Through Support Means Patents (Class 361/707)
  • Patent number: 10756057
    Abstract: A half-bridge power semiconductor module includes an insulating wiring board including a positive-electrode wiring conductor, a bridge wiring conductor, and a negative-electrode wiring conductor arranged on or above a single insulating plate in such a way as to be electrically insulated from each other. The back-surface electrodes of a high-side power semiconductor device and a low-side power semiconductor device are joined to the front sides of the positive-electrode wiring conductor and the bridge wiring conductor. Front-surface electrodes of the high-side power semiconductor device and the low-side power semiconductor device are connected to the bridge wiring conductor and the negative-electrode wiring conductor by a plurality of bonding wires and a plurality of bonding wires.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: August 25, 2020
    Assignee: NISSAN MOTOR CO., LTD.
    Inventor: Satoshi Tanimoto
  • Patent number: 10691184
    Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 23, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sunil Rao Ganta Papa Rao Bala, Kelly K. Smith, Joseph Allen
  • Patent number: 10679791
    Abstract: The invention relates to an arrangement comprising a first electrical component, which has a pair of flat, spaced-apart first connection lugs, a second electrical component, which has a pair of flat, spaced-apart second connection lugs, wherein the first and second connection lugs are in each case connected in pairs in an electrically conductive manner, and an electrically conductive plate which is electrically insulated from the first and second connection lugs and which is arranged below the first and second connection lugs in the plane of the surfaces of the first and second connection lugs.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: June 9, 2020
    Assignee: Robert Bosch GmbH
    Inventor: Martin Kessler
  • Patent number: 10671907
    Abstract: An electrical junction comprising a first pair of leads and a second pair of leads. The first pair of leads and the second pair of leads comprise a Weyl semimetal. The junction comprises an electrical crossing arranged between the leads of the first pair and the leads of the second pair and is configured to provide an electrical connection between the leads of the first pair and the leads of the second pair. A related electrical device and a related neural network may be also presented.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: June 2, 2020
    Assignee: International Business Machines Corporation
    Inventors: Heinz Schmid, Bernd Gotsmann
  • Patent number: 10666458
    Abstract: A method and apparatus for connecting a user equipment (UE) to a wireless communication network such as a 5th generation network. The network supports node-level tunneling. Node-level tunnels can be pre-configured prior to receipt of UE attach requests. The tunnels can be shared by plural UEs, flows, or services. A policy function is connected to a network management function and performs tasks such as applying constraints to the node-level tunnels. A session management function pre-establishes node-level tunnels based on policy information from the policy function. Operations of network elements such as the access network node and user plane function to handle UE attachment, session establishment, and handling of mobile-originated and mobile-terminated traffic are described. Also described is a method and apparatus for packet transmission in which packets are processed according to an identified tunnel type. The tunnel type can be identified using a field in the tunnel encapsulation header.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: May 26, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD
    Inventors: Ngoc Dung Dao, Xu Li, Hang Zhang
  • Patent number: 10658941
    Abstract: In an embodiment, a three-level active neutral-point clamped (ANPC) converter system is provided. The system includes first and second Direct Current (DC)-bus structures that include at least one of a number of DC-bus capacitors on printed circuit boards (PCBs). The PCBs are laminated together with an air gap (e.g., one or more millimeters) in between for a thermal dissipation and an insulation creepage. The three DC-bus terminals include PCBs, and are electrically connected to the three-level power converter, which are typically mounted on a heatsink or a cold plate.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: May 19, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Mark Dame, Jiangbiao He, Di Zhang
  • Patent number: 10660243
    Abstract: A power conversion apparatus is provided, which comprises a housing, a mother board, a first electromagnetic filtering board, a second electromagnetic filtering board, a signal board, a capacitor board, and a heat-dissipation module. The housing includes a heat-dissipation wall and a coolant runner. The mother board is disposed upon the housing and comprises a first surface facing the housing and a power device. The heat-dissipation module includes an thermal conductive insulating sheet adhered to the heat-dissipation wall and an elastic clamp. When the mother board approaches the housing to clamp the power device in the accommodating space between the elastic clamp and the thermal conductive insulating sheet, the power device is pressed against by the elastic clamp and thus adhered to the thermal conductive insulating sheet, so that the power device is thermally coupled to the heat-dissipation wall and the coolant runner via the thermal conductive insulating sheet.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: May 19, 2020
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Peiai You, Hao Sun, Jinfa Zhang
  • Patent number: 10641409
