With Cooling Means Patents (Class 361/676)
  • Patent number: 8094435
    Abstract: A power drive stack system comprises a series of power electronic modules, each one of the modules containing power components and module contacts electrically and mechanically aligned for building a portion of a complete AC/DC drive stack. The modules utilize a common set of circuit connection points that are matched to a common set of physical connection points. The modules can be plugged together like building blocks to form a large variety of AC/DC drive stacks that can be tailored to meet an exact system requirement. The drive stack may be used in conjunction with a controller to adjust the torque and speed of an AC/DC electric motor.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: January 10, 2012
    Assignee: Parker-Hannifin Corporation
    Inventors: Jeremy Howes, David Levett, John Froeb
  • Patent number: 8081462
    Abstract: A method and kit of components for configuring electronics cooling configurations, the kit comprising a plurality of passageway forming members, each forming member including an extruded member having first and second ends and forming at least one passageway and at least one of an input port and an output port that opens into the passageway, each forming member also including at least one plug insert secured to the second end of the forming member to block the at least one passageway, a plurality of elastomeric seals, a plurality of mechanical fasteners, wherein forming members can be arranged adjacent each other with ports aligned and the fasteners can be used to mechanically fasten the forming members together with seals there between to form various cooling configurations.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: December 20, 2011
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: John A. Balcerak, Scott D. Day, Jeremy J. Keegan, William K. Siebert, Neil Gollhardt
  • Patent number: 8081464
    Abstract: An exemplary encapsulated high-voltage switch is disclosed which contains a heat-generating current conductor, a metal encapsulation surrounding the current conductor, and a cooling element. A cooler of the cooling element is fixed on a part of the encapsulation that is embodied as a mounting plate, and has cooling ribs arranged outside the encapsulation. In a section of the cooler that is embodied as a cooling block, at least a portion of the cooling ribs is arranged parallel to the mounting plate and is held on a heat distributor fixed to the mounting plate in such a way that on both sides of the heat distributor in each case one of two groups of cooling channels arises, in which the cooling channels are in each case arranged in the manner of a sandwich. The cooling channels can, for example, be oriented in a manner inclined relative to a horizontal axis of the switch.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: December 20, 2011
    Assignee: ABB Technology AG
    Inventors: Jean-Claude Mauroux, Guenter Steding, Martin Lakner, Bruno Widmer
  • Patent number: 8081423
    Abstract: An electrical installation has a container which encloses high-voltage components. The electrical installation can be fitted inexpensively and quickly, and at the same time provide sufficient cooling of the high-voltage components. A control room with control elements and/or display elements of the electrical installation and a cool room with a cooling device for at least one of the high-voltage components are disposed in the interior of the container.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: December 20, 2011
    Assignee: Siemens Aktiengesellschaft
    Inventors: Marcos Pereira, Andreas Zenkner
  • Patent number: 8076586
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: December 13, 2011
    Assignee: Imbera Electronics Oy
    Inventors: Risto Tuominen, Petteri Palm
  • Patent number: 8063533
    Abstract: An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a piezoelectric pump cooling air by a piezoelectric element; a drive circuit driving the piezoelectric element; and a control circuit monitoring and controlling operation of the audio input section, the audio recording section, and the drive circuit, wherein when an operation mode being monitored is an audio recording mode, in which the input sound is used for recording by the audio recording section, the control circuit controls the drive circuit to decrease the amount of air flow exhausted outside from the piezoelectric pump, and when the operation mode being monitored is another mode without audio recording, the control circuit maintains the amount of the air flow.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: November 22, 2011
    Assignee: Sony Corporation
    Inventor: Keiji Osano
  • Patent number: 8040665
    Abstract: An electricity transformer station having a foundation and a housing on top of the foundation, the housing comprising walls and a roof. The housing comprises a plurality of identical modules assembled in a row along a longitudinal axis of the housing, each of the modules having two side walls and a roof section connecting the side walls.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: October 18, 2011
    Assignee: ABB Technology AG
    Inventor: Carsten Thrue
  • Patent number: 7999179
    Abstract: One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: August 16, 2011
    Assignee: International Business Machines Corporation
    Inventors: Eric Alan Eckberg, James Dorance Gerken, John Theodore Gullicksrud, Stephen Peter Mroz, Scott Alan Shruson
  • Patent number: 7994424
    Abstract: A high voltage system including a HVDC valve, a liquid fluid cooling system for cooling the valve, and a high voltage bushing for transferring high voltage and high current from the fluid cooled HVDC valve. The high voltage bushing includes an insulating body surrounding an electrical conductor electrically connectable to a connector of the HVDC valve. The electrical conductor of the high voltage bushing includes a cooling duct arranged for cooling the bushing utilizing a circulating gaseous fluid. A heat exchanger is connected to the cooling duct and adapted to cool the circulating gaseous fluid, wherein the heat exchanger is connected to the cooling system of the HVDC valve and adapted to receive cooling water from and to return heated cooling water to the cooling system of the HVDC valve.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: August 9, 2011
    Assignee: ABB Technology Ltd.
