Abstract: A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substrate and sandwiched between the heat spreaders. A plurality of first channels are defined in the first fin unit and parallel to the heat spreaders. Each of the second fin units is perpendicularly arranged on the substrate and located at a lateral, outer side of one of the heat spreaders. A plurality of second channels are defined in each of the second fin units and extend along a different direction compared to that of the first channels.

Abstract: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.

Abstract: A heat-dissipating device includes a heat sink, a heat-dissipating fan, and a first air guide hood. The heat sink includes a base, and a plurality of interconnected heat-dissipating fins provided on the base. Each adjacent pair of the heat-dissipating fins defines an air channel therebetween. The heat-dissipating fan is disposed at a rear side of the heat sink to provide a heat-dissipating air current to the heat sink such that the air current flows from the rear side of the heat sink through the air channels and out through a front side of the heat sink. The first air guide hood is disposed at one of left and right sides of the heat sink and is located in front of the heat-dissipating fan to guide a portion of the air current provided by the heat-dissipating fan to the outside through one side of the heat sink.

Abstract: According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the heat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.

Abstract: A cooling system for a heat producing component includes a base having two or more cells. The cells may include microchannel passages. A pump system may be coupled to the base. The pump system may circulate fluid independently in each of two or more of the cells. The pump system may include an array of two more magnetohydrodynamic pumps. Each magnetohydrodynamic pump may provide fluid to a different cell. A controller may control a flow rate in each one of cell of the cooling system independently one or more of other cells of the cooling system.

Abstract: A heat sink assembly includes a base plate, a fin group and a heat pipe thermally connecting the base plate with the fin group. The fin group includes a plurality of fins. The heat pipe includes a straight evaporating section contacting with the base plate, a first condensing section extending upwardly from an end of the evaporating section and through the fins, a second condensing section bent downwardly from a free end of the first condensing section and through the fins, and a third condensing section extending upwardly from an opposite end of the evaporating section and through the fins. Periphery walls of at least two of the first, second and third condensing sections substantially totally contact with the fins to increase a contact area between the heat pipe and the fins.

Abstract: A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver (30), includes a heat sink (10) for contacting the graphic card and a fan duct (20) fixed on the heat sink. The fan duct is made by bending a planar metal plate and has a first portion soldered to a top face of the heat sink and a second portion slantwise and upwardly extending from the first portion. When a fan (40) generates an airflow towards the heat sink, a part of the airflow flows through the heat sink to remove heat in the heat sink, and another part of the airflow is guided slantwise and upwardly by the second portion of the fan duct to flow through the hard disk driver, thereby to cool the hard driver.

Abstract: A planar transformer comprises a primary coil board including a primary coil, a secondary coil board including a secondary coil, a heat sink integrally having a spacer portion, and a magnetic core assembly mounted to the primary coil board and the secondary coil board. The spacer portion is inserted into a gap between and facing the primary coil board and the secondary coil board and at least a surface of the heat sink is electrical insulating.

Abstract: The present invention provides an assembled heat sink structure including a base, a plurality of heat dissipating fins mounted on the top of the base, and a capillary device located inside the base, wherein the base is formed and assembled by an upper cover with a lower cover and the mountain-shaped fin-like device for diversion or capillary is located inside the base, so that after a plurality of heat dissipating fins are assembled on the top of the base, they can be welded to form an integration. Then, a heat dissipating medium can be poured into the airtight chamber of the base, and thus, when the base is contacted with the contact surface, the heat can be absorbed by an absorbing end of the base, transmitted to a plurality of heat dissipating fins on the top of the base and then exhausted by a fan, thereby achieving heat dissipating effect.

Abstract: In an assembly of an electronic device and a heat-dissipating module, the electronic device includes an electronic component disposed within a housing provided with an air outlet port, and the heat-dissipating module includes a heat-dissipating fin base disposed within the housing adjacent to the air outlet port, and a dust removing mechanism disposed on the heat-dissipating fin base. The heat-dissipating fin base includes two spaced-apart upright sidewalls, and a plurality of heat-dissipating fins arranged between the upright sidewalls. The dust removing mechanism includes a scraping plate disposed between the upright sidewalls and accessible outwardly of the air outlet port. The scraping plate has scraping teeth extending respectively into clearances among the heat-dissipating fins. By manipulating the scraping plate to displace upwardly and downwardly relative to the heat-dissipating fin base, dust that accumulates among the heat-dissipating fins can be scraped off.

