Abstract: A stretched film comprising a dispersion of at least one polyester and/or polycarbonate in a matrix of at least one polyester and/or polycarbonate different from the first polyester and/or polycarbonate, the percentage by weight of the dispersed polyester and/or polycarbonate in the dispersion being less than 50% and the dispersed polyester and/or polycarbonate being in the form of platelets. The stretched film can be used as a dielectric in a capacitor.

Abstract: Techniques are generally described herein for the design, manufacture and use of composite dielectric materials. Embodiments include, but are not limited to, methods, apparatuses, and systems. Other embodiments may also be disclosed and claimed. Some techniques described herein include electrophoretic deposition of dielectric particles to conformally form a thin layer of dielectric material for use in energy storage devices. Example energy storage devices include capacitor devices, which in some instances may be used to replace and/or assist in the operation of batteries, ultra-capacitors, and other similar devices.

Abstract: A first electrode pattern comprises a first lead-out electrode portion extending continuously along the longitudinal direction of a first dielectric film, a plurality of first capacitor electrode portions each extending from the first lead-out electrode portion almost perpendicularly to the first lead-out electrode portion, and second capacitor electrode portions which are disposed between the first capacitor electrode portions and connected thereto. The second capacitor electrode portions each have a plurality of first sections. Each first section is connected to one end surface and the other end surface extending along the width direction of the first dielectric film of the first capacitor electrode portions through a narrow first fuse portion.

Abstract: A metalized film capacitor capable of exhibiting stable performance in a wide temperature range is provided. The metalized film capacitor has an elliptical cross sectional shape having a major axis of 60 mm or above. In this capacitor, offset for shifting in the width direction of a pair of metalized film is set to 1.2 mm or above. Since the bonding state between metal vapor-deposited electrode and metal sprayed electrode formed on the end surface is stable, a stable contact between metal sprayed electrode and dielectric film is maintained, thereby preferably maintaining tan ?and exhibiting excellent performance even if the use temperature range is increased and the thermal stress is increased.

Abstract: A method for fabrication of passive electronic components includes disposing a sacrificial layer on a carrier and forming a curable resin layer on top of the sacrificial layer and patterning the curable resin to form a cured resin template having multiple pattern levels. A metal material is deposited into the first pattern level to form a first structure. A dielectric material is then formed on exposed portions of the first structure. A nonselective subtractive process is used to expose the sacrificial layer in a bottom of the second pattern level and metal material is deposited into the second pattern level and built up to include a portion which crosses over the dielectric material.

Abstract: The present invention provides a nonporous highly dielectric film which can improve withstanding voltage, insulating property and dielectric constant, especially can decrease a dielectric loss at high temperatures and can be made thin, and a coating composition for forming the highly dielectric film comprising (A) a vinylidene fluoride resin, (B) a cellulose resin and (C) a solvent.

Abstract: The invention concerns multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. A thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Abstract: In one aspect of the present invention, an article is described, including a polymer layer; and a composite layer disposed on the polymer layer. The composite layer includes a thermoplastic polymer, which contains at least one inorganic component having selected dimensions; wherein the largest dimension of the inorganic component is less than about 1 micrometer. The composite layer has a dielectric constant, which is at least about 30 percent greater than the dielectric constant of the polymer layer. The article has a breakdown strength of at least about 150 kV/mm. Related devices are also described.

Abstract: An ionic polymer metal composite (IPMC) capacitor is disclosed which includes a thin single layer non-hydrated ionic polymer substrate with conductive film electrodes applied to at least a portion of each side of the non-hydrated ionic polymer substrate. The disclosed capacitor is suited for providing thin capacitance structures made to substantially any desired dimensions and shape and may be particularly suited for short term power storage in low power electronics, sensors, micro-electronics, MEMs and high temperature applications. A method of manufacturing an IPMC capacitor is also disclosed including providing a thin single layer non-hydrated ionic polymer substrate, applying a conductive film electrode to both sides of the substrate, and attaching electrical connections to the electrodes. The disclosed method of manufacture may optionally also include heat curing the capacitor and coating the capacitor with at least one moisture-resistant protective coating layer.

Abstract: A wireless communications adapter adapted for connection to a direct audio input of a hearing assistance device, the wireless communications adapter adapted for radio frequency communications with a remote device. Varying embodiments enable communication using a protocol compatible with a BLUETOOTH standard to reach a hearing assistance device through a direct audio input. Some examples of the wireless communication adapter offer microphone options to receive audio information and transmit it with far field communications.

