Abstract: An electric cabinet with a heat dissipation system is provided. The electric cabinet includes an body and a plurality of electric boards amounted in rows and arranged vertically in the body. The heat dissipation system includes: an air inlet and an air outlet respectively located on a lower surface and a higher surface of the body; a fan having fan blades arranged horizontally amounted between two of the electric boards for guiding the air to flow from the air inlet to the air outlet; and a plurality of air-cooling devices, each is amounted on sides of the body and designated with cooling one of the electric boards, wherein at least one of the air-cooling devices is amounted to be higher than the horizontal blades of the fan.

Abstract: A data center cooling system, including a support structure having a lower portion and an upper portion, one or more fans supported by the support structure at a height that is equal to or greater than a height of the electronics cabinets, and a heat exchanger having one or more cooling coils supported at the upper portion of the support structure. In some embodiments, the cooling coils can be supported by the upper portion of the support structure so as to be above the top of and/or over one or more of the electronics cabinets. The fans can be configured to draw air from the one or two rows of electronics cabinets and to cause the air to be passed through the heat exchanger to cool the warmer air from the electronics cabinets.

Abstract: A heat dissipation structure (1) includes a heat generation part (2) and an internal heat dissipation part (3), inside a housing (8); a heat transport member (4); an external heat dissipation part (5); and a fixing member (6), wherein edges are vertically disposed on both sides of the heat transport member (4), in the vicinity of the fixing member (6) in a first groove (3a); a second groove (6b) extending from the through hole (6a) toward an area not covered with the external heat dissipation part (5) is formed in the second surface (6d); and a gap portion between the heat transport member (4) and the through hole (6a), a portion between the edges vertically disposed on both sides of the heat transport member (4), and the second groove (6b) are filled with a sealant.

Abstract: A temperature control cabinet includes at least one cabinet unit. Each cabinet unit includes: a subrack, where there is a placement space for placing a device inside the subrack, and there is at least one opening at a periphery of the cabinet; and a cabinet door mounted on the subrack and configured to buckle the opening, where at least two temperature control components are disposed on the cabinet door, the temperature control components are arranged in a first direction, the first direction is a direction from the top to the bottom of the subrack, each temperature control component is provided with an air exhaust vent and an air return vent, the air return vent of each temperature control component communicates with a hot area at the top of the placement space, and the air exhaust vent of each temperature control component communicates with the placement space.

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

Abstract: A switch cabinet with at least one brush strip for the conductor feed-through, the switch cabinet having a switch cabinet frame with a horizontal or vertical profile frame from which a profile web extends, wherein the brush strip is placed on a free end of the profile web with bristles extending from the profile web over the inner portion of the profile frame.

Abstract: A cooling device includes: a duct that guides air that has absorbed heat generated inside a cooling target and has been discharged, to the cooling target; a cooler that is provided in the duct and cools the air flowing inside the duct; and an adjusting mechanism that is located on a downstream side of the cooler, adjusts an amount of the air discharged from the duct into a room where the cooling target is installed.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.

Abstract: A system including a data center rack enclosure, a first aisle emulator, and a second aisle emulator. The data center rack enclosure is configured to retain a data center rack, which has a first side and a second side. The first aisle emulator is coupled with the data center rack enclosure and provides a first controlled test environment with first temperature and a first gas flow to the first side of the data center rack. The second aisle emulator is coupled with the data center rack enclosure and provides a second controlled test environment for the second side of the data center rack.

Abstract: A method for configuring the airflow direction through a chassis having electronic components installed therein. The method may include: powering on at least a first power supply unit installed within the chassis; determining an airflow direction of the first power supply unit may include one or more unidirectional fans; configuring the airflow direction through the chassis to be the airflow direction of the first power supply unit to create a first configured airflow direction; determining an airflow direction of a first fan tray installed within the chassis, the first fan tray may include one or more unidirectional fans; and conducting a conflict check between the first configured airflow direction and the airflow direction of the first fan tray to determine if the airflow directions are substantially the same.

