Plurality Of Air Streams Patents (Class 361/679.5)
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Patent number: 7990704Abstract: An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.Type: GrantFiled: December 8, 2009Date of Patent: August 2, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Hao-Der Cheng
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Patent number: 7983038Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.Type: GrantFiled: May 19, 2009Date of Patent: July 19, 2011Assignee: Ortronics, Inc.Inventors: Stewart A. Levesque, Lars R. Larsen
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Patent number: 7974094Abstract: An outdoor equipment cabinet includes a housing with an equipment compartment therein. An intake air vent and an exit air vent are formed in the housing. A fan is mounted within the housing for pulling air into the intake air vent, moving an air stream through the equipment compartment, and pushing air out of the exit air vent. A membrane is disposed adjacent the intake air vent. The membrane allows air to pass therethrough, but resists the passage of water and contaminants therethrough. In some embodiments, a baffling plate is disposed to direct the air stream within the equipment compartment, and/or the fan speed is controlled by a temperature sensor, and/or a clogging of the membrane is monitored and reported, and/or the intake air vent is located in a first door and the exit air vent is located in a second door of the cabinet.Type: GrantFiled: March 27, 2008Date of Patent: July 5, 2011Assignee: CommScope, Inc. of North CarolinaInventors: Mark Hendrix, Alan Skrepcinski
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Patent number: 7969727Abstract: According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.Type: GrantFiled: April 29, 2009Date of Patent: June 28, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert Tozer, Cullen Bash, Chandrakant Patel
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Patent number: 7965504Abstract: An embedded computer chassis may include a midplane having a first side and second side substantially opposite each other, where the midplane is suitably adapted to receive at least one computer card in each of the first side and the second side. Embedded computer chassis may further include a cooling region suitably adapted to cool the at least one computer card, where at least a portion of the cooling region is suitably adapted to receive a first fan tray and a second fan tray, where the first fan tray is suitably adapted to couple to the first side of the midplane, and where the second fan tray is suitably adapted to couple to the second side of the midplane. The first fan tray and the second fan tray are substantially redundant for removing the heat generated by the at least one computer card.Type: GrantFiled: May 25, 2006Date of Patent: June 21, 2011Assignee: Emerson Network Power—Embedded Computing, Inc.Inventor: Gregg R. Hamlin
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Publication number: 20110134594Abstract: A fan module for dissipating heat from a computer server includes a mounting bracket and a fan mounted on the mounting bracket. The mounting bracket is mounted to an outside of the computer server. The mounting bracket is hollow and forms an air passage in an interior of the mounting bracket. The air passage is communicated with an interior of the computer server. An airflow generated by the fan flows into the interior of the computer server through the air passage to take heat away from the interior of the computer server.Type: ApplicationFiled: December 16, 2009Publication date: June 9, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HAO-DER CHENG, WEN-TANG PENG
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Patent number: 7957133Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.Type: GrantFiled: May 29, 2008Date of Patent: June 7, 2011Assignee: Cisco Technology, Inc.Inventors: Christopher E. Zieman, Todd Mason
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Publication number: 20110116221Abstract: An electronic device includes a server, a plurality of fans, a fan holder attached to one outer side of the server and a plurality of fan ducts received in the fan holder. The server defines an inner cavity therein. Each fan is centrifugal fan and has a fan intake and a fan outlet perpendicular to the fan intake. The fan holder accommodates the fans therein. Each fan duct has an inlet communicating with the fan outlet and an outlet communicating with the inner cavity of the server through the fan holder to allow airflow from the fans into the server.Type: ApplicationFiled: December 16, 2009Publication date: May 19, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HAO-DER CHENG, WEN-TANG PENG
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Patent number: 7933120Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.Type: GrantFiled: March 11, 2010Date of Patent: April 26, 2011Assignee: Hitachi, Ltd.Inventors: Shigeaki Tanaka, Yoshikatsu Kasahara
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Publication number: 20110090636Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.Type: ApplicationFiled: December 30, 2009Publication date: April 21, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: JIN-BIAO JI, ZHI-GUO ZHANG, LI-FU XU
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Patent number: 7929294Abstract: A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures are provided to each compartment. The batteries are cooled by a thermo-electric type air-conditioner, while the electronics are cooled by direct air cooling device or a heat exchanger.Type: GrantFiled: March 25, 2009Date of Patent: April 19, 2011Assignee: CommScope Inc. of North CarolinaInventors: Joseph Yeh, Walter Hendrix
