With Cooling Means Patents (Class 361/676)
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Patent number: 8787013Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.Type: GrantFiled: September 19, 2011Date of Patent: July 22, 2014Assignee: Amazon Technologies, Inc.Inventors: Michael P. Czamara, Osvaldo P. Morales
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Patent number: 8755187Abstract: Certain exemplary embodiments can comprise a system, which can comprise a basepan comprising a banding stud. The banding stud can be configured to releasably attach a heat sink to the basepan. The heat sink configured to increase a current carrying capacity of a system associated with the basepan from a first predetermined level to a second predetermined level.Type: GrantFiled: June 2, 2006Date of Patent: June 17, 2014Assignee: Siemens Industry, Inc.Inventors: Fan Zhang, Robert E. Henry, Jr.
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Patent number: 8755209Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.Type: GrantFiled: June 25, 2013Date of Patent: June 17, 2014Assignee: Hitachi, Ltd.Inventors: Kenichiro Nakajima, Haruki Hamada, Hideyo Suzuki
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Patent number: 8749051Abstract: A semiconductor device which provides a small and simple design with efficient cooling. A first electrically conducting cooling element is in contact with first electrodes of semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the first electrodes of the semiconductor elements to an external apparatus. A second electrically conducting cooling element is in contact with second electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the second electrodes of the semiconductor elements to an external apparatus. The semiconductor device includes an interface which is electrically connected to gates of the semiconductor elements for external control of respective states of the semiconductor elements.Type: GrantFiled: February 7, 2012Date of Patent: June 10, 2014Assignee: ABB Research LtdInventors: Slavo Kicin, Nicola Schulz, Munaf Rahimo, Raffael Schnell
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Patent number: 8743532Abstract: In order to obtain a switchgear which can improve heat dissipation efficiency, in the switchgear which dissipates heat outside an apparatus vessel, the heat being generated from an electrical apparatus placed in the apparatus vessel, the switchgear includes a first heat conductor in which one side is connected to a heat generation portion of the apparatus vessel and the other side is extended toward the apparatus vessel side, a second heat conductor in which one side is disposed near the other side of the first heat conductor and the other side is extended outside the apparatus vessel, and an insulating member between conductors disposed between the other side of the first heat conductor and one side of the second heat conductor.Type: GrantFiled: August 25, 2009Date of Patent: June 3, 2014Assignee: Mitsubishi Electric CorporationInventors: Tomotaka Yano, Satoru Yoshida, Masahiro Arioka
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Patent number: 8736788Abstract: A liquid crystal display device includes a liquid crystal display panel, a light guide plate disposed on a lower part of the liquid crystal display panel, an LED circuit substrate disposed along at least one side of the light guide plate to accommodate an LED on a front surface thereof, and a heat transmission member having a first part that faces a lower surface of the light guide plate and a second part that is extendedly bent from the first part and faces the LED circuit substrate.Type: GrantFiled: June 12, 2006Date of Patent: May 27, 2014Assignee: Samsung Electronics Co., LtdInventors: Sung Ki Kim, Won-nyun Kim
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Patent number: 8699210Abstract: A system for cooling a multi-cell power supply, the system including a water pump, a water-to-air heat exchanger in fluid communication with the water pump, and a supply water manifold in fluid connection with the water-to-air-heat exchanger. The system further includes a plurality of power cells in fluid communication with the supply water manifold via one or more water hoses, and a multi-winding device in fluid communication with the plurality of power cells via at least one water-cooled bus, wherein the at least one water cooled bus electrically connects the power cells to secondary windings of the multi-winding device. The water-cooled buses provide both electrical current as well as cooling fluid to each winding of the multi-winding device, thereby eliminating a need for separate cooling and power connections.Type: GrantFiled: May 30, 2008Date of Patent: April 15, 2014Assignee: Siemens Industry, Inc.Inventors: Marc F. Aiello, Peter Willard Hammond, Edward Alan Cheesman, Wayne Sheldon Jordan, Jonathan Kunkle
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Patent number: 8699254Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.Type: GrantFiled: August 8, 2008Date of Patent: April 15, 2014Assignee: Hitachi, Ltd.Inventors: Fusanori Nishikimi, Kinya Nakatsu