Abstract: A pressproof fan structure includes: a fan frame having an upper case and a lower case; a support shaft having one end inserted into the lower case, and the other end protruding out from the upper case; an oil-retaining bearing having a bearing hole, in which the support shaft is fitted; a rotor assembly fitted around and connected with the oil-retaining bearing; a restriction member fitted around the support shaft near the oil-retaining bearing; a thrust member fitted around the support shaft near the oil-retaining bearing; and a stator assembly disposed on the lower case near the oil-retaining bearing without contacting.

Abstract: A telecommunication cabinet includes a first and a second cabinet bodies, an internal fan, a partition board, multiple heat dissipation pipes and an external fan. The first cabinet body includes an upper slot and a lower slot. The second cabinet body covers the first cabinet body and includes an air inlet and an air outlet. The internal fan is arranged in the first cabinet body. The partition board is connected with the second cabinet body and includes multiple air vents and multiple air intakes. The heat dissipation pipes are disposed in the second cabinet body and include multiple upper nozzles and multiple lower nozzles. Multiple heat dissipation channels are disposed between the heat dissipation pipes. The external fan is disposed on a bottom inside the second cabinet body.

Abstract: A power supply apparatus includes a plurality of power supply boards and a cooler. The power supply boards supply power. The cooler cools the power supply boards. The power supply boards are disposed in rows in a front-back direction and stepwise so as to be disposed more upward as disposed more forward.

Abstract: A power conversion apparatus includes a plurality of semiconductor modules each having a semiconductor element integrated thereto; a plurality of cooling pipes that cools the semiconductor modules; a plurality of dummy modules with no integrated semiconductor element; and a pair of DC bus bars that constitute a current path between a DC power source and respective semiconductor modules. The semiconductor modules or the dummy modules, and the cooling pipes are alternately stacked to form a stack; m the plurality of semiconductor modules constitute an inverter circuit that converts a DC power supplied from the DC power source into a multi-phase AC power in which a plurality of types of AC outputs having mutually different phases are combined; and the dummy modules are each interposed between two semiconductor modules having mutually different phases of the AC outputs.

Abstract: A sensor assembly includes a navigation sensor. The sensor assembly includes a heatsink thermally coupled to the navigation sensor. The sensor assembly includes an air conditioning unit. The sensor assembly includes a duct positioned to direct airflow from the air conditioning unit toward the heatsink.

Abstract: An optical module includes an optical transmission device including a heating element, an optical element, an optical cable and an optical coupling unit that performs optical coupling between the optical element and one end of the optical cable; and a container that houses the heating element, the optical element, the optical coupling unit, and a portion including the one end of the optical cable, the container having an opening located between the heating element and the optical coupling unit in a direction in which the heating element and the optical coupling unit are arranged, the container having a portion located closer to the optical coupling unit than the opening in the arrangement direction wherein the portion is sealed.

Abstract: Devices, systems, and methods are provided for monitoring air flow through a server using differential pressure measurements. The device includes an external pressure sensor, an internal pressure sensor, and a controller that receives the pressures from the external and internal pressure sensors. The external pressure sensor detects air pressure of the ambient air around a server enclosure, the internal pressure sensor detects air pressure through a server enclosure, and the controller calculates a pressure differential between the pressure from the external pressure sensor and the internal pressure sensor. The controller can then generate a signal based on the pressure differential, the signal optionally controlling a cooling fan, generating an interrupt for the server circuitry, or performing some other action.

Abstract: A method of controlling air circulation in a data center system. The data center system includes: a cold aisle; a hot aisle including a floor element and a ceiling element; a server rack comprising a controller and servers separating the cold aisle from the hot aisle; and an air conditioning unit. The method includes: toggling, by the controller, the hot aisle between: (a) a first configuration in which the ceiling element is opened and the floor element is closed and (b) a second configuration in which the ceiling element is closed and the floor element is opened, wherein the first configuration enables circulation of air from the from the hot aisle to the cold aisle via the air conditioning unit, and wherein the second configuration enables circulation of air from the from the hot aisle to the cold aisle without the circulated air passing through the air conditioning unit.