    Inventor: David Emilsson
  • Publication number: 20110188174
    Abstract: A solid state contactor assembly includes at least one solid state switch electrically connected to a first bus bar via at least one conductive plate. The solid state switch controls a flow of current between the first bus bar and a second bus bar. A current sensor is formed along a cross section of one of the first or second bus bar such that the current sensor separates its associated bus bar into two separate bus bar portions, and such that a flow of current between the two separate bus bar portions passes through the current sensor. A switch control is operable to control the solid state switch. The switch control is in communication with the current sensor.
    Type: Application
    Filed: June 29, 2010
    Publication date: August 4, 2011
    Inventors: Norbert J. Simper, Rainer Seidel
  • Patent number: 7944697
    Abstract: Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an air vent, and an internal unit in which an electronic component is mounted. The internal unit has a heat sink and radiation fins for releasing heat generated by the electronic component. The fins are inserted into the opening. The heat sink has a draining portion formed below the fins in a direction perpendicular to an extending direction of the radiation fins, a groove for waterproofing around the fins except an upper portion thereof, and two protrusions for fitting above the fins. The case has a rib for waterproofing around the opening except an upper portion thereof, and two holes for fitting above the opening.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: May 17, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Koji Hata, Hiroshi Kuwaki, Yasushi Kimura, Shinya Hamagishi, Seiji Asai
  • Patent number: 7933126
    Abstract: A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: April 26, 2011
    Assignee: Schneider Electric USA, Inc.
    Inventor: Dipin Jain
  • Patent number: 7923630
    Abstract: An enclosure (4) for electrical apparatus (6) has a sealable outlet (8) for partially evacuating the enclosure and a sealable inlet (9)for partially filling the enclosure with a liquid (7) having a vapor pressure at operating temperatures of the apparatus suitable to enhance electrical isolation of the electrical apparatus and suitable to provide convective cooling of the electrical apparatus. The vapor preferably provides a voltage hold-off sufficiently high for operating voltages of the electrical apparatus and has a relative permittivity sufficiently low to prevent stray capacitance in the electrical apparatus above a predetermined limit.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: April 12, 2011
    Assignee: E2V Technologies (UK) Limited
    Inventor: Robert Richardson
  • Patent number: 7881045
    Abstract: An enclosure arrangement, with protection against touch, of a power electronics appliance, more particularly of a frequency converter (31, 51) and its additional devices (12, 13), which solution contains an enclosed power electronics appliance and one or more enclosed additional devices installed in connection with it, which enclosed power electronics appliance and additional devices are modules, which can be fitted to be installed in combination one above the other such that the protection against touch of the appliance entity formed is as great as or higher than the protection against touch of the separate appliances.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: February 1, 2011
    Assignee: Vacon Oyj
    Inventor: Matti Pispa
  • Patent number: 7876561
    Abstract: A plastic liquid cooled variable speed drive or inductor provided. The cooler provides lightweight, space conservative, corrosive free cooling to the components as well as provides a mounting area for modules. A cooler can be mounted to the core of an inductor to absorb heat generated by the core losses.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: January 25, 2011
    Assignee: Johnson Controls Technology Company
    Inventors: Harold R. Schnetzka, Ivan Jadric, Steve Hoover, Kathleen S. Rogers, Mustafa Kemel Yanik
  • Patent number: 7869211
    Abstract: An electronic module. The electronic module includes a chassis, a plurality of capacitors, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The chassis also includes a first side, a second side, a third side, and a fourth side. The second side is opposite the first side. The third side is connected to at least one of the first and second sides. The fourth side is connected to at least one of the first and second sides, and is opposite the third side. The chassis is fabricated from a material which stops component debris from passing through the sides of the chassis. The capacitors are positioned within the chassis. The heat sink is positioned between the capacitors and the second end.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: January 11, 2011
    Assignee: Siemens Industry, Inc.
