Abstract: A supercapacitor module is provided. In some embodiments, the supercapacitor can include a first supercapacitor, a second supercapacitor, and an interconnect electrically connecting the first and second supercapacitors in series. A casing can encapsulate at least the first and second supercapacitors. The operating voltage of the supercapacitor module can be greater than 3.5 volts, and the equivalent series resistance of the supercapacitor module can be less than about 10 ohm.

Abstract: An electrolytic capacitor module includes a plurality of capacitor elements, an electrode lead, a sealing member, and a heat dissipation member. The electrode lead is electrically connected to each of the plurality of capacitor elements, and penetrates through the sealing member. The heat dissipation member has a plurality of housing portions that respectively house the plurality of capacitor elements. Further, the heat dissipation member has a first surface and a second surface opposite to the first surface. Each of the plurality of housing portions has an insertion opening opened in the first surface. The sealing member seals the insertion opening. The electrode lead is led out from the insertion opening.

Abstract: A feedthrough includes a first printed circuit board, a first flexible conductive element coupled to and extending from an edge of the first printed circuit board, a second printed circuit board, and a second flexible conductive element coupled to and extending from an edge of the second printed circuit board.

Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Abstract: A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.

Abstract: A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.

Abstract: A composite electronic component includes a composite body having a multilayer ceramic capacitor and a tantalum capacitor coupled to each other, so as to have an excellent acoustic noise reduction effect, a low equivalent series resistance (ESR)/equivalent series inductance (ESL), improved direct current (DC)-bias characteristics, and a low chip thickness.

Abstract: A capacitor module of an inverter for a vehicle includes: a DC-link capacitor configured to be connected in parallel to an input of an inverter between a first high voltage input terminal and a second high voltage input terminal; and a plurality of Y-capacitors configured to be connected in parallel to the inverter. Each of the plurality Y-capacitors includes a first capacitor element connected between the first high voltage input terminal and a ground bus bar and a second capacitor element connected between the second high voltage input terminal and the ground bus bar, and the ground bus bars of the plurality of Y-capacitors are separately provided and the ground holes of the ground bus bars are disposed so as to face each other in a first direction.

Abstract: An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.

Abstract: A mounting arrangement for a capacitor package is disclosed. The capacitor package is suitable for use in electric drive traction applications that are subjected to high vibration. Such a capacitor package is relatively large and requires a unique mounting arrangement in order to account for a large mass and high vibration environment. The mounting arrangement provides a clamp load plane that is near the center of mass of the capacitor package.

Abstract: Some features pertain to an integrated device (e.g., package-on-package (PoP) device) that includes a substrate, a first die, a first encapsulation layer, a first redistribution portion, a second die, a second encapsulation layer, and a second redistribution portion. The substrate includes a first surface and a second surface. The substrate includes a capacitor. The first die is coupled to the first surface of the substrate. The first encapsulation layer encapsulates the first die. The first redistribution portion is coupled to the first encapsulation. The second die is coupled to the second surface of the substrate. The second encapsulation layer encapsulates the second die. The second redistribution portion is coupled to the second encapsulation layer.

Abstract: A planar capacitor includes, in part, a first metal line forming spiral-shaped loops around one of its end point, and a second metal line forming spiral-shaped loops between the loops of the first metal line. The first and second metal lines are coplanar, formed on an insulating layer, and form the first and second plates of the planar capacitor. The planar capacitor may be used to form a filter. Such a filter includes a first metal line forming first spiral-shaped loops, a second metal line forming second spiral-shaped loops, and a third metal line—coplanar with the first and second metal lines—forming loops between the loops of the first and second metal lines. The filter further includes a first inductor coupled between the first and third metal lines, and a second inductor coupled between the second and third metal lines.

Abstract: Implementations and techniques for employing phase change materials in ultracapacitor devices or systems are generally disclosed.

Abstract: An improved high capacitance module for multi-layer ceramic capacitors is described. The module contains a flexible substrate comprising at least one first conductive trace and at least one second conductive trace. A first termination trace is in electrical connection with each first trace and a second termination trace is in electrical connection with each second trace. Each capacitor comprises interleaved conductors wherein alternate conductors are terminated to a first external termination and adjacent conductors are terminated to a second external termination. Each capacitor is mounted on the substrate with the first termination in electrical contact with the first trace and the second termination in electrical contact with the second trace. A housing with the substrate is received in the housing. A first lead tab is in electrical contact with the first termination wherein the first lead tab extends from the housing.

Abstract: There is provided an array-type multilayered ceramic electronic component including: a ceramic body; a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; and a plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively, wherein when a gap between the internal electrode multilayered parts is G and internal electrode density is D, 40%?D?57%, 10 ?m?G?200 ?m, and G?(0.0577×D2)?(4.4668×D)+111.22. Therefore, delamination and cracking may be prevented.

