Abstract: A cooling device includes a frame structure housing an internal channel and an inlet port coupled to the frame structure. The inlet port is to receive a coolant fluid and to direct the coolant fluid to the internal channel. The cooling device includes one or more contactless cooling ports disposed on the frame structure and at a predetermined distance from an electronic chip. A contactless cooling port accelerates a stream of coolant fluid across a surface of the electronic chip to transfer heat from the electronic chip to the stream of coolant fluid. The cooling device includes a separator for segregating and diverging streams of coolant fluid. The cooling device includes a mounting structure secured to the frame structure, where the mounting structure is mounted to a server chassis or a server board.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.

Abstract: An electronic assembly includes a chassis having electronic module mounting positions. The electronic assembly also includes a respective electronic module received in each electronic module mounting position and having a module cooling gas passageway. Each electronic module has a module glide surface. The electronic assembly includes a respective sealing retainer coupled between the chassis and each electronic module. The sealing retainer has a cooling gas passageway aligned with a chassis cooling gas passageway and the module cooling gas passageway. The sealing retainer includes a retainer body having a retainer glide surface, and a gas sealing gasket carried by the retainer body. The module glide surface and the retainer glide surface have respective cooperating features so that the respective electronic module is maintained in spaced relation from the sealing gasket as the respective electronic module is slidably inserted into a seated position.

Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.

Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Abstract: The present disclosure provides a display device and a backlight module thereof, the backlight module comprises a back plate, light bars and a radiator, and the back plate comprises a bottom plate and a first side plate disposed at one side of the bottom plate. The light bar is disposed at the inner side of the first side plate; the radiator comprises a heat absorption part, a condensation part and a pipe, the heat absorption part and the condensation part are communicated with each other by the pipe. the heat absorption part is disposed between the first side plate and the light bar, and the heat absorption part is configured to absorb the heat emitted by the light bar; and the condensation part is disposed at the outer side of the bottom plate.

Abstract: The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.

Abstract: Electronic rack and data center thermal management systems are disclosed. An electronic rack system includes a heat exchange system and the electronic rack having a plurality of servers containing heat-generating components. The heat exchange system includes a filter and a pump to circulate filtered cooling fluid to the electronic rack, via an internal cooling loop. An external cooling loop provides a backup cooling fluid supply to the electronic rack to function as a redundant system for the heat exchange system. The external cooling loop includes an external cooling fluid pump and filter, and is coupled to the internal cooling fluid supply via a valve. The cooling fluid in the internal cooling fluid loop, and its associated filter, are of a higher quality than the cooling fluid and filter of the external cooling fluid loop. In one embodiment, the external cooling loop filter is a high quality filtration system.

Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.

Abstract: A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

Abstract: A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

Abstract: Devices, systems, and methods for managing server chassis are disclosed. The server chassis may be managed thermally by controlling a flow of gas through an opening in the server chassis. The server chassis may be managed for security by controlling physical access to various portions of the server chassis, and, for example, to a portion of the server chassis proximate to an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed electromagnetically by controlling a flow of electromagnetic radiation into and out of the server chassis and, for example, through an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed structurally by physically reinforcing various portions of the server chassis.

Abstract: Heat dissipation systems may include a base, a vapor chamber, and a plurality of cooling fins. The base may contact a top surface of a chip on a printed circuit board to be cooled. The vapor chamber may be planar and be coupled to and extend from the base so that the planar vapor chamber is perpendicular relative to the top surface of the chip. The vapor chamber is coupled to the base so that a first portion of the vapor chamber extends along the base in a first direction, and a second portion of the vapor chamber, adjacent to the first portion of the vapor chamber, extends in the first direction past an edge of the base in order to overhang the printed circuit board. Both the first portion and the second portion of the vapor chamber include the plurality of cooling fins.

Abstract: A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

Abstract: An evaporative cooler which includes a sealed loop of conduit with a first portion in a space to be cooled and a second portion in a space where heat is rejected, a volume of working fluid, and a fan inside the conduit loop. The fan forces air over the working fluid to accelerate its evaporation, which requires heat. Evaporation creates vapor-enriched air which carries heat and is forced by the fan to the second portion. Within the second portion, the vapor-enriched air rejects the absorbed heat before being forced back to the first portion. In certain cases, a portion of the working fluid in the vapor-enriched air condenses out and drains or is pumped back to the first portion. In certain uses, the cooler provides cooling to an area. In other uses, the cooler captures vaporized water, producing an impurity-free condensate for removal or use.

