Abstract: The present invention relates that a part of the outer bottom is combined with an intermediate heat conductor (102) the flow guide holes (300) are not totally shielded after combined, the interior of the heat dissipater (100) is installed with the heat conductive rib structure (310) for being combined with the inner periphery of the heat dissipater (100), the intermediate heat conductor is installed with the electric luminous body (200) and formed as the heat source, so the heat can be conducted to the surface of the heat conductive rib structure (310) and the heat dissipater (101), and with the fluid effect of hot ascent/cold descent, the airflow is enabled to upwardly flow from one side of the electric luminous body (200) through the flow guide holes (300) then flow out from the other side thereof.

Abstract: A power converting apparatus includes a housing base, a main body, an air duct, a pair of upright air duct walls, first and second heat generators, and a protrusion. The housing base has first and second surfaces. The main body is on the first surface. The air duct is for cooling air to flow through the air duct and is on the second surface. The upright air duct walls are on the second surface and extend from an upwind side to a downwind side. The first and second heat generators are disposed in series from the upwind side to the downwind side in the air duct. The protrusion is between the first and second heat generators to protrude from at least one of the pair of air duct walls toward a center portion of an air-flowing space for the cooling air.

Abstract: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.

Abstract: An ultrasound diagnostic apparatus includes an apparatus for heating a coupling medium, wherein the apparatus includes an external heat conductive unit, including a base for positioning a container storing the coupling medium, and an internal heat sink unit for absorbing heat from the heat generating unit of the ultrasound diagnostic apparatus. The external heat conductive unit and the internal heat sink unit are configured as separate assembly structures such that, in the state of assembly, the heat of the heat generating unit is transferred to the container through them.

Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

Abstract: Magnetic fluid cooling devices and power electronic devices are disclosed. In one embodiment, a magnetic fluid cooling device includes a magnetic field generating device, a magnetic fluid chamber assembly, and a heat sink device. The magnetic field generating device includes a plurality of magnetic regions having alternating magnetic directions such that magnetic flux generated by the magnetic field generating device is enhanced on a first side of the magnetic field generating device and inhibited on a second side of the magnetic field generating device. The magnetic fluid chamber assembly defines a magnetic fluid chamber configured to receive magnetic fluid. The heat sink device includes a plurality of extending fins, and is thermally coupled to the magnetic fluid chamber assembly. Power electronic devices are also disclosed, wherein the magnetic fluid chamber may be configured as opened or closed.

Abstract: An electronic device includes: a casing in which electronic components including a heat-emitting component which emits heat during operation are accommodated; a heat-dissipating component including a plurality of fins to which heat emitted in the heat-emitting component transfers; a fan operable to supply cooling air to the heat-dissipating component; and a cleaning component movable on an end surface of the fins along the side nearer the fan with the cleaning component abutting against the end surface of the fins. In these features, dust on the end surface of the fins can be automatically removed by moving the cleaning component in the case of the spatial orientation of the electronic device being changed. Therefore, an effect of removing heat emitted in the heat-emitting components, by using cooling air supplied from the fan, can be continuously obtained.

Abstract: A combination heat sink including a first radiating element having a first plane section and a second radiating element having a second plane section. Multiple first radiating fins integrally upward extend from the first plane section. Each two adjacent first radiating fins define therebetween a first connection section. Multiple second radiating fins integrally upward extend from the second plane section. Each two adjacent second radiating fins define therebetween a second connection section. The first and second radiating elements are connected with each other in an alternating manner with the first radiating fins attaching to and contacting with the second radiating fins to form the heat sink.

Abstract: The present invention provides a heat sink device, suitable to the heat dissipation of a high-power medium-voltage drive power cell. The device comprises a heat dissipation substrate having a first surface, a second surface and an inner layer between the first surface and the second surface; a heat pipe having an evaporation section and a condensation section. The evaporation section is buried in the inner layer of the heat dissipation substrate, and the condensation section is used to dissipate the heat from the evaporation section to the air. The power elements of the high-power medium-voltage drive power cell are disposed on the first surface and the second surface, respectively.

Abstract: The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED.

Abstract: An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset.

Abstract: A cooling system for cooling a heat source and a projection apparatus having the same are disclosed. The cooling system includes a heat dissipating device and a thermoelectric cooler (TEC). The heat source is disposed on the side of the heat dissipating device. The TEC is disposed on the other side of the heat dissipating device corresponding to the heat source. The TEC is initiated as the temperature of the heat source is greater than the first value, while the TEC is shut off as the temperature of the heat source is lower than the second value. Therefore, the cooling system economizes the energy by controlling the operation of the TEC according to the temperature of the heat source.

Abstract: In a power conversion apparatus including a rectifying module mounted with a power conversion device, an inverter module, and a direct-current reactor, a rectifying module and an inverter module 5B are mounted on a base section of a cooling fin, a direct-current reactor (DCL) is arranged in a lower layer of a vane section attached to the lower surface of the base section of the cooling fin 3A, an air gap section is provided in the cooling fin 3A, and a terminal block for obtaining electrical connection between the rectifying module and the inverter module and the direct-current reactor (DCL) is arranged making use of a space of the air gap section.

Abstract: An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.

Abstract: A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement parts of the active element and the passive element on its one end side and electrically connected to one of the first and second electrodes of the active element and the passive element arranged in the first region, a cooling fin arranged in a second region defined on the other end side of the heat pipe, and a heat pipe provided to sandwich the active element, the passive element, and the cooling fin arranged on the heat pipe along with the heat pipe and electrically connected to the other of the first and second electrodes of the active element and passive element.

Abstract: A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.