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Patent number: 7929304Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.Type: GrantFiled: June 8, 2009Date of Patent: April 19, 2011Assignees: Hong-Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Liang-Liang Cao, Jeng-Da Wu, Yang Li
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Patent number: 7929295Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.Type: GrantFiled: June 23, 2009Date of Patent: April 19, 2011Inventor: Shailesh N. Joshi
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Publication number: 20110080701Abstract: A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.Type: ApplicationFiled: October 11, 2010Publication date: April 7, 2011Applicant: LIQUID COMPUTING CORPORATIONInventors: Sylvio BISSON, Willi Manfred LOTZ
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Publication number: 20110080700Abstract: Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater.Type: ApplicationFiled: October 2, 2009Publication date: April 7, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick M. Bland, Vinod Kamath, Jimmy G. Foster, SR., Ivan R. Zapata
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Patent number: 7920381Abstract: An interior cooling structure according to the present invention includes a frame in which a plurality of circuit board modules are stacked, with electronic components mounted on the plurality of circuit board modules by being classified by function; an external housing which covers the frame together with the plurality of circuit board modules; a plurality of cooling devices which reduce temperature rises in the external housing caused by heat produced by the plurality of circuit board modules; and a heat generating region a partitioned in such away as to enclose a circuit board module which has the highest total power consumption out of the plurality of circuit board modules, wherein the plurality of cooling devices are arranged in such away as to reduce temperature rises in the heat generating region by displaying capacity higher than capacity of each of the cooling devices.Type: GrantFiled: July 16, 2009Date of Patent: April 5, 2011Assignee: Olympus Medical Systems Corp.Inventor: Toshihiro Kitahara
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Patent number: 7920380Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.Type: GrantFiled: July 15, 2009Date of Patent: April 5, 2011Assignee: Teradyne, Inc.Inventors: Brian S. Merrow, Nicholas C. Krikorian
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Patent number: 7916471Abstract: In a storage device accommodating a plurality of memory devices in a general-purpose chassis provided from both surface sides thereof, a cooling device is provided on the front of the memory devices. This cooling device is allowed to freely move to leave available the area in front of the memory devices, thereby enabling maintenance and replacement of the memory devices from the both surface sides of the chassis. With such a storage device of a type using a general-purpose chassis, and inserting therein a plurality of memory devices from the both surface sides thereof, even if a cooling device is located on the front of the chassis, the memory devices can be subjected to maintenance and replacement.Type: GrantFiled: November 19, 2008Date of Patent: March 29, 2011Assignee: Hitachi, Ltd.Inventors: Kenichi Miyamoto, Shinichi Nishiyama
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Patent number: 7916472Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.Type: GrantFiled: August 17, 2010Date of Patent: March 29, 2011Assignee: Juniper Networks, Inc.Inventors: Gunes Aybay, David J. Lima, Olaf Moeller
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Patent number: 7916470Abstract: A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum.Type: GrantFiled: April 11, 2008Date of Patent: March 29, 2011Assignee: Dell Products L.P.Inventors: R. Steven Mills, Ty R. Schmitt
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Publication number: 20110069438Abstract: A computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a ventilation area defining a plurality of ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame.Type: ApplicationFiled: April 7, 2010Publication date: March 24, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MENG-HSIEN LIN, YU-CHIA LAI, YAO-TING CHANG
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Patent number: 7907396Abstract: The invention relates to a system unit of a computer. The system unit has a plug-in card populated with components and a fan which supplies an air flow to an air ducting body arranged in the system unit. The air flow is provided for cooling the plug-in card which is arranged in the system unit essentially parallel to the air ducting body. Cooling of the plug-in card is improved in that the air ducting body has a central conduit and a first and a second side conduit. The side conduits are provided with a plurality of openings which are arranged in a row and aligned essentially parallel to heat sinks arranged on the plug-in card. The central conduit has a constriction for the admission of air.Type: GrantFiled: March 31, 2009Date of Patent: March 15, 2011Assignee: Siemens AktiengesellschaftInventors: Stefan Engert, Klaus Hertlein, Rainer Hölle
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Patent number: 7907395Abstract: According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.Type: GrantFiled: March 16, 2009Date of Patent: March 15, 2011Assignee: Raytheon CompanyInventors: Richard M. Weber, William G. Wyatt