Abstract: A data center system includes an infrastructure unit including a public area and a bridge area and at least one computer room. The computer room is disposed along an extending direction of the bridge area, and a length of the bridge area is matched with a length of computer rooms arranged along the bridge area, so that a number of computer rooms may be increased according to the needs. The computer room includes a plurality of layers of data centers stacked on each other. Cold passage areas and hot passage areas of two neighboring layers of data centers form a cold air passage and a hot air passage so that cold air produced by a cooling module may be directed to each data center, and hot air in each data center may be directed to the cooling module to enable devices in each data center to operate under appropriate temperature.

Abstract: A rack housing includes, for example, a frame, a door attachable to a front of said frame, a plurality of movable supports for supporting a plurality of electronic devices in the frame, and an actuator for moving said plurality of movable supports to define an adjustable air volume in the rack housing for receiving cooling air from a raised floor of a data center. Computer-implemented methods, computer program products, and systems are also disclose.

Abstract: An electric cabinet provided with an interconnection system for devices such as computers received in the cabinet. The interconnection system includes at least one waveguide forming part of the frame of the cabinet. The waveguide is provided with openings disposed facing housings for receiving the aforementioned devices. The openings being dimensioned to form a barrier to the passage of radio-frequency wireless communication waves to be transmitted through the waveguide and to form a barrier to external waves.

Abstract: A fan (10) includes: an external ferrule (12), whose internal surface (20) delimits a vein of air (14), a wheel (26) provided with blades (28) rotatably mounted in the ferrule (12) for setting into motion the vein of air, a motor (22) for driving the wheel (26), an electric circuit (40) including components (44) for controlling and powering the motor (22), which circuit (40) includes elements for cooling the components (44) by circulating air taken from the vein of air (14), wherein the cooling elements include a downstream area intake tapping aperture (52) and an upstream tapping aperture (54, 56) for reintroducing air formed through the internal surface (20) of the ferrule (12), and at least one continuous cooling conduit (50) connecting the upstream and downstream tapping apertures isolating the components (44) of the electric circuit from the air circulating in the cooling conduit.

Abstract: According to various embodiments, a heating system for heating a building and/or for preparing hot water is provided. The heating system can comprise a heat distributing device; and a computer, which is coupled to the heat distributing device in such a way that the heat produced by the computer is distributed in the building by means of the heat distributing device; wherein the computer is designed in such a way that the computer produces a message for a computing load distribution computer, wherein the message contains a piece of information about the heat demand of the heating system and/or of the building.

Abstract: A system for managing air flow computing devices in a rack includes a stall and filler elements. The stall includes a stall top panel and two side panels spaced apart from one another. The stall accommodates a rack computing system. The filler elements fill gaps between the computing devices of the rack computing systems and the panels of the stalls. An air moving system moves air from the cold aisle through cold-aisle facing air inlets of the computing devices. The filler elements inhibit air moving toward the cold aisle-facing inlets from leaking through gaps between the computing devices of the rack computing systems and the stall panels such that the filler elements inhibit air moving toward inlets in the computing devices from leaking through the gaps between the computing devices in the rack and the stall panels.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: A data center system includes an infrastructure unit including a public area and a bridge area and at least one computer room. The computer room is disposed along an extending direction of the bridge area, and a length of the bridge area is matched with a length of computer rooms arranged along the bridge area, so that a number of computer rooms may be increased according to the needs. The computer room includes a plurality of layers of data centers stacked on each other. Cold passage areas and hot passage areas of two neighboring layers of data centers form a cold air passage and a hot air passage so that cold air produced by a cooling module may be directed to each data center, and hot air in each data center may be directed to the cooling module to enable devices in each data center to operate under appropriate temperature.

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

Abstract: An electronic device includes a casing and a rotary flap door device. The rotary flap door device is installed inside the casing and includes a base plate and a door member. The base plate is mounted on the casing. A base constraining structure and a base engaging structure are formed on the base plate. The door member includes a door body, a door limit part and a door engaging portion. The door body is rotably disposed on the base plate. The door limit part extends from the door body and is for embedding into the base limit part. The door engaging portion protrudes from the door body and is for engaging with the base engaging portion.