Abstract: In one aspect of the present invention, a method for increasing the dielectric breakdown strength of a polymer is described. The method comprises providing the polymer and contacting a surface of the polymer in a reaction chamber with a gas plasma, under specified plasma conditions. The polymer is selected from the group consisting of a polymer having a glass transition temperature of at least about 150° C., and a polymer composite comprising at least one inorganic constituent. The contact with the gas plasma is carried out for a period of time sufficient to incorporate additional chemical functionality into a surface region of the polymer film, to provide a treated polymer. Also provided are an article and method of manufacture.

Abstract: There is provided a highly dielectric film which has highly dielectric property, can be made thin, being excellent in winding property (flexibility) and assures a small dielectric loss, and the highly dielectric film comprises a vinylidene fluoride type polymer (A), and compound oxide particles (B) represented by the formula: MaTibOc, wherein M is a metallic element of the group II of from the second period to the fifth period in Periodic Table; a is from 0.9 to 1.1; b is from 0.9 to 1.1; c is from 2.8 to 3.2, and the compound oxide particles (B) are contained in an amount of 10 to 500 parts by mass based on 100 parts by mass of the vinylidene fluoride type polymer (A).

Abstract: An embodiment mitigates one or more of the limiting factors of fabricating polymer ferroelectric memory devices. For example, an embodiment reduces the degradation of the ferroelectric polymer due to the polymer's reaction with, and migration or diffusion of, adjacent metal electrode material. Further, the ferroelectric polymer is exposed to fewer potentially high temperature or high energy processes that may damage the polymer. An embodiment further incorporates an immobilized catalyst to improve the adhesion between adjacent layers, and particularly between the electrolessly plated electrodes and the ferroelectric polymer.

Abstract: A multilayer polymer dielectric film includes a coextruded first dielectric layer and second dielectric layer. The first dielectric includes a first polymer material and the second dielectric layer includes a second polymer material. The first dielectric layer and the second dielectric layer defining an interface between the layers that delocalizes charges in the layers.

Abstract: A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

Abstract: The present invention relates to a capacitor film comprising a biaxially oriented polypropylene wherein a) said polypropylene has a draw ratio in machine direction of at least 4.0 and a draw ratio in transverse direction of at least 4.0, and b) said polypropylene has an electrical breakdown strength EB63% according to IEC 60243-part 1 (1988) of at least 300 kV/mm at a draw ratio in machine direction and in transverse direction of 4.0.

Abstract: The present invention relates to a highly dielectric film formed by using (A) a fluorine-containing resin comprising vinylidene fluoride unit and tetrafluoroethylene unit in a total amount of not less than 95% by mole, and provides a film for a film capacitor which has high dielectric property and high withstanding voltage and can be made thin.

Abstract: Examples of the present invention relate generally to high electric energy density polymer film capacitors with high charge-discharge efficiency and fast discharge speed. For example, a high energy density polymer capacitor may be fabricated using a polymer blend comprising one or more high dielectric constant PVDF-based polymers (including homopolymers, copolymers and/or terpolymers) and one or more other polymer with low dielectric loss and high volume resistivity compared to the one or more PVDF-based polymers. An example film capacitor may comprise a high temperature fluoropolymer with dielectric loss lower than 0.2% and good film manufacturability. Polymer films can be stretched and orientated at least in one direction to make thinner films with improved performance. Film capacitors can be made by winding metallized films, plain films with metal foils, or using a hybrid construction where the dielectric films comprise the new compositions.

Abstract: The invention relates to the production of a coating of a porous electrically conductive support material (1) with a dielectric (18), particularly for use in a capacitor. The production method comprises the steps: infiltrating the support material (1) with a solution (2) which contains precursor compounds of the dielectric (18) and at least one solvent (12), and which has a boiling temperature TS and a crosslinking temperature TN, and drying the support material (1) infiltrated with the solution (2) at a drying temperature, which is lower than the boiling temperature TS and lower than the crosslinking temperature TN of the solution (2), until more than 75 wt.