    Inventor: Jonathan Kunkle
  • Patent number: 7852617
    Abstract: The present invention is to provide a main circuit terminal assembly for a vacuum circuit breaker, which can prevent temperature increase by increasing a surface area of a main circuit conductive unit, the main circuit terminal assembly for a vacuum circuit breaker which is electrically connected to a vacuum interrupter, including: a clamp electrically connected to a movable unit of the vacuum interrupter, and configured as a pair of conductors so as to support the movable unit by clamping; a heat sink fixed to the clamp that increase a surface area of the clamp; a flexible shunt having one end thereof electrically and mechanically connected to the clamp, and configured as a flexible conductor to allow the movable unit to move; a terminal block electrically and mechanically connected to another end of the flexible shunt, and configured as an electrical conductor; and a contactor unit electrically connected to the terminal block and having a plurality of clip-shaped contactors.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: December 14, 2010
    Assignee: LS Industrial Systems Co., Ltd.
    Inventor: Jae-Yong Lee
  • Publication number: 20100302715
    Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 2, 2010
    Applicant: ABB S.p.A.
    Inventors: Mario Bortoli, Alessio Bergamini, Bruno Agostini, Francesco Agostini, Daniel Chartouni, Tilo Buehler
  • Patent number: 7827063
    Abstract: A point of sale device includes a point of sale functional component, such as, for example, a display, an input device, a printer, scales, a card reader, or other. An interface is connected to the component, through a standard port of the component. The interface includes a radio frequency communications function. The interface communicates information regarding the component over a wireless communication network. The wireless communication network connects to a maintenance gateway for the device, either via the network, other networks, or by other communicative connection. The device can be monitored and maintained by the maintenance gateway, and the maintenance gateway can be located at a remote location from the device. The interface can also include cooling elements and controls for the device and/or the interface.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: November 2, 2010
    Assignee: DigiPoS Store Solutions Group Limited
    Inventors: Geoffrey Girdler, Graham Worsfold, David Halyk, Arthur Sullivan
  • Patent number: 7815315
    Abstract: A cooling device with a thermoelectric conversion element having a heat absorbing surface and a heat releasing surface includes: a heat-absorbing-side heat conductive member connected with the heat absorbing surface in a heat-conductive manner; a heat-releasing-side heat conductive member connected with the heat releasing surface in a heat-conductive manner; a plurality of heat-absorbing-side fin members that is disposed to the heat-absorbing-side heat conductive member, protrudes in an out-of-plane direction from an end surface remote from the heat absorbing surface and extends in a predetermined direction; and a plurality of heat-releasing-side fin members that is disposed to the heat-releasing-side heat conductive member, protrudes in an out-of-plane direction from an end surface remote from the heat releasing surface and extends in a predetermined direction intersecting with the plurality of heat-absorbing-side fin members in plan view.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: October 19, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Yasunaga Momose, Yoshiyuki Yanagisawa
  • Patent number: 7796376
    Abstract: An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: September 14, 2010
    Assignee: Yaskawa America, Inc.
    Inventors: John Alan Cairo, Tyler Fleig, Bruce Carl Nemec
  • Patent number: 7778013
    Abstract: A venting system is described for use with electrical enclosures in which hot gasses may be generated by certain types of fault. The venting assembly may be mounted to a surface of the enclosure, such as adjacent to an aperture formed in the enclosure door. The vent assembly includes a series of louvers that divert all gasses flowing from the enclosure and provide no direct path for gas. The vent assembly thus provides unimpeded flow of hot gasses during a fault event to divert and cool the gasses before exiting the enclosure. The vent assembly may be configured as a cartridge-type insert mounted either inside or outside the enclosure.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: August 17, 2010
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Gary P. Bruski, Chester Malkowski, Jr.
