Abstract: A capacitor having improved tolerance to humidity. The capacitor includes a packaging material and/or a dielectric material comprising a film having a water vapor transmission rate significantly lower than the dielectric films and/or packaging films used in conventional capacitors.

Abstract: Methods of manufacturing metal-insulator-metal capacitor structures, and the metal-insulator-metal capacitor structures obtained, are disclosed. In one embodiment, a method includes providing a substrate, forming on the substrate a first metal layer comprising a first metal, and using atomic layer deposition with an H2O oxidant to deposit on the first metal layer a protective layer comprising TiO2. The method further includes using atomic layer deposition with an O3 oxidant to deposit on the protective layer a dielectric layer of a dielectric material, and forming on the dielectric layer a second metal layer comprising a second metal. In another embodiment, a metal-insulator-metal capacitor includes a bottom electrode comprising a first metal, a protective layer deposited on the bottom electrode and comprising TiO2, a dielectric layer deposited on the protective layer and comprising a dielectric material, and a top electrode formed on the dielectric layer and comprising a second metal.

Abstract: An integrated capacitive device includes an electrically conducting comb, at least some of whose teeth form first electrodes of capacitors, and electrically conducting fingers extending between the teeth of the comb so as to form second electrodes of the capacitors. The device includes a first finger-teeth set having a single reference finger forming a reference capacitor having a reference capacitive value, at least one second finger-teeth set including several fingers, the reference finger and the number of fingers of the second finger-teeth set or sets forming a geometric series with ratio two. At least one additional set includes a single additional finger forming, with at least one tooth of the comb, an additional capacitor having an additional capacitive value substantially equal to half the reference capacitive value.

Abstract: There is provided a multi-layered ceramic capacitor having a dual layer-electrode structure formed by applying a dual layer of electrode paste to the multi-layered ceramic capacitor. The multi-layered ceramic capacitor having a dual layer-electrode structure includes a capacitor body having a preset length and width and having a plurality dielectric layers stacked therein, an internal electrode unit formed on the plurality of dielectric layers and having a preset capacitance, and an external electrode unit including first external electrodes respectively formed on both sides of the capacitor body to be electrically connected to internal electrodes, and second external electrodes formed on the first external electrodes.

Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic including: a ceramic body; and a plurality of internal electrodes laminated within the ceramic body, wherein, when T1 is the greatest distance between an upper outermost internal electrode and a lower outermost internal electrode among the plurality of internal electrodes and T2 is the distance between the highest point and the lowest point in each of the upper outermost internal electrode and the lower outermost internal electrode in a thickness direction of the ceramic body, T2/T1<0.05 is satisfied, and thus, defects in alignment of internal electrodes of the multilayer ceramic electronic component may be suppressed.

Abstract: An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.

Abstract: A thin film capacitor includes a lower electrode layer, a dielectric layer that is provided on said lower electrode layer, and an upper electrode layer that is formed on the dielectric layer. Wherein, the lower electrode layer contains at least a Ni electrode layer, the upper electrode layer configured with at least two layers of a Ni electrode layer and a Cu electrode layer, and the dielectric layer is in contact with both the Ni electrode layer of the lower electrode layer and the Ni electrode layer of the upper electrode layer.

Abstract: This invention relates generally to capacitors comprising organized assemblies of carbon and non-carbon compounds. This invention further relates to methods of making such organized structures. It also relates to devices containing such structures. In preferred embodiments, the organized structures of the instant invention take the form of nanorods or their aggregate forms. More preferably, a nanorod is made up of a carbon nanotube filled, coated, or both filled and coated by a non-carbon material. In particular, the present invention is directed to a capacitor electrode comprising a carbon nanotube filled with one or more non-carbon materials comprising titanium, a titanium compound, manganese, a manganese compound, cobalt, nickel, palladium, platinum, bromine, iodine, an interhalogen compound, or the combination thereof.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including respective lead-out portions exposed to a first surface of the ceramic body and a third or fourth surface thereof connected to the first surface and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; first and second external electrodes extended from the first surface of the ceramic body to the third or fourth surface thereof connected to the first surface and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and the third and fourth surfaces thereof connected to the first surface.

Abstract: The invention is directed to a process for making a dielectric ceramic film capacitor and the ceramic dielectric laminated capacitor formed therefrom, the dielectric ceramic film capacitors having increased dielectric breakdown strength. The invention increases breakdown strength by embedding a conductive oxide layer between electrode layers within the dielectric layer of the capacitors. The conductive oxide layer redistributes and dissipates charge, thus mitigating charge concentration and micro fractures formed within the dielectric by electric fields.

