Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers, internal electrode layers, and first and second end surfaces facing each other in a length direction, a first external electrode on a side of the first end surface, and a second external electrode on a side of the second end surface. The first and second external electrodes each include lower and upper electrode layers, the lower electrode layers include a metal component and a glass component, the upper electrode layers include a metal component and a glass component, and include pores, an amount of the glass component in the upper electrode layers is less than an amount of the glass component in the lower electrode layers, and a maximum inscribed circle diameter of the pores in the upper electrode layers is greater than or equal to about 0.02 ?m and less than or equal to about 0.52 ?m.

Abstract: A multilayer ceramic capacitor includes a multilayer body including ceramic layers, internal electrodes and a pair of side surfaces, and side margin portions, wherein each of ceramic layers and the side margin portions is composed of a polycrystalline body having a perovskite structure, wherein the side margin portions contain at least one of calcium and strontium, when the side margin portions contain calcium, an atomic ratio of the calcium to titanium in the side margin portions is greater than that in the ceramic layers, and when the side margin portions contains strontium, the atomic ratio of the strontium to titanium in the side margin portions is greater than that in the ceramic layers, wherein glass particles composed of silicon as a main component are dispersed in the polycrystalline body, and an atomic ratio of silicon to titanium is 1 at % or more and 10 at % or less.

Abstract: A multilayer electronic component includes: a body and an external electrode disposed on the body, wherein the external electrode includes a conductive resin layer containing a bisphenol A-based resin and a biphenyl-based resin with a specific mixing ratio (e.g., a ratio of a content of the biphenyl-based resin with respect to a total content is 10 wt % or more and 50 wt % or less). Such a resin mixing ratio between the bisphenol A-based resin and the biphenyl-based resin can lead to 0.337?2*C/A?0.367 or 0.048?B/A?0.14, with an aromatic ring peak intensity (A), a carbonyl peak intensity (B), and an alcohol peak intensity (C) in a Fourier transform infrared spectroscopy (FT-IR) analysis. The multilayer electronic component showing such peak intensity characteristics can suppress oxidation of a conductive resin layer while also securing excellent adhesive strength of the conductive resin layer.

Abstract: Composite carbon particles including a porous carbon material and a silicon component, the composite carbon particle having an average aspect ratio of 1.25 or less, and a ratio (ISi/IG) of a peak intensity (ISi) in the vicinity of 470 cm?1 to a peak intensity (IG) in the vicinity of 1580 cm?1 as measured by Raman spectroscopy of 0.30 or less, wherein the porous carbon material satisfies V1/V0>0.80 and V2/V0<0.10, when a total pore volume at a maximum value of a relative pressure P/P0 is defined as V0 and P0 is a saturated vapor pressure, a cumulative pore volume at a relative pressure P/P0=0.1 is defined as V1, a cumulative pore volume at a relative pressure P/P0=10?7 is defined as V2 in a nitrogen adsorption test, and has a BET specific surface area of 800 m2/g or more.

Abstract: A multilayer capacitor includes: a body including a multilayer structure in which one or more first internal electrodes and one or more second internal electrodes are alternately stacked in a first direction with one or more dielectric layers interposed therebetween; and first and second external electrodes disposed on the body and spaced apart from each other to be connected to the first internal electrodes and the second internal electrodes, respectively. The body further includes: a plurality of side margin layers with the multilayer structure interposed therebetween in a second direction, perpendicular to the first direction; and one or more edge margin portions for providing a margin between an edge of at least one of the side margin layers in a third direction and the multilayer structure, and between an edge of at least one of the side margin layers in the first direction and the multilayer structure.

Abstract: An electrolytic capacitor that includes a cuboidal resin molding including a first end surface, a second end surface, a laminate of capacitor elements each including an anode and a cathode opposite to the anode, and a sealing resin sealing the laminate; a first external electrode on the first end surface of the resin molding and electrically connected to the anode exposed at the first end surface; and a second external electrode on the second end surface of the resin molding and electrically connected to the cathode exposed at the second end surface, wherein the first external electrode includes, sequentially from a side thereof adjacent to the first end surface of the resin molding, a first thermal spraying electrode layer and a second thermal spraying electrode layer in contact with the first thermal spraying electrode layer and having a higher porosity than the first thermal spraying electrode layer.