Abstract: A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

Abstract: A light emitting diode lamp includes a heat sink, a socket, a light emitting module, a holder and a lens. The socket and the holder are respectively positioned opposite sides of the heat sink. The light emitting module is combined with the heat sink and has a light emitting diode unit. The lens is mounted on the light emitting diode unit and combined inside the holder. The heat sink includes a substrate and a plurality of heat dissipating fins. The substrate has a plurality of extending arms in a manner that a slot is formed between two neighboring extending arms. A plurality of heat dissipating fins is inserted into the corresponding slots. One of opposite sidewall surfaces of each extending arm is against one of opposite surfaces of each heat dissipating fin. Thereby, there is no need of producing a heat sink by soldering.

Abstract: An entrainment heatsink system and method using distributed micro jets. Such a system and/or method utilize a pressurized primary flow through arrays of micro nozzles to entrain a much larger secondary flow to carry heat away from the heatsink. The bleed air from an aircraft engine represents an ideal pressurized air source for the primary flow with respect to such a heatsink. As such, the needed high-pressure primary flow is very small and can be delivered via thin air hoses, which has the flexibility to reach constraint spaces. In addition to the entrainment effect, the distributed micro jets also induce a high level of turbulence in the heatsink, significantly enhancing heat transfer and cooling performance.

Abstract: A heat sink for dissipating a heat from an object includes a plurality of fins. The fins are arranged radially about a center axis to be spaced away from one another, and extend outward in a radial direction substantially perpendicular to the center axis. Each fin is branched at at least two different positions in the radial direction into at least three fin end portions spaced away from one another.

Abstract: A heat dissipating module includes a heat dissipating apparatus and a fan. The fan is disposed adjacent to a side of the heat dissipating apparatus. A heat dissipating apparatus includes a flat heat column and a plurality of heat dissipating fins. The heat dissipating fins are disposed at the exterior of the flat heat column. A flat heat column has a pipe-body and a base, and the pipe-body includes a circular sidewall, an open end and a closed end. The base is coupled to the circular sidewall at the open end to form a closed space in the flat heat column, wherein the circular sidewall converges from the open end toward the closed end to form a converging part and a flat part.

Abstract: One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Abstract: A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.

Abstract: A heat radiator is in the form of a rectangular body having two opposite longer sides and two opposite shorter sides, and includes a contact section located at an end surface of the heat radiator for contacting with a heat source and having at least one extension wall outward extended therefrom to divide the heat radiator into a first heat-dissipating zone, which consists of a plurality of curved radiation fins outward extended from the contact section toward the two longer sides, and a second heat-dissipating zone, which consists of a plurality of straight or curved radiation fins outward extended from the contact section and the extension wall toward the two shorted sides. These radially outward extended radiation fins not only provide increased heat radiating areas, but also guide airflow produced by a cooling fan to smoothly flow therethrough to carry heat away from the heat radiator in different directions.

Abstract: An electronic apparatus includes a circuit board, circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The circuit elements include a heat generating element. The cooling structure includes a heat spreader, cooling fins integrally formed with the heat spreader, an air inlet, an air outlet, and a fan device for generating cooling air flowing from the air inlet to the air outlet. The heat spreader is placed above the circuit board and thermally joined to the heat generating element mounted on the circuit board. The cooling fins extend toward the circuit board to provide a plurality of air passages between the circuit board and the heat spreader. The air inlet and outlet communicate with each other through the air passages.

Abstract: A light source module includes at least a light source and a housing. The housing includes a base having a slanted reflective surface, a plurality of sidewalls extending out of a peripheral of the base cooperatively defining an opening with the base, the sidewall aligned with a trough of the slanted reflective surface having an inner surface and an outer surface opposite to the inner surface, and a plurality of fin structures formed on the outer surface of the sidewall. The light source is fixed on the inner surface of the sidewall. Light rays emitted from the light source being reflected at the slanted reflective surface toward the opening. A backlight system using the light source module is also provided. The present backlight system has a good heat dissipation capability due to an employment of the present light source module, and can be configured to be a thin body.

Abstract: An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part and the heat generated by the first component.

Abstract: The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

Abstract: A heat dissipation device includes a base, a first heat sink located on the base, a second heat sink located on the first heat sink, and a heat pipe contacting with the base and the first and second heat sink. The first heat sink includes a heat spreader and a plurality of fins extending from the heat spreader. The second heat sink includes a heat spreader and a plurality of fins extending from the heat spreader. The heat pipe includes an evaporating portion, first and second condensing portions parallel to the evaporating portion and first and second connecting portions interconnecting corresponding first and second condensing portion and the evaporating portion. The evaporating portion and the first condensing portion are located between the base and the heat spreader of the first heat sink. The second condensing portion is located on the heat spreader of the second heat sink.

Abstract: A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

Abstract: A heat dissipation device includes a heat sink assembly, a fan holder and two fans mounted on the two sides of the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and a fin assembly thermally connecting with the heat spreader. The fin assembly has a plurality of channels therein. The fan holder includes a top plate mounted on a top of the fin assembly and a pair of vertical baffle walls extending from two opposite ends of the top plate. The baffle walls of the fan holder are located at two lateral ends of the fin assembly and sandwich the fin assembly therebetween. The two fans respectively abut against inlets and outlets of the channels of the fin assembly. An airflow generated by one fan flows through the fin assembly and is sucked by the other fan.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A heat-dissipating module dissipating heat generated by a heat-generating element includes a plurality of fins, a fan generating an air current and a heat pipe. Each fin has a first edge facing the fan and a second edge facing the fan. The first edges are located on a first surface. The second edges are located on a second surface not coinciding with the first surface. The air current passing through the first and second surfaces passes by the fins. A first end of the heat pipe is thermally coupled to the heat-generating element. A second end of the heat pipe is thermally coupled to the fins.

Abstract: In an assembly of an electronic device and a heat-dissipating module, the electronic device includes an electronic component disposed within a housing provided with an air outlet port, and the heat-dissipating module includes a heat-dissipating fin base disposed within the housing adjacent to the air outlet port, and a dust removing mechanism disposed on the heat-dissipating fin base. The heat-dissipating fin base includes two spaced-apart upright sidewalls, and a plurality of heat-dissipating fins arranged between the upright sidewalls. The dust removing mechanism includes a scraping plate disposed between the upright sidewalls and accessible outwardly of the air outlet port. The scraping plate has scraping teeth extending respectively into clearances among the heat-dissipating fins. By manipulating the scraping plate to displace upwardly and downwardly relative to the heat-dissipating fin base, dust that accumulates among the heat-dissipating fins can be scraped off.

Abstract: A heat sink assembly and a method of fabricating a heat sink assembly. The heat sink assembly comprises a cylindrical core onto which are mounted a plurality of fin disks. The fin disks and cylindrical core are assembled to a threaded base. This assembly comprises the heat sink assembly. The heat sink assembly can be mounted onto a mounting clip or threaded directly onto a device having mating threads. The device can be a printed circuit board or components of a printed circuit board adapted to have threads or other electrical or electronic component that is adapted to have threads to receive the heat sink assembly. The fin disks are interference fit onto the cylindrical core to form a fin disk assembly to provide thermo-mechanical contact between the fin disks and the cylindrical core. The base is then interference fit onto the fin disk assembly to provide thermo-mechanical contact between the fin disk assembly and the base to form a heat sink assembly.

Abstract: A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.

Abstract: The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The heat-radiating member surround the impeller that applies cooling air. The heat-radiating member has a coolant passage in which liquid coolant flows, and a plurality of heat-radiating fins which are thermally connected to the coolant passage. The case contains the impeller and the heat-radiating member and has at least one outlet port through which the cooling air is expelled.

Abstract: A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor module, and a controller which estimates a change of a heat transfer coefficient from the power semiconductor module to cooling water based on output information Tj of the temperature detection sensor and drive output information Sr of a rotation speed detection sensor for a pump motor to drive a cooling pump, controls the pump motor according to this estimated result, and controls cooling capacity of the cooling water.

Abstract: A heat dissipating device includes an electric member, a heat sink having a base to be secured on the electric member. The base includes an upper surface and includes four corner areas, and includes four posts extended upwardly from the four corner areas thereof respectively. A fan device is disposed on and secured to the posts. The heat sink includes a number of rods extended upwardly from the upper surface of the base, and each of the rods includes an upper portion, and a recess formed in the upper portions of the rods. Each of the rods preferably includes a planar surface formed on the upper portion to form the recess on top of the rods.

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract: The present invention provides a heat-radiating module with composite phase-change heat-radiating efficiency. The cooling pad of the heat-radiating module is fitted with a heating portion and radiating portion. The first and second chambers are placed at intervals into the cooling pad. The first and second phase-change materials are separately placed in two chambers. The reaction temperatures of two phase-change materials differ from each other. The phase-change material of higher reaction temperature assists in heat-absorbing and preventing overheating. There is a heat peak when the cooling pad reaches the preset high-temperature state. When the temperature of the cooling pad declines below a preset temperature, the phase-change material of lower reaction temperature will release the stored latent heat, enabling the cooling pad to maintain an operating temperature and improve the heat-radiating efficiency in a variety of equipment.

Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

Abstract: A cooling structure for a power supply is disclosed. The power supply has a housing. The cooling structure includes a cooling fan and a cooler. The cooling fan is located on the inner side of the top surface of the housing. The cooler is located below the cooling fan. The cooler includes a vertical board and a plurality of cooling fins. The cooling fins are disposed slantwise on the vertical board and at intervals. There is a plurality of air-guiding channels between the cooling fins. Thereby, the airflow of the cooling fan can be guided forward to a specified direction. The hot air circulating flow will not occur. The cooling fan blows onto the electronic elements on the circuit board to exhaust the heat generated by the electronic elements, and noise generated from the cooling fans is lowered.

Abstract: A cooling device (1) for an electronic component (3), especially for a microprocessor, includes a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). The heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9). A rack may store several electronic components (3) to be cooled, wherein each electronic component to be cooled is included in a respective system such as respective server for a data-processing system.

Abstract: A heat sink, in particular for a rectifier unit of an electrical machine has at least one diode opening, and disposed around the at least one diode opening at least partially ring-shaped cooling air openings and at least one mass-increasing raised area, wherein the mass-increasing raised area extends between two of the cooling air openings associated with the diode opening.

Abstract: A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.

Abstract: A wing-spanning thermal-dissipating device has a plurality of thermal-dissipating sheets. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets connect with each other. The thermal-dissipating fin is extended outwardly and spread out from the connecting portion. The sub-thermal-dissipating fins are extended from at least one side of the thermal-dissipating fin.

Abstract: A heat dissipation device includes a retention module (60), a heat sink (10), a fan bracket (50), a fan (70) mounted on the fan bracket, and a pair of wire clips (30) cooperating with the fan bracket and the retention module to secure the heat sink to a heat-generating electronic element (82). The retention module forms a pair of fixture blocks (64) at a pair of lateral sidewalls thereof. The heat sink defines grooves (160) at lateral sides thereof. Each of the clips includes an operating portion (356) fastened to the fan bracket, a central axle (33) connecting with the operating portion and a locking portion (31) connecting with the central axle. Each central axle is slidably engaged in corresponding grooves of the heat sink and the locking portions of the clips engage with the fixture blocks of the retention module.

Abstract: A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.

Abstract: A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like.

Abstract: A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetween. The second heat sink includes a second base and a plurality of second fins extending from the second base with a plurality of second channels defined therebetween. The second fins extend beyond a common edge of the first base and the second base to extend into first channels of the first heat sink.

Abstract: A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.

Abstract: An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator includes a first thin sheet exhibiting a first coefficient of thermal expansion and the second thin sheet dissimilar from the first thin sheet and exhibiting a second CTE that is substantially different than the first CTE. The first and second thin sheets are bonded together. The first and second thin sheets expand and contract at different rates based on changes in temperature such that the first and second thin sheets change shape to create a fanning motion to circulate the fluid and thus cool the electrical device.