Abstract: In one embodiment, a Light Emitting Diode (LED) driving device for driving a plurality of LEDs has a switching matrix utilizing a plurality of one of a turn off thyristors or turn off triacs coupled to the plurality of LEDs. A controller is coupled to the switching matrix responsive to a voltage of a rectified AC halfwave, wherein combinations of the plurality of LEDs are altered to ensure a maximum operating voltage of the plurality of LEDs is not exceeded. A current limiting device is coupled to the combinations of the plurality of LED to regulate current.

Abstract: An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.

Abstract: A capacitor module is provided with a plurality of capacitors juxtaposedly disposed to have electrode terminals that are composed of positive electrode terminals and negative electrode terminals, respectively. Neighboring capacitors, among the plurality of capacitors, are disposed adjacent to each other to define neighboring electrode terminals, among the electrode terminals thereof, with the same polarity.

Abstract: A capacitor forming unit according to one embodiment includes a dielectric plate with a plurality of through holes; a first conductor film formed on an upper surface of the dielectric plate; a first insulator film formed on the front end portion of the upper surface of the dielectric plate; a second conductor film formed on a lower surface of the dielectric plate; a second insulator film formed on the rear end portion of the lower surface of the dielectric plate; first electrode rods disposed in some of the through holes; and second electrode rods disposed in the remaining through holes where the first electrode rods are not disposed. The first electrodes are electrically connected to the first conductor film and electrically insulated from the second conductor film. The second electrode rods are electrically connected to the second conductor film and are electrically insulated from the first conductor film.

Abstract: A capacitor (20A-E) formed as a roll of inner and outer electrode strips (21, 23) alternating with inner and outer dielectric strips (22, 24). Each of the dielectric strips (22, 24) is shorter than an inwardly adjacent one of the electrode strips (21, 23) at a radially outer end thereof (21 E, 23E). This exposes the radially outer end of each electrode strip on respectively different portions of an outer side surface (26, 28) of the capacitor. The exposed ends of the electrode strips may be arranged on opposite sides of the capacitor, such that stacking the capacitors interconnects them either in parallel, in series, or in combinations thereof in different embodiments.

Abstract: Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 110; a pair of clamp members 120 and 130 being installed on one side and another side of the capacitance block 110, respectively; a pair of lead members 140 and 150 being installed on the clam members 120 and 130, respectively; and a molding member 160 filling in the capacitance block 110 to partially expose each of the pair of lead members 140 and 150. The capacitance block may be configured by adhering at least two of a ceramic sintered member 111, a metal capacitance member 112, and a thin film capacitance member 113 using an insulating adhesive member and thereby disposing the at least two members in a multilayered form. Accordingly, capacitance may increase and mechanical strength may be enhanced.

Abstract: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.

Abstract: A case mold type capacitor is formed of multiple metalized film capacitors connected together in parallel and rigidly accommodated with molding resin within a case. The multiple metalized film capacitors are divided into a first block and a second block, and P-poles of each block confront each other, and N-poles thereof also confront each other. Bus-bars including a connection terminal for external connection at an end are connected to respective P-poles and N-poles of each block. The bus-bars connected to the P-poles are coupled together, and the bus-bars connected to the N-poles are coupled together. Each one of the bus-bars includes a section located on the opening side of the case with respect to the blocks. The bus-bars connected to the P-poles overlap in part, and the bus-bars connected to the N-poles also overlap in part.

Abstract: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality of capacitors, which may be connected singly or in combination to provide a selected capacitance. An electronic or other relay connects the selected capacitance in parallel with a motor run capacitor. The hard start capacitor replacement unit is thereby adapted to replace a wide variety of hard start capacitors.

Abstract: A power electronics module includes a capacitor having a trough-shaped housing and at least one capacitor winding. An electronic unit includes a base on which the capacitor is mounted. A cooling plate in thermal contact with a cooling surface of the capacitor is formed by a bus bar. The cooling plate is on the base of the electronic unit.

Abstract: A bundled capacitor with a plurality of individual capacitors is described herein. Each bundled capacitor provides an individual capacitance value. The bundled capacitor can include a housing, a cap connected to the housing, a central common terminal, a plurality of auxiliary terminals, an interrupter, an insulating spider, an insulated collective connection, a thermal fuse, a frangible electrical connection, an insulating layer, a resin disposed around the capacitors, and an expansion chamber formed between the resin and the interrupter, enabling the cap to deform when one of the capacitors overheats in the bundled capacitor.

