And Liquid Patents (Class 361/698)
  • Patent number: 12288733
    Abstract: A conformal cooling assembly for multiple-die electronic assemblies, such as printed circuit boards, integrated circuits, etc., which addresses and solves a multitude of challenges and problems associated with using liquid-cooled cold plates and dielectric immersion cooling to manage the heat produced by a multiplicity of dies. The conformal cooling assembly comprises a conformal cooling module comprising inlet and outlet passageways and a plenum configured to permit a cooling fluid to pass therethrough, thereby facilitating direct fluid contact with heat-generating components affixed to the substrate of the electronic assembly. The conformal cooling assembly also includes a fastener for attaching the conformal cooling module to the substrate; and a fluid-barrier disposed between the substrate and the plenum. The fluid-barrier is adapted to minimize, inhibit or prevent the cooling fluid from penetrating and being absorbed by the substrate.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: April 29, 2025
    Assignee: JetCool Technologies Inc.
    Inventors: Bernard Malouin, Jordan Mizerak, Stuart Putz
  • Patent number: 12225693
    Abstract: A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, and an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port. The internal structure guides the coolant fluid flow and/or distribution along a surface of the electronic chip, where the electronic chip transfers heat to the coolant fluid to cause a portion of the coolant fluid to change from a liquid to a vapor phase.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: February 11, 2025
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 12219732
    Abstract: A graphic card assembly includes a bracket, a graphic card module, a first fin set, a centrifugal fan, a second fin set, a heat pipe set and an axial flow fan. The graphic card module is assembled to the bracket and has at least one heat source. The first fin set and the second fin set are assembled to the bracket and the first fin set thermally contacts the heat source. The centrifugal fan is disposed beside the first fin set to generate a first air flow dissipating heat from the first fin set. The heat pipe set contacts the heat source. The axial flow fan is disposed on the second fin set to generate a second air flow dissipating heat from the second fin set. The first air flow and the second air flow are separated from each other, and the second air flow passes through the bracket and the graphic card module.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: February 4, 2025
    Assignee: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Shu-Hao Kuo, Tsung-Ting Chen
  • Patent number: 12203790
    Abstract: A system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, a management controller for providing out-of-band management of the system, and a flow-rate sensor coupled to the liquid cooling system and configured to measure a volume of flow of fluid through a fluidic channel of the liquid cooling system per unit time and communicate one or more signals to the management controller indicative of the volume of the flow of the fluid through the fluidic channel of the liquid cooling system per unit time.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: January 21, 2025
    Assignee: Dell Products L.P.
    Inventors: Robert B. Curtis, Richard M. Eiland
  • Patent number: 12176499
    Abstract: Provided herein are methods and systems for preventing and/or suppressing fire in a rechargeable battery.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: December 24, 2024
    Assignee: RePurpose Energy Inc.