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Patent number: 7907402Abstract: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.Type: GrantFiled: November 7, 2008Date of Patent: March 15, 2011Assignee: Panduit Corp.Inventor: Jack E Caveney
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Patent number: 7903403Abstract: Airflow intake systems for use with computer cabinet air conditioning systems are disclosed herein. In one embodiment, a computer system includes a plurality of computer modules and an associated air mover positioned in an interior portion of a computer cabinet. The computer cabinet includes an opening that provides access to the interior portion. In this embodiment, a door or other panel is positioned in front of the opening and is at least partially offset from the opening to define a gap between the panel and the cabinet. Operation of the air mover draws cooling air into the cabinet through the gap, and then drives the cooling air through the cabinet to cool the computer modules.Type: GrantFiled: October 17, 2008Date of Patent: March 8, 2011Assignee: Cray Inc.Inventors: Wade J. Doll, Brian F. Hawkins
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Patent number: 7903415Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.Type: GrantFiled: April 15, 2009Date of Patent: March 8, 2011Assignee: Tai-Sol Electronics Co., Ltd.Inventors: Ko-Pin Liu, Yue-Ping Dai
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Patent number: 7898805Abstract: A cooling system may include a fan which may be placed near the center of the system board. The fan may include bottom inlet and may draw air through an opening in the bottom skin of the computer system and may generate a positive pressure within the computer system. Exhaust vents may be positioned at the periphery.Type: GrantFiled: December 30, 2006Date of Patent: March 1, 2011Assignee: Intel CorporationInventor: Mark MacDonald
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Patent number: 7885066Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.Type: GrantFiled: July 17, 2008Date of Patent: February 8, 2011Assignee: Juniper Networks, Inc.Inventors: Demick Boyden, Pradeep Sindhu, Keith J. Hocker
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Patent number: 7876557Abstract: A disk array device comprises: a hard disk drive module including a disk for recording information thereon and having one side that has a length substantially equal to the diameter of the disk; a battery nodule; an operation module; a fan module having at least one cooling fan; a controller module having a controller; a power supply module provided for supplying power to the modules; a circuit board to which the above-mentioned modules are connected via electrical connectors; and a substantially box-shaped chassis in which the modules and the circuit board are housed. A front surface and a rear surface of the chassis are opened in a rectangular shape. A length of one side of the opened front surface of the chassis is substantially the same length as the one side of the hard disk drive module.Type: GrantFiled: June 9, 2009Date of Patent: January 25, 2011Assignee: Hitachi, Ltd.Inventors: Katsuyoshi Suzuki, Masahiko Sato, Kenichi Tateyama, Naoto Matsunami, Koichi Kimura, Hidehiko Iwasaki, Kenichi Takamoto, Kenji Muraoka, Takamasa Ishikawa, Nobuhiro Yokoyama, Kiyotaka Takahashi, Yoshinori Nagaiwa
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Patent number: 7864523Abstract: A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.Type: GrantFiled: March 27, 2009Date of Patent: January 4, 2011Assignee: Fujitsu LimitedInventor: Yoshihisa Iwakiri
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Patent number: 7859835Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).Type: GrantFiled: June 10, 2009Date of Patent: December 28, 2010Assignee: Allegro Microsystems, Inc.Inventors: Angelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
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Patent number: 7859842Abstract: A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.Type: GrantFiled: March 10, 2009Date of Patent: December 28, 2010Assignee: Siemens AktiengesellschaftInventors: Klaus Busch, Christian Scharf, Christoph Wiesner
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Publication number: 20100321874Abstract: An expandable server housing having one or more server chassis stacked upon each other and one intake plenum and one exhaust plenum disposed on opposite sides of the stacked server chassis is disclosed. Each server chassis may have two or more fans predominately controlling airflow rate through a zone of the server chassis. Also, a method and system determining fan failure regardless of blockage of air path.Type: ApplicationFiled: June 17, 2010Publication date: December 23, 2010Inventors: Neeloy Bhattacharyya, Tim Byrd
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Publication number: 20100321873Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.Type: ApplicationFiled: June 23, 2009Publication date: December 23, 2010Inventor: Shailesh N. Joshi
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Patent number: 7848101Abstract: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.Type: GrantFiled: January 30, 2008Date of Patent: December 7, 2010Assignee: General Electric CompanyInventors: Subhrajit Dey, Petrus Joannes Joseph Moeleker, Chellappa Balan
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Patent number: 7848100Abstract: A reconfigurable mounting bracket is disclosed. The bracket includes a first face plate configured to attach to an enclosure, a first flange that extends perpendicularly from a first end of the first face plate, and a second flange that extends perpendicularly from a second end of the first face plate, the second flange extending in an opposing direction from the first flange. The reconfigurable mounting bracket accommodates a plurality of attachment options.Type: GrantFiled: March 27, 2007Date of Patent: December 7, 2010Assignee: ADC Telecommunications, Inc.Inventors: Michael J. Wayman, Jennifer L. Casey
