong Jo
  • Patent number: 10692967
    Abstract: A self-routing capacitor for an integrated circuit having: a first electrode comprising a first base region and a first finger, the first finger extending from a wall of the first base region in a first direction; a second electrode comprising a second base region and a second finger; the second finger extending from a wall of the second base region in a second direction substantially parallel to and opposing the first direction, the second finger coupled to the first finger; a third electrode comprising a third base region and a third finger, the third finger extending from a first wall of the third base in the second direction; and a fourth electrode comprising a fourth finger, the fourth finger extending from a second wall of the third base region in the first direction. The capacitor being coupled to other metal layers through a base region of an electrode.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: June 23, 2020
    Assignee: Analog Devices, Inc.
    Inventors: Baozhen Chen, Lalinda D. Fernando, Micah Galletta O'Halloran, Andrew Wayne Shaw
  • Patent number: 10687420
    Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: June 16, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean Audet, Edmund D. Blackshear, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada
  • Patent number: 10685783
    Abstract: An alternating current power capacitor including one or more capacitor bodies (e.g., bobbins) having conductive and dielectric film windings, wherein edges of the conductive film windings define a plane forming at least one capacitor body contact surface, one or more electrodes having one or more electrode contact surfaces and a housing operative to apply compressive force that binds the capacitor body and electrode together so as to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: June 16, 2020
    Assignee: CELEM PASSIVE COMPONENTS LTD
    Inventors: Benjamin Jakoubovitch, Anat Jakoubovitch
  • Patent number: 10658098
    Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 19, 2020
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
  • Patent number: 10658119
    Abstract: A power capacitor including: a casing, a first bushing, a second bushing or an earthing stud having the same electric potential as the casing, wherein the first and second bushing extend through the casing, a dielectric liquid, and a plurality of wound capacitor elements, each wound capacitor element including: a first electrode having two first layers of electrically conducting material connected to the first bushing, the two first layers being arranged movable towards and from each other, a second electrode having two second layers of electrically conducting material connected to the second bushing or to the earthing stud, the two second layers being arranged movable towards and from each other, and a dielectric layer arranged between the first electrode and the second electrode, wherein the two first layers, the two second layers and the dielectric layer are together wound in a plurality of turns to obtain a plurality of layers of the first electrode, of the second electrode and of the dielectric layer, wh
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 19, 2020
    Assignee: ABB Schweiz AG
    Inventor: Felix Bandalo
  • Patent number: 10650965
    Abstract: A film capacitor includes a main body portion including a dielectric film and a metal film; and external electrodes, and the external electrodes are disposed at a pair of main body ends in a first direction of the main body portion, respectively. The metal film includes a first portion connected to one of the external electrodes which is disposed at one of the main body ends, a second portion disposed at the other main body end, and a third portion disposed between the first portion and the second portion in the first direction, and a film thickness of the third portion is smaller than a film thickness of the second portion.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: May 12, 2020
    Assignee: KYOCERA Corporation
    Inventor: Naoki Kikuchi
  • Patent number: 10643793
    Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Soon Kwon, Kyoung Jin Cha, Ji Hong Jo
  • Patent number: 10629378
    Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Pil Lee, Jin Kyung Joo, Young Key Kim, Taek Jung Lee
  • Patent number: 10629374
    Abstract: A composite electronic component includes a composite body including: a multilayer ceramic capacitor including a first ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween and stacked to be perpendicular to a lower surface of the first ceramic body, and a ceramic chip being coupled to the multilayer ceramic capacitor and disposed on a lower portion of the multilayer ceramic capacitor, the ceramic chip including a second ceramic body, first and second terminal electrodes disposed on upper and lower portions of the second ceramic body and connected to the first and second external electrodes, respectively.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan Son, Young Ghyu Ahn, Man Su Byun
  • Patent number: 10629377
    Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Soon Kwon, Kyoung Jin Cha, Ji Hong Jo
  • Patent number: 10622155
    Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping each other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the cross-section is greater than 27%.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: April 14, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeong Ju Choe, Min Woo Kim, Eun Jung Lee, Ki Pyo Hong
  • Patent number: 10614946
    Abstract: An electronic component includes a body and a pair of terminal electrodes. The body has a pair of end faces opposing each other in a first direction, a pair of main faces opposing each other in a second direction, and a pair of side faces opposing each other in a third direction. One of the main faces serves as a mounting face. A clearance in the first direction between an end edge of a conductive resin layer and the end edge of a base metal layer at an end portion of the one of the main faces in the third direction is longer than a clearance in the first direction between the end edge of the conductive resin layer and the end edge of the base metal layer at a central portion of the one of the main faces in the third direction.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: April 7, 2020
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Junichi Otsuka, Tsutomu Ono, Hidekazu Sato
  • Patent number: 10600567
    Abstract: A multilayer ceramic capacitor includes a capacitor body and first to fourth outer connectors. The capacitor body includes dielectric layers and conductor layers, first and second principal surfaces facing each other in a height direction, first and second side surfaces facing each other in a length direction, and third and fourth side surfaces facing each other in a width direction. The first to fourth outer connectors cover portions of the first to fourth side surfaces, respectively. In a case where L0, W0, and H0 are maximum external dimensions of the multilayer ceramic capacitor in the length direction, the width direction, and the height direction, respectively, L0, W0, and H0 satisfy a condition of about 2.67?L0/H0 and a condition of about 1/1.72?L0/W0?about 1.72.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yasuo Fujii