Abstract: Disclosed are coated metal oxide nanoparticles comprising a metal oxide nanoparticle having a surface; and ligands attached to the metal oxide nanoparticle surface. Also disclosed are phosphonic acid compounds comprising the structure Gn-R-Xn, wherein G is a terminal group; wherein R is a bridging group; wherein X is a phosphonic acid group; and wherein each n is, independently, 1, 2, or 3. Also disclosed are methods for preparing and using coated metal oxide nanoparticles. Also disclosed are nanocomposite compositions comprising a polymer; and a coated metal oxide nanoparticle dispersed within the polymer. Also disclosed are articles, films, and capacitors comprising a coated metal oxide nanoparticle or a nanocomposite composition. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Abstract: The present invention relates to a solid state capacitor having a conductive polymer cathode layer counter electrode comprising acrylate binder and a method for its manufacture. In particular the present invention relates to a solid state capacitor comprising: providing a porous anode body of valve action material; forming a dielectric layer on said porous body; forming a cathode layer in contact with said dielectric layer, which cathode layer comprises a conductive polymer and an acrylic binder; and providing an anode terminal in electrical connection with the porous body anode and a cathode terminal in electrical connection with the cathode layer and a method for its manufacture.

Abstract: A film capacitor suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic is provided. The film capacitor comprises a film capacitor element, a bus bar as metal terminal connected to electrode of this film capacitor element, and a case for containing them, in which the film capacitor element and bus bar are packed within the case by plural layers of epoxy resin compositions, and the plural layers of epoxy resin compositions are composed so that the coefficient of linear expansion is smallest in the composition disposed in the uppermost layer.

Abstract: A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first insulation layer stacked over a first metal layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

Abstract: A device includes a base plate, a first cell, a second cell, and a housing in which the-first cell and the second cell are arranged. The first cell and the second cell each include at least one capacitor. The device also includes a first metal plate configured connected to a capacitor in the first cell and second metal plate connected to a capacitor in the second cell. The first and second metal plates each having at least one hole configured to receive the conductive fastening element. The device also includes an electrically conductive fastening element connected through the hole in the first metal plate and the hole in the second metal plate such that the first metal plate and the second metal plate are-electrically connected to one another and mechanically attached to one another and to the base plate.

Abstract: An electrical-energy-storage unit (EESU) has as a basis material a high-permittivity composition-modified barium titanate ceramic powder. This powder is single coated with aluminum oxide and then immersed in a matrix of poly(ethylene terephthalate) (PET) plastic for use in screen-printing systems. The ink that is used to process the powders via screen-printing is based on a nitrocellulose resin that provide a binder burnout, sintering, and hot isostatic pressing temperatures that are allowed by the PET plastic. These lower temperatures that are in the range of 40° C. to 150° C. also allows aluminum powder to be used for the electrode material. The components of the EESU are manufactured with the use of conventional ceramic and plastic fabrication techniques which include screen printing alternating multilayers of aluminum electrodes and high-permittivity composition-modified barium titanate powder, sintering to a closed-pore porous body, followed by hot-isostatic pressing to a void-free body.

Abstract: A metallized plastic film is formed by winding two sheets of film vapor-deposited with an electrode metal as one group and a film capacitor, comprising; three individual splittings of electrode metal by predetermined width and length and then adjoining of splitting parts. Accordingly, self-heating of the film capacitor can be restrained and a capacitance reduction rate caused by the operation of the fuse parts can be reduced.

Abstract: A film capacitor suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic is provided. The film capacitor comprises a film capacitor element, a bus bar as metal terminal connected to electrode of this film capacitor element, and a case for containing them, in which the film capacitor element and bus bar are packed within the case by plural layers of epoxy resin compositions, and the plural layers of epoxy resin compositions are composed so that the coefficient of linear expansion is smallest in the composition disposed in the uppermost layer.

Abstract: A capacitor is provided. The capacitor includes a dielectric polymer film comprising a cyanoresin and at least one electrode coupled to the dielectric polymer film. The capacitor has an energy density of at least about 5 J/cc. A method of making a capacitor is provided. The method includes dissolving a cyanoresin in a solvent to form a solution and coating the solution on a substrate to form a dielectric polymer film. The dielectric polymer film has a breakdown strength of at least about 300 kV/mm.

Abstract: An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture resistance and low gas and moisture permeability to protect the electric element from short and long term moisture degradation effects. A known case layer is located adjacent to the coating layer. The case layer is a metal, epoxy-based, silicone-based, or polymer material that encapsulates the coating layer and the electric element to protect the coating layer and electric element from physical damage.

