Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: A system for attaching liquid cooling apparatus includes a fan, a chassis and a grill. The chassis is configured to house electronic components in an interior volume and has an air flow opening large enough to receive the fan. The grill is configured to be fastened to the fan and to the chassis such that, when the grill is so fastened, the fan is disposed at least partially in the interior volume and the grill substantially covers the air flow opening. At least one recess is formed either in the chassis or the grill such that a coolant conduit may be inserted into the recess when the grill is not fastened to the chassis and the coolant conduit is confined within the recess when the grill is fastened to the chassis.

Abstract: A cooling unit includes: a heat-radiating section in which a coolant flows and which radiates heat caught by the coolant; and a path where the coolant flows through the heat-radiating section; a pump on the path to cause the coolant to flow; and heat absorbing sections disposed on the path to touch heat-producing elements having different heating values, in which the coolant runs to absorb heat produced by the heat-producing elements. One of the heat-absorbing sections is a maximum-heat-absorbing section that touches a maximum-heat-producing element and is disposed downstream from the pump and upstream from the heat-radiating section in a flow of the coolant on the path. Another one of the heat absorbing sections is a low-heat absorbing section that touches the heat-producing element except the maximum-heat-producing element and is disposed upstream from the pump and downstream from the heat-radiating section in the flow of the coolant on the path.

Abstract: There is disclosed a projector capable of efficiently cooling an optical element while decreasing the generation of noise as much as possible. A projector P includes a main body 1 provided with a light source 2, an optical element 4 (liquid crystal panels 5, 6 and 7, polarization plates 8A, 8B and a prism 25) which processes (modulates) light emitted from this light source 2 in accordance with image information and a projection lens 9 which projects a modulated projection optical image onto a screen, and further includes a cooling apparatus 10 in which a compressor 12, a radiator 14, a capillary tube 16 (a pressure reducing unit) and an evaporator 18 provided in the main body 1 constitute a refrigerant circuit, and air subjected to heat exchange between the air and the evaporator 18 is supplied to the liquid crystal panels 5, 6 and 7 to cool the panels.

Abstract: Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively.

Abstract: A power conversion apparatus includes a power module, four corners of which are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus that includes nuts which are screwed with bolts projecting from the rear face of the cooling jacket to fasten the power module. An AC terminal of the power module, a DC positive electrode terminal connection portion, and a DC negative electrode terminal are arranged on the top surface of the cooling jacket facing the bolts.

Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In an embodiment, the vapor configuration is modified to include fins that define a cross-flow heat exchanger where the vapor from the vapor chamber serves as the fluid in the vertical cross-flow in the heat exchanger and natural or forced cooling air serves as the horizontal cross-flow for the heat exchanger.

Abstract: A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.

Abstract: Cooling systems (1) suitable for cooling an electronic unit (2) or assembly. The cooling system is provided with a cooling channel (6). An electronic unit (2) rests over a heat-conducting cooler wall (7). A coolant guide apparatus (11) is provided in the cooling channel (6) and has insert conduit elements (13) for guiding the coolant onto the cooler wall indentations (12). The end of each insert conduit (13) opening to the cooling channel (6) may be provided with an inclined entry surface (19) and an inlet opening (20) towards the inner longitudinal channel (14). A plurality of such coolant guides (11) may be arranged in series so that, for example, the same cooling medium flows through a plurality of semiconductor modules in succession.

Abstract: A system includes a plurality of motor controllers. A coolant system for the plurality of motor controller has a common inlet line, a common outlet line, and a plurality of parallel branch lines leading to the plurality of motor controllers. A control selectively increases a flow of coolant to certain of the plurality of motor controllers or limits the flow of coolant to others of the plurality of motor controllers. In addition, a method of operating a system of motor controllers is disclosed and claimed.

Abstract: A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I/O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability.

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Abstract: An enclosure (100) comprising a wall structure (110) defining a container space (112) and electronic devices (114) contained within this space (112). The wall structure (110) includes an entrance for providing an operative fluid (e.g., a heat-transfer fluid) into the container space (112) and an exit for draining the operative fluid therefrom. The wall structure (110) includes an inducement chamber that, when a motive fluid is introduced through an inlet (120), produces a differential pressure that induces the operative fluid in the container space (112) to flow through the exit to an outlet (122). The wall structure (110) can be at least partially constructed from a stack (400) of plates having openings and grooves forming the inlet, the outlet, the entrance, the exit, the fluid circuits, and the chambers.

Abstract: A movable data center is disclosed that comprises a portable container in which an operable computer system is assembled. A data link, power supply link and cooling system are provided through ports on the exterior of the container. The computer system is assembled to a rack that is secured to the container with a shock absorbing mechanism.

Abstract: A power delivery system includes a group of removable power cells. Each power cell includes a water cooled heat sink, an air intake, and an air output. The system also includes a heat exchanger. The heat exchanger draws air from the cells, cools it, and recirculates the cooled air to the cells via each cell's air intake. The cell may be designed so that components that are not near the heat sink are cooled by air from the intake before that air reaches the heat sink.

Abstract: A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.

Abstract: Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.

Abstract: A cooling system for a rotary tablet press with which a rotor is driven by an electrical drive motor and the rotor and drive motor are arranged in a closed housing, and a control cabinet for the drive motor and further units in the housing, wherein arranged within the housing is a cooling machine whose evaporator is part of a first heat exchanger, whose other part is arranged in a coolant circuit for the drive motor, a fan is arranged in a channel in the housing closed relative to the housing interior, where the fan draws cool air in via an air inlet of the housing and gives it off via an air outlet of the housing, wherein the cool air is engaged in heat exchange with a condenser of the cooling machine.

Abstract: A system for attaching liquid cooling apparatus includes a fan, a chassis and a grill. The chassis is configured to house electronic components in an interior volume and has an air flow opening large enough to receive the fan. The grill is configured to be fastened to the fan and to the chassis such that, when the grill is so fastened, the fan is disposed at least partially in the interior volume and the grill substantially covers the air flow opening. At least one recess is formed either in the chassis or the grill such that a coolant conduit may be inserted into the recess when the grill is not fastened to the chassis and the coolant conduit is confined within the recess when the grill is fastened to the chassis.

Abstract: A thermal capacitor cools servers when an active cooling system fails. The thermal capacitor includes cold insulation passages, fans, temperature sensors, and a control unit. The cold insulation passages each have a plurality of air flow channels obtained by dividing the air flow path into a plurality of air flow paths with different air flow path cross-sectional areas. The fan is mounted in each air flow path and the fan controls the air flow of each air flow channel. A temperature sensor is mounted in each outlet of the cold insulation passages. When a detected temperature exceeds a predetermined temperature, the control unit controls air flow so that the ratio of air flow by air flow passage with larger air flow path diameter to overall air flow of all air flow channel increases.

Abstract: A cooling device includes a base having cells. A pipe is coupled to the base for each of the cells. The pipes include passages that carry fluid toward the cell and away from the cell. A magnetohydrodynamic pump system coupled to the pipe circulates an electrically conductive cooling fluid within the passages and the cell. An orifice may emits jets of fluid into the cells. A controller coupled to the cooling device may independently control flow rates in two or more cells of the cooling device. The controller may receive information from the temperature sensors on the base of the cooling device for use in controlling the flow rates in the cells.

Abstract: To improve coolant sealing or reduce the risks in the event of leakage for an electronic unit, e.g. an engine control unit, containing electric and/or electronic components which are disposed on an upper side of a thermally conductive electronic base plate and thermally coupled to the base plate, the base plate in turn being thermally coupled to a coolant passage, there is provided a particular configuration and arrangement of the components delimiting a coolant passage. Advantageously, the underside of the base plate can come into direct contact with a coolant (“direct cooling”). By making a ridge running in an annularly closed manner and being formed in one-piece with the base plate, coolant escaping from the coolant passage is prevented from passing directly to the underside of the base plate. Accordingly, the coolant passage may be sealed by a “double sealing arrangement” on the underside of the base plate.

Abstract: The invention refers to a high-frequency filter (1), comprising a filter housing (2), the filter housing (2) having at least one cover element (2a) with at least one resonator (5, 6, 7, 8, 9, 10, 11, 12) positioned therein and at least one signal input (3), through which a high frequency signal is coupled to the first resonator (5) and a signal output (4), through which a high frequency signal is coupled from the last resonator (10) to downstream appliances wherein the cover element (2a) is made from a thermally conductive material and the resonator (5, 6, 7, 8, 9, 10, 11, 12) is arranged to be in thermal connection with the cover element (2a). The cover element (2a) has at least one recess (23) arranged therein, along with a liquid coolant is guided in order to absorb thermal energy resulting from feeding the high frequency signal to the resonator (5, 6, 7, 8, 9, 10, 11, 12).

Abstract: A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an input bus bar and an output bus bar, and a circuit card assembly connected to the plurality of discrete power devices for managing power signals among the plurality of discrete power devices. The power panel includes a chassis, a mounting bracket with connector sockets formed in the mounting bracket, and a plurality of high power solid state power control modules modularly mounted in the connector sockets.

Abstract: A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.

Abstract: A housing for electronic equipment comprises a heat exchanger for exchanging heat between a liquid-containing medium and a gas. This heat exchanger comprises a medium inlet and a medium outlet and a flat heat exchanger mat. The mat comprises a number of parallel, equidistant capillaries of heat-conducting material and wires of heat-conducting material which are attached in heat-conducting contact to the capillaries, extend in transverse direction relative thereto and have a mutual distance in the order of magnitude of the diameter of the wires, wherein air can flow along the wires for heat exchange between this air and the medium flowing through the capillaries. The heat exchanger is embodied such that the air flows along the mat and at least a substantial part of the air is prevented from flowing through the mat, and that it is ensured that the air flows along the wires in longitudinal direction of these wires.

Abstract: An electric drive is disclosed which includes at least a choke unit, a power step unit, and a capacitor unit for implementing power supply to an electricity-consuming device. A cooling arrangement is disclosed for cooling the choke unit, the power step unit, and the capacitor unit. The choke unit, the power step unit, and the capacitor unit can be distributed into at least two separate and separately coolable entities, and the cooling arrangement can include parallel cooling apparatuses for cooling the at least two separate and separately coolable entities.

Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Abstract: A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces.

Abstract: A flat vapor chamber apparatus and method are provided for transferring heat between integrated circuits. In use, a flat vapor chamber is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit.

Abstract: An electronic device and a heat dissipation unit thereof are provided. The electronic device includes a housing, a circuit board, a heat source, a heat dissipation system and a heat dissipation unit. The circuit board is disposed in the housing and the heat source is disposed on the circuit board. The heat dissipation abuts the heat source, and the heat dissipation unit, disposed on the housing, abuts the heat dissipation system, wherein a portion of the heat dissipation unit is exposed outside of the housing. The heat dissipation unit includes a connecting portion, a heat exchanger, and a heat pipe. The connecting portion, disposed in the housing, abuts the heat dissipation system. The heat exchanger is disposed in the housing, and a portion of the heat exchanger is exposed outside of the housing. The heat pipe connects the connecting portion with the heat exchanger.

Abstract: Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components of the dies.

Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation.

Abstract: A computing system and method of operating a computing system is provided.

Abstract: A method and apparatus for an electronic equipment enclosure that provides directed airflow only to those volumes within the enclosure that require the airflow. The electronic equipment enclosure further provides protection from contaminants such as falling dirt, rain, sleet, snow, windblown dust, splashing water, hose-directed water, and ice. A pedestal may be coupled to the electronic equipment enclosure that facilitates movement of the electronic equipment enclosure via a pallet jack, forklift, front loader, or similar jacking device. A sidecar may also be coupled to one or more sides of the electronic equipment enclosure to facilitate vertically mounted equipment within the sidecar.

Abstract: Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.

Abstract: A heat exchange apparatus is provided and includes an external structure to support an airflow cooled computing device, first and second doors, each of which includes a heat transfer surface, sequentially coupled to the external structure downstream from the computing device, a water supply system fluidly coupled to a water supply and to the heat transfer surfaces of the first and second doors to thereby supply water to the heat transfer surfaces, first and second valves coupled to the water supply system for association with the first and second doors, respectively, and an exhaust system, disposed proximate to the external structure, configured to recycle the cooled airflow downstream from the first and second doors for repeated cooling of the computing device.

Abstract: A cooling device comprises a heat radiating portion, heat-transferring component, such as a heat pipe, a fan and a support member. The heat radiating portion radiates the heat generated by the heat-generating component. The heat-transferring component transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion. The support member includes a first part to hold the heat radiating portion, and a second part to hold the fan.

Abstract: A heat dissipation module for an electronic device includes a base disk, a suction disk, a water guide and a cover. The base has a containing space and a plurality of cooling strips. The suction base is attached to the base disk and further includes a water chamber for receiving sucked water, an inlet and an outlet. The water guide is attached to the suction disk with a guide port at the periphery thereof. The cover closes the suction disk and is movably joined to a guide fan. When the heat dissipation module is full with fluid, the fluid can flow therein rapidly while the guide fan rotating such that the fluid is discharged from and flows into the heat dissipation module more effectively.

Abstract: Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat-generating element mounted in the housing, a cooling fan mounted in the housing, a fin unit which is mounted in the housing and opposed to the cooling fan, and a heat transfer member which thermally connects the fin unit to the heat-generating element. The cooling fan includes a fan case which is provided with an opening portion. The fin unit includes an insertion portion which is inserted into the fan case through the opening portion. The insertion portion is provided to extend from one longitudinal end area to the other longitudinal end area of the opening portion.

Abstract: An electronic component or assembly that is assembled within a case that is designed to operate as a liquid phase to gas phase heat pipe where the electronic component or assembly is introduced into a liquid or partially liquid partially gaseous environment; whereby said liquid evaporates into a gas absorbing heat energy and transferring it to and through the component's or assembly's case. The case will be engineered out of materials that do not contaminate the liquid and electronics with ions and will be engineered to include a plurality of chambers/towers that extend in various directions providing enhanced heat pipe functionality in any physical orientation.

Abstract: A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.

Abstract: A water-cooled heat dissipation device for a notebook computer includes primarily a pad and a heat dissipation device at a bottom of the pad having an air through-hole. The heat dissipation structure has a fan below a U-shape plate, a groove of which is latched with parallel fins being transfixed with a metallic tube in a detouring way, with two ends of the metallic tube being connected to a water pump, allowing cooling water to circulate in the metallic tube to cool down the fins. The heat dissipation structure is fixed below the air through-hole of the pad with the two ends of the U-shape plate. In usage, a notebook computer is put on the pad, and temperature of the notebook computer is conducted to the pad. Furthermore, cold wind is blown to the pad by the fan, such that the notebook computer can be cooled down rapidly.

Abstract: In order to make a power supply unit available for an electrical appliance, in particular, for a computer, it is suggested that said electrical appliance has a fan device, wherein a radiator for a liquid cooling device is integrated into the power supply unit.

Abstract: A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

Abstract: Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

Abstract: The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system.