  • Patent number: 10593479
    Abstract: In an exemplary embodiment, each of external electrodes 12 of a multilayer ceramic capacitor 10 continuously has a first planar part 12a present on each end face of a capacitor body 11 in a first direction d1, a second planar part 12b present on one end face of the capacitor body 11 in a third direction d3, and auxiliary planar parts 12c present on both end faces of the capacitor body 11 in a second direction d2. A maximum third-direction dimension D3 [12c] of each of the auxiliary planar parts 12c is smaller than a third-direction dimension D3 [12a] of the first planar part 12a, while a first-direction dimension D1 [12c] of each of the auxiliary planar parts 12c is smaller than a first-direction dimension D1 [12b] of the second planar part 12b.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: March 17, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takashi Sasaki
  • Patent number: 10593473
    Abstract: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Cheol Park, Kyo Kwang Lee, Young Ghyu Ahn, Hyun Tae Kim, Sang Soo Park
  • Patent number: 10580583
    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gwang Hyeon Park, Jang Yeol Lee, Yong Park, Hye Young Choi, Jong Ho Lee, Ji Hong Jo
  • Patent number: 10546681
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: January 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Kyung Seop Lee, Yong Un Choi, Kyung Min Son
  • Patent number: 10529491
    Abstract: A multilayer ceramic electronic component includes a ceramic body having at least one rounded corner, and including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, and first and second external electrodes, electrically connected to corresponding internal electrodes, respectively. The first and second external electrodes include first and second base electrode layers, each having at least a portion in contact with first and second external surfaces of the ceramic body, first and second conductive resin layers disposed to cover the first and second base electrode layers, respectively, and first and second plating layers disposed to cover the first and second conductive resin layers, respectively.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: January 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Min Hyang Kim
  • Patent number: 10529975
    Abstract: One embodiment includes forming surface-modifying phases on a surface of a functional electrode via atomic layer deposition and controlling the chemistry of constituent phases, the crystalline nature of the constituent phases and the thickness of the surface-modifying phase via the atomic layer deposition such that the thickness is between about 2 nm to about 200 nm. The surface-modifying phases enhances the performance of electrocatalytic activity of the functional electrode and the device.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: January 7, 2020
    Assignee: West Virginia University
    Inventors: Xueyan Song, Yun Chen, Kirk Gerdes, Shiwoo Lee
  • Patent number: 10510492
    Abstract: Monolithic capacitor structures having a main capacitor and a vise capacitor are discussed. The vise capacitor provides to the monolithic capacitor structure reduced vibrations and/or acoustic noise due to piezoelectric effects. To that end, vise capacitor may cause piezoelectric deformations that compensate the deformations that are caused by the electrical signals in the main capacitor. Embodiments of these capacitor structures may have the main capacitor and the vise capacitor sharing portions of a rigid dielectric. Electrical circuitry that employs the vise capacitor to reduce noise and/or vibration in the monolithic capacitor structures is also described. Methods for fabrication of these capacitors are discussed as well.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: December 17, 2019
    Assignee: APPLE INC.
    Inventors: Ming Y. Tsai, Albert Wang, Curtis C. Mead, Tyler S. Bushnell, Paul A. Martinez
  • Patent number: 10497513
    Abstract: There is provided a ceramic electronic component including: a ceramic chip having a first surface, a second surface facing the first surface, and a third surface connecting the first surface to the second surface; a first electrode unit disposed on the first surface; a second electrode unit disposed on the second surface apart from the first electrode unit; and a modified zone disposed on the third surface, and modified by irradiation of a high energy beam.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: December 3, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuji Tomizawa, Yasutomo Suga
  • Patent number: 10490332
    Abstract: An inductor includes a body having a coil portion disposed therein, and a protective layer disposed on a surface of the body. The body includes an active portion in which a coil portion is disposed, and a cover portion disposed on upper and lower surfaces of the coil portion. A grain size in the protective layer is greater than a grain size in the body.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: November 26, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seong Kim, Jae Hyun Kwon
  • Patent number: 10468195
    Abstract: A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
  • Patent number: 10468185
    Abstract: A multilayer ceramic capacitor includes a capacitor body including a plurality of first to third internal electrodes. The first internal electrodes have opposing ends exposed at third and fourth surfaces of the capacitor body. The second internal electrodes have a portion exposed at either of fifth or sixth surfaces of the capacitor body. The third internal electrodes have portions respectively exposed at the fifth and sixth surfaces. First and second external electrodes are on the third and fourth surfaces, respectively, and are connected to the first internal electrodes. Third and fourth external electrodes are on the fifth and sixth surfaces, respectively, and are connected to the second and third internal electrodes.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Beom Seock Oh, Jin Yung Ryu, Young Ghyu Ahn, Jae Yeol Choi
  • Patent number: 10461040
    Abstract: Capacitor devices having multiple capacitors with similar nominal capacitances are described. The capacitors may be multilayer ceramic capacitors (MLCCs) and may be fabricated employing class 2 materials. The arrangement of the electrodes in the device may reduce relative variations between the capacitors of the device. The capacitor devices may be allow high performance and compact electrical circuits that may employ matched capacitors.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: October 29, 2019
    Assignee: APPLE INC.
    Inventors: Paul A. Martinez, Ming Y. Tsai, Won Seop Choi