Abstract: An electrical condenser is disclosed for an automotive ignition system wherein the ignition system has first and second contact breaker points and first and second electrically conductive members electrically connected to the first and second contact breaker points, respectively, the first and second electrically conductive members having first and second faces, respectively, facing each other but not directly electrically connected to each other. The condenser comprises an attachment portion arranged to be interposed between the first and second faces of the electrically conductive members of the ignition system. The attachment portion has first and second oppositely facing electrically conductive faces for making electrical contact with the first and second faces, respectively, of the electrically conductive members of the ignition system.

Abstract: A method for supplying a plurality of capacitance values to a plurality of heating, ventilation, air-conditioning, and refrigeration (HVAC/R) components is provided. The method includes configuring a first set of terminals of a connection device to couple a first capacitor to the connection device and configuring the connection device to couple the first capacitor to at least one of the plurality of HVAC/R components. The method further includes configuring a second set of terminals of the connection device to couple a second capacitor to the connection device and configuring the connection device to selectively couple the second capacitor to at least one of the plurality of HVAC/R components.

Abstract: A capacitor (20A-E) formed as a roll of inner and outer electrode strips (21, 23) alternating with inner and outer dielectric strips (22, 24). Each of the dielectric strips (22, 24) is shorter than an inwardly adjacent one of the electrode strips (21, 23) at a radially outer end thereof (21 E, 23E). This exposes the radially outer end of each electrode strip on respectively different portions of an outer side surface (26, 28) of the capacitor. The exposed ends of the electrode strips may be arranged on opposite sides of the capacitor, such that stacking the capacitors interconnects them either in parallel, in series, or in combinations thereof in different embodiments.

Abstract: The invention relates to a variable capacitor array which has excellent controllability on a capacitance value and has variable and high tunability.

Abstract: There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.

Abstract: A capacitor apparatus includes eight capacitor elements connected in parallel to an alternating-current current source. The impedance of a bus bar between the (j+1)th (j is 1 to 6) capacitor element and the (j+2)th capacitor element from a connecting terminal is (j+1) times the impedance of the bus bar between the first capacitor element and the second capacitor element from the connecting terminal. The impedance of the bus bar between the (j+1)th capacitor element and the (j+2)th capacitor element from a connecting terminal is (j+1) times the impedance of the bus bar between the first capacitor element and the second capacitor element from the connecting terminal.

Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Abstract: There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged in a laminated direction; and first to fourth outer electrodes formed on side surfaces of the capacitor body, respectively, wherein the first capacitor unit includes first and second inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing a corresponding one of dielectric layers, the second capacitor unit includes third and fourth inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing another corresponding one of the dielectric layers, the first and second capacitor units are electrically insulated from each other, and the first capacitor unit operates in a first frequency range and the second capacitor unit operates in a second frequency range lower than the first frequency range.

Abstract: A feedthrough capacitor assembly for attachment to a mount having an opening is disclosed. The assembly includes a feedthrough terminal adapted for insertion through said opening for coupling a signal from a first side of the mount to a second side of the mount. The assembly includes a first conductive region extending about and electrically coupled to the feedthrough terminal and a second conductive region extending about the first conductive region. A plurality of capacitors are electrically coupled between the first conductive region and the second conductive region. The plurality of capacitors are arranged about the feedthrough terminal with each capacitor having about the same capacitance as each of the other capacitors.

Abstract: an exemplary film includes a base having an electrically insulating polymer which carries on one or both surfaces a sequence of electrically conductive coated areas which are separated by non-coated interstices. The film, which can include a superposition of films arranged one above another, can be shaped to form a capacitor. The capacitor can include a plurality of parallel electrodes which are insulated from each other. Each electrode can include one or more electrode layers formed by the coated areas that are separated by dielectric layers formed by sections of the base.

Abstract: The invention relates to a method for determining a functional area of an electronic textile (100;200). The electronic textile comprises a textile substrate having a first plurality of conductors (108a-b;202a-d), a second plurality of conductors (104a-c;204a-d), and a plurality of capacitors (112;212a-p), each capacitor comprising a conductor from the first plurality of conductors (108a-b;202a-d) and a conductor from the second plurality of conductors (104a-c;204a-d), separated by a dielectric (103a), the capacitors (112;212a-p) being distributed across substantially an entire surface of the electronic textile, wherein each capacitor (112;212a-p) has a capacitance of at least 10 pF.

Abstract: A capacitance system for a radio frequency (RF) charge pump of an RF integrated circuit (IC) includes a fringe capacitor, a second capacitor, and a silicon substrate region. The fringe capacitor is made of backend masks. The second capacitor is located underneath the fringe capacitor. The silicon substrate region is located underneath the second capacitor.

