Abstract: An electrical apparatus having a cooling system includes a first cover to cover a first part of the electrical apparatus to be cooled and a second cover substantially enclosing the first cover to define a surrounding space. A base plate on which the first cover is mounted defines an environmentally-sealed enclosure that houses the first part of electrical apparatus. A first circulation device causes air to circulate in the environmentally-sealed enclosure and a second circulation device causes a cooling fluid to circulate around the surrounding space. A heat transfer structure is positioned on each side of the first cover. A third cover is mounted to an opposite side of the base plate from the first cover to define a second enclosure that houses a second part of the electrical apparatus to be cooled. A heat exchange structure is positioned within the second enclosure. The second circulation device is arranged to drive cooling fluid both through the heat exchange structure and through the surrounding space.

Abstract: In a disk array apparatus, by taking note of a first sound of a specific frequency which is a noise element of original sounds generated from a fan, a second sound whose phase is inverted to that of the first sound is generated by a structure of a cooling air flow path passing through the fan, and the second sound is synthesized with the first sound on the cooling air flow path, thereby reducing the noise. For example, an exhaust duct is located on a fan unit in an upper part of the apparatus, two flow paths extending to an exhaust port are formed in an internal structure of the exhaust duct, and the two flow paths are designed so that the difference in the flow path length therebetween becomes equivalent to half wavelength of the specific frequency.

Abstract: A computing system and method of operating a computing system is provided.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces.

Abstract: A heat dissipation device is provided for being mounted on a computer enclosure to seal an inside of the enclosure from an outside of the enclosure. The heat dissipation device comprises a housing, a plurality of fins received in the housing, and two fans respectively fixed on a top and a bottom of the housing. The plurality of fins divides an inner space of the housing into two separate chambers, wherein a lower chamber communicates with the interior of the enclosure, and an upper chamber communicates with the exterior of the enclosure. A lower fan forces airflow through the lower chamber to take heat in the enclosure to the fins. An upper fan forces airflow through the upper chamber to carry the heat in the fins to the exterior of the enclosure.

Abstract: A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.

Abstract: Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

Abstract: A symmetric multiprocessor computer is provided with a star interconnection architecture and a cooling system. The star interconnection architecture include a middle plane, and plural first processor boards and second processor boards configured vertically onto opposite surfaces of the middle plane. The first processor boards and the second processor boards are crisscross to each other at the opposite surfaces of the middle plane. The cooling system includes a first cooling module and a second cooling system module configured for generating a plurality of first airflows and second airflows for the first processor boards and the second processor boards respectively, wherein the paths of the first airflows and the second airflows are crisscross to each other at the opposite surfaces of the middle plane.

Abstract: A storage apparatus has a cabinet stored with an array of memory mediums, a power supply unit housed at the bottom of the cabinet, a fan provided immediately under the top surface of the cabinet and immediately above the memory mediums, and a partition member provided insides the cabinet and configured to partition a first cooling path from mixing with a second cooling path inside the cabinet. The first cooling path of first external air for cooling the memory mediums starts at an inlet on a side surface of the cabinet and ends at the top surface of the cabinet to discharge the first external air out of the cabinet form the top surface. The second cooling path of second external air for cooling the power supply unit ends at the top surface of the cabinet and discharges the second external air out of the cabinet at the top surface.

Abstract: The present invention provides a portable computer in which an increase in temperature of a housing is suppressed. In the present invention, a guide plate is provided to suppress an increase in temperature of a bottom surface. When a cooling fan device operates, outside air taken in from inlet openings flows as an air current through a narrow flow path formed between the guide plate and the bottom surface. A flow velocity of the air current can be increased by narrowing the flow path, and heat exchange with the guide plate can be effectively performed, thereby sufficiently cooling a cooling surface. The cooled guide plate cools an air layer between the guide plate and the heat sink and thermally insulates between the air layer and the bottom surface.

Abstract: A personal computer (electronic apparatus) (1) is equipped with a plurality of heat generating devices: a power source unit (11), a CPU (12), an FD drive device (13), a CD/DVD drive device (14), and an LCD (15), and a cooling fan (16) for cooling the plurality of heat generating devices (11) through (15). The plurality of heat generating devices (11) through (15) are arranged in parallel in a direction Y which crosses a central axis (16c) of an impeller (16b) of the cooling fan (16). Further, the heat generating devices (11) through (15) are arranged within a blowing range (21) of the cooling fan (16).

