Abstract: An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.

Abstract: A data center cabinet has a base frame with a pair of front vertical posts, first bottom and top side-to-side beams connected to the front vertical posts, a pair of back vertical posts, second bottom and top side-to-side beams connected to the back vertical posts, and front-to-back beams connecting the front vertical posts and back vertical posts. The first and second bottom side-to-side beams each comprise an opening configured to allow a removable transport caster to pass through the opening, a first set of keyholes configured to receive and retain a set of mounting buttons of a first removable transport caster, and a second set of keyholes configured to receive and retain a set of mounting buttons of a second removable transport caster.

Abstract: Systems and methods for thermally managing display assemblies are provided. An airflow pathway extends within a housing for an electronic display and includes a storage area at least partially defined by a partition. A loopback channel forms a pathway about an equipment storage device for accepting electronic equipment located within the storage area. The loopback channel accepts a flow of air in the airflow pathway when a fan unit for moving the air through the airflow pathway is activated.

Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.

Abstract: A method for processing data between host computer and CPLD provides a host computer, a circuit board comprising a UART unit, a pre-debugged hardware, and a CPLD. The UART unit communicates with the host computer via UART. The method further provides the CPLD coupled between the UART unit and the pre-debugged hardware and allows the CPLD to receive data from the host computer via the UART unit and to analyze the data. According to the method, the CPLD debugs the pre-debugged hardware according to the analyzed data and obtains a result of debugging. The CPLD outputs the result and allows the CPLD to transmit the result to the host computer via the UART unit. A system using the method is also provided.

Abstract: Data center management over a power plane, including: coupling, via a plurality of power planes, a management hub to one or more servers; and transferring, via the plurality of power planes, data between the management hub and the one or more servers.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may: store, by an integrated circuit (IC) of an information handling system (IHS), first multiple fan speed values and second multiple fan speed values; determine, by the IC, that a baseboard management controller is impaired to control fans of the IHS; if the IHS is in the information processing mode: provide, by the IC, the first multiple fan speed values to fan modules; and set, by the fan modules, fan speeds of fans of the IHS based at least on the first multiple fan speed values; and if the IHS is not in the information processing mode: provide, by the IC, the second multiple fan speed values to the fan modules; and set, by the fan modules, the speeds of the fans based at least on the second multiple fan speed values.

Abstract: A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.

Abstract: Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

Abstract: A memory module assisting in efficient heat dissipation includes a motherboard, a plurality of fixing devices, a plurality of memory cards, and a plurality of dummy memory cards. The fixing devices are fixed on the motherboard side by side. The memory cards are fixed on some of the fixing devices as necessary, and the dummy memory cards are fixed on the remaining fixing devices which are vacant. The dummy memory cards inserted into the vacant fixing devices prevent the flow of air through the space above the vacant fixing devices. An electronic device including the memory module is also disclosed.

Abstract: There is disclosed in one example, an encasement for a mobile computer, including: an external casing in a clamshell form factor, the external casing including a base, a secondary display chassis hingedly connected to the base at a secondary hinge, and a primary display chassis hingedly connected to the secondary display chassis at a primary hinge disposed at a removed edge of the secondary display chassis from the secondary hinge, the primary display chassis to substantially overlay the secondary display chassis and the base when the primary hinge is in a closed position; and pivot means disposed to substantially bias the secondary hinge against movement from a selected position in at least one direction in the absence of an electrical input.

Abstract: A VR integrated machine and a running method thereof are provided. The VR integrated machine includes a heat generating device, a heat conducting member and thermoelectric conversion member, the heat conducting member is connected with the heat generating device, the thermoelectric conversion member has a first end connected with the heat conducting member, and is configured to generate electrical energy and to supply the electrical energy to the UR integrated machine.

Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

Abstract: An electronic device is disclosed. The electronic device discloses a plurality of wireless charging antennas, a plurality of shielding partition layers, at least some of the plurality of shielding partition layers disposed between the plurality of wireless charging antennas, a plurality of external device-receiving grooves formed through spaces defined between pairs of the shielding partition layers, and a processor electrically coupled to the plurality of wireless charging antennas. The processor is configured to: determine whether at least one external device is inserted into at least one of the plurality of external device-receiving grooves, and when the at least one external device is inserted into the at least one of the plurality of external device-receiving grooves, wirelessly transmit power through at least one wireless charging antenna corresponding to the at least one of the plurality of external device-receiving grooves into which the at least one external device is inserted.