  • Patent number: 7773369
    Abstract: A cooling arrangement is disclosed for electrical components which are arranged in a housing of a soft starter which in particular may be designed for operation of an electric motor. In at least one embodiment, the cooling arrangement includes at least one fan arranged inclined in an opening in a housing wall such that the rotation axis of the fan is at an angle to the normal to the housing wall.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: August 10, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Marco Dornauer, Norbert Reichenbach
  • Patent number: 7751918
    Abstract: Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr., Arvind K. Sinha
  • Patent number: 7733632
    Abstract: A casing includes a first casing member and a second casing member. The first casing member is provided on a side with a fuse module mounting section having a side opening. The second casing member is provided on the same side as the first casing member with a relay module mounting section having a side opening and extending downward. An ECU mounting frame extends from a bottom wall of the second casing member. An ECU is disposed on a second side of a bottom wall of the second casing member and in parallel with the relay module mounting section. A fuse module is attached to the fuse module mounting section to receive fuses. A relay module is attached to the relay module mounting section to receive relays. The fuse module and relay module that generate heat are disposed on a side of the casing in a vertical direction.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: June 8, 2010
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Katsuya Ito
  • Patent number: 7715195
    Abstract: The invention relates to an inverter casing, said inverter casing comprising in the bottom at least one depression for receiving heat dissipating electric components, coils in particular.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: May 11, 2010
    Assignee: SMA Solar Technology AG.
    Inventors: Sven Bremicker, Andreas Donth, Stefan Domagala
  • Patent number: 7679886
    Abstract: An engine control device, especially an engine control device having an internal by-pass, is disclosed. The universally applicable engine control device includes an integrated by-pass function. For this purpose, a housing includes chambers that are electrically insulated from one another and that are configured both to receive a respective power subunit, and, alternatively, to receive a continuous current-bearing element.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: March 16, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Markus Meier, Norbert Reichenbach, Fritz Royer
  • Patent number: 7652871
    Abstract: An electrical distribution panel includes a backplane, a circuit breaker comprising a load conductor for transmitting electrical power to a load, and a load sensing assembly comprising a load sensor operatively coupled to the load conductor for detecting an electrical load of the load conductor and generating a load signal proportional to the electrical load. The load sensing assembly is selectively positionable with respect to the load conductor at a plurality of fixedly secured positions on the backplane to facilitate positioning the load sensor with respect to the load conductor.
    Type: Grant
    Filed: January 4, 2006
    Date of Patent: January 26, 2010
    Assignee: General Electric Company
    Inventors: Robert J. Caggiano, Suresh Redditha, Raghunath Parbhu
  • Publication number: 20090323259
    Abstract: A cooling arrangement for a system for generating electric power may include at least one heat exchanger configured to cool air entering an engine operably associated with the system. The arrangement may further include a first fan configured to supply air to the at least one heat exchanger, and at least one radiator configured to cool engine coolant. The arrangement may also include a second fan configured to supply air to the at least one radiator. The arrangement may be configured such that air supplied to the at least one radiator is not supplied to the at least one heat exchanger prior to being supplied to the at least one radiator.
    Type: Application
    Filed: July 9, 2008
    Publication date: December 31, 2009
    Inventors: Michael R. Errera, Kenton D. Gills
  • Publication number: 20090296321
    Abstract: The invention relates to an electrical cabinet (1) for receiving electrical and/or electronic and/or optoelectronic devices, in particular low-current distribution devices, which is particularly suited for installation outdoors, comprising an inner cabin (2) and an outer cabin (3), a first cooling channel (12) and a second cooling channel (23) being configured to be bordering externally on boundary surfaces (6) of the inner cabin (2) and separated from each other.
    Type: Application
    Filed: April 26, 2007
    Publication date: December 3, 2009
    Inventor: Michael Wantschik
  • Publication number: 20090272143
    Abstract: An improved computer cooling apparatus includes: at least one evaporator installed on a surface of at least one heat generating source which is a central processing unit in a computer system unit; a compressor, connected to the evaporator; a condenser, connected to the compressor; an expansion valve, connected between the condenser and the evaporator; a fan, installed on a side of the condenser; and a coolant, circulating among the evaporator, the compressor, the condenser and the expansion valve. The evaporator, compressor, condenser, fan, expansion valve and coolant are used for achieving the effect of quickly dispersing a heat generating source in the computer system unit.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 5, 2009
    Applicant: THERMALTAKE TECHNOLOGY CO., LTD.