    Abstract: Provided are a driver and a driver-integrated electric actuator that can suppress a temperature rise of the driver integrated with an electric actuator. A driver circuit of an electric actuator-integrated driver controls a current to be supplied to an electric actuator. A metal member (heat-conducting portion) conducts heat generated in the driver circuit. A driver sealing portion is fixed to the electric actuator and seals the driver circuit and the metal member. The metal member is extended to the electric actuator.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: May 5, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Takayuki Fukuzawa, Yoshio Kawai, Yujiro Kaneko
  • Patent number: 10630506
    Abstract: A method and apparatus for connecting a user equipment (UE) to a wireless communication network such as a 5th generation network. The network supports node-level tunneling. Node-level tunnels can be pre-configured prior to receipt of UE attach requests. The tunnels can be shared by plural UEs, flows, or services. A policy function is connected to a network management function and performs tasks such as applying constraints to the node-level tunnels. A session management function pre-establishes node-level tunnels based on policy information from the policy function. Operations of network elements such as the access network node and user plane function to handle UE attachment, session establishment, and handling of mobile-originated and mobile-terminated traffic are described. Also described is a method and apparatus for packet transmission in which packets are processed according to an identified tunnel type. The tunnel type can be identified using a field in the tunnel encapsulation header.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: April 21, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD
    Inventors: Ngoc Dung Dao, Xu Li, Hang Zhang
  • Patent number: 10586775
    Abstract: A memory package includes a multi-level package substrate, a first memory chip, a second memory chip, a first band pass filter and a second band pass filter. The multi-level package substrate includes a plurality of wiring layers and a plurality of insulating layers alternately stacked on one another. The first memory chip is on the multi-level package substrate, and includes a plurality of first memory cells and a first receiver. The second memory chip is on the first memory chip, and includes a plurality of second memory cells and a second receiver. The first band pass filter is in the multi-level package substrate, is connected to the first receiver, and passes a first data signal within a first frequency band. The second band pass filter is in the multi-level package substrate, is connected to the second receiver, and passes a second data signal within the first frequency band.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: March 10, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Uk Kim, Il-Joon Kim
  • Patent number: 10575442
    Abstract: A heat sink assembly for a pluggable module having a housing includes a plurality of discrete heat sink members in thermal communication with more than one wall of the housing. The heat sink members transfer heat from the pluggable module to the surrounding environment. The heat sink assembly also includes a spring member configured to exert a force on the plurality of discrete heat sink members for forcing the heat sink members into thermal engagement with the housing.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: February 25, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Patent number: 10536038
    Abstract: A system for harvesting energy for a vehicle includes an antenna, a DC bus, a receiver circuit, and an electrical load. The antenna is located on the vehicle and is configured to receive a plurality of signals in at least one of a 2.4 gigahertz band and a 5.9 gigahertz band. The receiver circuit is coupled to the antenna and the DC bus. The receiver circuit is configured to convert the plurality of signals to a DC signal that is transmitted onto the DC bus. The electrical load is coupled to the DC bus and is configured to operate at least when the vehicle is not running using the DC signal supplied by the receiver circuit.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: January 14, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventor: William Joseph Boyd
  • Patent number: 10481652
    Abstract: Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: November 19, 2019
    Assignee: UATC, LLC
    Inventors: David Patrick Rice, Thomas Jeffrey Watson, John William Zinn, Robert Henry Doll, Declan Seamus Kelly
  • Patent number: 10448497
    Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: October 15, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takuya Ota, Shigeki Yamane, Hirotoshi Maeda, Toshiyuki Tsuchida, Yoshihiro Tozawa
  • Patent number: 10401581
    Abstract: A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module includes a fixed base; a hinge connector of the fixed based coupled to the heatsink; and an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position and a lowered position. The heatsink includes a Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position. The module can include a pluggable optical module.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: September 3, 2019
    Assignee: Ciena Corporation
    Inventor: Adrianus Van Gaal
  • Patent number: 10403693
    Abstract: A display apparatus and a method for producing the same are disclosed. The display apparatus includes a display panel, a first antistatic pattern, and an electronic component. The electronic component has a second antistatic pattern. The first antistatic pattern and the electronic component are provided at a side of the display panel away from the light-emitting side thereof in an inlaid manner.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: September 3, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OTPOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Hao Wu, Xiaoping Zhang, Ying Liu, Lingguo Wang, Jianguo Zhu, Hongjun Yu, Xin Wang, Na An, Baolei Guo
  • Patent number: 10368470