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Patent number: 8681482Abstract: This disclosure describes examples of an apparatus to enclose components of a switching assembly of an automatic transfer switch. In one embodiment, the apparatus, or arc chamber cover, has a housing made of material with optical properties that permit observation of the interior of the housing. A mounting assembly couples to the housing. The mounting assembly secures the apparatus to the automatic transfer switch. In one example, the mounting assembly comprises feet comprising a material with mechanical properties that can withstand pressure and other forces inside of the interior chamber. The apparatus also includes one or more baffles to control the flow of gasses and control electric arcs within the switching assembly.Type: GrantFiled: January 19, 2012Date of Patent: March 25, 2014Assignee: General Electric CompanyInventors: Suresh Srikantaiah, Arthur Michael Evans, Sudarshan Allada, Pravin Pralhad Kulkarni
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Patent number: 8682203Abstract: A disclosed cooling structure includes a casing including a bottom plate arranged in a bottom portion of the casing and having a through hole formed in the bottom plate; a heat source to be cooled accommodated in the casing; a suctioning unit configured to suction outer air from an outside of the casing to an inside of the casing via the through hole in the bottom plate; an open and close member including an outer air path for carrying the suctioned outer air and being capable of opening and closing relative to the casing; and an outer air applying unit configured to cool the heat source by the carried outer air received from the open and close member.Type: GrantFiled: October 5, 2011Date of Patent: March 25, 2014Assignee: Ricoh Company, Ltd.Inventors: Yuuki Kikushima, Mamoru Takayama, Hiroshi Suzuki, Satoshi Aizawa
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Patent number: 8634220Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.Type: GrantFiled: July 26, 2013Date of Patent: January 21, 2014Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito
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Patent number: 8631890Abstract: The object of the present invention is to provide an electric construction machine capable of efficiently cooling the battery mounted on the swing structure. To achieve the object, there is provided an electric construction machine in which a battery storage room 11 is formed in the swing structure 3 and a plurality of batteries 231 as electric power sources are arranged in the battery storage room 11, comprising: a battery storage structure 23 storing the batteries 231 and having an air flow channel through which air can flow upward from a lower part of the battery storage structure 23; a covering sheet 26 entirely covering the top and side faces of the battery storage structure 23; and a duct 27 for discharging the air, one end of which is arranged in an upper part of the covering sheet 26.Type: GrantFiled: May 24, 2011Date of Patent: January 21, 2014Assignee: Hitachi Construction Machinery Co., Ltd.Inventors: Akira Noguchi, Masayuki Yunoue
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Patent number: 8631411Abstract: A method for controlling a data center, comprising a plurality of server systems, each associated with a cooling system and a thermal constraint, comprising: a concurrent physical condition of a first server system; predicting a future physical condition based on a set of future states of the first server system; dynamically controlling the cooling system in response to at least the input and the predicted future physical condition, to selectively cool the first server system sufficient to meet the predetermined thermal constraint; and controlling an allocation of tasks between the plurality of server systems to selectively load the first server system within the predetermined thermal constraint and selectively idle a second server system, wherein the idle second server system can be recruited to accept tasks when allocated to it, and wherein the cooling system associated with the idle second server system is selectively operated in a low power consumption state.Type: GrantFiled: July 21, 2010Date of Patent: January 14, 2014Assignee: The Research Foundation for The State University of New YorkInventor: Kanad Ghose
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Patent number: 8625256Abstract: Closed busbar system for three-phase low voltage distribution, comprising phase bars that extend lengthways and transverse branch bars, one of which is respectively electrically connected to an associated phase bar. The phase bars are maintained in an inserted manner in a socket of an insulating housing for reducing the cross-section or increasing the power in such a manner that a cooling channel associated with each phase track is formed between the rear side of the phase tracks and the base inner side of the socket.Type: GrantFiled: May 16, 2009Date of Patent: January 7, 2014Inventor: August Schmid
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Patent number: 8614906Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.Type: GrantFiled: March 12, 2012Date of Patent: December 24, 2013Assignee: Hitachi, Ltd.Inventors: Kenichiro Nakajima, Haruki Hamada, Hideyo Suzuki