    Inventor: Pei-Hsi Lin
  • Publication number: 20090251851
    Abstract: The present invention provides highly efficient system level EMI filtering in a dual feed Power Distribution Unit (PDU) using custom designed magnetic components that are uniquely designed to provide excellent performance under various load conditions. The PDU of the present invention includes filters for providing the necessary EMI filtering at all frequencies in the range between 200 Hz and 200 MHz under all load conditions including a single feed failure. Additionally, the present invention provides mechanisms for cooling EMI components using a combination of natural convection and conduction techniques at the board level to ensure no loss of EMI filtering performance. The present invention also includes blank panels made of formed Aluminum alloy sheet metal pieces or the like to direct air flow to components on printed wiring boards (PWB's) using air director plates.
    Type: Application
    Filed: April 3, 2008
    Publication date: October 8, 2009
    Inventors: Terrence Michael McGill, SR., David Bennitt Harris, Michael Stephen Brown, Richard Hobbs, Curtis Keys
  • Patent number: 7593235
    Abstract: A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit mounted on a circuit board and a thermal conduit having a first and a second portion. The first portion of the thermal conduit is thermally coupled to one or more electrical terminals of the integrated circuit through an opening defined in the circuit board while the second portion of the thermal conduit is thermally coupled to a first material of the circuit board.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: September 22, 2009
    Assignee: Power Integrations, Inc.
    Inventor: Marvin C. Espino
  • Patent number: 7586738
    Abstract: A chimney assembly is provided for an electrical switching apparatus, such as a circuit breaker including a housing and a number of poles. The chimney assembly includes a frame, an intake, a duct and an exhaust. A first side of the frame is coupled to the circuit breaker housing proximate the poles of the circuit breaker, and the intake and exhaust are respectively disposed at first and second ends of the frame. A first portion of the duct is coupled to the circuit breaker housing above the poles, and a second portion is coupled to the first side of the frame. The chimney assembly draws a volume of air through the intake into the circuit breaker housing, circulates the volume of air through the poles of the circuit breaker, and discharges the volume of air out of the circuit breaker housing through the duct and the exhaust.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: September 8, 2009
    Assignee: Eaton Corporation
    Inventors: Ronald D. Hartzel, James E. Smith, Douglas M. Brandt, Anthony T. Ricciuti, James J. Benke
  • Publication number: 20090219673
    Abstract: Information equipment includes an open/close mechanism that opens or closes exhaust ports, a cooling fan that dissipates heat in the information equipment into the air through the exhaust ports, a user state detecting part that detects a contact state in which the hand of a user is in contact with the information equipment or a closeness state in which the hand of the user is close to the information equipment, and a heat dissipation control part that controls an open/closed state of the open/close mechanism so that heat exhausted from the exhaust ports is not directed to the hand of the user that is contact with or close to the information equipment, in accordance with the contact state or the closeness state detected by the user state detecting part.
    Type: Application
    Filed: September 22, 2008
    Publication date: September 3, 2009
    Applicant: Fujitsu Limited
    Inventors: Yuki Tamura, Yoshiyasu Nakashima, Shinichi Shiotsu, Akira Shiba, Koichi Yokota
  • Patent number: 7576985
    Abstract: A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an enclosure, an exhaust duct coupled to the enclosure, and a phase change material disposed in the enclosure, the exhaust duct, or both, wherein the phase change material is configured to rapidly cool exhaust in response to a high temperature in the enclosure. A method is provided that includes cooling an exhaust at a high temperature from a power center by changing phase of a phase change material from a solid to a vapor. Another method is provided that includes providing a phase change material configured to cool an exhaust at a high temperature from a power center by changing phase from a solid to a vapor.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: August 18, 2009
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Murray Peter Kingston
  • Publication number: 20090141432
    Abstract: A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an enclosure, an exhaust duct coupled to the enclosure, and a phase change material disposed in the enclosure, the exhaust duct, or both, wherein the phase change material is configured to rapidly cool exhaust in response to a high temperature in the enclosure. A method is provided that includes cooling an exhaust at a high temperature from a power center by changing phase of a phase change material from a solid to a vapor. Another method is provided that includes providing a phase change material configured to cool an exhaust at a high temperature from a power center by changing phase from a solid to a vapor.