    Abstract: A reactor unit includes reactors; and a cooler. The reactors are disposed in at least one line on a reactor cooling surface that is one of outer surfaces of the cooler. The cooler has a cooling medium flow passage that is in contact with an inner surface on a reverse side of the reactor cooling surface. The cooling medium flows linearly from an inlet portion to an outlet portion of the cooling medium flow passage. A direction in which the cooling medium flows inside the cooling medium flow passage is same as a direction in which the reactors are disposed in the at least one line. Cooling fins are provided on the inner surface on the reverse side of the reactor cooling surface. A longitudinal direction of each cooling fin is same as the direction in which the cooling medium flows inside the cooling medium flow passage.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: July 30, 2019
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Ikuhiro Nakamura, Shuji Kawamura, Kozo Matsuura, Koji Katano, Hiroyuki Sekine
  • Patent number: 10356926
    Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: July 16, 2019
    Assignee: DEERE & COMPANY
    Inventors: Brij N. Singh, Thomas J. Roan, Michael J. Zurn, Brad G. Palmer, Robert K. Kinyanjui, Jeff K. Hansen
  • Patent number: 10306798
    Abstract: Provided is a current control apparatus including a first cooler that cools a switch element, a bus bar connected to the switch element, a core penetrated by the bus bar, a magneto-electric transducer, which is inserted into the core in order to detect a value of a current supplied to the switch element, a controller that controls the switch element, a case, and a cover, wherein the core includes an exposed disposal structure in which a part of the core is exposed to the exterior of the case as an exposed portion, and the current control apparatus further includes a divided cooling structure in which the exposed portion is cooled without being affected by the temperature of the first cooler that cools the switch element.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: May 28, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toru Daigo, Taisuke Iwakiri, Yuji Kuramoto
  • Patent number: 10225927
    Abstract: A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: March 5, 2019
    Assignee: NSK LTD.
    Inventors: Masakazu Morimoto, Noboru Kaneko, Shin Kumagai
  • Patent number: 10206290
    Abstract: A method for manufacturing a structure of a flexible printed circuit board that is installed on a substrate in a display device is provided.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: February 12, 2019
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Ducksu Oh, Sung Soo Park, Minsoo Kang
  • Patent number: 9991593
    Abstract: An Electronically Scanned Array (ESA) antenna is controlled via an optical domain without electrical conductors on the ESA Printed Wiring Board (PWB). Distribution of the control signal occurs over pulses of light through an optical medium separate from the ESA PWB. External to the ESA PWB are one or more optical wave guides functional as communications channels which connect the ESA optical receivers/transceivers with transmitters/transceivers interfaced to a system controller. The ESA is divided into groups of elements with serial busses and discrete signals driven by local controllers. The local controller for each group of elements may include one or more optical receivers (unidirectional) or transceivers (bidirectional). This concept offers a trade in electrical complexity associated with an ESA PWB for an additional manufactured medium redundantly supplying the control signal to the ESA as well as routing the RF data signal from the ESA to the system controller.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: June 5, 2018
    Assignee: Rockwell Collins, Inc.
    Inventors: Adrian A. Hill, Jeremiah D. Wolf, Bryan S. McCoy, Michael C. Meholensky, Anders P. Walker
  • Patent number: 9991053
    Abstract: A power capacitor, in particular a DC link capacitor, having a capacitor housing which has a first housing wall, in particular made of metal, which is galvanically connectable to a housing of an electronics unit, in particular a power electronics unit, and planar energizing units for energizing the power capacitor. A first subregion of a first energizing unit extends in an inner space of the housing adjacent to and at a distance from the first housing wall or from a different housing wall of the capacitor housing that is conductively connected to the first housing wall. A layer made of a dielectric material other than air is situated between the first subregion of the first energizing unit and this housing wall.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: June 5, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventor: Hartmut Sparka
  • Patent number: 9983557
    Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 29, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Hee Jun Park, Rajat Mittal, Mehdi Saeidi
  • Patent number: 9968001
    Abstract: Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: May 8, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xingxing Huang, Kaikai Liu, Shineng Chen
  • Patent number: 9844161
    Abstract: A retaining arrangement can secure an electronic module to a body. Two end wedges, each with a ramped end, can be mounted on a rail. At least one inner wedge can be slidably mounted on the rail between the two end wedges, with ramped ends of the at least one inner wedge engaging the ramped ends of the two end wedges. Each of the ramped ends can have a respective angle of between 20 degrees and 30 degrees. An even number of inner wedges can be provided. A pin extending through mounting holes in one of the end wedges, but not extending into the rail, can secure the end wedge to a screw for moving the retaining arrangement into the compressed configuration.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: December 12, 2017
    Assignee: Pentair Technical Products, Inc.