Abstract: A system includes a data shuttle with rows of data storage devices, which are communicatively coupled to a shared printed circuit board assembly. Each row includes multiple data storage devices. The printed circuit board assembly is configured to communicatively couple to a first controller to enable storing data to the data storage devices and to communicatively coupled to a second controller to enable transferring data from the data storage devices.

Abstract: This disclosure is related to a thin type counter-rotating axial air moving device. The ratio of the front hub diameter to the front blade diameter is about 0.3 to about 0.85. The front average pitch angle of the front blades is greater than about 46 degrees. The ratio of the rear hub diameter to the rear blade diameter is about 0.3 to about 0.85. The rear average pitch angle of the rear blades is less than about 38 degrees. The ratio of the total thickness to the greater one between the front blade diameter and the rear blade diameter is less than or equal to about 0.75.

Abstract: An electronic device having a function expansion assembly includes a host, and a function expansion assembly for function expansion of the host. The host includes an opening and a fixing portion. The function expansion assembly includes a functional module and an anti-collision module. The functional module includes an expansion circuit board and an expansion connector disposed on the expansion circuit board. The expansion circuit board is detachably fixed at the fixing portion. The anti-collision module includes a covering and a lid. The covering is detachably fixed at the host and covers the opening, and includes an insertion slot. The lid corresponds to the position of the insertion slot, and is connected in a liftable and covering manner to the covering. The lid blocks the expansion connector by covering the insertion slot.

Abstract: The present disclosure discloses a split mobile phone radiator. The split mobile phone radiator includes a protective cover. An accommodating groove is formed in the top of the inner wall of the protective cover. A refrigeration module is separably arranged on the top surface, far away from the accommodating groove, of the protective cover. The refrigeration module includes a semiconductor refrigeration mechanism, a radiating mechanism used for cooling the semiconductor refrigeration mechanism, and a rear cover wrapping around the semiconductor refrigeration mechanism and the radiating mechanism. A heat conducting silica gel sheet is arranged on one side, close to the protective cover, of the rear cover. According to the present disclosure, the whole refrigeration module fits the top of the protective cover, so that the mobile phone radiator is directly attached to the back side of the mobile phone, and the mobile phone radiator has a split function.

Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.

Abstract: A method for determining the positions of a number of fans (Vn,m) for generating an air flow in a preferably enclosed space. The fans (Vn,m) have an acceleration sensor to determine their position. The fans (Vn,m) are arranged in rows (R1, R2, . . . , Rn) and columns (S1, S2, . . . , Sm). At least the position (i, j) of one fan (Vi,j) is known.

Abstract: A server chassis includes a main frame, a fan module, and a flow-guiding device. The fan module and the flow-guiding device are in the main frame. The flow-guiding device includes a plurality of plate bodies. The plate bodies are parallel to each other and are spaced apart from each other by a spacing. Each of the plate bodies has a plurality of openings. The plurality of openings of one of the plate bodies are arranged alternately with those of another plate body adjacent to the one of the plate bodies.

Abstract: A fan-equipped heatsink includes: a heat receiving substrate made of metal; a centrifugal fan disposed on an upper surface side of the heat receiving substrate; a plate-shaped wall that is made of metal, is provided so as to stand at a position, on the upper surface of the heat receiving substrate, which is around and opposed to an outer peripheral portion having an air discharge opening of the centrifugal fan, and are provided with a plurality of through-holes that are open in a plate surface opposed to the centrifugal fan; and a lid member fixed to an upper end of the plate-shaped wall 4 and configured to close a space on the inner side of the plate-shaped wall.

Abstract: A system and method for cooling components and a chassis in a portable information handling system includes a pressure barrier that divides the chassis into a plurality of zones, an evacuative fan in a first zone to generate airflow across components to cool the components and a hyperbaric fan in a second zone to increase air pressure in the second zone. The pressure barrier may provide thermal isolation, acoustic dampening and electromagnetic insulation. A controller communicatively coupled to the fans can operate each fan independently to cool components for improved performance and maintain a surface temperature of the chassis below a temperature for user comfort.