    Type: Application
    Filed: December 3, 2007
    Publication date: June 4, 2009
    Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
    Inventor: Murray Peter Kingston
  • Publication number: 20090135552
    Abstract: A heat dissipating device is disclosed. The heat dissipating device comprises a heat dissipating base, a frame and at least one resilient member. The heat dissipating base has a plate, and at least one hole is formed on the plate. The frame has at least one protruding column, and at least one side of the frame has a protrusion. The resilient member is put on the protruding column correspondingly. When the frame buckles an edge of the plate by the protrusion and be put on the heat dissipating base, the protruding column can pass through the hole on the plate to make the frame elastically associate with the heat dissipating base through the resilient member. Thus, the heat dissipating device makes the heat dissipating base keep closer contact with a chip, balances internal stresses, prevents hestsinks design from being restricted, and further lowers cost.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 28, 2009
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Kun Feng Tu, Ying Lin Hsu, Tsung Hsi Yu
  • Publication number: 20080316701
    Abstract: A gaming device has a housing with at least one air inlet vent and at least one air exhaust vent. In one aspect of the invention, the vents are configured with a duct or flange having at least one upwardly sloping portion configured to prevent the entry of contaminants such as liquids into the gaming device. In another aspect of the invention, a gaming machine cooling system includes at least one air flow device such as a centrifugal blower or squirrel-cage air handling device which provides high volumetric air flow at positive pressure. The air flow device is coupled to the exhaust vent, whereby the air flow device exhausts air from the interior to the exterior of the gaming device. A low pressure condition in the gaming machine causes cool air to be drawn into the interior of the housing.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Inventor: Joseph W. Cole
  • Publication number: 20080266803
    Abstract: A technique for cooling electrical bus structures is disclosed, in which a phase change heat spreader is thermally coupled to the bus. A continuous phase change cycle occurs within the heat spreader to draw heat from the bus during operation. The heat spreader may be planar, and extend over an area greater then the surface area of the bus to enhance cooling and to render the overall assembly more isothermal. The heat spreader may be placed near bus joints and circuits to remove heat caused by increased resistance at such locations.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventors: Neil Golhardt, Scott Duane Day, Richard A. Lukaszewski, Lawrence D. Radosevich, Bruce W. Weiss
  • Patent number: 7432819
    Abstract: A fluidic cooling assembly for removing heat from electrical equipment includes operational diversity features in which multiple fluid moving devices are mounted in a single housing. The assembly may include a first fluid baffle and a second fluid baffle disposed within the housing so as to define a first and a second control compartment. A first fan and a second fan may be disposed within the first control compartment and the second control compartment, respectively. A first sensor and a second sensor may be configured to sense changes in operation of the first fluid moving device and the second fluid moving device, respectively; and a controller unit configured for receiving signals generated by the first sensor and the second sensor go as to the transmit control signals to the first fan and the second fan.
    Type: Grant
    Filed: July 29, 2005
    Date of Patent: October 7, 2008
    Assignee: Toshiba International Corporation
    Inventors: John D. Kleinecke, Todd A. Willhoit, John T. Kelley
  • Patent number: 7432441
    Abstract: An assembly of modularized housing and door cover includes a modularized housing; a door cover having a upper part thereof formed with at least one sleeve for putting around the axial pin, and a main body thereof formed with a plurality of ventilation openings; a film having a surface thereof partially adhered to peripheral areas of the ventilation openings using an adhesive layer to form loose-leaf connection; and spring accommodated in the axial pin, and having one end thereof pushed against the wall surface and the other end thereof pushed against an inner wall of the door cover. The modularized housing is provided with excellent ventilation effects therein when assembled with power supply device. The accommodating chambers are not assembled with power supply devices, external air in large amounts is prevented from entering into the idle accommodating chamber, thereby forming negative pressure at the interior of the modularized housing.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: October 7, 2008
    Assignee: Super Micro Computer, Inc.