    Inventor: Jackson Gilmore
  • Patent number: 9844132
    Abstract: The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: December 12, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shinsuke Serizawa
  • Patent number: 9826895
    Abstract: An endoscope is provided and includes a flexible insertion tube; a distal end assembly provided at an end of the insertion tube; and a cooling medium tube provided in the inside of the insertion tube, and connected to the distal end assembly. A cooling medium for cooling the distal end assembly is introduced through one of the insertion tube and the cooling medium tube, and discharged through the other of the insertion tube and the cooling medium tube. Since the endoscope is configured such that the cooling medium directly contacts with a heating element or a conductor through which the heat of the heating element is conducted, the cooling effect of the front end portion of the endoscope is improved.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: November 28, 2017
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hae-In Chung, Mun-Kue Park, Jin-Won Lee
  • Patent number: 9814169
    Abstract: An apparatus for mounting electronic components includes a linear actuator defining a longitudinal axis. A driver member is engaged to the linear actuator for motion along the longitudinal axis. The driver member defines a mounting plane and includes a wedge surface that is oblique facing in a direction that has a component towards the mounting plane and a component away from the longitudinal axis in a direction parallel to the mounting plane. A locking wedge is engaged with the wedge surface of the driver member to be driven both toward the mounting plane and lateral to the mounting plane away from the longitudinal axis by sliding along the wedge surface of the driver member with the actuator driving the drive member toward a center of the locking wedge.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: November 7, 2017
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Naison E. Mastrocola
  • Patent number: 9741649
    Abstract: An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: August 22, 2017
    Assignee: INVENSAS CORPORATION
    Inventors: Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao
  • Patent number: 9698091
    Abstract: A power semiconductor device includes an insulating substrate, a semiconductor element, a case, and a wiring member. The case forms a container body having a bottom surface defined by a surface of the insulating substrate, to which said semiconductor element is bonded. The wiring member has a bonding portion positioned above an upper surface electrode of the semiconductor element. The bonding portion of the wiring member is provided with a projection portion projecting toward the upper surface electrode of the semiconductor element and bonded to the upper surface electrode with a solder, and a through hole passing through the bonding portion in a thickness direction through the projection portion.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: July 4, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinsuke Asada, Naoki Yoshimatsu, Yuji Imoto, Yusuke Ishiyama, Junji Fujino
  • Patent number: 9698123
    Abstract: An apparatus includes a substrate and a pair of die that include electronic circuitry. The substrate includes a cavity. One of the die is disposed in the cavity formed in the substrate. The other die is disposed above the first die and is electrically coupled to the first die.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: July 4, 2017
    Assignee: Altera Corporation
    Inventors: Arifur Rahman, Jon M. Long, Yuanlin Xie
  • Patent number: 9667075
    Abstract: A wireless charging device (100) includes a shell (1), a heat conduction plate (2), a charging assembly (4) and a connecting assembly (5). The heat conduction plate (2) includes a first portion (201), a second portion (202) parallel with the first portion (201) and contacted with an inner surface of the shell (1), and a third portion (203) connecting a lower edge of the first portion (201) to a lower edge of the second portion (202). The charging assembly (4) is disposed between the first and second portions (201,202) and includes a circuit board, a chip (401) disposed on the circuit board and contacted with the first portion (201), a charging coil and an exciting unit. The connecting assembly (5) defines a first end electrically connected with the circuit board. A method for charging an apparatus with the wireless charging device (100) is also provided.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: May 30, 2017
    Assignee: BYD Company Limited
    Inventors: Minglin Li, Qingchun Yang, Xinhua Zhang, He Huang, Xinwei Cai, Zaixing Yang, Ying Zhou, Yanqin Chen, Xianjun Kong, Dajun Chen
  • Patent number: 9607917
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: March 28, 2017
    Assignee: Intersil Americas LLC
    Inventors: Zaki Moussaoui, Nikhil Vishwanath Kelkar
  • Patent number: 9510466
    Abstract: Disclosed is an electronic control apparatus for a vehicle, comprising: a printed circuit board (PCB) configured to electrically control each part of the vehicle and have both sides provided with at least one fixed hole; a connector cover includes a connector part electrically connected and coupled with the PCB and a coupling part; a housing configured of a one-piece slot type and receiving the PCB inserted in a slide form; and at least one coupling member each fastened with at least one fixed hole of the PCB, wherein the PCB is inserted into the housing and the PCB adheres to a bottom side of the housing by the coupling member which is pressed by physically deforming each corresponding surface of the housing corresponding to at least one coupling member.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: November 29, 2016
    Assignee: HYUNDAI AUTRON CO., LTD.