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Patent number: 8591037Abstract: A projector includes: an external housing; and an exhaust fan configured to suck an air within the external housing and discharges the sucked air to the outside, the external housing has a top and bottom surface crossing a vertical axis, an air discharge port through that the air discharged from the exhaust fan is discharged to the outside, and a side surface that connects the top surface and the bottom surface, the exhaust fan constituted by a turbo fan that has an impeller rotatable around a predetermined rotation axis, and the rotation axis extends along the vertical axis.Type: GrantFiled: March 25, 2011Date of Patent: November 26, 2013Assignee: Seiko Epson CorporationInventors: Toshihiko Nagumo, Hideki Takasuka
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Patent number: 8575479Abstract: In one embodiment, a transformer is provided for coupling between a utility connection and a plurality of power cells of a drive system. The transformer may be of a horizontal arrangement and include a housing and a core configured within the housing and having multiple columns each adapted along a horizontal axis. Each column corresponds to a phase, and each phase includes a coil having primary winding and multiple secondary windings concentrically adapted about the column horizontal axis to provide an air gap between adjacent ones of the primary and secondary windings. In addition, the transformer may include a baffler adapted about the core and configured within the housing to prevent air flow at a periphery of the coils and to direct air flow through the air gaps of the coils.Type: GrantFiled: March 17, 2011Date of Patent: November 5, 2013Assignee: TECO—Westinghouse Motor CompanyInventors: Mehdi Abolhassani, Manzoor Hussain
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Patent number: 8547687Abstract: The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).Type: GrantFiled: October 1, 2009Date of Patent: October 1, 2013Assignee: Koninklijke Philips N.V.Inventors: Alexander Christiaan De Rijck, Hendrik Huisman
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Patent number: 8531821Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.Type: GrantFiled: January 28, 2011Date of Patent: September 10, 2013Assignee: Raytheon CompanyInventors: Eli Holzman, Paul Brian Hafeli, Robert Michael Sterns
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Patent number: 8526801Abstract: The present invention relates to a line connector for media lines, consisting of a connector piece with at least one junction portion for junction connection to a media line or to an assembly and with a transitional portion contiguous to the junction portion and having a flow duct. In this case, at least in the region of the transitional portion, electrical heating means are provided in an arrangement at least partially surrounding the flow duct. Furthermore, the invention relates to a ready-made media line consisting of a pipeline with a heating conductor arranged on the circumference and with a heatable line connector fastened at least to one pipeline end of the media line.Type: GrantFiled: March 19, 2008Date of Patent: September 3, 2013Assignee: VOSS Automotive GmbHInventors: Olav Borgmeier, Eduard Brück, Erb Ulrich, Reiner Gründel, Martin Lechner, Frank Peters, Sascha Rosenfeldt, Otfried Schwarzkopf, Ahmet Gündüz, Marco Isenburg
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Patent number: 8514552Abstract: A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer.Type: GrantFiled: December 17, 2010Date of Patent: August 20, 2013Assignee: Eaton CorporationInventors: Patrick Wellington Mills, James Michael McCormick, Kevin Francis Hanley, Timothy Richey Budd
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Patent number: 8502491Abstract: A rotation direction control method of a cooling fan is disclosed. The rotation direction control method includes a detection step, a determination step and a driving step. The detection step receives a temperature control signal from a temperature detection unit by a rotation direction control unit when a predetermined dust-expelling time period begins. The determination step determines whether a detected temperature is higher than a predetermined value based on the temperature control signal by the rotation direction control unit. The driving step controls the rotation direction control unit to keep outputting a cooling signal so as to drive a motor of the cooling fan for a cooling operation when the determination of the determination step is positive.Type: GrantFiled: December 10, 2010Date of Patent: August 6, 2013Assignee: Sunonwealth Electric Machine Industry Co., Ltd.Inventors: Alex Horng, Ching-Sheng Hung
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Patent number: 8488096Abstract: A liquid crystal display device includes a panel, a heater, and a temperature detector. The panel includes substrates, electrodes and liquid crystal. The electrodes and the liquid crystal are disposed between the substrates. The heater has a transparent heating member, and the heating member emits heat by being supplied with electricity. At least a part of the heating member of the heater is located to overlap with a display area of the panel in a thickness direction of the substrates. A temperature detecting portion of the temperature detector and the heating member of the heater are located adjacent to each other.Type: GrantFiled: March 16, 2012Date of Patent: July 16, 2013Assignee: Denso CorporationInventor: Naoyuki Aoki