Abstract: A thermal insulation apparatus for a capacitor and the capacitor with the thermal insulation apparatus is provided. The thermal insulation apparatus includes a basis, a thermal baffle is stretched upwards from a side wall of the basis, a bracket is connected with a inner wall of the basis. The basis and the bracket form a cavity to hold the capacitor. The thermal insulation apparatus can isolate the capacitor from external heat sources. After assembly, a distance lies between the bracket and the basis of the thermal insulation apparatus so that the capacitor can eliminate heat efficiently.

Abstract: The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.

Abstract: An electronic disabling device includes first and second electrodes positionable to establish first and second spaced apart contact points on a target having a high impedance air gap existing between at least one of the electrodes and the target. The power supply generates a first high voltage, short duration output across the first and second electrodes during a first time interval to ionize air within the air gap to thereby reduce the high impedance across the air gap to a lower impedance to enable current flow across the air gap at a lower voltage level. The power supply next generates a second lower voltage, longer duration output across the first and second electrodes during a second time interval to maintain the current flow across the first and second electrodes and between the first and second contact points on the target to enable the current flow through the target to cause involuntary muscle contractions to thereby immobilize the target.

Abstract: The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error compression alignment on laminates. The invention employs a plurality of different sized metal laminates stacked for a built-in capacitor to achieve a high-precise capacitor PCB. More particularly, the invention can raise the capability of noise-immunity of a capacitive PCB applied to high frequency/speed modules and systems, and also provides precise capacitance to regular circuit design for the need of compact package and high-precise capacitance in the future.

Abstract: The present invention is to provide a metallized film capacitor having a compact size, a large capacitance and a low inductance whereas number of parts is reduced. The metallized film capacitor comprises: a plurality of capacitor elements (1) provided with metallized contact electrodes (2) on both ends in the width direction; a bus-bar (3) to connect each of a plurality of electrodes (2) on one end; and a capacitor case (5) to house a plurality of capacitor elements (1), wherein a plurality of capacitor elements (1) are arranged in the capacitor case such that one side of electrodes (2) faces the opening surface of capacitor case (1) and each electrode (2) of one of both ends of each capacitor element (1) are positioned generally coplanarly.

Abstract: The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 ?m or less, and the object of the present invention is to secure good voltage resistant proprieties. For the double-sided copper-clad laminate of the present invention uses an electrodeposited copper foil provided with a matte side to be joined to the dielectric layer prepared by physically polishing the rough surface of an untreated electrodeposited copper foil obtained by an electrolysis method to a surface roughness (Rz) of 0.5 ?m to 3.0 ?m, and nodular treatment, and as required, passivation, silane coupling agent treatment, or the like are performed thereon. As the manufacturing method thereof, a manufacturing method wherein the surfaces of the resin layers of two electrodeposited copper foils having resin layers facing to each other are adhered, or the like.

Abstract: Different from conventional so-called mix-type film capacitors involving several disadvantages, in which the dielectric layers consist of a combination of a dielectric plastic resin film and an insulating paper sheet, the invention provides an all-film oil-impregnated capacitor in which the dielectric layers consist only of a plastic resin film such as a biaxially oriented polypropylene resin film (OPP film) suitable for use in microwave ovens. The all-film capacitor of the invention can be obtained and has satisfactory properties only when prepared by using specified materials including the OPP film, aluminum foil and capacitor oil and under specified conditions relative to the dielectric tangent values and dielectric capacity values before and after impregnation with a capacitor oil as well as the conditions in the step of oil impregnation.

Abstract: A method of fabricating a capacitor provides for coupling a ball grid array (BGA) lead configuration to a foil and disposing the foil within a case. The BGA lead configuration extends from the case.

Abstract: The present invention mainly relates to a method for reducing shrinkage during sintering low-temperature-cofired ceramics, the ceramics comprising a dielectric portion and a heterogeneous material portion, the method comprising the steps of: (a) providing a monolithic structure, the monolithic structure comprising a dielectric body and a constraining layer; the dielectric body comprising at least one dielectric layer that comprises at least one active area; wherein said active area is disposed with at least one heterogeneous material pattern; the constraining layer positioned on the top of the dielectric body comprising at least one window wherein the edge of the active area of the dielectric layer each falls within the edge of the window in the vertical direction; (b) firing the monolithic structure; and (c) singulating the monolithic structure along a cutting line to provide the low-temperature-cofired ceramics, wherein the cutting line is disposed in the area formed between the edge of the window and the e

Abstract: This invention relates to capacitor films that have increased moisture and breakdown resistance. The capacitor films include a polymer coating that helps prevent air entrapment.