    Inventor: Chien-Fa Liang
  • Patent number: 7430120
    Abstract: An improved induction lighting system is presented where the electronic power supply device powering the induction lamp is insulated and an extensive set of heat sink fins is provided to control the temperature of the power supply. Reduction of power supply device temperature in this manner greatly extends the operational life of these devices. The improved induction lighting system is designed to be retrofitted into existing induction lighting systems, in all indoor and outdoor lighting applications.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: September 30, 2008
    Inventor: Kenneth Lau
  • Publication number: 20080232040
    Abstract: A fast terminal box includes a casing, a cover, plural wiring sockets, plural metal connection components and a plurality of wiring terminals. The wiring sockets are placed and distributed on a bottom plate of the casing one by one. The metal connection component is provided on the wiring socket for connection purpose. The casing and the cover are combined to each other. The wiring terminals are distributed at sidewall of the casing for receiving corresponding wiring plugs therein. The fast terminal box is characterized in heat sink metal fins are contained in a space around the wiring socket, and heat sink metal fins contact pins of a diode and the metal connection component respectively through corresponding connection portions thereof.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 25, 2008
    Inventors: Guoqing LI, Yueming LIN
  • Patent number: 7427566
    Abstract: A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer is etched.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: September 23, 2008
    Assignee: General Electric Company
    Inventors: Kevin Matthew Durocher, Stacey Joy Goodwin, Ernest Wayne Balch, Christopher James Kapusta
  • Publication number: 20080180886
    Abstract: A cooling arrangement is disclosed for electrical components which are arranged in a housing of a soft starter which in particular may be designed for operation of an electric motor. In at least one embodiment, the cooling arrangement includes at least one fan arranged inclined in an opening in a housing wall such that the rotation axis of the fan is at an angle to the normal to the housing wall.
    Type: Application
    Filed: January 16, 2008
    Publication date: July 31, 2008
    Inventors: Marco Dornauer, Norbert Reichenbach
  • Patent number: 7404298
    Abstract: Refrigerator including a body forming an outer appearance of the refrigerator, a terminal detachably mounted on the body for controlling the refrigerator, a power supply device at one side of the body, for receiving power from an outside of the refrigerator, converting to a predetermined charge power, and supplying to the terminal, and an electric connection part connected between the power supply device and the terminal.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: July 29, 2008
    Assignee: LG Electronics Inc.
    Inventors: Jung Ho Kim, Ik Kyu Lee, Ki Cheol Woo
  • Patent number: 7397653
    Abstract: An inverter component layout and mounting bracket are disclosed which allow for electrical components, or the inverter as a whole to be replaced easily in the field. The disclosed mounting bracket and component layout also improve the heat rejection properties of the inverter.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: July 8, 2008
    Assignee: PV Powered, Inc.
    Inventor: Bill Taylor
  • Patent number: 7356386
    Abstract: A method for reducing instantaneous current on startup is applicable to an electronic device with a management controller. The management controller is electrically connected to a startup processing module of the electronic device such that operations of fans equipped in the electronic device can be controlled via this electrical connection relationship. When the electronic device is turned on, operations of the fans in the electronic device are disabled by the startup processing module. Then, when power is detected by the management controller, the smallest amount of current possible for operations of the fans for heat-dissipating purpose is generated by the management controller. Finally, hardware components in the electronic device are initialized by the management controller. The above method solves the problem of system instability due to large instantaneous current on startup in the prior art.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: April 8, 2008
    Assignee: Inventec Corporation
    Inventors: Wh Shin, Chao-Huang Chang, Min-Tsung Huang
  • Patent number: 7336477
    Abstract: A heat sink is for an integrally fused low-voltage power air circuit breaker including a line terminal and electrical bus work coupled to a current limiter. The line terminal, electrical bus work, and current limiter contribute to the formation of a thermal dam. The heat sink includes a heat exchanger structured to be coupled to the line terminal at or about the current limiter in order to expel heat from the thermal dam. The heat exchanger comprises at least one conductive member having a first end, a second end, and a plurality of bends therebetween. The heat exchanger includes heat reduction features, such as, for example, two conductive members having a number of air gaps therebetween to facilitate heat convection, a dark coating to expel heat, materials having a high thermal conductivity, and surface-enlarging mechanisms such as fins, flanges and apertures.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: February 26, 2008
    Assignee: Eaton Corporation
    Inventors: Nathan J. Weister, George A. Smith, Frank K. Ostrowski, Lawrence J. Kapples