Abstract: A heat dissipation device includes a heat sink and a fan duct. The fan duct includes a cover and a baffle. The cover includes a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate. The baffle is located between the first sidewall and the second sidewall of the cover and pivotally contacts the first and second sidewalls. The baffle forms an angle with the top plate and is rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate.

Abstract: A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

Abstract: In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

Abstract: An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A portable air cooled data center can include interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in thermal communication with the heat sink allowing for heat dissipation. External fans can pull external air over the outer heat pipe assembly. A first transducer can monitor inner air temperature within the data center, a second transducer can monitor the outer heat pipe assembly, and a third transducer can be secured proximate to a fin side of the heat sink. A controller can be connected to the transducers, fans, and a power supply. Computer instructions can be used to monitor temperatures from the transducers, compare the temperatures to preset limits, and individually or simultaneously actuate, regulate, or turn off the fans when monitored temperatures meet or exceed preset limits.

Abstract: A heat dissipation member is disposed opposing a reflective light modulation element, and includes: a heat receiving surface that receives heat from the element; a heat dissipation surface; and heat dissipation fins that protrude from the heat dissipation surface. The fins are formed so that the density at which the fins are disposed is greater at the center area of the heat dissipation surface than at the end areas of the heat dissipation surface, or are formed so that the cross-sectional surface area of the fins is greater at the center area of the heat dissipation surface than at the end areas of the heat dissipation surface.

Abstract: Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.

Abstract: The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.

Abstract: A cooling system for computer, a cooling apparatus and a cooling method are described. The cooling system includes a computer casing, a fan and the fan-less cooling apparatus. The fan-less cooling apparatus has an air passage with two open ends and a closed circumference. The air passage passes a heat dissipating part of the apparatus, one end of the air passage communicates with air outside the computer casing and the other end communicates with air inside the computer casing. a plurality of blowholes for the fan and the air passage are formed in the computer casing. There is at least one fan. Air is blown inside or outside through the blowholes, which causes a pressure difference between the interior and the exterior of the computer casing. The pressure difference leads an air flow to flow through the blowholes to dissipate heat.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: An enclosure comprises a thermal barrier (42) for protecting a heat sensitive component (40). The thermal barrier includes at least one endothermic layer (48, 54, 58) that includes water gelled with a thickening agent, absorbed onto a cellulose-comprising fabric or paper. The endothermic layer is sandwiched between layers comprising metal foil or sheet (49, 52, 56).

Abstract: A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.

Abstract: A flat-panel display apparatus comprises a display panel, a circuit board, and a cover. The circuit board includes a first and second circuit boards. The first circuit board is arranged above the second circuit board so that, on the back side of the display panel, a mounting surfaces of the first and second circuit boards are approximately in parallel with a display surface of the display panel and do not overlap each other. Each of the first and second circuit boards have a primary mounting surface on which a large number of electrical components are mounted, and a secondary mounting surface that is opposite the primary mounting surface. The primary mounting surface of the first circuit board is arranged in an inverted orientation to the primary mounting surface of the second circuit board. A radiator with fins is provided on the secondary mounting surface side of the first circuit board.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.

Abstract: A photovoltaic receiver comprising an elongated structure bearing a plurality of photovoltaic cells. Said structure carries a plurality of finned dissipators, mounted on which are said photovoltaic cells, and ventilating means, designed to convey a flow of cooling air towards said dissipators.

Abstract: A cold plate assembly includes an inlet manifold layer, a target heat transfer layer, a second-pass heat transfer layer, and an outlet manifold layer. The inlet manifold layer includes a coolant fluid outlet and an inlet channel. The inlet channel includes a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles. The target heat transfer layer includes a plurality of target heat transfer cells having a plurality of target heat transfer layer microchannels extending in a radial direction from a central impingement region. The second-pass heat transfer layer includes a plurality of second-pass heat transfer cells having a plurality of second-pass heat transfer layer microchannels extending in a radial direction toward a central fluid outlet region, and one or more transition channels. The impingement jet nozzles are positioned through the central fluid outlet region. The outlet manifold layer includes an outlet channel having a plurality of fluid outlet holes.

Abstract: A heat sink for use with a heat generating component includes a molded cooling block including a molded cooling passage for receiving a cooling medium. The cooling block is configured to be positioned in sufficient heat transfer relationship with respect to the heat generating component so that the cooling medium receives heat from the heat generating component.

Abstract: A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages. At least one of the plurality of first passages extends between an adjacent pair of the plurality of second passages and is oriented to channel fluid toward at least one of the plurality of fins.

Abstract: A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach.

Abstract: A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: According to one embodiment, an antenna cooling system, comprises a first cylinder and a second cylinder substantially concentric to the first cylinder. The first and second cylinders form a chamber between the first cylinder and the second cylinder. The chamber is configured to receive a fluid flow. A plurality of fins are disposed within the chamber and rigidly coupled to the first cylinder and the second cylinder. The plurality of fins are configured to transmit thermal energy to the fluid flow. A plurality of ports are coupled to the second cylinder. Each port is configured to receive an antenna unit.

Abstract: A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.

Abstract: A heat sink includes a plurality of metal fins interconnected together. Each metal fin includes a main plate, a flange extending forwardly from the main plate and an interlocking unit formed on the flange. The interlocking unit includes an engaging ear and a hook. The ear extends rearwards from a rear edge of the flange and defines a locking hole therein. The flange defines a cutout adjacent to a front edge thereof. The cutout is aligned with the ear and recessed rearwards from the front edge of the flange. The hook extends forwardly from the flange and is located within the cutout. The ear of a fin is engaged in the cutout of an adjacent rear fin. The hook of the adjacent rear fin is engaged in the locking hole of the engaging ear of the fin.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.