Abstract: A temperature control unit includes: a substantially flat-plate-shaped placement section (10) configured to support a heat transfer target; a heating section (20) configured to heat a heat transfer target placed on the placement section (10); and a heat transfer section (30) disposed in contact with at least one of the placement section (10) and the heating section (20), the heat transfer section (30) being at least partially formed of a metal porous structure.

Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

Abstract: An ink includes a vinyl-terminated polydimethylsiloxane polymer, a polydimethylsiloxane copolymer having a hydride component, wherein a hydride to a vinyl ratio (hydride:vinyl) is in a range of greater than 1:1 to about 4:1, a hydrophobic filler, a crosslinking agent, and a carbon dioxide-binding component. A method includes extruding an ink for forming a three-dimensional (3D) structure, the ink including a vinyl-terminated polydimethylsiloxane polymer, a polydimethylsiloxane copolymer having a hydride component, wherein a hydride to a vinyl ratio (hydride:vinyl) is in a range of greater than 1:1 to about 4:1, a hydrophobic filler, a crosslinking agent, and a carbon dioxide-binding component. The method further includes curing the 3D structure for forming a silicone polymer product having the carbon dioxide-binding component.

Abstract: A lighting arrangement (10) is disclosed, comprising a substrate (11) for mechanically and electrically connecting at least one light-emitting element (12) thereto. The substrate (11) comprises at least a first side (13) and a second side (14), and a circumferential edge (20) along a periphery of the substrate, the circumferential edge (20) extending between the first side (13) and the second side (14), and at least one electrically conductive region (16) disposed on the first side (13). The lighting arrangement (10) comprises at least one thermally conductive element (18) arranged such that the at least one thermally conductive element (18) is coupled to at least a portion of the second side (14) and to at least a portion of an outer surface (17) of the circumferential edge (20), and such that the at least one thermally conductive element (18) is not coupled to the at least one electrically conducting region (16).

Abstract: A power generation apparatus according to the present invention comprises: a thermoelectric conversion part including a duct and multiple thermoelectric modules arranged on a surface of the duct; a chamber having a hole formed through a lateral surface thereof to allow the thermoelectric conversion part to be inserted therethrough; a wire connected to the multiple thermoelectric modules; and a guide member having a reception space formed therein for receiving the wire, wherein the guide member comprises: a case disposed adjacent to the side surface of the chamber and including a through-hole and a wire hole through which the wire passes; a pipe disposed outside the reception space of the case to correspond to the through-hole; a molding member disposed in the reception space; and a cover disposed at the upper end of the case, and the molding member is disposed to surround the wire.

Abstract: A semiconductor apparatus, including an insulated substrate having a first surface and a second surface that are opposite to each other, a semiconductor element that is mounted on the first surface of the insulated substrate, and a cooler for cooling the semiconductor element. The cooler includes a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate, a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess. The heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and sealing portions disposed on outer surfaces of the body, wherein the external electrodes and the sealing portions include glass, the sealing portions include first sealing portions that are disposed between the body and the external electrodes, and second sealing portions that extend from the first sealing portions in the second direction and are not in contact with the external electrodes, and an average length of the second sealing portion is 20 ?m or more.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

Abstract: A graded multilayered composite comprises a metal matrix material having a first side and a second side opposite the first side. A first layer of microspheres is dispersed on the first side of the metal matrix material. A second layer of microspheres is dispersed on the second side of the metal matrix material.

Abstract: Provided is an electromagnetic interference mitigation apparatus including a power supply; a power cord; a power supply chassis encapsulating at least the power supply, the power supply physically isolated from the power cord; a low value resistor in electrical communication with at least the power cord and the power supply; and a capacitor disposed between the power supply chassis and an equipment chassis, wherein the equipment chassis encapsulates the power supply chassis, wherein the equipment chassis is disposed a distance from the power supply chassis, and wherein the capacitor is formed by the equipment chassis and the power supply chassis.

Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

Abstract: A semiconductor element is bonded to a circuit pattern integrated with an insulating layer and a heat radiation fin, a case is bonded to a peripheral edge of the heat radiation fin so as to surround the semiconductor element, the circuit pattern, and the insulating layer, and a sealing resin is sealed in a region surrounded by the insulating layer, the circuit pattern, and the case. An internal electrode includes a flat plate-shaped portion, and is provided with a through hole and a pair of bent and inclined-shaped support portions. The support portion is bonded to the circuit pattern, and the upper surface of the semiconductor element, the through hole, and an embossed portion provided around the through hole are bonded. The internal electrode, and an external electrode integrally molded with the case, are bonded.

Abstract: An optical communication module includes: a circuit board; optical communication devices that are provided on an upper surface side of the circuit board; a case that accommodates the circuit board and the optical communication devices; and a heatsink that is attached to the case. The optical communication devices include a first device and a second device. The first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is. A height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device. The heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided.

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

Abstract: An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

Abstract: An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

Abstract: A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.

Abstract: A carrier configured to be attached to a semiconductor substrate via a first surface comprises a continuous carbon structure defining a first surface of the carrier, and a reinforcing material constituting at least 2 vol-% of the carrier.

Abstract: Integrated Thermal Interface Detachment Mechanism for Inaccessible Interfaces are disclosed. According to an aspect, an exemplary device for an electronic component having a thermal interface material, comprising a heat sink configured to contact the thermal interface material and configured to heat transfer interface with the electronic component while the thermal interface material is in contiguous contact with both the heat sink and the electronic component, and a separator mechanism configured to advance a separator ram with respect to the heat sink and effect a force upon the thermal interface material, such that advancing the ram breaks the contiguous contact of the thermal interface material with at least one of the heat sink and the electronic component.

Abstract: A method for manufacturing a concentrating photovoltaic solar sub-module equipped with a reflective face having a concave predefined geometric shape, wherein it includes laminating, in a single step, a multi-layer assembly comprising in succession: a structural element equipped with a reflective first face and a second face, opposite the first; a layer of a material of good thermal conductivity, higher than that of the material from which the structural element is composed, the layer being placed on the second face of the structural element; a layer of encapsulant or of adhesive; a photovoltaic receiver, the layer of encapsulant or of adhesive being placed between the layer of a material of good thermal conductivity and the receiver; a layer made of transparent encapsulating material, covering at least the entire surface of the photovoltaic receiver; and a transparent protective layer covering the layer made of transparent encapsulating material; and during the lamination, the reflective face of the structura

Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

Abstract: A electronic module includes a printed circuit board (PCB) substrate, a controller substrate, a controller, a memory device, and a heat spreader. The controller is disposed on the controller substrate. The memory device is disposed on the PCB substrate. The heat spreader is disposed on the controller and the memory device, in which the heat spreader has a first portion on the controller and a second portion on the memory device, and the heat spreader has a first opening between the first portion and the second portion.

Abstract: A semiconductor device may include: an upper conductive plate, a middle conductive plate, and a lower conductive plate that are stacked on each other; a first semiconductor chip located between the upper conductive plate and the middle conductive plate and electrically connected to both the upper conductive plate and the middle conductive plate; and a second semiconductor chip located between the middle conductive plate and the lower conductive plate and electrically connected to both the middle conductive plate and the lower conductive plate, wherein one of an area of the upper conductive plate and an are of the lower conductive plate may be smaller than an area of the middle conductive plate, and another of the area of the upper conductive plate and the area of the lower conductive plate may be larger than the area of the middle conductive plate.

Abstract: A vent for reduced airflow impedance and increased electromagnetic interference (EMI) shielding for an information handling system. The vent comprises two plates, wherein each plate comprises a plurality of structures. Each structure has a base opening with a first set of dimensions, a contact area with a second set of dimensions smaller than the first set of dimensions, and a wall extending at an angle from the base opening to the contact area. Each wall has a plurality of holes to increase the open percentage of the vent for decreased airflow impedance, which allows more airflow through the vent. The reduced size of each hole, the angled walls and continuous surface areas between adjacent structures reduce the amount of electromagnetic energy that can pass through the vent.