Abstract: A capacitor element (20) for a power capacitor with a dielectric film layer (3) and an electrode layet arranged on each flat side of the film layer, which electrode layers are divided into at least three metallized areas (4, 9, 10), separate from each other, in order to form an inner series connection arranged to conduct a load current, of which thee areas at least one is divided into segments (5) separated by non-metallized sections (6), and at least one bridge (7) arranged to electrically connect two of the segments together. In accordance with the invention the bridge is so arranged that, in the area divided into segments, the load current appears substantially only in the segments. The invention also relates to a power capacitor with such a capacitor element and also a metallized tape for such a power capacitor.

Abstract: The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.

Abstract: A process for extending the operating temperature limit of a polypropylene film capacitor to greater than 105° C., by use of a post assembly curing process of placing the capacitor in a 10 Torr or less pressure environment, preferably less than 1 Torr, and slowing heating it at a rate of less than an average rate of 5° C./hour to a peak temperature of about 10 to 20 degrees higher than the intended operating temperature, the peak temperature being not more than preferably 180° C.

Abstract: Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): and (B) 0.1 to 60 parts by weight of a copolymer having a functional group reactive with the above-mentioned polyphenylene oxide.

Abstract: An object of the present invention is to provide a niobium powder for producing a capacitor exhibiting excellent reliability; a sintered body formed from the powder; and a capacitor including the sintered body. Even when niobium exhibiting high affinity to oxygen is employed, the niobium powder is obtained by regulating the amount of oxygen contained in the powder. By employing niobium powder which has undergone partial oxidation and partial nitridation, in which the mass ratio of the nitrogen content to the oxygen content is about 1/45 or more, a capacitor exhibiting excellent reliability can be obtained.

Abstract: A power supply arrangement, especially in connection with a conductor (5) of a medium-voltage overhead line, which arrangement comprises a power supply (2) and a first and second element (3, 4) made of an electrically conductive material, which are connected electrically to the power supply for feeding energy to the power supply. The first element (3) of the power supply arrangement is arranged to be close to the conductor (5) and has a capacitance (Ce) to an element in a second potential, the capacitance being arranged to charge itself by effect of an electric field generated by the voltage of the medium-voltage conductor, and said second element (4) is arranged to have a galvanic or capacitive connection with the conductor (5) for feeding energy to the power supply (2) from the potential difference between said first and second elements.

Abstract: By using a polymeric film having a dielectric loss tangent of 0.002 or less measured at a frequency in the range of 1 kHz to 1 GHz at a temperature of 25 ° C., heat generation of dielectric loss of capacitors can be reduced and rising of temperature can be inhibited, and, can highly stand the rise of temperature, whereby further miniaturization and increase in capacity of capacitors become possible. Furthermore, the problems in handling that the films are apt to cut or become entangled at the rewinding step can be greatly improved by using polymeric films which are 1 or less in friction coefficient between the films of the same material. Accordingly, the polymeric films are excellent in performance of insulator film, namely, small in dielectric loss tangent, and, moreover, are free from the problems in handling that the films are apt to cut or become entangled at the rewinding step. Furthermore, the polymeric films are suitable for film capacitors.

Abstract: An electrically conductive ceramics comprises a compound containing at least one element belonging to the Group 3A of the periodic table and TiO2−x (0<x<2) in a range such that the TiO2−x (0<x<2) accounts for 1 to 60 wt % of the total amount of the ceramics, and at least part of the compound and the TiO2−x form a composite oxide.

Abstract: A novel capacitor foil and printed circuit board intermediate made using that foil are disclosed. The capacitor foil is a three-layer construction having a conductive layer, a partially-cured high dielectric constant layer, and a partially-cured bonding layer. The high dielectric constant and bonding layers are formed with epoxy or other polymer, however, the high dielectric constant layer is loaded with capacitive ceramic particles or pre-fired ceramic forming particles. The bonding layer may or may not be filled with ceramic particles or prefired ceramic-forming particles. The resulting capacitor foil may be applied to a laminate having copper patterns thereon to define a PCB intermediate containing at least one buried capacitor device. Multiple layers of capacitance material also can be used to increase the overall capacitance of the board.

Abstract: A capacitive element for a circuit board or chip carrier having improved capacitance and method of manufacturing the same is provided. The structure is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cured or softened followed by being fully cured or hardened. The lamination takes place by laminating a partially cured or softened sheet to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils; thus, the single dielectric sheet does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness.