Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: A method and system of cooling components of a computer system. At least some of the illustrative embodiments are computer systems comprising an enclosure, a motherboard within the enclosure, a heat generating component coupled to the motherboard and within the enclosure, a canister comprising a compressed fluid (the canister coupled to the enclosure), and a gas cooling device selectively fluidly coupled to the compressed fluid (the gas cooling device produces chilled gas when fluidly coupled to the compressed fluid). The chilled gas is directed upon the heat generating component.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: A method for cooling electronic equipment can include flowing cooling air across a plurality of computer units and into a common warm air plenum located at a first end of the computer units; flowing air from the warm air plenum through one or more cooling units, and into an area located at a second end of the computer units; and controlling a flow rate of air out of the warm air plenum to maintain a predetermined pressure differential between the second end of the computer units and the first end of the computer units.

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Abstract: The present invention is directed to a cooling system (1) for electronic components (4). The cooling system (1) comprises means (7) for producing cyclic air pressure fluctuations, wherein the electronic components (4) are distanced from the pressure producing means (7). In the vicinity of the electronic components (4) are situated means (5), preferably restrictions like holes, which are affected by the cyclic air pressure fluctuations, and which produce cyclic air jets (6). The air jets (6) affect the surface of the electronic component (4), and since the air jets (6) originate directly in the vicinity of the electronic components (4), an efficient heat transfer is affected. Preferably, the pressure producing means (7) actuate a pressure Pc inside a chamber (2), and turbulent air jets (6) are produced through holes (5) of a substrate (3), onto which electronic components (4) are mounted.

Abstract: A power supply includes a main body, a fan, and a mounting bracket. The main body defines an opening therein. The mounting bracket for mounting the fan is detachably mounted to the main body to cover the opening. The fan is mounted on the mounting bracket and received in the main body through the opening.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: A plenum provides cooled air to an inlet of an enclosure. An electronics assembly within the enclosure includes temperature sensors. Each of a plurality of position variable flow restrictors is positioned to control flow of the cooled air to a portion of the electronics assembly. A controller individually positions each flow restrictor based on temperature measurements provided by the temperature sensors associated with the portion of the electronics assembly for which cooled air is provided via the flow restrictor.

Abstract: An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: A fan includes, an impeller having propeller-shaped blades, a motor disposed inside of a hub to rotationally drive the impeller centered on the rotation axis, a tubular air duct forming an air passage on a periphery of the blades of the impeller and the rotation axis, wherein the rotation axis penetrates the inside of the air duct, and an exhaust outlet larger than an outer diameter of a rotation trajectory of the blades is formed on one end of the air duct, and an air flow guiding plate blocking an opening on an other end of the air duct in the rotation axis direction, a suction inlet through which the rotation axis passes being formed in approximately the center of the air flow guiding plate, wherein the blades are closer to the air flow guiding plate than the air duct.

Abstract: A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.

Abstract: A DC to AC inverter used in a solar cell power system can include an improved structure for cooling itself and increasing power output.

Abstract: A cooling system having a enclosure, a plurality of disk drives stored in the enclosure, a first portion of the disk drives having housings with a first form factor and a second portion of the disk drives having housings with a second form factor smaller than the first form factor, and an air baffle system for directing a flow of air internal the enclosure over portions of the housing of the second portion of the disk drives while at the same time creating a wall to maintain the flow of air over neighboring ones of the first portion of the disk drives (the external flow).

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: A method and arrangement are provided for reducing the amount of condensed moisture inside an enclosure which encloses at least one piece of electrical equipment which is configured to receive electric power from outside the enclosure in a first electrical magnitude range (0 . . . maxinput) and to feed electric power to outside the enclosure in a second electrical magnitude range (minoutput . . . maxoutput). Electric power received on at least one portion (a, b, c) of the first electrical magnitude range (0 . . . maxinput) being outside the second electrical magnitude range (minoutput . . . maxoutput) is utilized for heating the condensed moisture for exhaustion thereof.

