Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract: An LED fixture include a mask structure and an LED module. The mask structure includes a cooling fin set of buckling type, an upper socket and a lower socket. The cooling fin set is constituted by a plurality of cooling fins that are encircled and inter-buckled to each other. An interior enclosed by the cooling fin set is formed into an accommodating space and a fitting hole connecting the accommodating space. The upper socket is assembled to one side of the fitting hole, while the lower socket is assembled to another side of the fitting hole. Meanwhile, the upper socket and the lower socket are respectively fastened by the cooling fin set through a clipping-and-abutting manner. The LED module is arranged by accommodating in the accommodating space and is connected to the cooling fin set as well. Accordingly, the entirely cooling effectiveness is promoted and the using lifetime is prolonged.

Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.

Abstract: An electronic apparatus that includes a circuit substrate being installed in a casing. The electronic apparatus has first and second groove portions that are formed on a first surface and a second surface of a heat sink, respectively. The heat sink discharges heat from a heat element on the circuit substrate to the outside of the casing. The electronic apparatus has a through-hole portion that is formed at an intersection point of the first groove portion formed on the first surface of the heat sink and the second groove portion formed on the second surface of the heat sink.

Abstract: Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.

Abstract: According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.

Abstract: A wing-spanning thermal-dissipating device has a plurality of thermal-dissipating sheets. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets connect with each other. The thermal-dissipating fin is extended outwardly and spread out from the connecting portion. The sub-thermal-dissipating fins are extended from at least one side of the thermal-dissipating fin.

Abstract: The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. Said cooling device comprises external cooling ribs (14) on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.

Abstract: A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.

Abstract: A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat generating component.

Abstract: Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.

Abstract: For retaining a heatsink in contact with a processor on a board, a plurality of spaced apart mounting studs are mounted on the board. Each mounting stud includes a pivotally mounted resilient arm and a catch. A pair of the studs are positioned such that the resilient arm of one of the studs pivots to extend to engage the resilient arm catch of an adjacent one of the studs.

Abstract: A heat dissipating structure includes a cover. The cover includes an inner heat dissipating body and an outer heat dissipating body. The inner heat dissipating body includes a cylinder and a plurality of first fins extending from an outer surface of the cylinder. The outer heat dissipating body includes a ring portion encircling a part of the inner heat dissipating body and a plurality of second fins extending from one side of the ring portion. In this way, more heat dissipating fins and larger heat dissipating surface area can be formed to enhance heat conduction and dissipation effect when restricted by the size of cover. A lamp with this heat dissipating structure is also provided. A service life of the LED in the lamp can be greatly prolonged.

Abstract: A cooling device includes a base having cells. A pipe is coupled to the base for each of the cells. The pipes include passages that carry fluid toward the cell and away from the cell. A magnetohydrodynamic pump system coupled to the pipe circulates an electrically conductive cooling fluid within the passages and the cell. An orifice may emits jets of fluid into the cells. A controller coupled to the cooling device may independently control flow rates in two or more cells of the cooling device. The controller may receive information from the temperature sensors on the base of the cooling device for use in controlling the flow rates in the cells.

Abstract: A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.

Abstract: A heat dissipation device for cooling an electronic device mounted on a printed circuited board includes a heat sink thermally contacting the electronic device, a fan defining a plurality of through holes in a periphery thereof and a fixing device fixing the fan on a side of the heat sink. A plurality of fasteners are attached on a bottom of the heat sink and fasten the heat sink on the printed circuited board. The fasteners block the through holes in a bottom of the fan. The fixing device includes fixing brackets attached to the heat sink and a plurality of resilient connecting devices. Each resilient connecting device has an end extending through a corresponding through hole in the bottom of the fan and connected to the fan, and another end connected to a bottom of a corresponding fixing bracket.

Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Abstract: A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.

Abstract: A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.

Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.

Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack. The apparatus includes a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

Abstract: A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.

Abstract: The present invention relates to a method of cooling a static electronic power converter device including at least one electrical circuit including an assembly of active components and of passive components mounted in a closed radiator housing from which only the inlet and the outlet of the circuit communicate with the outside of the housing, in which the distribution of the heat energy given off by the active and passive components is made uniform throughout the inside volume of the housing, and the heat energy is transferred from the radiator housing by forced convection in substantially uniform manner over the entire inside surface of the walls of the housing by causing at least one fluid contained inside the leaktight housing to circulate in a closed circuit. The invention also provides a static electronic power converter device enabling the method to be implemented.

Abstract: The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased.

Abstract: The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.

Abstract: A heat-dissipating structure for an optical isolator is capable of suppressing an increase in temperature caused by light absorption in a magnetic garnet crystalline film by radiation fins extending from the inside of an external heat conducting cover. The heat-dissipating structure for the optical isolator is formed by housing a magnetic garnet crystalline film (12), first and second heat conductive plates (6, 7, 8 and 9) and magnet 18 in the external heat conducting cover, placing the radiation fins (10 and 11) on the second heat conductive plate, attaching the first heat conductive plates (6 and 7) onto either side of the magnetic garnet crystalline film, arranging the second heat conductive plates (8 and 9) on the outer surface of the first heat conductive plates, and passing the radiation fins through guide openings (2a and 2b) in the isolator holder 2 to the outside of the external heat conductive cover from the extracting opening (3c) to be brought into contact with the outer grooves (4d and 5d).