    Inventors: Sun Jae Yang, Dong Gi Lee, Seung Mok Song, Yeon Chul Choo
  • Patent number: 9417015
    Abstract: A backing plate for joining a heat removal device to a heat source. The backing plate can include a planar plate region having a first face and a second face opposite the first face. The backing plate can also include at least one boss projecting from the first face and having an opening therein for receiving a fastener.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: August 16, 2016
    Assignee: Thermal Corp.
    Inventors: Matt Connors, Jerome E. Toth
  • Patent number: 9413145
    Abstract: A method for producing a low-induction busbar including providing a tray with a base and a border which projects peripherally from the base so as to form a frame and which is composed of an electrically insulating material, producing a busbar element by arranging a first busbar strips, applying a film with openings which provide access to the first busbar strips, arranging the second busbar strips, on the film, bending regions of the busbar strips forming connections making electrical contact with the capacitors through the openings, inserting the busbar element into the tray and pouring an encapsulation compound into the tray so as to surround the base of the capacitors, while leaving free the connections.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: August 9, 2016
    Inventor: Peter Fischer
  • Patent number: 9414480
    Abstract: A power conversion device is provided. The power conversion device includes a printed wiring board assembly, a grounding member, and a plurality of insulating struts. The printed wiring board assembly includes a printed circuit board and a plurality of electronic components. The printed circuit board has a plurality of through holes. The electronic components are disposed on the printed circuit board. The insulating struts correspond to the through holes and physically connect and electrically insulate the printed circuit board and the grounding member.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: August 9, 2016
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Xing-Xian Lu, Pei-Ai You, Gang Liu, Jin-Fa Zhang
  • Patent number: 9385445
    Abstract: A combined-type intelligent terminal wiring device and a plug device are provided. The wiring device includes a top wiring terminal board, a bottom wiring terminal board and a combined-type socket. An interior of each terminal of the combined-type socket has a spring-leaf structure, and each spring leaf includes an upper spring leaf and a lower spring leaf which are conductively connected via a contact surface. The top wiring terminal board has one end configured to connect the upper spring leaf, and the bottom wiring terminal board has one end configured to connect the lower spring leaf. The plug device includes a plug and a wiring terminal, the plug is located at a front end of the plug device and is a conductive metallic sheet, and the wiring terminal is located at a rear end of the plug device and has one end connected to the conductive metallic sheet.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: July 5, 2016
    Assignees: STATE GRID CORPORATION OF CHINA (SGCC), STATE GRID CHONGQING ELECTRIC POWER CO. ELECTRIC POWER RESEARCH INSTITUTE
    Inventors: Guojun He, Xingzhe Hou, Yingying Cheng, Huaxiao Yang, Ji Xiao, Jianming Hu, Ke Zheng, Xiaorui Hu, Xiyang Ou, Jing Liu
  • Patent number: 9235016
    Abstract: The electronic device with cable includes a circuit substrate provided with a heat generating element mounted thereon, an electrical connector connected to one end of the circuit substrate, a cable that is connected to the other end of the circuit substrate, heat conducting sheets and disposed in the circuit substrate, a first metal housing including an accommodation portion accommodating the electrical connector and a pair of wall portions communicating with the accommodation portion, a second metal housing fitted to the first metal housing so as to cover a one-side opening of the pair of wall portions, and a third metal housing fitted to the second metal housing so as to cover the other-side opening of the pair of wall portions. The cable and the first metal housing are thermally connected to each other.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: January 12, 2016
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hajime Arao, Toshihisa Yokochi
  • Patent number: 9226387
    Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 29, 2015
    Assignee: CYNTEC CO., LTD.