Abstract: A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.

Abstract: A system for cooling an environment housing a plurality of electronic equipment in one or more cabinets is disclosed, the system comprising a remote cooling unit(s) adapted to provide relatively cool air into the environment, an exhaust associated with each cabinet, the exhaust being provided with variable airflow means; the remote unit being adapted to receive exhausted air, and; sensor means adapted to determine cooling demand and alter the output of the remote cooling unit(s) accordingly. Schemes for using the system are described.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: This disclosure relates to a cooling structure for an electronic device including an inlet for conveying a flow in a first flow direction towards a first component and an outlet for conveying the flow further. To deter dirt particles from proceeding to electronic components, the cooling structure can include a second flow channel, which starts from a port oriented transversely to the first flow direction or away therefrom and receives part of the flow from the inlet, and which conveys the part of the flow to an electronic component located in the second flow channel.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

Abstract: A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe.

Abstract: A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be coupled to a heat generating device and a jet impingement target surface. The jet impingement target surface may further include at least one target structure having a wavy-fin topology with a fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device.

Abstract: A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the air outlet are located at another two opposite sides of the top plates, respectively. The guiding plates are located between the side plates and adjacent to the air outlet. Each of the guiding plates forms a guiding face facing the air inlet. The guiding face is obliquely oriented with respect to the top plate. An electronic device incorporating the fan duct is also provided.

Abstract: A system for thermal management of electronic equipment. The system can include a cabinet forming an enclosure for the electronic equipment, wherein the cabinet has an inlet and an outlet. Additionally, the system can include a supply channel connected with the cabinet inlet, wherein the cabinet is positioned on a floor and the supply channel is under the floor; an exhaust channel, wherein at least a portion of the exhaust channel is in proximity to the cabinet outlet. Furthermore, the system can include a plurality of flexible barriers forming a thermal curtain for directing air exiting the outlet of the cabinet to the exhaust channel, and wherein a position of the barriers is adjustable.

Abstract: A plenum for guiding a flow of cooling air through the interior of a computer is designed to maximize the airflow over those electrical components within the computer which are most sensitive to temperature, and/or which require the greatest amount of cooling. The plenum is designed to be mounted over top of a computer motherboard which includes a plurality of electrical components mounted thereon. One or more apertures are formed in the lower wall of the plenum so that electrical components mounted on the computer motherboard can protrude through the apertures and into the interior of the plenum. The lower surface of the plenum is designed to prevent the flow of cooling air passing through the plenum from escaping through the apertures on the lower wall. Also, upper and lower protrusions on the plenum can extend into the interior of the plenum to concentrate the flow of cooling air onto the electrical components which are protruding through the apertures and into plenum.

Abstract: A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: Provision of a control device, method and program capable of performing a suitable temperature control in a room having an equipment installed therein. A control device controls air-conditioning of a room having installed therein a plurality of pieces of equipment each being capable of drawing outside air to thereby cool down an interior of the equipment. A storage portion is capable of storing therein operating information that represents as to whether it is abnormal or not if each piece of equipment is put into a non-operating state. A temperature measurement portion is capable of measuring a temperature of the air drawn by each piece of equipment. A detection portion is capable of measuring a flow speed of the air drawn by each piece of equipment. A control portion is configured to control the air-conditioning based on the measurement result of the temperature or the flow speed of the air drawn by each piece of equipment.

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: A modular cooling system includes a positive displacement compressor and a microchannel heat exchanger for cooling a heat generating device such as a semiconductor.

Abstract: An exemplary heat dissipation device includes a heat sink defining air passages therein, a fan holder fixedly mounted on the heat sink, a fan mounted on the fan holder, and an adjustable wind-guiding module located in and pivoted to the fan holder. The fan is positioned for generating an airflow flowing through the adjustable wind-guiding module generally toward the air passages of the heat sink. The adjustable wind-guiding module is selectably pivotable with respect to the fan holder such that a direction of the airflow generally toward the air passages of the heat sink is changed accordingly.