Abstract: Systems and methods of manufacture of radiator fins. In one embodiment, a radiator fin made of carbon fiber is provided. In one aspect, the radiator fin is made of carbon fibers forming an interlaced pattern. In another aspect, the interlaced carbon fiber radiator fin is attached directly to a heat pipe, the heat pipe connected to a heat source.

Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and a hollow slot passing therethrough. The second magnetic core is exposed through the hollow slot. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

Abstract: Reflective stacks including heat spreading layers (320) are described. In particular, reflective stacks including polymeric multilayer reflectors (330). Heat spreading layers (320) may include natural or synthetic graphite or copper.

Abstract: Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition containing: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J/g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W/(m·K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.

Abstract: A CNT-metal composite structure is formed by forming a plurality of CNTs which stand side by side from a base substance, forming a sheet-shaped support film which covers upper ends of the CNTs, and filling gaps each present between adjacent ones of the CNTs with a metal. By this structure, highly reliable bonding sheet and heat dissipation mechanism which are very excellent in heat dissipation efficiency, and manufacturing methods of these are realized.

Abstract: Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axi

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: A method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.

Abstract: An integrated device that includes a substrate, a device level layer formed over the substrate, and interconnect portion over the device level layer. The device level layer includes a plurality of first device level cells, each first device level cell comprising a first configuration. The device level layer includes a plurality of second device level cells. At least one second device level cell includes a second configuration that is different than the first configuration. The plurality of second device level cells is located over at least one region of the integrated device comprising at least one hotspot.

Abstract: A method for orienting elongated objects arranged on the surface of a substrate, the elongated objects extending according to an initial orientation, the method including depositing on the surface of the substrate at least one layer of a soft material covering at least partially a portion of the elongated objects, and applying a mechanical stress on at least one portion of the layer of soft material in such a way as to modify the orientation of at least one portion of the elongated objects.

Abstract: In one aspect, thermally managed electronic components are described herein. In some implementations, a thermally managed electronic component comprises an electronic component and a thermal management coating disposed on a surface of the electronic component. The thermal management coating comprises a graphene coating layer disposed on the surface of the component. The graphene coating layer may comprise a layer of aligned carbon nanoparticles. Moreover, the thermal management coating may further comprise an additional layer of aligned carbon nanoparticles disposed on the graphene coating layer. In another aspect, methods of applying a thermal management coating on an electronic component are disclosed. In some implementations, such a method comprises disposing a graphene coating layer on a surface of an electronic component. The graphene coating layer may comprise a layer of aligned carbon nanoparticles.

Abstract: The variable thermodynamic Raman spectroscopy method and apparatus is a system for material analysis. In operation, a target material is subjected to a variable thermodynamic protocol and analyzed using a differential scanning calorimeter.

Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

Abstract: Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

Abstract: The present invention relates to phase change materials (PCMs) which may be used with photovoltaic (PV) modules. More specifically, solid/solid PCMs having a polyolefin backbone polymer and a crystallizable side chain are provided. Preferably, the solid/solid PCM has a copolymer backbone having a polyolefin repeating unit, and the crystallizable side chains are grafted onto the copolymer backbone. Most preferably, the copolymer is poly(ethylene-co-glycidyl methacrylate) (PE-co-GMA), and polyethylene glycol (PEG) is the crystallizable side chain. Photovoltaic modules and backsheets for photovoltaic modules having solid/solid PCMs are also provided.

Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.

Abstract: A mobile electronic device with enhanced laminate construction is disclosed. The device 10 can include: a housing 150 including a front housing 34 and a rear housing 86; a user interface 62 connected to the front housing 34; and a stack module 152 including a printed circuit board 28 including an outwardly facing side 154 and an inwardly facing side 156, an electronic component 48 attached to the inwardly facing side 156 and a battery 32 attached with laminate 162 to the electronic component 48. Advantageously, this provides a durable low profile multilayer construction for use in connection with mobile electronic devices desired by users.

Abstract: A method includes providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate, dispensing an interface material on the IC die, positioning a portion of a heat spreader in contact with the interface material, and dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame.

Abstract: A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.

Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.