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Patent number: 8482924Abstract: The invention provides an apparatus for dissipating heat produced by a laser for lighting projection to enable a passive encapsulated enclosure. The laser is mounted into a collar system which integrates to the internal enclosure body with a single or plurality of bonded extending facet planes. The facet planes can conduct and radiate heat to the internal enclosure body planes which dissipate heat to the outside environment of the closed enclosure as a heat sink.Type: GrantFiled: October 11, 2010Date of Patent: July 9, 2013Inventor: Richard Redpath
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Patent number: 8462487Abstract: A power system for connecting high voltage components includes an enclosure having an interior space. A plurality of high voltage (HV) components are removably coupled to the enclosure and positioned in the interior space of the enclosure. The plurality of HV components are electrically coupled to each other. A motor is positioned outside the enclosure, and the motor is electrically interconnected through the enclosure to one of the HV components. A heat sink is positioned within the interior space for providing thermal heat transfer away from the components.Type: GrantFiled: November 18, 2010Date of Patent: June 11, 2013Assignee: BAE Systems Controls Inc.Inventors: Derek Matthews, Filippo Muggeo, Jurgen Schulte, Brendan Pancheri, Dan Snavely
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Patent number: 8456838Abstract: Arc resistant enclosures for dry-type transformers. More particularly, transformer enclosures having one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums, and methods for providing same.Type: GrantFiled: February 28, 2011Date of Patent: June 4, 2013Assignee: ABB Inc.Inventors: Robert C. Ballard, Nathan T. Sigman, Edgar A. Wimmer, Jr., Rafael Gutierrez, Jr.
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Patent number: 8451589Abstract: A metal clad switchgear assembly comprising multiple compartments defined within an electrical enclosure is provided. The compartments interchangeably accommodate electrical components, for example, current transformers, a circuit breaker, a control power transformer, an epoxy encapsulated potential transformer, etc., electrical cables, and bus bars in predetermined positions for allowing front access and/or rear access to them. One or more compartments are configured for enabling the electrical cables to enter into and/or exit out from the electrical enclosure for allowing front and/or rear access to the electrical cables. A mounting block assembly is positioned in one or more of the compartments for mounting, enclosing, and providing front access to the electrical components.Type: GrantFiled: June 2, 2011Date of Patent: May 28, 2013Assignee: Abd El & Larson Holdings LLCInventors: Predrag Milovac, Ashok BabuRao Kulkarni, Edward Joseph Rossi, Dennis Wayne Sapp
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Patent number: 8369067Abstract: An electricity feeding control device is provided with an air hole (31c) which is formed by penetrating a part of a peripheral wall of a body (31) constituting a part of a housing case (3). The housing case (3) is provided in its inside with an inner pressure adjusting sheet (5), formed with a breathable and waterproof member, and arranged so as to cover the air hole (31c) from the inside of the housing case (3). The air hole (31c) comprises a long recess (31c2) formed in an outer surface of the body (31), a communicating hole (31c1) consecutively formed in one end of a longi-tudinal direction of the recess (31c2) and communicated with an inner surface of the body (31), and a shielding plate (33) attached in the outer surface of the body (31) so as to cover a region other than the other end of the longitudinal direction of the recess (31c2), in a region of an opening section (31c3) of the recess (31c2).Type: GrantFiled: November 17, 2010Date of Patent: February 5, 2013Assignees: Panasonic Corporation, Toyota Jidosha Kabushiki KaishaInventors: Shinichi Nakamura, Kouji Kakiuchi, Tatsuya Mukai, Shiro Mori, Hirotoshi Watanabe, Naoki Fukuo, Yoji Minami, Kazuhiro Kondou
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Patent number: 8363387Abstract: A converter arrangement comprising a switchgear cabinet for a plurality of converter assemblies forming respective main modules and each consisting of submodules, formed as a switching module and a capacitor module. The switchgear cabinet has connection devices for electrical connection of the converter assemblies and also, for each converter assembly, a rail system for the mechanical arrangement thereof. The capacitor module has a DC voltage contact device for electrical connection to the assigned switching module, and also sliding elements. The switching module has a cooling device, power semiconductor modules and also dedicated sliding elements. The sliding elements of the submodules are arranged in a stacked manner in the same rails of the rail system of the switchgear cabinet.Type: GrantFiled: November 1, 2010Date of Patent: January 29, 2013Assignee: Semikron Elektronik GmbH & Co., KGInventors: Francois Vanhyfte, Briag Allain