Abstract: A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules.

Abstract: A DC to AC inverter used in a solar cell power system can include an improved control scheme for cooling itself and optimizing power output.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A cooling device (1) using pulsating fluid for cooling of an object, comprising: a transducer (2) having a membrane adapted to generate pressure waves at a working frequency (fw), and a cavity (4) enclosing a first side of the membrane. The cavity (4) has at least one opening (5) adapted to emit a pulsating net output fluid flow towards the object, wherein the opening (5) is in communication with a second side of the membrane. The cavity (4) is sufficiently small to prevent fluid in the cavity (4) from acting as a spring in a resonating mass-spring system in the working range. This is advantageous as a volume velocity (u1) at the opening is essentially equal to a volume velocity (u1?) at the second side of the membrane, apart from a minus sign. Thus, at the working frequency the pulsating net output fluid can be largely cancelled due to the counter phase with the pressure waves on the second side of the membrane resulting in a close to zero far-field volume velocity.

Abstract: A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

Abstract: Provided is a vibrating device which can generate efficient vibrations in a vibrating member and efficiently apply vibrations to a gas, a jet flow generating device in which the vibrating device has been implemented, and an electronic device in which the jet flow generating device has been implemented. A jet flow generating device 10 has a vibrating device 15 including a frame 4, and actuator 5 mounted on the frame 4, and a vibrating member 3 supported on the frame 4 by an elastic supporting member 6. The vibrating member 3 has a side plate 3b formed on the perimeter portion of a disc-shaped vibrating plate 3a, for example. Vibration of the vibrating member 3 applies vibrations to air within chambers 11a and 11b, whereby gas can alternatingly be blown from nozzles 2a and 2b.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is positioned for ingressing air to pass thereacross before passing through the electronics rack, is in fluid communication with a coolant loop for passing coolant through the heat exchanger, and the heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the heat exchanger's dehumidifying of ingressing air, and an evaporator disposed at the air outlet side humidifies air egressing from the electronics rack employing condensate from the condensate collector.

Abstract: An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones.

Abstract: Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing, and in particular a control system for controlling the temperature and pressure within the data center.

Abstract: This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are connected to the avionic rack on the one hand electrically (C3-C4) and on the other hand fluidically (36?-37, 45?-44) to a system of pipes (30a, 30b) on at least one cold source for a cooling fluid (30). A heat-dissipating electronic board (35) is equipped with a dissipated-heat collector plate (61-65), in which fluid circulation channels are implemented, connected via quick-disconnect fluidic couplings (42, 39) to quick-disconnect fluidic couplings of the system of pipes. These devices allow the equipment to be removed from or inserted into the rack (32-EE) or the electronic board (35) to be removed from or inserted into the electrical equipment (33-35).

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A system for thermal management of electronic equipment. The system can include a cabinet forming an enclosure for the electronic equipment, wherein the cabinet has an inlet and an outlet. Additionally, the system can include a supply channel connected with the cabinet inlet, wherein the cabinet is positioned on a floor and the supply channel is under the floor; an exhaust channel, wherein at least a portion of the exhaust channel is in proximity to the cabinet outlet. Furthermore, the system can include a plurality of flexible barriers forming a thermal curtain for directing air exiting the outlet of the cabinet to the exhaust channel, and wherein a position of the barriers is adjustable.

Abstract: A thermal cage for managing environmental conditions affecting electronic equipment. The thermal cage can be connectable with a plenum and a supply channel. Additionally, the thermal cage can include a cabinet faulting an enclosure for the electronic equipment and an outlet in fluid communication with the cabinet, wherein the outlet is connectable to the plenum. Furthermore, the thermal cage can include an inlet in fluid communication with the cabinet, wherein the inlet is connectable to the supply channel, and a thermal curtain comprising a plurality of adjustable barriers for directing air flowing through the cabinet to the outlet, wherein the thermal cage is movable.