Abstract: Expandable shelters having a heating, ventilation, and air conditioning (HVAC) system arranged to receive outside air away from a mechanical compartment are disclosed. The expandable shelters may comprise an air inlet vent disposed in a front of the expandable shelter interconnected to an in-floor air duct arranged to draw outside air below an interior floor and exchange heat with the coolest area of the expandable shelter. By virtue of having an air inlet vent receive outside air from a location substantially away from the mechanical compartment and exchange heat with the coolest area of the expandable shelter, an environmental control unit (ECU), housed in the mechanical compartment, receives relatively cool outside air, keeping air temperatures inside the mechanical compartment below the upper operating limit of the ECU.

Abstract: An integral avionics bay module. The module has a structure that has an integral cabin floor on top that closes the structure. Installing such an integral avionics bay structure in a single operation inside a primary fuselage structure considerably reduces the integration time on the final assembly line for the aircraft.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: An electronic device includes: an air-cooled substrate on which an air-cooled component that is cooled by an airflow is mounted; a liquid-cooled substrate that is set apart from the air-cooled substrate in plan view, the liquid-cooled substrate being mounted thereon a liquid-cooled component that is cooled by a liquid; and a refrigerant supply member that is disposed above the liquid-cooled substrate, the refrigerant supply member supplying a refrigerant that cools the liquid-cooled component.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: An improved solution for cooling a data center is provided. In an embodiment of the invention, a data center design that combines physical segregation of hot and cold air streams together with a data hall variable air volume system is provided. The invention is a data center design that resolves air management issues of re-circulation, bypass and load balance. Bypass is airflow supplied by the cooling units that directly returns without cooling servers. Recirculation airflow is server discharge warm air that returns directly without being cooled. Load balance is supplying the required server airflow. An embodiment includes physical segregation of cold and hot air streams and by providing variable air volume to match server load. Air segregation is done by enclosing the hot aisle end and above the cabinets. The air conditioning system provides variable air volume to the data hall (cold side) to meet server demands.

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: A heat dissipation device is arranged in an outer case of an electronic device, and includes an oscillation assembly, an air disturbing member and at least one fixing seat. The oscillation assembly includes a base and an oscillating member provided on the base; and the air disturbing member is connected at a first end to the oscillating member and at an opposite second end to the fixing seat. When an electric power is supplied to the oscillation assembly, the oscillating member is oscillated to thereby vibrate the first end of the air disturbing member, producing a continuous wave of the air disturbing member. The waving air disturbing member in turn disturbs air in the outer case, forcing the air toward a heat source and causing air convection in the outer case to enable largely upgraded heat dissipation efficiency of the electronic device.

Abstract: A method and system of cooling a server rack unit is described herein. A server rack for housing certain devices may be configured to receive a first air flow at a server rack front. Each device may form a wall at the back of the device creating a channel between the wall and the server rack back. The camber may collect warm air created by the first air flow as it extends over the at least one server. A first surface of the server may define at least one server rack opening allowing the warm air in the channel to exit the server rack.

Abstract: When testing or powering up a magnet in a magnetic resonance imaging device, a switch is provided that switches a winding between resistive and superconductive modes. The switch includes a housing that contains a winding wound about a bobbin, and an internal coolant cavity that contains coolant that cools the winding, A baffle separates the internal coolant cavity from an external coolant reservoir. The baffle has small apertures that permit influx of liquid coolant into the internal cavity to cool the winding, At high temperatures, the coolant in the internal cavity vaporizes causing the winding to further increase its temperature and resistance, Upon reduction of heat to the winding, the winding cools sufficiently to permit influx of liquid coolant, thereby restoring a superconductive mode of operation to the winding.

Abstract: An apparatus includes a reservoir, a structure, and one or more metal tubes. The reservoir is configured to hold a volume of liquid therein and, has a wall area with a metal cross section. The structure has a distribution of injectors. Each injector is configured to inject gas bubbles into said volume of liquid in a bottom portion of the reservoir. The one or more metal tubes traverse a part of the reservoir. Each metal tube is capable of carrying a gas flow.