Abstract: According to one embodiment, an immersion cooling system includes a coolant tank that has liquid coolant and contains at least partially submerged within the liquid coolant 1) a thermoelectric cooling (TEC) element that is coupled to an information technology (IT) component that is mounted on a piece of IT equipment, and 2) a heat sink that is coupled to the TEC element, wherein the TEC element is configured to transfer heat generated by the IT component into the liquid coolant via the heat sink.

Abstract: An information handling system having a heat exchanger positioned near and in thermally-conductive conduct with an electrical, heat-generating component of the information handling system, such as a central processing unit or graphics processing unit. A fan directs air across the heat exchanger to cool the electrical component by convection. A first portion of the heat pipe may be in direct physical contact with the electrical component and a second portion of the heat pipe may be in thermal contact with the electrical component and the first portion and in direct physical contact with an additional heat exchanger. The fan may direct air across both heat exchangers to cool the electrical component.

Abstract: A blowing system includes: a first blowing unit including a first body that houses a first fan and includes a first air outlet for blowing-out wind from the first fan; a second blowing unit including a second body that houses a second fan, includes a second air outlet for blowing-out wind from the second fan, and has a shape that is in two-fold symmetry with the first body; and a first connection that rotatably-connects an edge on a back face-side of a first side face of the first body and an edge on a back face-side of a second side face of the second body so that an angle formed by the first and second bodies is variable. The first and second blowing units come into contact at three or more points, and the directions of respective rotation axes of the first and second fans cross at a predetermined angle.

Abstract: Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.

Abstract: The present invention belongs to the technical field of hard disk device, and specifically relates to a Hard Disk Device Based on Blockchain. The hard disk device comprises a storage unit and a protection unit; wherein a hard disk body stores information in the blockchain; the protection unit comprises a protective case, an airbag and an interface extension board; the airbag is laid flat on the inner bottom of the protective case; the interface extension board passes through a side wall of the protective case and is bolted to the protective case; a dust board in a first through hole of the interface extension board is located at the port on the interface extension board close to the hard disk body when the hard disk body is not placed in the protective case; the dust board is connected to the inside of the first through hole by a first spring.

Abstract: An information handling system includes a baseboard management controller (BMC) and a cooling module that receives a control signal from the BMC. The cooling module includes an air mover assembly, and a foam gasket that is disposed in between the air mover assembly and the bulkhead. A cam assembly has a cam lever holder that draws in a compression bracket to provide axial stress to the air mover assembly, a bulkhead, and the foam gasket.

Abstract: A heat dissipation device of a display apparatus and a method for dissipating heat of a display apparatus, and a display device are provided. The heat dissipation device includes a front cover assembly including a front cover, a support assembly including a support base, and a rear cover assembly including a rear cover and a heat dissipation component. The front cover is provided with a heat dissipation control switch and a receiving groove configured to receive the display apparatus. The support base is slidably mounted in first sliding grooves respectively provided on both sides of the receiving groove. The rear cover is provided with an air inlet and an air outlet. When the display apparatus is inserted into the receiving groove, the support base slides under weight of the display apparatus, to press the heat dissipation control switch, to control the heat dissipation component to dissipate heat.

Abstract: A fan package of an information handling system includes a rear cooling fan, a front cooling fan, and a fan fin package. The rear cooling fan generates a first airflow. The front cooling fan generates a second airflow. The fan fin package is in physical communication with the rear cooling fan and the front cooling fan. The fan fin package includes multiple fins. Based on the first airflow and the second airflow, the fins rotate between a closed position and an open position. The fins are biased toward the closed position.

Abstract: A system includes a network element having a housing that is configured for front-to-rear airflow; and a cooling apparatus located adjacent to the network element and having a housing that forms a cavity that is closed by the housing of the network element, wherein the cooling apparatus includes one or more fan units that are accessible via front access and wherein the one or more fan units are configured to draw the front-to-rear airflow from the network element into the cavity. This enables a front-to-back airflow design with rear fan access to be converted into a front-to-back airflow design with front fan access.