    Inventors: Jae Wan Park, Joseph Lacap
  • Patent number: 12154920
    Abstract: A camera module is configured to capture an optical image of a target area and includes a lens member, an imager, a light transmitting member, and a seat. The lens member is configured to receive light from the target area. The imager has a curved portion convex in a direction away from the lens member and is configured to capture the optical image formed on the curved portion. The light transmitting member optically couples the lens member and the imager. The seat has a supporting portion that supports an outer rim of the imager and a fluid space defined inside the supporting portion. A heat dissipation fluid undergoes convection in the fluid space. The curved portion is interposed between the light transmitting member and the seat having the supporting portion and the fluid space.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: November 26, 2024
    Assignee: DENSO CORPORATION
    Inventors: Kouji Satou, Hiroki Sasaki, Shotaro Miyawaki, Akira Wada, Satoru Wakiyama, Kazuhiro Aoyama
  • Patent number: 12156383
    Abstract: In some aspects, the techniques described herein relate to a cooling system for a computing device. The cooling system includes an air-cooled cooling system located in a housing. The air-cooled cooling system includes a heat sink thermally connected to a processor, an air-cooling radiator, and a heat pipe connecting the heat sink to the air-cooling radiator. The cooling system includes a liquid-cooled cooling system located in the housing. The liquid-cooled cooling system includes a cold plate thermally connected to a to the heat sink, a pump, a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: November 26, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Brandon Earl Gary, Luke Thomas Gregory, Christy Felix Pradeep Antony
  • Patent number: 12141005
    Abstract: A cooling system for a datacenter device is disclosed. Fins are provided between a first plate and a second plate to dissipate a first amount of heat to an environment in a first configuration of the fins. The first plate is movable relative to the second plate to expose a surface area of the fins to the environment in a second configuration of the fins.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: November 12, 2024
    Assignee: Nvidia Corporation
    Inventors: Xiaozhuo Cai, Shuanghu Yan, Dinghai Yi, Hao Zhu, Yonghua Fu
  • Patent number: 12144149
    Abstract: A cooling apparatus for an electronic element includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: November 12, 2024
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Jin Soo Yeo, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jeong Hyun Choi, Jae Hyun Park
  • Patent number: 12101910
    Abstract: A smoothly switching negative pressure liquid cooling system is provided in the present application, wherein a gas extraction pipeline of a gas circuit is used to extract gas to form a negative pressure environment, a gas supply pipeline is used to supply the gas to form a positive pressure environment. One of the three gas-liquid chambers is used for feeding the liquid and one of the three gas-liquid chambers is used for discharging the liquid to form a coolant circulation. The other chamber maintains a negative pressure environment. At the moment of switching a working state, the chamber that maintains the negative pressure environment forms a large pressure difference, so that the coolant enters the chamber quickly. Before the working state is switched, enough negative pressure has been formed to ensure the fluidity of the coolant at the moment of switching the working state.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: September 24, 2024
    Assignee: SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Zhitao Xin, Guangzhi Liu, Xiaowei Zhang, Shengfu Liu
  • Patent number: 12100643
    Abstract: An electronics assembly in which microjet nozzles are co-located with electronic elements on the same substrate or layer. This technique may be used to integrate lower power-density electronics onto an existing microjet nozzle plate to perform microjet nozzle cooling, which removes the need for separate thermal management solutions for systems that contain both high and lower power-density elements in proximity. This technique may also be used in multilayered 3D integrated electronic substrates, allowing for thin, high performing thermal management solutions in 3D integrated stackups using microjets.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: September 24, 2024
    Assignee: JetCool Technologies, Inc.
    Inventors: Jordan Mizerak, Bernard Malouin
  • Patent number: 12101915
    Abstract: The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: September 24, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Nobutake Tsuyuno, Akira Matsushita, Toru Kato
  • Patent number: 12085344
    Abstract: The present invention discloses a boiling enhancement device which comprises an evaporation chamber having a cavity therein and boiling enhancement fins, the boiling enhancement fins are arranged on an inner wall surface of the evaporation chamber, a phase-change heat exchange medium is arranged in the evaporation chamber, and the evaporation chamber absorbs heat from a heat source and transfers the heat to the phase-change heat exchange medium through the inner wall surface. The boiling enhancement fins can increase the number of vaporization cores on the inner wall of the evaporation chamber and increase the area of boiling heat exchange so as to promote boiling vaporization of the phase-change heat exchange medium and reduce boiling thermal resistance.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 10, 2024
    Assignee: SMARTH TECHNOLOGY LTD.
    Inventors: Chun Li, Guangfan Hu, Chunhong Yao, Qiucheng Ma
  • Patent number: 12082371
    Abstract: An electronic device includes a substrate which is provided in a housing and on which a heat generating member is mounted, a cooling member configured to cool the heat generating member, a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member, a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube, a support member fixed to the housing or the substrate, and a tube fixing portion configured to fix the first tube to the support member.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: September 3, 2024
    Assignee: NEC Platforms, Ltd.