Abstract: The present invention features an energy storage device and methods of storing electromagnetic energy that take advantage of the resonance transfer of energy in a dielectric matrix placed between two oppositely charged electrodes and subjected to a high voltage bias. Electromagnetic energy is stored in high-quality cavities in coated semiconducting nanoparticles.

Abstract: In a ceramic electronic component, a section of a first extraction section located closer to a first end surface defines a first thick section. The first thick section is at least about 1.5 times as thick as a first central section of a first opposed section in a direction. The length of the first thick section is within the range of about ¼ to about ¾ of a distance from a tip of a second opposed section closer to the first end surface, to the first end surface in the direction.

Abstract: A multilayer ceramic capacitor includes a multilayer body including a plurality of laminated dielectric layers and a plurality of internal electrodes arranged along interfaces between the dielectric layers, and a plurality of external electrodes located on an outer surface of the multilayer body and electrically connected to the internal electrodes. A main component of the internal electrodes is Ni, and the internal electrodes also contain Sn.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic capacitor having the same, and a fabrication method thereof. The conductive paste composition for an internal electrode includes a binder, a solvent, and metal powder for an internal electrode, including a nickel particle coated with a nickel nitride.

Abstract: A conductive structure, including an adhesion layer and a conductor in contact with the adhesion layer and having a thickness of less than six hundred Angstroms. The present invention may be used to form a capacitor, including an adhesion layer, a first conductor in contact with the adhesion layer and having a thickness of less than six hundred Angstroms, a second conductor, and a dielectric between the first and second conductors. The present invention is also directed towards structures wherein iridium or rhodium may be used in place of the combination of the adhesion layer and conductor.

Abstract: A clad capacitor and method of manufacture includes assembling a preform comprising a ductile, electrically conductive fiber; a ductile, electrically insulating cladding positioned on the fiber; and a ductile, electrically conductive sleeve positioned over the cladding. One or more preforms are then bundled, heated and drawn along a longitudinal axis to decrease the diameter of the ductile components of the preform and fuse the preform into a unitized strand.

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

Abstract: Provided is a multilayer capacitor that can be manufactured with high yields and whose warpage is suppressed. The multilayer capacitor includes two or more laminated bodies which are bonded together, the two or more laminated bodies each including resin layers and metal layers which are alternately laminated a plurality of times in a thickness direction and each being warped and having front and rear surfaces covered with surface layers containing a resin material, one of the front and rear surfaces being formed of a first surface as a smooth surface having no recess portion, another of the front and rear surfaces being formed of a second surface having a recess portion, in which at least two adjacent laminated bodies are bonded together at the first surfaces or the second surfaces. Also provided are a manufacturing method for the multilayer capacitor, and a circuit board and an electronic device which use the multilayer capacitor.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

Abstract: The present invention relates to a multilayer electronic component having a structure in which a dielectric layer and an internal electrode layer are alternately laminated, which includes the dielectric layer and the internal electrode layer including metal powder and an inhibitor, wherein the inhibitor includes 0.5 to 20 mol % of a Ca component based on 100 mol % of a barium titanate (BT) base material, and a method for manufacturing the same. According to the present invention, it is possible to provide a multilayer electronic component that can implement excellent electrical characteristics and electrode connectivity by adding a Ca component to an internal electrode layer as a sub-component of the inhibitor to minimize the occurrence of oxygen vacancies on the interface formed when the inhibitor component included in the internal electrode layer moves to the dielectric layer.

Abstract: In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively.

Abstract: Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between the bottom electrode and the top electrode. The capacitor structures further include a metal oxide buffer layer interposed between the dielectric layer and at least one of the bottom and top electrodes. Each metal oxide buffer layer acts to improve capacitance and reduce capacitor leakage. The capacitors are suited for use as memory cells and apparatus incorporating such memory cells, as well as other integrated circuits.

Abstract: An electronic device includes a metal-insulator-metal capacitive device. In connection with an example embodiment, a metal-insulator-metal (MIM) capacitor device is in a substrate having a surface and a three dimensional structure with high aspect ratio sidewalls. The MIM capacitor device includes a first capacitor electrode including a platinum group metal (PGM)-based layer and a Ta-based layer that is between the PGM-based layer and one of the sidewalls. The MIM capacitor also includes a second capacitor electrode and an insulator material between the first and second electrodes.

Abstract: Metal-insulator-metal capacitors with a bottom electrode including at least two portions of a metal nitride material. At least one of the portions of the metal nitride material includes a different material than another portion. Interconnects including at least two portions of a metal nitride material are also disclosed, at least one of the portions of the metal nitride material are formed from a different material than another portion of the metal nitride material. Methods for fabricating such MIM capacitors and interconnects are also disclosed, as are semiconductor devices including such MIM capacitors and interconnects.