Abstract: In a multilayer capacitor, when a width of a element body in a facing direction of a pair of side surfaces is W, and a distance from a start position of a curved shape of the element body on the side surface side in a plane of a first internal electrode of an outermost layer to a virtual surface including the side surface when viewed from the facing direction of a pair of end surfaces is Rw, We/4?X<W?2×Rw is satisfied.

Abstract: A multilayer capacitor includes a laminate having a first side surface and a second side surface, a first side covering portion covering the first side surface, and a second side covering portion covering the second side surface. The laminate includes first conductor layers, second conductor layers, dielectric layers and insulating layers laminated in the z direction. Each first conductor layer is connected to the first side covering portion and spaced apart from the second side covering portion. Each second conductor layer is connected to the second side covering portion and spaced apart from the first side covering portion. The insulating layers have a lower dielectric strength than the dielectric layers. Each dielectric layer is sandwiched between a first conductor layer and a second conductor layer. The insulating layers include one sandwiched between two first conductor layers and one sandwiched between two second conductor layers.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein 0.46 to 1.08 at % is a range of an indium (In) content compared to nickel (Ni) and indium (In) contents in a surface layer portion of the internal electrode.

Abstract: A multilayer electrical component including a plurality of parallel plate electrodes embedded in a dielectric body between first and second conductive terminations is disclosed. The dielectric body and the plurality of parallel plate electrodes form a plurality of capacitive layers each comprising a series of capacitors between the first and second conductive terminations. Each capacitor of the capacitive layers is partly defined by a gap in one of the parallel plate electrodes, wherein a gap of the one capacitive layer is laterally offset relative to a gap of an adjacent capacitive layer and a total capacitance of the adjacent capacitive layers is equivalent.

Abstract: A capacitor includes a bus bar. The bus bar includes a bus bar body member and a terminal formation member configured to be superposed on and fixed to a terminal formation part of the bus bar body member. In the terminal formation part, a plurality of first connection terminal parts are formed so as to be arranged in one direction, by portions of the terminal formation part being cut and raised. In the terminal formation member, a plurality of second connection terminal parts are formed so as to be arranged in one direction, by portions of the terminal formation member being cut and raised, and second openings are formed in places where the portions have been cut and raised. The first connection terminal parts and the second connection terminal parts are alternately arranged in one direction, by the first connection terminal parts being passed through the second openings.

Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

Abstract: A capacitor includes a silicon substrate, a conductor layer, and a dielectric layer. The silicon substrate has a principal surface including a capacitance generation region and a non-capacitance generation region. The silicon substrate includes a porous part provided in a thickness direction in the capacitance generation region. The conductor layer includes a surface layer part at least covering part of a surface of the capacitance generation region and a filling part filled in at least part of the porous part. The dielectric layer is provided between an inner surface of the porous part and the filling part. The porous part includes a macroporous part having macro pores and a nanoporous part formed in at least part of inner surfaces of the macro pores and having nano pores smaller than the macro pores.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and first and internal electrodes disposed to be stacked with the dielectric layer interposed therebetween; a first and a second external electrode disposed on the ceramic body. The first and the second external electrodes may include a first and a second base electrode layers disposed in contact with the ceramic body and a first and a second resin electrode layers disposed on the first and the second base electrode layer respectively, a width of the ceramic body in the second direction may be less than 1.0 mm, and 0.4×ta?tb?0.5×ta in which ta is an average thickness of the first base electrode layer and tb is an average thickness of the first resin electrode layer.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, a plurality of external electrodes, an active region including a plurality of internal electrodes, and an additional electrode region including a plurality of additional electrode layers. The plurality of additional electrode layers are connected to an external electrode, among the plurality of external electrodes, different from an external electrode which a most adjacent internal electrode among the plurality of internal electrodes of the active region is connected to, and 1<d/e?5 in which e is a distance between adjacent internal electrodes among the plurality of internal electrodes and d is a distance between an internal electrode, among the plurality of internal electrodes, and an additional electrode layer, among the plurality of additional electrode layers of the additional electrode region, which are most adjacent to each other.

Abstract: An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.