    Inventor: Satoshi Isoya
  • Patent number: 12035508
    Abstract: An immersion cooling system and methods for operating the system are described. The system can comprise a vessel configured to hold thermally conductive, condensable dielectric fluid; a pressure controller to reduce or increase an interior pressure of the vessel; a computer component configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: July 9, 2024
    Assignee: Modine LLC
    Inventors: John David Enright, Raquel Parker, Darshan Patell, Randall Coburn, Josh Haley, Ryan Graham, Jason Erickson, Jacob Mertel, Taylor Monnig, Brian Haught, Ryan Myre, William Bret Boren, Andrew Downs, Dustin Yeatman, Edward King, Rick Margerison, Jimil M. Shah, William Hadala, Josh Whitaker, Seamus Egan, Brad Furnish, Tim Tomlin
  • Patent number: 11963337
    Abstract: A cooling device includes a frame structure housing an internal channel and an inlet port coupled to the frame structure. The inlet port is to receive a coolant fluid and to direct the coolant fluid to the internal channel. The cooling device includes one or more contactless cooling ports disposed on the frame structure and at a predetermined distance from an electronic chip. A contactless cooling port accelerates a stream of coolant fluid across a surface of the electronic chip to transfer heat from the electronic chip to the stream of coolant fluid. The cooling device includes a separator for segregating and diverging streams of coolant fluid. The cooling device includes a mounting structure secured to the frame structure, where the mounting structure is mounted to a server chassis or a server board.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: April 16, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11956931
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: April 9, 2024
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11930613
    Abstract: An electronic assembly includes a chassis having electronic module mounting positions. The electronic assembly also includes a respective electronic module received in each electronic module mounting position and having a module cooling gas passageway. Each electronic module has a module glide surface. The electronic assembly includes a respective sealing retainer coupled between the chassis and each electronic module. The sealing retainer has a cooling gas passageway aligned with a chassis cooling gas passageway and the module cooling gas passageway. The sealing retainer includes a retainer body having a retainer glide surface, and a gas sealing gasket carried by the retainer body. The module glide surface and the retainer glide surface have respective cooperating features so that the respective electronic module is maintained in spaced relation from the sealing gasket as the respective electronic module is slidably inserted into a seated position.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: March 12, 2024
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Clarke O. Fowler, Lawrence Ludwig, III
  • Patent number: 11856728
    Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: December 26, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-Yu Chen, Wei-Hao Chen, Yuh-Shiuan Liu
  • Patent number: 11844193
    Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: December 12, 2023
    Assignee: JetCool Technologies, Inc.
    Inventors: Jordan Mizerak, Bernard Malouin
  • Patent number: 11822116
    Abstract: The present disclosure provides a display device and a backlight module thereof, the backlight module comprises a back plate, light bars and a radiator, and the back plate comprises a bottom plate and a first side plate disposed at one side of the bottom plate. The light bar is disposed at the inner side of the first side plate; the radiator comprises a heat absorption part, a condensation part and a pipe, the heat absorption part and the condensation part are communicated with each other by the pipe. the heat absorption part is disposed between the first side plate and the light bar, and the heat absorption part is configured to absorb the heat emitted by the light bar; and the condensation part is disposed at the outer side of the bottom plate.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: November 21, 2023
    Assignee: HKC CORPORATION LIMITED
    Inventors: Xingjia Jiang, Baohong Kang
  • Patent number: 11778783
    Abstract: The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 3, 2023
    Assignee: ZUTA-CORE LTD.