Abstract: A projector includes a first cooling target, a cooling device, and an exterior housing that houses the first cooling target and the cooling device. The cooling device includes a first compressor configured to compress working fluid, a condenser configured to condense the working fluid, a first expander configured to decompress the working fluid, a first evaporator configured to change the working fluid to the working fluid in the gas phase with heat transferred from the first cooling target, a first connection pipe configured to lead the working fluid discharged from the first expander to the first evaporator, a second connection pipe configured to lead the working fluid discharged from the first evaporator to the first compressor, and a first case configured to seal the first expander, the first connection pipe, the first evaporator, and the second connection pipe on an inside.

Abstract: Phased array antennas, such as a multi-function aperture, are limited in performance and reliability by traditional air-cooled thermal management systems. A fuel-cooled multi-function aperture passes engine fuel through channels within the ribs of the multi-function aperture to provide better heat transfer than can be achieved through air cooled systems. The increased heat transfer and thermal management results in a multi-function aperture with improved performance and reliability.

Abstract: A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.

Abstract: A retention assembly includes a first retention member with a first set of ribs and a second set of ribs. The first set of ribs are positioned to form slots, which are shaped to receive data storage devices. The first set of ribs are arranged to separate adjacent data storage devices and have a first length. The second set of ribs extend into respective slots to form air channels within the slots, and the second set of ribs have a second length that is shorter than the first length.

Abstract: A water-cooling head adjustment structure for computer water cooling includes a water-cooling head attached to a heating element of a circuit board, a water-cooling head adapter including a bottom panel attached to the water-cooling head, a hollow frame located on the bottom panel and a cover plate covering the hollow frame and equipped with two water inlet and outlet connectors, a steering adapter having two water pipes connected to a water cooling row connector of a water cooling row and two connection pipes respectively connected to the water inlet and outlet connectors of the water-cooling head adapter, and a one-dimensional movement adjustment mechanism provided between the cover plate and the hollow frame for adjustment of the relative position between the cover plate and the hollow frame to align the connection pipes and the water inlet and outlet connectors.

Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. Alternatively, the blind mating adapter can be separable into two halves that can be positioned to align with, and blind mate to, the coolant distribution manifold. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold. The blind mating adapter unit functions as an intermediate layer for server and rack fluid mating.

Abstract: A thermal management system includes an auxiliary thermal management unit, the auxiliary thermal management unit includes a vapor inlet line, a liquid outlet line, and a phase change unit. The phase change unit includes a condenser and a compressor. The auxiliary thermal management unit includes a vapor buffer unit coupled between the vapor inlet line and the phase change unit. The auxiliary thermal management unit includes a liquid buffer unit coupled between the liquid outlet line and the phase change unit, where the auxiliary thermal management unit is to form a double-buffered vapor-liquid loop between the vapor inlet line and the liquid outlet line, where the vapor inlet line is coupled to a rack vapor return of an electronic rack to receive vapor and the liquid outlet line is coupled to a rack liquid supply of the electronic rack to supply cooling liquid.

Abstract: Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

Abstract: A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.

Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

Abstract: The disclosure generally relates to an exemplary cooling system for an enclosure that can house an electrical network protection element and provide protection to the electrical network protection element against damage in various environments such as when the enclosure is placed in an underground vault that may be flooded during rain, or when a liquid (oil, for example) comes in contact with the enclosure. The exemplary cooling system may include a coolant reservoir, one or more false walls coupled to the exterior of the enclosure, one or more pancake panels coupled to the false walls through one or more header pipes, and one or more coolant pipes for circulating coolant from the coolant reservoir, through the one or more pancake panels, false walls, and header pipes, and back to the coolant reservoir. The cooling system may only be in contact with the exterior portion of the enclosure. That is, the cooling system may not directly contact the electronics within the enclosure.

Abstract: A method, a device and a system for controlling heat dissipation of an electrical cabinet are provided. The method includes: a heating capacity in the electrical cabinet is predicted; according to the heating capacity predicted, a corresponding heat dissipation capacity is determined; and a rotational speed of a heat dissipation fan is controlled, so that a difference between the heating capacity and the heat dissipation capacity is within a predetermined range.