Abstract: An information handling system includes a memory device having a voltage regulator enabled by a command from a processor. The memory device provides an indication to a logic device that the voltage regulator successfully powered up the memory device. A failure to provide the indication within a time duration indicates that the voltage regulator failed to successfully power up the memory device. The logic device determines that the processor issued the first command, sends a second indication to the processor indicating that the first voltage regulator successfully powered up the first memory device when the first indication is received within the first time duration after determining that the processor issued the first command, and sends a third indication to the processor that the first voltage regulator failed to successfully power up the first memory device when the first indication is not received within the first time duration after determining that the processor issued the first command.

Abstract: A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel.

Abstract: An outdoor unit includes a housing that includes a front panel having an outlet for an airflow, a back panel facing the front panel, a left side panel, a right side panel facing the left side panel, a bottom panel, and a top panel facing the bottom panel. The outdoor unit further includes a control substrate that is provided in the housing and provided with an electric component, an electric component box in which the control substrate is provided, and a heat dissipator that is provided between the top panel and the electric component box and dissipates heat generated by the electric component. A second region surrounded by the heat dissipator, the back panel, the front panel, the electric component box, and the top panel is formed on a windward side of the heat dissipator.

Abstract: Examples of hinge assemblies are described. In an example, a hinge assembly includes a first hinge element having a first shaft, a second hinge element having a second shaft, and a clip coupling the first shaft to the second shaft. The clip includes a first portion formed of c a composite material and a second portion formed of a metal.

Abstract: The present invention is an HVAC fan array wiring system that provides a quick connect box that is provided within the air stream of an HVAC air handler. Because the wiring for each fan within the fan array is to be connected to the quick connect box, the wiring materials and placement of the wiring can be predetermined at the time the fan array is designed. Accordingly, the novel wiring system and quick connect box reduces redundancies in manufacturing and installation of the fan array. Furthermore, the quick connect box and wiring system allows for easy installation of the HVAC fan array at a job site and improves a customer's experience with the control panel. This is primarily because, with the use of the claimed invention, an electrician need only link a main control and power line to the quick connect box and therefore, can install the control panel in a location that provides ease of access to the customer.

Abstract: A case assembly includes a case body including a bottom panel, two side panels, a back panel higher than the side panels, a mounting structure located on the side panels, a first circuit board mounted on the bottom panel and a second circuit board mounted on the back panel and electrically connected to the first circuit board, and a cover including a top cover panel for covering the top open side of the case body, a front cover panel pivotally connected to the top cover panel for covering the front side of the case body and a positioning structure located on the bottom side of the top cover panel for detachably fastened to the mounting structure of the case body through a sliding action facilitating repair or replacement of the first circuit board or the second circuit board.

Abstract: A closed cold pool system is disclosed. The closed cold pool system may include a first closing assembly, a cabinet assembly and a second closing assembly. The first closing assembly is provided on a front side of the cabinet assembly to form a first closed cold aisle, and the second closing assembly is provided on a rear side of the cabinet assembly to form a second closed cold aisle. The cabinet assembly may include a power distribution cabinet, an in-row air conditioner and a main device unit that are provided side by side. The in-row air conditioner may include a front air supply opening, a rear air supply opening and a top air return opening. The front air supply opening is communicated with the first closed cold aisle, and the rear air supply opening is communicated with the second closed cold aisle.

Abstract: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The devices are positioned on shelves in racks and are connected via network switches. The computing devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack into a hot aisle, and each position is offset from positions on neighboring shelves above and below the current shelf. The racks can be offset, or the positions within the racks can be offset. Each computing device on the rack can also be angled horizontally and or vertically to improve airflow. Multiple racks can be configured together into sloped regular polygons, with the interior forming the hot aisle, and deflectors can be installed to further improve airflow.

Abstract: A foolproof frame assembly includes a blocking component fixed on a case, and first and second frames disposed on opposite sides of the case. Each of the first and second frames has a foolproof component fixed to one of two side plates thereof and blocking one of two through holes on its bottom plate. When the first frame is in a first mounting position, the blocking component passes through another through hole and form a space with another side plate of the first frame for one of two mounting side plates of the mounting frame to be disposed therethrough. When the second frame is in the first mounting position, a space occupied by its foolproof component overlaps a space occupied by the blocking component. When the first and second frames are respectively in the first and second mounting positions, the foolproof components block the two mounting side plates.