    Inventor: Nahshon Eadelson
  • Patent number: 11765865
    Abstract: Electronic rack and data center thermal management systems are disclosed. An electronic rack system includes a heat exchange system and the electronic rack having a plurality of servers containing heat-generating components. The heat exchange system includes a filter and a pump to circulate filtered cooling fluid to the electronic rack, via an internal cooling loop. An external cooling loop provides a backup cooling fluid supply to the electronic rack to function as a redundant system for the heat exchange system. The external cooling loop includes an external cooling fluid pump and filter, and is coupled to the internal cooling fluid supply via a valve. The cooling fluid in the internal cooling fluid loop, and its associated filter, are of a higher quality than the cooling fluid and filter of the external cooling fluid loop. In one embodiment, the external cooling loop filter is a high quality filtration system.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: September 19, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11758692
    Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: September 12, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Wei-Hao Chen, Bo-Zhang Chen, Chun-Chi Lai, Yun-Kuei Lin
  • Patent number: 11744040
    Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: August 29, 2023
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11744004
    Abstract: A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: August 29, 2023
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD.
    Inventor: Wei-Xiang Li
  • Patent number: 11729954
    Abstract: A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: August 15, 2023
    Assignee: Dell Products L.P.
    Inventors: Weidong Zuo, Yuan Chen, Gemma Hui Chen
  • Patent number: 11682660
    Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Chun Chen Chen, Shang Chien Chen
  • Patent number: 11632873
    Abstract: Devices, systems, and methods for managing server chassis are disclosed. The server chassis may be managed thermally by controlling a flow of gas through an opening in the server chassis. The server chassis may be managed for security by controlling physical access to various portions of the server chassis, and, for example, to a portion of the server chassis proximate to an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed electromagnetically by controlling a flow of electromagnetic radiation into and out of the server chassis and, for example, through an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed structurally by physically reinforcing various portions of the server chassis.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: April 18, 2023
    Assignee: Dell Products L.P.
    Inventors: Jean Marie Doglio, Richard William Guzman, Sean Padrig Odonnell
  • Patent number: 11632853
    Abstract: Heat dissipation systems may include a base, a vapor chamber, and a plurality of cooling fins. The base may contact a top surface of a chip on a printed circuit board to be cooled. The vapor chamber may be planar and be coupled to and extend from the base so that the planar vapor chamber is perpendicular relative to the top surface of the chip. The vapor chamber is coupled to the base so that a first portion of the vapor chamber extends along the base in a first direction, and a second portion of the vapor chamber, adjacent to the first portion of the vapor chamber, extends in the first direction past an edge of the base in order to overhang the printed circuit board. Both the first portion and the second portion of the vapor chamber include the plurality of cooling fins.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: April 18, 2023
    Assignee: Heatscape.com, Inc.
    Inventors: Ali Mira, Yashar Mira, Michael Mira
  • Patent number: 11627687
    Abstract: A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 11, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11578476
    Abstract: An evaporative cooler which includes a sealed loop of conduit with a first portion in a space to be cooled and a second portion in a space where heat is rejected, a volume of working fluid, and a fan inside the conduit loop. The fan forces air over the working fluid to accelerate its evaporation, which requires heat. Evaporation creates vapor-enriched air which carries heat and is forced by the fan to the second portion. Within the second portion, the vapor-enriched air rejects the absorbed heat before being forced back to the first portion. In certain cases, a portion of the working fluid in the vapor-enriched air condenses out and drains or is pumped back to the first portion. In certain uses, the cooler provides cooling to an area. In other uses, the cooler captures vaporized water, producing an impurity-free condensate for removal or use.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: February 14, 2023
    Inventor: John Saavedra
  • Patent number: 11573484