Abstract: While one of ventilation fans operates, the other ventilation fan is at rest. Air flows from the operating ventilation fan to the ventilation fan at rest. The airflow passes through an air passage defined in a heat radiating member located between the ventilation fans. Dust cumulates at the entrance of the air passage. The other ventilation fan is then driven to operate while the operating ventilation fan is brought to rest. Airflow is generated in the reverse direction. The airflow is inverted within the air passage. The inverted airflow serves to remove the dust from the entrance of the air passage. The cumulation of the dust can thus reliably be avoided. Accordingly, no dust filter is required in the path of airflow outside the air passage. Airflow of a sufficient amount can always be maintained in the air passage.

Abstract: Airflow management apparatuses for computer cabinets and associated methods are disclosed herein. The computer cabinets include a plurality of computer modules positioned between an air inlet and an air outlet and an air mover configured to move a flow of cooling air from the air inlet, past the plurality of computer modules, and out the computer cabinet via the air outlet. The computer cabinets carry an airflow restrictor positioned proximate to the air outlet. The airflow restrictor is configured to restrict the flow of cooling air through a portion of the computer cabinet to achieve a desired temperature profile in the computer cabinet.

Abstract: An information-processing apparatus has housing enclosing at least one electronic part and has at least one opening and a passage connecting the opening and allowing air to flow therein. The apparatus has an air intake member, which is arranged in the passage, having two air intake portions for separating the air flown in the passage through the opening into its first and second portions. The apparatus has a first exhausting device that exposes the electronic part to the first portion of the air separated in the air take member and exhausts the first portion of the air to outside and a second exhausting device that exposes the electronic part to the second portion of the air separated in the air take member and exhausts the second portion of the air to outside. At least one air intake portion of the air intake member is positioned facing the electronic part.

Abstract: Embodiments of remote exhaust for dissipating heat in computers or other electronic devices are disclosed. An exemplary method may include coupling branch lines to each of a plurality of fan-less chassis in the rack system. The method may also include coupling the branch lines to at least one main line. The method may also include connecting the main line to at least one exhaust pump to remove heat generated in each of the plurality of fan-less chassis to a physically remote environment.

Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.

Abstract: A disk array device comprises: a hard disk drive module including a disk for recording information thereon and having one side that has a length substantially equal to the diameter of the disk; a battery module; an operation module; a fan module having at least one cooling fan; a controller module having a controller; a power supply module provided for supplying power to the modules; a circuit board to which the above-mentioned modules are connected via electrical connectors; and a substantially box-shaped chassis in which the modules and the circuit board are housed. A front surface and a rear surface of the chassis are opened in a rectangular shape. A length of one side of the opened front surface of the chassis is substantially the same length as the one side of the hard disk drive module.

Abstract: A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the base, provides a diversion direction, and has a heat insulated pipe-wall which partitions the diversion pipeline into an inside and an outside portions and reduces the heat conduction in the diversion direction of the diversion pipeline. The heat conductive pieces are fixed on the diversion pipeline, and have a heat dissipation direction from the inside portion to the outside portion of the diversion pipeline which crosses the diversion direction. Each two neighboring heat conductive pieces are separated with the heat insulated pipe-wall. The fan is assembled on the outside of the diversion pipeline and provides a cool air for the heat conductive pieces.

Abstract: A chassis panel for a computerized device includes ventilation elements that visually obscure electronic components disposed within an associated chassis and that minimize airflow resistance. Each ventilation element includes a first angled ventilation portion having openings that provides limited visual access to the electronic components disposed within the chassis. Each ventilation element also includes a second angled ventilation portion having openings that provide no visual access to the electronic components disposed within the chassis. As such, the ventilation elements visually obscure the electronic components disposed within the chassis without the need for additional materials such as screens, mesh, or foam. Also, the openings of the first and second ventilation portions provide the chassis panel with a relatively large free area ratio, such as between about 42% and 48% or greater depending on hole pitch values and opening sizes.