Abstract: A multilayer ceramic electronic device includes a ceramic functional part having a generally rectangular shape in which a plurality of ceramic dielectric layers and a plurality of internal electrodes are laminated alternately in a vertical direction; a pair of cover parts that cover the functional part from top and bottom, respectively; and a pair of side margin parts covering side surfaces of the functional part, respectively, wherein an end portion of an uppermost internal electrode among the plurality of internal electrodes is curved downward to satisfy a?1 ?m and 0.1?a/b?0.4, where a is a dimension of the curved end portion in the vertical direction in a cross section taken along a plane perpendicular to the side surfaces, and b is a dimension of the curved end portion in a horizontal direction in said cross section.

Abstract: A method of forming a capacitor structure includes following operations. A first electrode is formed. A hafnium-zirconium oxide (HZO) layer is formed over the first electrode under a first temperature. An interface dielectric layer is formed over the HZO layer under a second temperature greater than the first temperature. A second electrode is formed over the interface dielectric layer. The HZO layer and the interface dielectric layer are annealed.

Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 ?m or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

Abstract: A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer structure opposite to each other, wherein x/y is 0.143 or less where x represents an average concentration of hydrogen in ppm in a capacitance section where the internal electrode layers exposed to one of the two edge faces and the internal electrode layers exposed to the other of the two edge faces are opposed to each other, as measured by secondary ion mass spectrometry (SIMS), and y represents an average concentration of titanium in ppm in the capacitance section, as measured by SIMS at the same time of measuring the average concentration of hydrogen.

Abstract: A multilayer capacitor includes: a capacitor body including first and second dielectric layers, internal electrodes, and including first to six surfaces; first and second external electrodes disposed on the third and fourth surfaces, respectively; and third and fourth external electrodes disposed on the fifth and sixth surfaces, respectively. The internal electrodes include: first internal electrode disposed on the first dielectric layer, having both ends connected to the first and second external electrodes, respectively, and having a hole; a second internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode and be connected to the third external electrode; and a third internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode, be spaced apart from the second internal electrode, and be connected to the fourth external electrode.

Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, first and second external electrodes provided on respective opposing end surfaces, and third and fourth external electrodes provided on any side surface. The internal electrode layers include first and second internal electrode layers connected to the first and second external electrodes, respectively, and third and fourth internal electrode layers connected to the third and fourth external electrodes, respectively. The third internal electrode layer is provided at a distance from the first internal electrode layer, and the fourth internal electrode layer is provided at a distance from the second internal electrode layer.

Abstract: A three-terminal multilayer ceramic capacitor includes a capacitor including a ceramic layer, first and second internal electrodes, first and second end surface electrodes, and first and second side surface electrodes, and has a lengthwise dimension of about 1300 ?m or more and about 1500 ?m or less, a widthwise dimension of about 1000 ?m or more and about 1200 ?m or less, a heightwise dimension of about 570 ?m or more and about 680 ?m or less, and a capacitance of about 12 ?F or more and about 32 ?F or less. The first and second end surface electrodes, and the first and second side surface electrodes include a Ni underlying electrode layer and at least one plating electrode layer. The first and second end surface electrodes have a thickness of about 0.73% or more and about 3.00% or less relative to the lengthwise dimension.

Abstract: A secondary battery made by laminating a separator layer and a second electrode to insides of a plurality of through holes of a first electrode, the first electrode having one face, an opposite face, a side face, and the through holes that penetrate from the one face to the opposite face, makes it possible to stably collect currents for the second electrode, and gives good cycle characteristics as a secondary battery.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body.

Abstract: A capacitor component includes a laminate including dielectric layers and internal electrode layers, first and second external electrodes respectively provided on first and second end surfaces of the laminate, and a third external electrode provided on at least one of first and second lateral surfaces of the laminate. The internal electrode layers include a first internal electrode layer connected to the first external electrode and not connected to either the second or the third external electrode; a second internal electrode layer connected to the second external electrode and not connected to either the first or the third external electrode; a third internal electrode layer not connected to any of the first, the second, or the third external electrode; and a fourth internal electrode layer connected to the third external electrode and not connected to either the first or the second external electrode.

Abstract: By controlling shapes of internal electrodes, when short-circuit occurs between the internal electrodes, a short-circuited portion may be opened by an overcurrent, to serve as a fuse. Also, by controlling shapes of internal electrodes, equivalent series inductance (ESL) at a high frequency may be reduced.

Abstract: A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m3 or more, or the dielectric resin film has a storage elastic modulus at 125° C. of 1.1 GPa or more.