    Abstract: A projector includes a first cooling target, a cooling device, and an exterior housing that houses the first cooling target and the cooling device. The cooling device includes a first compressor configured to compress working fluid, a condenser configured to condense the working fluid, a first expander configured to decompress the working fluid, a first evaporator configured to change the working fluid to the working fluid in the gas phase with heat transferred from the first cooling target, a first connection pipe configured to lead the working fluid discharged from the first expander to the first evaporator, a second connection pipe configured to lead the working fluid discharged from the first evaporator to the first compressor, and a first case configured to seal the first expander, the first connection pipe, the first evaporator, and the second connection pipe on an inside.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: February 7, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Kaname Nagatani, Osamu Katsuda
  • Patent number: 11539109
    Abstract: Phased array antennas, such as a multi-function aperture, are limited in performance and reliability by traditional air-cooled thermal management systems. A fuel-cooled multi-function aperture passes engine fuel through channels within the ribs of the multi-function aperture to provide better heat transfer than can be achieved through air cooled systems. The increased heat transfer and thermal management results in a multi-function aperture with improved performance and reliability.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: December 27, 2022
    Assignee: Hamilton Sundstrand Corporation
    Inventors: William E. Rhoden, Anders Walker, David Cripe, Ross Keith Wilcoxon, Jeremiah Wolf
  • Patent number: 11503735
    Abstract: A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: November 15, 2022
    Assignee: Google LLC
    Inventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
  • Patent number: 11495267
    Abstract: A retention assembly includes a first retention member with a first set of ribs and a second set of ribs. The first set of ribs are positioned to form slots, which are shaped to receive data storage devices. The first set of ribs are arranged to separate adjacent data storage devices and have a first length. The second set of ribs extend into respective slots to form air channels within the slots, and the second set of ribs have a second length that is shorter than the first length.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: November 8, 2022
    Assignee: Seagate Technology LLC
    Inventor: Kevin L. Van Pelt
  • Patent number: 11467638
    Abstract: A water-cooling head adjustment structure for computer water cooling includes a water-cooling head attached to a heating element of a circuit board, a water-cooling head adapter including a bottom panel attached to the water-cooling head, a hollow frame located on the bottom panel and a cover plate covering the hollow frame and equipped with two water inlet and outlet connectors, a steering adapter having two water pipes connected to a water cooling row connector of a water cooling row and two connection pipes respectively connected to the water inlet and outlet connectors of the water-cooling head adapter, and a one-dimensional movement adjustment mechanism provided between the cover plate and the hollow frame for adjustment of the relative position between the cover plate and the hollow frame to align the connection pipes and the water inlet and outlet connectors.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: October 11, 2022
    Assignee: AMERICAN FUTURE TECHNOLOGY
    Inventor: You-Chi Liu
  • Patent number: 11464127
    Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. Alternatively, the blind mating adapter can be separable into two halves that can be positioned to align with, and blind mate to, the coolant distribution manifold. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold. The blind mating adapter unit functions as an intermediate layer for server and rack fluid mating.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: October 4, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11457547
    Abstract: A thermal management system includes an auxiliary thermal management unit, the auxiliary thermal management unit includes a vapor inlet line, a liquid outlet line, and a phase change unit. The phase change unit includes a condenser and a compressor. The auxiliary thermal management unit includes a vapor buffer unit coupled between the vapor inlet line and the phase change unit. The auxiliary thermal management unit includes a liquid buffer unit coupled between the liquid outlet line and the phase change unit, where the auxiliary thermal management unit is to form a double-buffered vapor-liquid loop between the vapor inlet line and the liquid outlet line, where the vapor inlet line is coupled to a rack vapor return of an electronic rack to receive vapor and the liquid outlet line is coupled to a rack liquid supply of the electronic rack to supply cooling liquid.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: September 27, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11324136
    Abstract: Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: May 3, 2022
    Assignee: EUROTECH S.P.A.