    Inventors: Chih-Tse Chen, Joseph D. S. Deng, Shih-Hsien Tseng
  • Patent number: 9210834
    Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. The semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within a casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 8, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Takayoshi Nakamura, Ryuichi Saito, Takashi Suga, Hiroki Funato
  • Patent number: 9179537
    Abstract: An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and patterned following deposition or may be patterned during deposition. A dielectric sheet having patterned metal may be shaped into a desired shape using molding equipment or other equipment that applies heat and pressure to the dielectric sheet and patterned metal. Metal on a dielectric sheet may also be patterned after the dielectric sheet is formed into a desired shape. Metal may be formed on opposing sides of the dielectric sheet.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: November 3, 2015
    Assignee: Apple Inc.
    Inventor: Benjamin M. Rappoport
  • Patent number: 9171964
    Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: October 27, 2015
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Ryan Supino
  • Patent number: 9123684
    Abstract: A chip package structure including a leadframe, a chip, at least one heat dissipation pillar, and a molding compound is provided. The leadframe includes a die pad and a plurality of leads. The die pad has at least one through hole. The leads surround the die pad. The chip is located on the die pad and electronically connected to the leads. The chip includes an active surface and a back surface opposite to the active surface. The back surface of the chip is adhered to the die pad. The heat dissipation pillar is located on the back surface and passes through the through hole. The molding compound encapsulates the chip, at least parts of the leads, and the die pad. The molding compound includes at least one opening to expose the heat dissipation pillar. A manufacturing method of the chip package structure is also provided.
    Type: Grant
    Filed: June 15, 2014
    Date of Patent: September 1, 2015
    Assignee: ChipMOS Technologies Inc.
    Inventor: Tsung-Jen Liao
  • Patent number: 9064846
    Abstract: A semiconductor device includes a semiconductor element, a base plate having an upper surface on which the semiconductor element is mounted, a cooling fin disposed on a lower surface of the base plate, a jacket disposed in a sealing manner on the lower surface of the base plate, the jacket surrounding the cooling fin, and a header partition wall formed separately from the jacket and fixed to the jacket on the lower side of the cooling fin in the jacket, the header partition wall forming a header and a flow path for causing a refrigerant flow to the cooling fin.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: June 23, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Miho Nagai, Yuji Imoto, Osamu Usui
  • Patent number: 9052348
    Abstract: A rack system and method are provided for processing manufactured products prior to shipment. To simulate reality, the design of such rack system and method contemplates replicating field conditions for use of the manufactured products. A rack system for processing units of manufactured products may comprise one or more plates coupled to a frame. A preferred approach includes designing the rack for use by an operator without specialized skills. This approach includes verifying that there is a match between the configuration of the unit mounted on the plate and the operating mode of the plate before processing can commence. The rack may include a detector for obtaining data from the plate and unit and a processor for comparing the obtained data to determine whether there is a match. A rack system designed using this approach can be useful in processing outdoor units of a split-mount system such as a microwave radio system.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: June 9, 2015
    Assignee: Aviat U.S., Inc.
    Inventors: Kesavan Srikumar, John Chung
  • Patent number: 9046906
    Abstract: A ruggedized computer assembly that includes a liquids proof case made of thermally conductive material and having an exterior surface and an interior surface. Also, an electrically-powered cooling assembly is supported on the exterior surface and draws heat from the exterior surface. Moreover, a plurality of computers is housed in the case, and supported by and thermally connected to the interior surface of the case, so that heat is transferred from the computer assembly, through the liquids proof case, to the cooling assembly.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: June 2, 2015
    Assignee: APlus Mobile Inc.
    Inventor: Tim Faucett
  • Publication number: 20150146378
    Abstract: A heat-dissipating base is provided. The heat-dissipating base includes a main body and at least one first protrusion. The first protrusion is disposed on the main body. The first protrusion has at least one first protrusion top surface for thermally contacting at least one first component above the main body.
    Type: Application
    Filed: November 23, 2014
    Publication date: May 28, 2015
    Inventors: Pei-Ai YOU, Xing-Xian LU, Gang LIU, Jin-Fa ZHANG
  • Patent number: RE48110
    Abstract: A semiconductor package includes a semiconductor chip formed with a non-volatile semiconductor memory, a resin encapsulation that encapsulates the semiconductor chip, electrodes in a lattice (solder balls) formed and arrayed in a lattice on a bottom surface of the resin encapsulation. The solder balls include a signal electrode formed within the central region of the array and a dummy electrode formed outside the signal electrode.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: July 21, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Tetsuya Yamamoto, Yasuo Takemoto