Abstract: A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.

Abstract: A grate access floor panel comprising a support frame and a plurality of vanes supported by the frame, each of the plurality of vanes having an upstream end and a downstream end with respect to a direction of airflow across the plurality of vanes and faces that extend between the upstream and downstream ends, wherein at least some of the vanes have openings that extend through the faces thereof and have angled tips.

Abstract: A server includes a chassis, a motherboard, a number of data storage devices, a number of system fans, and a power supply mounted in the chassis. The system fans generate an airflow flowing through the chassis, from a front portion of the chassis to a rear portion of the chassis. The power supply includes a power fan causing an airflow directed rearwards through the front portion of the chassis to prevent a disturbance with the airflow from the system fans.

Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.

Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.

Abstract: An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.

Abstract: A cooling system for an electronics chassis includes a plurality of centrifugal blowers arranged to motivate cooling air through the electronics chassis. The centrifugal blowers are arranged in one or more sets, each having blowers oriented with respective inlets in mutual facing relationship. The orientation, positioning, and alignment of the centrifugal blowers facilitates a compact arrangement of the plurality of blowers that achieves increased aerodynamic efficiencies to reduce noise output and energy consumption.

Abstract: A data center includes a wind collecting structure that directs prevailing winds external to the data center into an interior of the wind collecting structure. The wind collecting structure includes vents around its perimeter configured to selectively open on a side of the wind collecting structure receiving prevailing wind, pressurizing the intake air. The pressurized air flows from the wind collecting structure through a compartment of the data center including computing assets. The air is directed across the computing assets to extract heat from the computing assets during operation.

Abstract: A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

Abstract: A system includes a rack and one or more computer systems mounted in the rack. At least one of the computer systems includes a circuit board assembly, such as a motherboard, and a chassis coupled to the circuit board assembly. At least a portion of the chassis is made of a shock-absorbing polymeric material, such as an expanded foam material.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.

Abstract: An electronic apparatus has a plurality of basic structures arranged adjacent to each other in a direction perpendicular to a gravitation direction. Each of the basic structures includes a casing, a board placed parallel to the gravitation direction inside the casing, a first space with large ventilation amount and a second space with small ventilation amount formed by the board dividing the inner space of the casing, vents in the upper and lower surfaces of the casing, an electronic component placed on the board in the first space, and an electronic component placed on the board in the second space. The casings of adjacent basic structures are in communication through inner vents in respective side walls of the casings, and external vents in communication with the outside are provided in left and right side walls of the electronic apparatus.

Abstract: An electronic device includes a cage and a fan module. The cage includes a mounting plate defining a ventilation hole. A positioning portion is located in the ventilation hole. A restriction is located on an inner surface of the positioning portion. The height of the restriction is such as to strictly require the fan module to be in the correct orientation when it is fitted to the electronic device.

Abstract: A computer system includes a computer case, a receiving tray, and a bracket. The computer case includes a front plate with a plurality of air intakes and a first side plate. The receiving tray includes a retaining wall. The bracket includes a first mounting plate and a second mounting plate. A plurality of first through hole is defined in the first mounting plate, and a plurality of second through hole is defined in the second mounting plate. The airflow guiding duct includes a first guiding plate and a second guiding plate. The first guiding plate is located between the front plate and the first mounting plate, the second guiding plate is located between the bracket and the first side plate; the plurality of air intakes, the airflow guiding duct, the plurality of first through hole second through hole together form a path for the air to flow.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: A cellular cooling part includes a number at least one movable part, that can be the removable flap or movable cover for a fan. The fan, for example, can be moved or opened to expose it. A flap can also be opened. In addition, different covering structures can be used.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: A high-voltage apparatus includes a battery device, a high-voltage control device, a housing, and a cooling structure. The cooling structure includes a first cooling channel to cool the battery device, a second cooling channel to cool the high-voltage control device, a connection channel connecting the first cooling channel to the second cooling channel, and a ventilator. The connection channel has a first opening portion connected to the first cooling channel, a second opening portion connected to the second cooling channel, and an inner flow path to communicate the first opening portion to the second opening portion. A sectional area of the first opening portion and a sectional area of the second opening portion are each set to be smaller than a sectional area of the inner flow path.

Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.

Abstract: An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side opposite to the interface plate; a power supply unit; a first housing portion capable of housing the power supply unit and provided within the casing to be close to the back plate; a second housing portion capable of housing the power supply unit and provided within the casing to be close to the interface plate; a detection portion that detects the air blowing direction of the fan unit and a position where the power supply unit is housed; and a warning portion that operates based on the detection portion to give a warning in a case where the air blowing direction of the fan unit is different from the side where the casing houses the power supply unit.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: A computer cart has removable electrical connector management system which may be removed from the computer cart to install portable electronic device electrical transformers, and then reinserted into the computer cart to enable multiple electrical transformers to be installed into the cart as a group. An electrical charging system uses a staggered round robin approach to control distribution of power within the computer cart without requiring the amount of power used from each power strip to be individually monitored.

Abstract: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.

Abstract: An apparatus and article is disclosed for separating intake air from exhaust air. The apparatus discloses an intake port, coupled to conduct intake air; an exhaust port, coupled to conduct exhaust air; and an air-curtain port, coupled to conduct air-curtain air to separate at least a portion of the intake air conducted by the intake port from the exhaust air conducted by the exhaust port. The article discloses a ductwork shell article, having an intake vent, an intake chamber, an exhaust vent, an exhaust chamber, an air-curtain vent, and an air-curtain chamber; wherein: the air-curtain vent is in part located between the exhaust vent and the intake vent.

Abstract: A display apparatus includes a display section, a control section, and a cooling section including a first ceiling section, a second ceiling section, a first connecting section and an air stream generating section. The first ceiling section is formed such that a distance of the first ceiling section from a non-display surface of the display section is shorter than that of the second ceiling section, and a ventilating area of a first ventilating passage is smaller than that of a second ventilating passage. The air stream generating section is configured such that an air stream is generated from the second ventilating passage toward the first ventilating passage so as to take the air out of the first ventilating passage and the second ventilating passage, and replenish the taken air with the ambient air. The control section is provided on a control section mounting surface of the first ceiling section.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: A container data center includes a container, a number of rack servers arranged in the container, and a cooling room. Each rack server includes a fan module attached to a first side of the rack server, and defines an opening in a second side of the rack server facing the cooling room. The fan module operates to draw air from the rack server, then the cool air in the cooling room flows into the rack server to cool the rack server.

Abstract: A container data center includes a container, a number of rack servers arranged in the container, and an air-conditioning device arranged in the container. The air-conditioning device defines a vent. A fan module is mounted in the vent, for blowing cooling air generated by the air-conditioning device to the rack servers.

Abstract: A method for cooling a system having a midplane design in which the midplane includes holes to allow air to flow via the midplane. Cards connected to the midplane have a front face that includes holes to allow the air to flow. The air flows from front to back or back to front to cool the cards connected to the midplane. A multi-slot chassis includes rails to support the cards. The rails form spaces to permit access to sockets associated with the cards to which cables may be connected. Platforms associated with the cards may permit a user to manage cables connected to the cards.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path.

Abstract: The docking station (10) comprises a casing (11) presenting an air inlet (12) and a cooled air outlet (13) and housing a refrigeration system (30) for cooling an air flow which is caused to pass through the interior of the casing (11), from the air inlet (12) to the cooled air outlet (13). The refrigeration system (30) comprises: a compressor (31) pumping refrigerant fluid through a refrigeration circuit comprising a condenser (32) and an evaporator (33) and, preferably, a ventilation means (34) producing said air flow which is conducted through the evaporator (33) to be cooled thereby and released, through said cooled air outlet (13), to the interior of a computer (20) seated against the docking station (10).

Abstract: The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.

Abstract: An electronics cooling system comprises a tubular fan duct and an electronics housing. The fan duct includes has a fan duct casing containing a fan with rotor blades and stator vanes. The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space. A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment. The electronics cooling system further comprises three electronics mounts within the interior space. A first electronics mount is located immediately adjacent to the inlet hole, on the fan duct. A second electronics mount is located immediately radially outward of the stator vanes, on the fan duct. A third electronics mount is located immediately adjacent to the bleed hole, on the housing.

Abstract: A server includes a server enclosure having an accommodating room with a front area and a rear area and a top plate defining a first intake hole communicating with the accommodating room, a first component module and a second component module respectively at the front and rear areas, a first fan module and a second fan module in the accommodating room. The first fan module is for forcing air to flow from the front area to the rear area. The second fan module includes an air-guiding housing and a fan inside the air-guiding housing. The air-guiding housing has a second intake hole aligned with the first intake hole, and an exhaust hole opening toward the rear area. The fan draws air outside the server enclosure through the first and second intake holes, and blows the air toward the rear area through the exhaust hole.

Abstract: The electronic device pertaining to an embodiment comprises a housing that holds an optical disk. The housing comprises a holding space holding an optical disk, a first internal space being apart from the holding space and in which a first electronic component controlling a pickup is disposed, an intake channel leading from the first internal space to the holding space, and an exhaust channel leading from the holding space to a specific space being distinct from the first internal space.

Abstract: An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of the idle expansion slot.

Abstract: A server assembly includes a server, a number of first air ducts, and a number of second air ducts. A number of intakes and outlets are defined in a top of a chassis of the server. Each of the first and second ducts includes a hollow main body, and a connecting portion extending from a bottom of the main body. A first opening is defined in an end of the main body of each of the first and second ducts. A second opening is defined in each of the connecting portions of each of the first and second ducts. Outside air flows through the first air ducts, thereby flowing into the chassis to be heated, thereby cooling the server. The heated air is expelled out of the chassis through the second air ducts.

Abstract: An electronic apparatus includes a heat dissipating module mounted at a position interposed between a shield plate and a main circuit board and air sent from a fan through a heat dissipating fin is discharged from an air vent, wherein the heat dissipating module includes the heat dissipating fin in contact with the heat generating electronic component; the fan sending the air; and a base body supporting the fan and the heat dissipating fin at a position closer to a side of the shield plate than a position of the fan, and having a slope between the fan and the heat dissipating fin for guiding the air sent from the fan to the heat dissipating fin, wherein the shield plate includes a cut and raised piece which faces the slope and obliquely guides the air sent from the fan to the heat dissipating fin along the slope.

Abstract: An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.

Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.

Abstract: A mounting apparatus includes a first bracket and a second bracket. Two guides are located on the first bracket. A locking block is located on the first bracket between the two guides. The second bracket receives a first fan. Two sliding portions are located on the second bracket and engaged with the two guides. A latch is resiliently deformable and located on the second bracket between the two sliding portions. A plurality of receiving holes is defined in the latch. The second bracket is slidable between the two guides relative to the first bracket. The locking block is can engage in the plurality of receiving holes to secure the first bracket to the second bracket in a plurality of positions.

Abstract: A housing for an electronic device. The housing includes a first shell at least partly enclosing the electronic device, a second shell, and at least a first fan. The first shell is arranged to allow a gaseous fluid to surround the electronic device. The second shell at least partly encloses the first shell, and is arranged in relation to the first shell such that the gaseous fluid may be present between the shells. The at least first fan is arranged in an opening of the first shell such that it is capable of providing a flow of the gaseous fluid through the opening in the first shell of the gaseous fluid to the second shell and thereby provide heat transport from the electronic device to the second shell.

Abstract: A computer case includes outer panels forming an internal space sized and shaped to accommodate at least a motherboard, a plug-in card and a hard drive; and an inner panel arranged in the internal space and which physically forms a separate lower section of the internal space from an upper section of the internal space, wherein the upper section is arranged above the lower section of the internal space such that the upper section of the internal space accommodates the motherboard and the plug-in card and the lower section of the internal space accommodates the hard drive.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.