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Patent number: 8355244Abstract: An electric power converter has a semiconductor module having a semiconductor element integrally and at least a pair of semiconductor terminals, a capacitor electrically connected to the semiconductor module, and a cooler that thermally contacts to at least one of a plurality of capacitor terminals provided in the capacitor. The capacitor terminals that thermally contact the cooler are arranged between the cooler and the capacitor.Type: GrantFiled: April 14, 2010Date of Patent: January 15, 2013Assignee: Denso CorporationInventors: Mitsunori Kimura, Yukitoshi Narumi, Masaya Tonomoto
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Patent number: 8339772Abstract: A thermally efficient electrical enclosure includes a busbar, a metallic heat sink, and an electrical insulator. The busbar is positioned entirely within the enclosure and electrically insulated from the enclosure. The metallic heat sink is attached to a wall of the enclosure. The electrical insulator physically contacts the busbar and is at least partially wrapped around at least two non-parallel surfaces of a portion of the metallic heat sink such that the metallic heat sink is electrically insulated from the busbar. The metallic heat sink is configured to transfer thermal energy or heat from the busbar to the enclosure such that the thermal energy is lost or transferred to the surrounding environment, which reduces the temperature of the busbar and the amount of copper needed for the busbar without reducing the rating of the enclosure.Type: GrantFiled: November 8, 2010Date of Patent: December 25, 2012Assignee: Schneider Electric USA, Inc.Inventors: Hildegard Peralta, Ezequiel Salas, Mauricio Diaz
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Patent number: 8278582Abstract: The present invention discloses a circuit breaker comprising: a vacuum chamber; a fixed contact and a movable contact disposed in a vacuum chamber; a fixed contact stem supporting said fixed contact in said vacuum chamber and extending outwards from a first end of said vacuum chamber; a movable contact stem supporting said movable contact in said vacuum chamber for reciprocal movement between contact with and separated from said fixed contact, and extending outwards from a second end of said vacuum chamber; a first electrical conductor coupled to said fixed contact stem; a second electrical conductor coupled to said movable contact stem; at least one heat dissipating means disposed for at least one of said fixed contact and movable contact; wherein, the heat dissipating means is hollow and has an external surface and internal surface; a plurality of fins provided on said internal surface constitute a passage through which air is convected in a direction parallel to that of reciprocal movement of movable contaType: GrantFiled: December 5, 2008Date of Patent: October 2, 2012Assignee: ABB Technology Ltd.Inventors: Zhanwei Tu, Shailendra Singh
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Patent number: 8270170Abstract: Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.Type: GrantFiled: August 4, 2009Date of Patent: September 18, 2012Assignee: Clustered Systems CompanyInventors: Phillip N. Hughes, Robert J. Lipps
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Publication number: 20120229959Abstract: The invention provides a variable impedance device including a first bus bar refrigeration system, a first bus bar thermally connected to the first bus bar refrigeration system to be maintained at a target bus bar temperature by the first bus bar refrigeration system, a variable impedance component refrigeration system, a variable impedance component electrically connected to the first bus bar and thermally connected to the component refrigeration system, a variable impedance component may be at least partially made of a material that is superconducting below a critical temperature and may be maintained at a target component temperature, wherein the target bus bar temperature may be between the 300K and critical temperature and the target component temperature may be below the critical temperature and a second bus bar connected to the variable impedance component so that current flows between the first and second leads through the variable impedance component.Type: ApplicationFiled: March 12, 2012Publication date: September 13, 2012Applicant: Grid Logic IncorporatedInventor: Matthew J. HOLCOMB
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Patent number: 8243453Abstract: Cooling arrangement for an electrically conductive element in an electrical installation. A casting body (3) is provided for electrically isolating the electrically conductive element (2). The casting body has an outer wall, part of which forms a contact surface 5 (5) for contact with a heat conducting surface (1) of the electrical installation. The outer wall of the casting body (3) is provided with an electrically conductive layer (4; 7) at its outer surface.Type: GrantFiled: April 16, 2008Date of Patent: August 14, 2012Assignee: Eaton Electric B.V.Inventors: Marcel Berend Paul Van Dijk, Arend Jan Willem Lammers, Gerard Cornelis Schoonenberg, Frederik Paul Schoten, Johannes Josephus Gerardus Van Thiel, Brad Robert Leccia