    Inventors: Mauro Rossi, Ugo Padulosi, Gianpaolo Zanier
  • Patent number: 11212943
    Abstract: A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: December 28, 2021
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11044834
    Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: June 22, 2021
    Assignee: Google LLC
    Inventors: Michael Chi Kin Lau, William F. Edwards, Jr., Justin S. Lee, Winnie Leung
  • Patent number: 10973141
    Abstract: The disclosure generally relates to an exemplary cooling system for an enclosure that can house an electrical network protection element and provide protection to the electrical network protection element against damage in various environments such as when the enclosure is placed in an underground vault that may be flooded during rain, or when a liquid (oil, for example) comes in contact with the enclosure. The exemplary cooling system may include a coolant reservoir, one or more false walls coupled to the exterior of the enclosure, one or more pancake panels coupled to the false walls through one or more header pipes, and one or more coolant pipes for circulating coolant from the coolant reservoir, through the one or more pancake panels, false walls, and header pipes, and back to the coolant reservoir. The cooling system may only be in contact with the exterior portion of the enclosure. That is, the cooling system may not directly contact the electronics within the enclosure.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: April 6, 2021
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Thomas Ambrose Dauzat, Cecilia Espinoza Diaz, Luis Sanchez Cabral
  • Patent number: 10966346
    Abstract: A method, a device and a system for controlling heat dissipation of an electrical cabinet are provided. The method includes: a heating capacity in the electrical cabinet is predicted; according to the heating capacity predicted, a corresponding heat dissipation capacity is determined; and a rotational speed of a heat dissipation fan is controlled, so that a difference between the heating capacity and the heat dissipation capacity is within a predetermined range.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 30, 2021
    Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Keqin Liu, Yingshuai You, Chongyang Feng
  • Patent number: 10912230
    Abstract: Hybrid multi-function rack door designs are disclosed. A rack includes a housing cabinet and rack door. The housing supports a plurality of servers or information technology (IT) equipment. The rack door is coupled to the housing and includes a rack manifold and a heat exchanger. The rack manifold supplies a cooling liquid to the rack door and extracts a cooling liquid from the rack door. The heat exchanger cools air from the blade servers, and the rack manifold is integrated into the heat exchanger as part of the rack door. The rack door can have the rack manifold in a fixed position and the heat exchanged configured to pivot away from the rack manifold in an open or partially open position. The rack door can be designed as one part of the data center cooling infrastructure, and commissioned together.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: February 2, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10900719
    Abstract: A heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.
    Type: Grant
    Filed: November 25, 2018
    Date of Patent: January 26, 2021
    Assignee: Asia Vital Components Co., LTD
    Inventor: Sheng-Huang Lin
  • Patent number: 10881020
    Abstract: An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: December 29, 2020
    Assignee: Wiwynn Corporation
    Inventors: Tsung-Lin Liu, Ting-Yu Pai, Shih-Lung Lin, Chin-Han Chan
  • Patent number: 10739831
    Abstract: An information handling system may include a circuit board that includes a plurality of expansion slots. The information handling system may further include a cooling card coupled to at least one of the plurality of expansion slots, and a processor coupled to the circuit board (but where the cooling card does not contain the processor). Further, the processor may include a heat exchanger coupled thereto. The cooling card may include a heatsink, and a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled to the heat exchanger.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: August 11, 2020
    Assignee: Dell Products L.P.
    Inventors: Hasnain Shabbir, Dominick A. Lovicott
  • Patent number: 10492341
    Abstract: The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: November 26, 2019
    Assignee: CommScope Technologies LLC
    Inventors: Thomas F. Craft, Jr., Alan James Skrepcinski, Patrick Eugene Yantz
  • Patent number: 10424532
    Abstract: Disclosed is a working contact cooling system for a high-power device (1), wherein the sealed case body (8) is a structure having inner and outer layers, a chamber between the inner and outer layers is filled with a heat-superconductive coolant (9), and an outer wall of the outer layer of the sealed case body (8) is provided with heat dissipating fins (10); the sealed case body (8) is provided with an insulating liquid heat-conductive coolant (2), the coolant pump (6) sinks in the insulating liquid heat-conductive coolant (2), the filter (7) is installed at an inlet of the coolant pump (6), the coolant pump (6) is connected to the spray main pipe (5), and a plurality of spray branch pipes (4) are connected in parallel with the spray main pipe (5), each of the spray branch pipes (4) is provided with a plurality of nozzles (3), and the nozzles (3) face the high-power device (1); the nozzles (3) spray against front and back surfaces of the high-power device (1).
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: September 24, 2019
    Assignee: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE CO LTD
    Inventor: Wei Wang