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Patent number: 7826216Abstract: An information handling center includes an information handling system (IHS) rack configured to receive cooled fluid from a pressurized plenum. The IHS rack includes at least one ventilator that is operable to cause cooled fluid to be drawn from the pressurized plenum into the IHS rack. A cooling fluid supply unit is coupled to the pressurized plenum and operable to cool a fluid passing through the cooling fluid supply unit and direct that cooled fluid into the pressurized plenum. A fluid flow control is located in the cooling fluid supply unit and coupled to a pressure sensor that is operable to determine a pressure in the pressurized plenum. The fluid flow control is operable to adjust the flow rate of the fluid passing through the cooling fluid supply unit based on the pressure determined by the pressure sensor.Type: GrantFiled: December 3, 2008Date of Patent: November 2, 2010Assignee: Dell Products L.P.Inventor: David Lyle Moss
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Patent number: 7817417Abstract: A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.Type: GrantFiled: October 17, 2008Date of Patent: October 19, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: John P Franz, Richard A. Bargerhuff, David A. Selvidge
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Patent number: 7813120Abstract: An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.Type: GrantFiled: June 13, 2008Date of Patent: October 12, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Wade D. Vinson, David W. Sherrod
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Patent number: 7813121Abstract: A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.Type: GrantFiled: January 31, 2007Date of Patent: October 12, 2010Assignee: Liquid Computing CorporationInventors: Sylvio Bisson, Willi Manfred Lotz
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Patent number: 7808792Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.Type: GrantFiled: December 18, 2007Date of Patent: October 5, 2010Assignee: Juniper Networks, Inc.Inventor: Tri Luong Nguyen
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Patent number: 7804684Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.Type: GrantFiled: December 22, 2008Date of Patent: September 28, 2010Assignee: Juniper Networks, Inc.Inventors: Gunes Aybay, David J. Lima, Olaf Moeller
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Patent number: 7800903Abstract: A heat-dissipating structure includes a support unit and a fan unit disposed in the receiving space. The support unit has a plane portion, a support portion extending downwards from a front side of the plane portion, and an opening passing through the plane portion. The plane portion has a board body, a concave space formed on the top surface of the plane portion, a non-skid pad detachably received in the concave space, a slender block body disposed on a base of the top surface of the board body, and a slender non-skid body disposed on a base of the bottom surface of the board body. The support portion has a support body, a receiving space formed in its inside, a plurality of slender openings formed on two opposite lateral sides of the support body, and a slender non-skid body disposed on a base of the support body.Type: GrantFiled: September 30, 2008Date of Patent: September 21, 2010Assignee: Cooler Master Co., Ltd.Inventor: Jen-Yu Wang
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Patent number: 7764493Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.Type: GrantFiled: September 25, 2008Date of Patent: July 27, 2010Assignee: Apple Inc.Inventors: Ihab A. Ali, Dinesh Mathew, Thomas W. Wilson, Jr., Keith Hendren
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Patent number: 7755889Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.Type: GrantFiled: June 12, 2008Date of Patent: July 13, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Wade D. Vinson, David W. Sherrod, David W. Deis, Steve Novack
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Patent number: 7755893Abstract: The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.Type: GrantFiled: March 15, 2006Date of Patent: July 13, 2010Assignee: Panasonic CorporationInventors: Hiroto Yanagawa, Hiroaki Takezawa
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Publication number: 20100172078Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.Type: ApplicationFiled: March 11, 2010Publication date: July 8, 2010Inventors: Shigeaki Tanaka, Yoshikatsu Kasahara
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Patent number: 7751191Abstract: A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.Type: GrantFiled: August 15, 2008Date of Patent: July 6, 2010Assignee: International Business Machines CorporationInventors: Kohichi Kakikawa, Yohichi Matsui, Hiroyuki Takenoshita
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Patent number: 7751189Abstract: A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.Type: GrantFiled: September 7, 2007Date of Patent: July 6, 2010Assignee: Intel CorporationInventors: Sandeep Ahuja, Ioan Sauciuc
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Patent number: 7742296Abstract: A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes.Type: GrantFiled: December 15, 2007Date of Patent: June 22, 2010Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hsiu-Chang Lai, Zhen-Xing Ye, Ke Sun, Ming-Ke Chen, Xiao-Zhu Chen