Abstract: Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Abstract: In an UPS system, following components are arranged in a machine cabinet: an AC-to-DC converter connected to a DC voltage link on its output side, a DC-to-AC converter connected to the DC voltage link on its input side; a motor/generator electrically connected to the DC voltage link and having a flywheel coupled to its rotor; a bypass to the AC-to-DC converter and the DC-to-AC converter connected in series, a bypass switch being arranged in the bypass; a controller; and a blower which draws air out of the surroundings through air filters, blows the air in the machine cabinet through a heat exchanger, and ejects the air again. The heat exchanger is arranged in a coolant circuit together with a coolant pump, cooling bodies for the power output stages, and coolant channels which include stator channels running through a stator of the motor/generator.

Abstract: A fan impeller structure includes a hub and a blade set. The hub has a top wall and a circumferential wall extending from a circumference of the top wall. The blade set has multiple upper blades and multiple lower blades. The upper and lower blades are alternately arranged on the circumferential wall. Each upper and lower blade respectively has a first windward face and a second windward face which is extending in a different direction from the first windward face. The first windward face is disposed in such a direction as to face the rear edge of the lower blade on the lower side, while the second windward face is disposed in such a direction as to face the rear edge of the upper blade on the upper side.

Abstract: A cooling fan module includes a fan unit and an air flow blocking unit. The air flow blocking unit includes a left-side plate, a left-side support pole, a left-side air flow blocking plate, a right-side plate, a right-side support pole, a right-side air flow blocking plate, and a stop member. The left-side air flow blocking plate and the right-side air flow blocking plate are blown by an air flow flowing from outside environment into a case through the fan unit that is in a malfunction state, thereby rotating by respectively taking the left-side support pole and the left-side support pole as a rotary center thereof. Consequently, the left-side air flow blocking plate and the right-side air flow blocking plate are stopped rotating by the stop member, such that the air flow is blocked, by the two air flow blocking plates, from being entering the case.

Abstract: The embodiments of the present disclosure provide a heat dissipation structure, applied to an electronic device. The electronic device includes a power consumption element, and the power consumption element disposed in an accommodation cavity. The heat dissipation structure includes a cover, configured to cover and seal the accommodation cavity. The cover is thermally connected to the power consumption element through a heat-conducting element. The heat dissipation structure further includes a heat-dissipation component, thermally connected to the cover and including a heat-dissipation module and a fan. The heat-dissipation module is disposed in an air outlet channel of the fan, such that the wind generated by the fan takes away the heat of the heat-dissipation module.

Abstract: A method for controlling a fan group in order to generate a predefined total volumetric flow. The group of fans has a plurality of individual fans operated in parallel. Each generates an individual volumetric flow. The group of fans is divided into at least a first and a second control group. Each group has at least one fan. The individual volumetric flow of at least one fan of the first control group is increased by adjusting into a range of optimum efficiency by a speed change. This maintains constant flow. The individual volumetric flow of at least one fan of the second control group is reduced accordingly by a rotational speed reduction. All the fans contribute to the total volume flow at all times and no fan of the second control group will be switched off at any time.

Abstract: Certain aspects direct to systems and methods for platform simulation for development projects of a management controller, such as a baseboard management controller (BMC). The management controller stores a firmware module and a simulator module. The firmware module is supposed to receive thermal output signals from cooling zones of a computing device. The simulator module is a software implemented module used to simulate the cooling zones, by generating the thermal output signals of the cooling zones based on configuration data stored in a data store, and sending the simulated thermal output signals to the firmware module for development and testing purposes.

Abstract: An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.

Abstract: A heat dissipation structure of a heat generating component includes a heat conductive plate that includes a heat receiving connecting part thermally connected to the heat generating component and a heat dissipation connecting part thermally connected to the chassis and an air cooling fan that generates cooling air for cooling the heat conductive plate. The heat conductive plate further includes a first heat dissipation area from which heat is dissipated by flowing the cooling air along a surface of the plate and a second heat dissipation area that is bent and extends from the first heat dissipation area so as to cross an advancing direction of the cooling air that flows along the surface of the plate at the first heat dissipation area, and from which heat is dissipated by receiving the cooling air that has flown along the surface of the plate at the first heat dissipation area.