Abstract: A multilayer capacitor may include a monolithic body including a plurality of dielectric layers. A first external terminal may be disposed along a first end, and a second external terminal may be disposed along a second end of the capacitor. The external terminals may include respective bottom portions that extend along a bottom surface of the capacitor. The bottom portions of the external terminals may be spaced apart by a bottom external terminal spacing distance. A bottom shield electrode may be arranged within the monolithic body between a plurality of active electrodes and the bottom surface of the capacitor. The bottom shield electrode may be spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance that may range from about 3 microns to about 100 microns. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be less than about 4.

Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.

Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.

Abstract: A multilayer ceramic capacitor includes a laminate including ceramic layers and internal electrode layers arranged in a stacking direction, and two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed. The laminate has a rectangular parallelepiped configuration or shape and includes two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces. On at least one of the four surfaces, the laminate includes a protrusion in which the exposure region protrudes outward.

Abstract: A film capacitor includes a main body portion. A dielectric film of the main body portion includes an insulation margin in a first direction. A first metal film and a second metal film are each separated by first slits which each includes a first end which is at an angle of ?1 to the second side face, and second slits. The second slit is connected at a contact point to the first slit, and includes a second end which is located on a negative side in the first direction relative to the contact point. The second end is positioned in alignment with a first end of a first slit which is continuous with the second slit adjacent thereto on the negative side in the first direction. A value of tan (?1) is in a range of 0.15 or more and 0.35 or less.

Abstract: A coil component includes a magnetic body portion that includes metallic particles and a resin material, a coil conductor that is embedded in the magnetic body portion, and a first outer electrode and a second outer electrode each of which is electrically connected to the coil conductor. At least a portion of an outer layer of the magnetic body portion forms an electrically conductive layer that includes a second metallic material having a specific resistance lower than a specific resistance of a first metallic material forming the metallic particles. The electrically conductive layer includes a first electrically conductive layer that is electrically connected to the first outer electrode and a second electrically conductive layer that is electrically connected to the second outer electrode. The first electrically conductive layer and the second electrically conductive layer are electrically isolated from each other.

Abstract: A ceramic electronic device including a ceramic body having ceramic layers and internal electrode layers stacked in alternating manner and a terminal electrode formed at an end face of the ceramic body. The terminal electrode includes a base electrode including a metal component and a glass component, an intermediate electrode layer including Ni and formed at an outer face of the base electrode layer, and an upper electrode layer including Pd or Au and formed at an outer face of the intermediate electrode layer. Also, a surface roughness Ra1 of the base electrode layer in the terminal electrode is 5.0 ?m or less; or the surface roughness Ra1 of the base electrode layer, a surface roughness Ra2 of the intermediate electrode layer, and a surface roughness Ra3 of the upper electrode layer satisfy a relationship of Ra1>Ra3?Ra2.

Abstract: A multilayer ceramic capacitor includes a laminate including a plurality of dielectric layers laminated one on the other, the laminate being in a cuboid or substantially cuboid shape. The multilayer ceramic capacitor includes external electrodes on the end surfaces of the laminate. A first inner electrode layer exposed through the first end surface and a second inner electrode layer exposed through the second end surface are provided on the dielectric layer. A first region and a second region are defined in the first inner electrode layer and the second inner electrode layer, in which coverages of the first inner electrode layer and the second inner electrode layer to the dielectric layer are greater in the first region than in the second region.

Abstract: A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

Abstract: A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

Abstract: An electronic component includes a laminate including internal electrodes alternately laminated in a lamination direction with dielectric layers interposed therebetween. The laminate includes main surfaces opposite to each other in the lamination direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction, and external electrodes provided on surfaces of the laminate and electrically connected to the internal electrodes. Each of the dielectric layers includes Ti and Mg. When a cross section including the length direction and the width direction of the laminate is viewed from the lamination direction, side margin portions in which the internal electrodes do not exist each include a dielectric including Ti and Mg with a molar ratio in each of the side margin portions smaller than a molar ratio of Mg to Ti included in each of the dielectric layers.

Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 ?m or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

Abstract: A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

Abstract: A ceramic electronic component includes a pair of electrodes facing each other and a dielectric layer disposed between the pair of electrodes and including a plurality of ceramic nanosheets, where the plurality of ceramic nanosheets has a multimodal lateral size distribution expressed by at least two separated peaks, a method of manufacturing the same, and an electronic device including the ceramic electronic component.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.