Abstract: A multilayer capacitor array having a plurality of multilayer capacitor devices formed in a single multilayer structure, the multilayer capacitor array including: a capacitor body formed by depositing a plurality of dielectric layers and having first and second side surfaces opposite to each other; a plurality of first polarity internal electrodes and second polarity internal electrodes, disposed oppositely to each other in the capacitor body, interposing the dielectric layer there between, and formed of a single electrode plate comprising a single lead, respectively; and a plurality of first polarity external electrodes and second polarity external electrodes, formed on the first side surface and second side surface, respectively, and connected to a correspondent polarity internal electrode via the lead, the first polarity external electrode formed on the first side surface and the second polarity external electrode formed on the second side surface, wherein the numbers of the first polarity external electro

Abstract: A high density capacitor and low density capacitor simultaneously formed on a single wafer and a method of manufacture is provided. The method includes depositing a bottom plate on a dielectric material; depositing a low-k dielectric on the bottom plate; depositing a high-k dielectric on the low-k dielectric and the bottom plate; depositing a top plate on the high-k dielectric; and etching a portion of the bottom plate and the high-k dielectric to form a first metal-insulator-metal (MIM) capacitor having a dielectric stack with a first thickness and a second MIM capacitor having a dielectric stack with a second thickness different than the first thickness.

Abstract: Vertical parallel plate (VPP) capacitor structures that utilize different spacings between conductive plates in different levels of the capacitor stack. The non-even spacings of the conductive plates in the capacitor stack decrease the susceptibility of the capacitor stack of the VPP capacitor to ESD-promoted failures. The non-even spacings may be material specific in that, for example, the spacings between adjacent conductive plates in different levels of the capacitor stack may be chosen based upon material failure mechanisms for plates containing different materials.

Abstract: A capacitor assembly comprises a capacitor housing wherein a relatively larger main capacitor and at least one relatively smaller secondary capacitor can be enclosed and include an efficient and simple combination of electrical connections from the multiple capacitors to an external electrical connection interface. Another aspect includes a capacitor housing wherein volumetric efficiency is enhanced by the arrangement of the multi-capacitors within a given volume of a cavity of the housing. For a given size main capacitor and one or more secondary capacitors, the total volume of space occupied by those capacitors and the housing is minimized to take up minimum room in an electrical box.

Abstract: A capacitor module in which the structure of a connecting portion is highly resistant against vibration and has a low inductance. The capacitor module includes a plurality of capacitors and a laminate made up of a first wide conductor and a second wide conductor joined in a layered form with an insulation sheet interposed between the first and second wide conductors. The laminate comprises a first flat portion including the plurality of capacitors which are supported thereon and electrically connected thereto, a second flat portion continuously extending from the first flat portion while being bent, and connecting portions formed at ends of the first flat portion and the second flat portion and electrically connected to the exterior.

Abstract: There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.

Abstract: Systems, methods, and apparatuses for balancing capacitor load are provided. A system includes a plurality of capacitors, a plurality of respective positive connections and a plurality of respective negative connections that connect each of the plurality of capacitors to at least one power source, where each of the plurality of positive connections has an approximately equal length, and each of the plurality of negative connections has an approximately equal length.

Abstract: An apparatus includes a measurement device for measuring two capacitances. The apparatus also includes a display module that simultaneously displays at least two numerical values based on the measured capacitances.

Abstract: A capacitor includes a first capacitor structure on a substrate, the first capacitor structure including a first electrode, a first dielectric layer pattern, and a second electrode, a second capacitor structure on the first capacitor structure, the second capacitor structure including a third electrode, a second dielectric layer pattern, and a fourth electrode, at least one first contact pad on a side of the first electrode, and a wiring structure connecting the at least one first contact pad and the fourth electrode.

Abstract: A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in response to different current frequency; in other words, different inductor is induced. Therefore, a single plate capacitor structure has function of hierarchical decoupling capacitor effect.

Abstract: A highly linearized capacitor structure is formed by a first capacitor, that is coupled between a first terminal and a common node, combine with a second capacitor, that is coupled between a second terminal and the common node. When a bias voltage is applied, the capacitance values of the first and second capacitors combine and a capacitance variation of the first capacitor is compensated by a capacitance variation of the second capacitor to reduce and linearize overall capacitance variation in the combined capacitor structure.

Abstract: A set of integrated capacitor arrangements is presented, each of which has a circuitry-effective main capacitor and a connectable correction capacitor. Each capacitor arrangement has an electrically conductive antifuse connection and antifuse interruption between the correction capacitor and the main capacitor, which are produced after the main capacitor has been formed. The connection and interruption enable the capacitance of the capacitor arrangement to be corrected.