Abstract: The invention relates to a film capacitor for power electronics, which comprises a first electrically conductive layer, which is arranged on a first end side face of the film capacitor, wherein the surface normal of the first electrically conductive layer is perpendicular to the surface normals of dielectric films of the film capacitor. A second electrically conductive layer is arranged on a second end side face opposite from the first end side face, wherein the surface normal of the second electrically conductive layer is perpendicular to the surface normals of the dielectric films of the film capacitor. The film capacitor has at least one inner passage, which extends from the first electrically conductive layer to the second electrically conductive layer, wherein the passage is formed by removal of capacitor material. The invention also relates to a capacitor assembly.

Abstract: A capacitor component includes a body having a stacked portion in which first internal electrodes and second internal electrodes are alternately stacked with each other and with dielectric layers therebetween in a first direction, and having first and second connection portions disposed on opposite surfaces of the stacked portion, respectively, in a second direction perpendicular to the first direction. First and second external electrodes are disposed on the first and second connection portions, respectively. The first and second connection portions each include a metal layer disposed on the stacked portion and a ceramic layer disposed on the metal layer. Corners of the body have a rounded shape in a cross-section of the body extending in the first and second directions.

Abstract: There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.

Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.

Abstract: An electronic component has a lead frame attached to an element with a conductive adhesive. The lead frame has one of a hole, cavity, cutout and groove filled with the adhesive. The lead frame may be provided with a plurality of grooves intersecting one another and divided into frame segments by the grooves.

Abstract: Systems and apparatuses for providing a broadband capacitor assembly. One broadband capacitor assembly includes a first capacitor operable to provide a first end of an operational band of frequencies within an operational band of a broadband capacitor assembly. The broadband capacitor assembly also includes a second capacitor coupled in parallel to the first capacitor, the second capacitor operable to provide a second end of the operational band of frequencies within the operational band of the broadband capacitor assembly. A DC block can be provided including a broadband capacitor assembly.

Abstract: Surface mount capacitors are made having ultra-small dimensions of length, width and height. For example, capacitors of 0402 size and smaller may be produced having lower height than has been achieved in the prior art. The components have L-shaped terminations on respective ends thereof, providing bottom lands for mounting to a circuit board. At most, the component will have top lands of negligible size to provide a large gap width between the terminations across the top surface of the component. In some embodiments, the top surface may also include orientation indicia located thereon. The invention also provides improved methodology for terminating a capacitor or other surface mount component.

Abstract: A capacitor comprising a capacitor element, a case for housing the capacitor element, and a fixing section having projections for attaching the case to electrical equipment. In an exemplary embodiment of the present invention, the case and the fixing section are unitarily molded. The fixing section and the capacitor case are formed of flame-resistant thermoplastic resins as required. This structure eliminates the need of components and tools for fixing the capacitor. Thus, the structure can improve workability, and reduce man-hours and manufacturing cost.

Abstract: A ceramic electronic part wherein widths of portions of external terminals that are joined to end surfaces of a ceramic electronic part element are made equal to or less than widths of internal electrodes disposed in the ceramic electronic part element. The joining portions of the external terminals are joined to the end surfaces of the ceramic electronic part element so as to be positioned within areas of the end surfaces of the ceramic electronic part element where the internal electrodes are exposed when viewed in a plane. The ceramic electronic part with the external terminal is a highly reliable one and makes it possible to prevent cracking of a ceramic part element even when the ceramic electronic part is large.