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Patent number: 8239074Abstract: System and method for controlling a fan. A value may be received for controlling the fan. The value may include a first number of bits and may correspond to a linear function of temperature. A first value may be determined using a first number of bits of the value. A modification to the first value may be determined based on a second number of bits of the value. A new output value may be generated based on the first value and the modification to the first value. The new output value may correspond to a first nonlinear function of temperature. The new output value may be provided for controlling the fan.Type: GrantFiled: May 27, 2010Date of Patent: August 7, 2012Assignee: Standard Microsystems CorporationInventors: Leonid A. Bekker, Robert W. Schoepflin
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Patent number: 8232637Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.Type: GrantFiled: April 30, 2009Date of Patent: July 31, 2012Assignee: General Electric CompanyInventors: Richard Alfred Beaupre, Peter Almern Losee, Xiaochun Shen, John Stanley Glaser, Joseph Lucian Smolenski, Adam Gregory Pautsch
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Patent number: 8233278Abstract: A cabinet for a solar power inverter is described. A solar power inverter receives DC current from a solar panel and transforms the DC current into AC current. To cool the inverter equipment, an air inlet receives ambient air drawn into the cabinet by an air pressurizer. The ambient air is urged into a pressurized air plenum, from which two ports channel the air into at least two air paths to flow over the equipment in the cabinet. The equipment in the cabinet is arranged such that the air passes over more heat-sensitive equipment before reaching less heat-sensitive equipment. The equipment in the cabinet can be separated by grounded, metal walls to contain and diminish electromagnetic interference. The equipment may be accessed from a single, front side of the cabinet.Type: GrantFiled: November 11, 2009Date of Patent: July 31, 2012Assignee: Advanced Energy Industries, Inc.Inventors: Brian J. Hoffman, Steven G. Hummel, Jon Ronhaar, Andrew Olseene
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Publication number: 20120154987Abstract: A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer.Type: ApplicationFiled: December 17, 2010Publication date: June 21, 2012Inventors: PATRICK WELLINGTON MILLS, James Michael McCormick, Kevin Francis Hanley, Timothy Richey Budd
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Patent number: 8199507Abstract: An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one integrated circuit (IC) chip. The first heat sink is also disposed internal to the housing and is thermally connected to the at least one IC chip. The second heat sink is connected to the housing such that at least a portion thereof is externally disposed to the housing. The second heat sink is thermally connected to the first heat sink via an aperture in the housing.Type: GrantFiled: December 16, 2009Date of Patent: June 12, 2012Assignee: OpenPeak Inc.Inventors: Yuval Shohet, Teerapat Theerawong
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Publication number: 20120139256Abstract: A wind turbine installation includes a foundation and a wind turbine tower erected on the foundation. A self-contained external enclosure is located proximate to a base of the tower. The enclosure is pre-assembled and includes a plurality of power production components contained therein. The enclosure is pre-assemble and pre-wired with the power production components independent of the tower and can be subsequently mated to the tower via disconnectable cables at the wind turbine site.Type: ApplicationFiled: October 6, 2011Publication date: June 7, 2012Applicant: GENERAL ELECTRIC COMPANYInventors: Richard A. Gajewski, Stefan Voss, Oscar Fernando Hoyt, Kevin Mark Bloomstran
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Patent number: 8189324Abstract: A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.Type: GrantFiled: December 7, 2009Date of Patent: May 29, 2012Assignee: American Superconductor CorporationInventor: Douglas C. Folts
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Publication number: 20120127638Abstract: A power system for connecting high voltage components includes an enclosure having an interior space. A plurality of high voltage (HV) components are removably coupled to the enclosure and positioned in the interior space of the enclosure. The plurality of HV components are electrically coupled to each other. A motor is positioned outside the enclosure, and the motor is electrically interconnected through the enclosure to one of the HV components. A heat sink is positioned within the interior space for providing thermal heat transfer away from the components.Type: ApplicationFiled: November 18, 2010Publication date: May 24, 2012Applicant: BAE SYSTEMS CONTROLS INC.Inventors: Derek Matthews, Filippo Muggeo, Jurgen Schulte, Brendan Pancheri, Dan Snavely