Abstract: In order to ensure waterproofing between a resin enclosure case and a heat sink, a canopy structure is provided in a portion, in which water is likely to penetrate, so as to prevent the water from entering the portion, thereby directing the water flow to the outside of the enclosure. This makes it easy to install and remove an electronic unit, so that an electronic component integrally formed with the heat sink can be easily replaced.

Abstract: A method of producing a thermally conductive cover for an electric circuit assembly having a plurality of heat dissipating components is disclosed. The thermally conductive cover including a top surface, a bottom surface, and at least one rib extending downwardly from the bottom surface. The method includes selecting a plurality of dimensions for the thermally conductive cover such that the bottom surface will be spaced above and extend over top sides of the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The at least one rib will extend over and be spaced from the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The method further includes producing the thermally conductive cover with the selected dimensions. Thermally conductive covers are also disclosed.

Abstract: A device (103) is provided which comprises (a) a housing (115) equipped with a viewing window (253); (b) a diaphragm (301), visible through said viewing window; (c) an actuator (126) adapted to vibrate said diaphragm at an operating frequency; and (d) a strobe light (121).

Abstract: A system for removing heat from an electronic component associated with an information handling system is disclosed. The system may comprise a mass providing a heat sink to the electronic component and a set of extended surfaces for transferring heat from the mass. The set of extended surfaces may define a primary flow direction for a cooling fluid. A first subset of the set of extended surfaces may have a first length measured in the primary flow direction. A second subset of the set of extended surfaces may have a second length measured in the primary flow direction. Each of the first and second subsets of extended surfaces may include one or more extended surfaces. The second subset of extended surfaces may be generally proximate the hotspot of the electronic component. The second length may be less than the first length such that the flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces.

Abstract: A mounting apparatus for mounting a data storage device that has a protrusion protruding from a sidewall thereof includes a bracket for holding the data storage device, a mounting member, a locking member, and a resilient member. The bracket includes a first side wall. The first side wall defines a slideway, for receiving the protrusion of the data storage device to slide therealong. The mounting member is mounted to the first side wall. The locking member slidably mounted to the mounting member includes a projecting part adjacent the slideway of the bracket, for locating the protrusion of the data storage device. The resilient member is located between the mounting member and the locking member.

Abstract: A heatsink having tapered geometry that improves passive cooling efficiency is discussed. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing cooling gas upon heating. Thus, the tapered heatsink elements result in higher velocity of gas flow and increased cooling efficiency of the heatsink. Optionally, the heatsink is made from a thermally conductive polymer allowing the heatsink to be created in complex shapes using injection molding.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the base, provides a diversion direction, and has a heat insulated pipe-wall which partitions the diversion pipeline into an inside and an outside portions and reduces the heat conduction in the diversion direction of the diversion pipeline. The heat conductive pieces are fixed on the diversion pipeline, and have a heat dissipation direction from the inside portion to the outside portion of the diversion pipeline which crosses the diversion direction. Each two neighboring heat conductive pieces are separated with the heat insulated pipe-wall. The fan is assembled on the outside of the diversion pipeline and provides a cool air for the heat conductive pieces.

Abstract: In an embodiment, an automotive inverter assembly has at least one component for cooling. The inverter assembly has a supporting body for supporting the at least one component. The supporting body defines at least part of a volume through which flows a cooling fluid coupled thermally with the at least one component for cooling.

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: A heat sink device for a display card includes a heat sink, the heat sink having a base and a plurality of heat-dissipating fins on the base, the base having two hooks respectively beside two lateral sides of the groove; a heat-dissipating fan, having a blade wheel and a power wire for the blade wheel, the blade wheel being on the base and the power wire being inside the groove of the base; and a fastener, having two engagement parts respectively corresponding to the hooks, wherein the fastener covers the groove so as to position the power wire by means of engagement of the hooks with the engagement parts. Therefore, the power wire of the heat-dissipating fan can be properly arranged on the heat sink.

Abstract: In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.

Abstract: In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.

Abstract: A heat dissipation assembly for dissipating heat from a heat-generating component includes a first heat sink mounted on the heat-generating component for dissipating heat therefrom, and a second heat sink movably mounted to the first heat sink, to be adjustable relative to the first heat sink. The second heat sink can be moved to a desired position to fit a need of heat dissipation.

Abstract: An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.

Abstract: A heat dissipation device includes a heat sink and an LED module attached to the heat sink. The heat sink includes a base and a plurality of fins mounted on the base. A plurality of channels is defined between the fins of the heat sink and slits are defined in two opposite side edges of the base. The slits extend through the base and corresponding fins and cross with corresponding channels. A plurality of grooves is defined in the fins opposite to the LED module. Each of the grooves interconnects corresponding two aligned slits.

Abstract: A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins.

Abstract: A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substrate and sandwiched between the heat spreaders. A plurality of first channels are defined in the first fin unit and parallel to the heat spreaders. Each of the second fin units is perpendicularly arranged on the substrate and located at a lateral, outer side of one of the heat spreaders. A plurality of second channels are defined in each of the second fin units and extend along a different direction compared to that of the first channels.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Abstract: A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.