Abstract: An electrical enclosure is disclosed for use with a mobile machine having a cabin. The electric enclosure may have a plurality of compartments configured to house a plurality of different electrical components. The electrical enclosure may also have a duct formed within a first of the plurality of compartments located below a floor of the cabin. The duct may be configured to receive conditioned air from the cabin and to direct the conditioned air from a second of the plurality of compartments into the first of the plurality of compartments.

Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.

Abstract: An arrangement for a laboratory room that is confined by a floor, a ceiling and walls connecting the floor with the ceiling, the arrangement comprises: a main base suspended on the floor; a tool base arranged on the main base; a platform arranged around the tool base, wherein the platform is permeable for air, and the platform is suspended at the walls; an air inlet arranged below the platform; an air outlet arranged above the tool base; and air guides for directing an air flow upwards at least partially parallel to the main base and/or the tool base.

Abstract: A synthetic jet ejector (501) is provided which includes a diaphragm (503) and a chassis (505). The chassis has first and second major surfaces which are equipped with a set of interlocking features (509) such that a first instance of the synthetic jet ejector releasably attaches to a second instance of the synthetic jet ejector by way of the interlocking features.

Abstract: A system for cooling electronic components is provided, the system comprising: a first electronic component having a first operating temperature; a second electronic component having a second operating temperature greater than the first operating temperature; a vapour compression loop configured to cool the first electronic component to the first operating temperature; a pumped cooling loop configured to cool the second electronic component to the second operating temperature; and a heat exchanger between the vapour compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapour compression loop before the second electronic component is cooled and after the first electronic component is cooled.

Abstract: A vehicle audio apparatus such as a car radio includes a casing defined by external walls and electrical components mounted on a printed circuit board. The radio also includes a cooling system having a fan arranged in a first external wall of the casing, an opening arranged in a second opposite external wall, and a cooling plate which forms a heat sink and which is adjacent to at least one electrical component producing heat. The cooling plate and an associated internal cover plate have a combined shape optimized for guiding the air flow between the fan and the cooling opening.

Abstract: A system for suppressing an overheat condition in an electrical housing includes an electrical housing that defines a housing area including one or more electrical devices; a suppression fluid container containing a suppression fluid; a valve configured to regulate the flow of the suppression fluid from the suppression fluid container to the housing area; at least one sensor configured to sense at least one of temperature and smoke; and a controller communicatively connected to the at least one sensor and the valve, the controller configured to receive signals from the at least one sensor indicating an overheat condition in the housing area; and in response to the received signals indicating the overheat condition in the housing area, control the valve to allow the suppression fluid to flow from the suppression fluid container into the housing area, in order to suppress the overheat condition in the housing area.

Abstract: The cooling system includes: a frame; a plurality of electronic devices disposed in the frame and operating or functioning independently from each other; fans disposed in the frame and supplying cooling air to the electronic devices; a temperature acquiring portion for acquiring the temperature of the cooling air; an air-flow resistance adjusting portion for adjusting the air-flow resistance to the cooling air; and a controller for controlling the fans and the each air-flow resistance adjusting portion. The controller determines each target cooling air volume required for cooling each electronic device to a predetermined temperature based on temperature information acquired by the temperature acquiring portion and heat generation information on each electronic device, controls each air-flow resistance adjusting portion to set the volume of cooling air to each target cooling air volume, and performs the drive control of the fans to set the volume of cooling air to the minimum necessary.

Abstract: The invention combines systems and methods for heat containment and cold air isolation for managing airflow and temperature in data centers. The data center contains at least two rows of cabinets containing heat-generating equipment and arranged to form a cold aisle and a hot aisle. The data center system includes panels or doors at both ends of the cold aisle and an optional cover over the cold aisle to inhibit cooled air supplied by an air conditioning system from exiting the cold aisle and inhibit air warmed by the heat-generating components from entering the cold aisle. A chimney coupled to the top, rear, or top and rear of the cabinets is configured to exhaust the warmed air into a region above the rows of cabinets. The chimneys may be ducted to a plenum or suspended ceiling or to the intake of the air conditioning system. Baffles and/or fans may be included in the chimneys, ducts, and/or plenums to control the air pressure.