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Publication number: 20120113569Abstract: A thermally efficient electrical enclosure includes a busbar, a metallic heat sink, and an electrical insulator. The busbar is positioned entirely within the enclosure and electrically insulated from the enclosure. The metallic heat sink is attached to a wall of the enclosure. The electrical insulator physically contacts the busbar and is at least partially wrapped around at least two non-parallel surfaces of a portion of the metallic heat sink such that the metallic heat sink is electrically insulated from the busbar. The metallic heat sink is configured to transfer thermal energy or heat from the busbar to the enclosure such that the thermal energy is lost or transferred to the surrounding environment, which reduces the temperature of the busbar and the amount of copper needed for the busbar without reducing the rating of the enclosure.Type: ApplicationFiled: November 8, 2010Publication date: May 10, 2012Applicant: Schneider Electric USA, Inc.Inventors: Hildegard Peralta, Ezequiel Salas, Mauricio Diaz
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Patent number: 8156358Abstract: Infrastructure power resources of a chassis information handling system are made available to run chassis information handling system modules when infrastructure devices are not using the power resources. For example, cooling fans that cool information handling system modules supported by an information handling system chassis run at variable speeds having variable power consumption. A power reserve maintained to run the cooling fans at full speed if needed is made available to information handling system modules when under power management by a chassis manager.Type: GrantFiled: February 19, 2009Date of Patent: April 10, 2012Assignee: Dell Products L.P.Inventors: Alan Brumley, Jaydev Reddy, Ashish Munjal, Arun Munhalyan
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Patent number: 8154871Abstract: According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating fins projecting toward a second housing, a first flow-in portion provided to the first housing to be open in one of first directions, a second heat radiating member receiving heat generated by a second heat generating body, and including a plurality of second heat radiating fins projecting toward a first housing, and a first flow-out portion provided to the second housing to be open in one of second directions crossing the first directions. The cooling structure includes a cooling fan unit configured to supply the air that has flown from outside to the first heat radiating fins, thereafter supply the air to the second heat radiating fins and cause the air to flow to the outside.Type: GrantFiled: July 27, 2010Date of Patent: April 10, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Shinichi Kuwahara
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Patent number: 8140195Abstract: A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.Type: GrantFiled: May 30, 2008Date of Patent: March 20, 2012Assignee: International Business Machines CorporationInventors: Jason Aaron Matteson, William Joseph Piazza
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Patent number: 8134323Abstract: A medium voltage variable frequency drive having a 2-high controller configuration with a dual bus system is described. The drive control system includes at least one motor control cabinet housing a fused medium voltage bypass controller, a non-fused transfer controller positioned above the fused medium voltage bypass controller, an extendable output bus coupled to the non-fused medium voltage transfer controller, and an extendable supply bus coupled to the fused medium voltage bypass controller. The drive control system further includes a variable frequency drive cabinet housing a variable frequency drive. The variable frequency drive is coupled to the extendable output bus and a power supply line. The power supply line may be further coupled to the extendable supply bus. The drive control system includes at least one cabling transition cabinet housing cabling between the at least one motor control cabinet, the power supply line, and the variable frequency drive.Type: GrantFiled: February 18, 2009Date of Patent: March 13, 2012Assignee: Toshiba International CorporationInventors: Alex Leung, Enrique Martinez, John Kleinecke
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Patent number: 8125777Abstract: Methods and apparatus for electrical components according to various aspects of the present invention may be implemented in conjunction with an electrical system comprising a heat generating component and a cooling system. The cooling system may comprise a cooling channel and a coolant. The coolant is disposed within the cooling channel and in thermal contact with the heat generating component.Type: GrantFiled: July 2, 2009Date of Patent: February 28, 2012Assignee: CTM Magnetics, Inc.Inventors: Grant MacLennan, Benjamin Richie
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Patent number: 8119908Abstract: The electricity transmission device comprises prolonged rigid conductors made of copper, and also a connector comprising a network of flexible elements, such as brazed tubes with cooling channels for the conductors, that enables angular displacements between the successive segments and therefore gives a flexibility absorbing small displacements of the device. A lifting manoeuvre system is associated with the segments. The segments may be joined to other elements of the device through connections with jaws enabling slipping.Type: GrantFiled: February 9, 2007Date of Patent: February 21, 2012Assignees: Areva NC, Commissariat a l'Energie AtomiqueInventors: Jacques Lacombe, Patrice Brun, Thierry Flament, Eric Chauvin, Antony Prod'Homme