Abstract: A stacked film capacitor including a resin protective film having excellent durability is provided which can stably secure desired properties. The stacked film capacitor includes a capacitor element including a plurality of dielectric layers, and a plurality of vapor-deposited metal film layers. Each dielectric layer and each vapor-deposited metal film layer are stacked with each other so as to be arranged alternately. The stacked film capacitor further includes a pair of external electrodes provided on opposing side surfaces of the capacitor element, and at least one resin protective film formed on at least one side surfaces other than the side surfaces on which the external electrodes are formed, in which the at least one resin protective film is provided by deposition polymerization.

Abstract: A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.

Abstract: An apparatus including a flexible substrate of electrically insulating material, and an electrically conductive polymer, wherein the electrically conductive polymer is retained by the flexible substrate to form together at least part of an electrode of an electrical storage apparatus such that the electrically conductive polymer provides an electrical path for electrons which are generated and/or stored by the electrical storage apparatus.

Abstract: An electronic device package includes first and second electrodes of a package substrate. The first electrode has fingers formed from a first metal level and is configured to operate at a first DC potential. The second electrode has fingers formed from the first metal level interdigitated with the fingers of the first electrode. A via conductively connects the second electrode to a second metal level. The second metal level is configured to operate at a second DC potential. The first and second DC potentials are thereby capacitively coupled through the interdigitated electrodes.

Abstract: There is provided a dielectric composition, including: a base powder including BamTiO3, where 0.995?m?1.010; a first subcomponent including 0.1 to 1.0 at % (x) of an oxide or carbonate containing at least one variable-valence acceptor element based on 100 moles of the base powder; a second subcomponent including 0.01 to 3.0 at % (y) of an oxide or carbonate containing at least one fixed valence acceptor element; a third subcomponent including an oxide or carbonate containing cerium (z) at % and at least one other rare-earth element (w) at %, where 0.01?z?x+4y and 0.01?z+w?x+4y; a fourth subcomponent including at least one of an oxide or carbonate containing at least one of Barium, Calcium, Aluminum, and Silicon and glass containing silicon; and a fifth subcomponent including 0.01 to 10.0 at % of an oxide containing zirconium.

Abstract: The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side; a plurality of inner electrodes formed within the ceramic body and having respective one ends exposed to the third side and the fourth side; and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A shortest distance from distal edges of an outermost inner electrode among the plurality of inner electrodes to the first side or the second side is smaller than a shortest distance from distal edges of a central inner electrode to the first side or the second side.

Abstract: A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 ?m to about 15 ?m, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 ?m or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.

Abstract: An electronic component has an element body and an external electrode arranged on the element body. The element body has a pair of end faces opposed to each other, a pair of principal faces opposed to each other, and a pair of side faces opposed to each other. The external electrode is formed so as to cover the end face and a partial region of the principal face and/or a partial region of the side face. The external electrode has a thick film electrode, a thin film electrode, and a plated layer. The thick film electrode is formed on the end face. The thin film electrode is formed so as to cover the thick film electrode and the partial region of the principal face and/or the partial region of the side face. The plated layer is formed outside the thin film electrode and contains Sn or an Sn alloy.

Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing a multilayer ceramic condenser. There is provided a method of manufacturing a multilayer ceramic condenser, including: printing a plurality of stripe-type inner electrode patterns on a ceramic green sheet in parallel; forming a laminate by stacking ceramic green sheets on which a plurality of stripe-type inner electrode patterns are formed; cutting the laminate so that a first inner electrode pattern and a second inner electrode pattern are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the side of the laminate to which both the first inner electrode pattern and the second inner electrode pattern are exposed.

Abstract: In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.

Abstract: A multilayer body includes first and second capacitance conductors and an internal conductor, which define a capacitor, provided therein. First and second external electrodes are respectively connected to the first and second capacitance conductors via first and second led out conductors. The internal conductor faces the first and second capacitance conductors. Third and fourth external electrodes are connected to the first capacitance conductor via third and fourth led out conductors. Fifth and sixth external electrodes are connected to the second capacitance conductor via fifth and sixth led out conductors.

Abstract: The disclosure relates generally to capacitor structures and more particularly, to capacitor structures having interdigitated metal fingers. Metal finger capacitors may have at least one layer, the at least one layer including: a first set of fingers, wherein each finger of the first set includes an end integrally connected to a bus segment of a first bus; a second set of fingers interdigitated with the first set of fingers, wherein each finger of the second set includes an end integrally connected to a bus segment of a second bus; an in port integrally connected to the first bus and an out port integrally connected to the second bus; and wherein a width of the first and second bus is non-uniform across a length of the first and second bus.