Abstract: Hybrid multi-function rack door designs are disclosed. A rack includes a housing cabinet and rack door. The housing supports a plurality of servers or information technology (IT) equipment. The rack door is coupled to the housing and includes a rack manifold and a heat exchanger. The rack manifold supplies a cooling liquid to the rack door and extracts a cooling liquid from the rack door. The heat exchanger cools air from the blade servers, and the rack manifold is integrated into the heat exchanger as part of the rack door. The rack door can have the rack manifold in a fixed position and the heat exchanged configured to pivot away from the rack manifold in an open or partially open position. The rack door can be designed as one part of the data center cooling infrastructure, and commissioned together.

Abstract: A heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

Abstract: An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.

Abstract: An information handling system may include a circuit board that includes a plurality of expansion slots. The information handling system may further include a cooling card coupled to at least one of the plurality of expansion slots, and a processor coupled to the circuit board (but where the cooling card does not contain the processor). Further, the processor may include a heat exchanger coupled thereto. The cooling card may include a heatsink, and a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled to the heat exchanger.

Abstract: The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.

Abstract: Disclosed is a working contact cooling system for a high-power device (1), wherein the sealed case body (8) is a structure having inner and outer layers, a chamber between the inner and outer layers is filled with a heat-superconductive coolant (9), and an outer wall of the outer layer of the sealed case body (8) is provided with heat dissipating fins (10); the sealed case body (8) is provided with an insulating liquid heat-conductive coolant (2), the coolant pump (6) sinks in the insulating liquid heat-conductive coolant (2), the filter (7) is installed at an inlet of the coolant pump (6), the coolant pump (6) is connected to the spray main pipe (5), and a plurality of spray branch pipes (4) are connected in parallel with the spray main pipe (5), each of the spray branch pipes (4) is provided with a plurality of nozzles (3), and the nozzles (3) face the high-power device (1); the nozzles (3) spray against front and back surfaces of the high-power device (1).

Abstract: A display card protection circuit monitoring structure includes: a display card body; at least one protection circuit module, configured on the display card body, and adapted to generate an open-circuit state when the display card body is abnormal; at least one monitoring device, configured on the display card body and in electric connection with the protection circuit module, and adapted to monitor a use state of the protection circuit module; at least one power supply, respectively in electric connection with and supplying power to the protection circuit module and monitoring device; and at least one warning module, in electric connection with the monitoring device, and driven by the monitoring device to issue warning when the open-circuit state happens. Whereby, the protection circuit module is used to prevent the abnormality or damage of the display card body, and the motoring device can drive the warning module to issue warning.

Abstract: An apparatus for holding and cooling rack-mountable servers having heat-producing electronic components includes a tank, a volume of dielectric liquid coolant in the tank, mounting members that hold rack-mountable servers in the tank, one or more pumps, fluid velocity augmentations devices, and a liquid-to-liquid or liquid-to-refrigerant heat exchanger outside of the tank. The mounting members hold the rack-mountable servers in a vertical orientation within the tank such that the servers are commonly submersed in the volume of the dielectric liquid coolant.

Abstract: A compact and inexpensive air-cooled laser device, having heat radiating fins configured to sufficiently cool a heat-receiving member thermally connected to a laser diode module positioned within a housing of the laser device having a substantially sealing structure. A flow direction of air flowing between heat radiating fins of a first fin set and a flow direction of air flowing between heat radiating fins of a second fin set are generally opposed to each other. Further, the first and second fin sets are positioned adjacent to each other, and thus an inflow area of the first fin set and an outflow area of the second fin set are also adjacent to each other. Therefore, most of the air after flowing between the fins of the first fin set is deflected by colliding with an inner wall of a housing, and then enters between the fins of the second fin set.

Abstract: A system includes a grid coupled to an electrical bus; an electrical power modulation device coupled to the electrical bus that can output modified electrical power received from the electrical bus; a blower motor coupled to the electrical power modulation device that can receive the modified electrical power output and can provide a stream of air to affect a temperature of the grid, and a controller. A speed of the blower motor may be based at least in part on an amount of the modified electrical power. The controller can receive an operating parameter, and is responsive to that parameter by causing the electrical power modulation device to vary the amount of the modified electrical power. A blower motor speed may be controlled based at least in part on the operating parameter.

Abstract: Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.

Abstract: A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.