Abstract: Provided is a multilayer ceramic capacitor including a multilayer ceramic plastic body formed so that a plurality of internal electrode layers intersects; and a plurality of external electrodes, each formed to cover one side or another side of the multilayer ceramic plastic body and connected to the plurality of internal electrode layers. Each of the plurality of external electrodes includes a plurality of conductive layers that is sequentially formed to cover one side or another side of the multilayer ceramic plastic body, and one of the plurality of conductive layers is formed of conductive resin hardened through an irradiation cross-linking method using gamma ray.

Abstract: There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer.

Abstract: A method for manufacturing a metal-insulator-metal (MIM) stack is described. The method includes forming a temporary stack by depositing a bottom electrode comprising at least one metal layer; depositing a dielectric comprising at least one layer of a dielectric material having a first dielectric constant value; and depositing a top electrode comprising at least one metal layer. The step of depositing the bottom and/or top electrode includes depositing a non-conductive metal oxide layer directly in contact with the dielectric; and after the step of depositing the bottom and/or top electrode's non-conductive metal oxide layer and the dielectric, subjecting the temporary stack to a stimulus, which transforms the non-conductive metal oxide into a thermodynamically stable oxide having conductive properties or into a metal, and the dielectric material into a crystalline form having a second dielectric constant value higher than the first dielectric constant value, thereby creating the final MIM stack.

Abstract: There are provided a conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. More particularly, there are provided a conductive paste for an external electrode including: a conductive metal powder; and a spherical glass frit having an average particle size of 0.05 to 3.0 ?m, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. According to the present invention, a spherical glass frit having fine particles may be applied at the time of preparing the conductive paste for an external electrode, thereby realizing external electrodes having excellent compactness at a low temperature and suppressing the occurrence of cracks, and thus, a multilayer ceramic electronic component having excellent reliability can be implemented.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.98 wt % of nickel (Ni), 0.01 to 10 wt % of copper (Cu), and 0.01 to 10 wt % of barium titanate (BaTiO3).

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.9 wt % of copper (Cu) and 0.1 to 20 wt % of nickel (Ni), and a frequency therefor is 1000 MHz or less.

Abstract: A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 ?m or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td?0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability.

Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

Abstract: A method for forming a Metal-Insulator-Metal Capacitor (MIMCAP) structure and the MIMCAP structure thereof are described. An example electronic device includes a first electrode, and a layer of a dielectric material including titanium oxide and a first dopant ion. The layer of the dielectric material is formed on the first electrode. The first dopant ion has a size mismatch of 10% or lower compared to the Ti4+ ion and the dielectric material has a rutile tetragonal crystalline structure at temperatures below 650° C. The example electronic device further includes a second electrode, formed upon the dielectric material layer.

Abstract: A thin-film capacitor 10 has an MIM structure in which a lower electrode 14, a dielectric layer 16, and an upper electrode 18 are formed in order on a substrate 12. Of the upper and lower electrodes 18 and 14, at least the upper electrode 18 is formed of a laminated electrode in which a nitride and a metal are laminated. The nitride preferably contains a high-melting point metal, such as Ta or Ti. In addition, the metal laminated along with the nitride is preferably the same as the metal contained in the nitride. Yet additionally, the nitride may contain Si. Thus, by using the laminated electrode containing the nitride in at least the upper electrode 18, identical I-V characteristics can be obtained and reliability is improved without the need for an annealing treatment for characteristic recovery necessary when a Pt electrode is used. Still additionally, adhesion between the dielectric layer 16 and the upper electrode 18 is improved, and therefore, delamination does not occur.

Abstract: A compact laminated ceramic electronic component having superior moisture resistance and electrical properties is provided. A laminated ceramic electronic component 1 includes an inner layer portion that contains a plurality of dielectric layers 2a and internal electrode layers 3 comprising Ni as a main component that are laminated alternately, and a pair of dielectric outer layer portions 2b which sandwich the inner layer portions. And Ni particles are segregated in the dielectric outer layer portions 2b. And the amount of Ni particles existing in the dielectric layers 2a is smaller than that in the dielectric outer layer portions 2b.

Abstract: A power converter utilizes one or more nonlinear composite film capacitors constructed solely of polymer anti-ferroelectric (AFE) particle composites and configured as DC-link bus capacitors providing an energy buffer to reduce DC-link voltage ripple.

Abstract: A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed remote from the first feedthrough passageway, and a second lead disposed within the second feedthrough passageway and conductively coupled to the first set of electrode plates. The second set of electrode plates are typically conductively coupled to a ground. An EMI shield may be provided to electromagnetically isolate the first lead from the second lead.