Details Patents (Class 361/710)
  • Patent number: 10942323
    Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: March 9, 2021
    Assignee: INPHI CORPORATION
    Inventors: Chris Togami, Radhakrishnan L. Nagarajan, Gary Sasser, Brian Taylor
  • Patent number: 10932392
    Abstract: A heat transfer system includes a heat source, a first heat exchanger coupled to the heat source to remove heat from the heat source, and a second heat exchanger coupled to the first heat exchanger to remove heat from the first heat exchanger. The heat transfer system also includes a thermal doubler coupled to the second heat exchanger to remove heat from the second heat exchanger, a first heat pipe coupled to the thermal doubler to remove heat from the thermal doubler, and a second heat pipe coupled to the first heat pipe to remove heat from the first heat pipe.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: February 23, 2021
    Assignee: Aavid Thermal Corp.
    Inventor: Nelson Gernert
  • Patent number: 10910134
    Abstract: The object of the invention is an electrical device comprising: a housing comprising a cavity receiving an electronic component, and at least one first electrical conductor connected to the electronic component so as to supply it with electric power, said electrical device being characterised in that it comprises a first electrically insulating film being against a surface of the first conductor so as to electrically insulate it, said first insulating film having at least one holding member enabling the first insulating film to be attached to a mechanical element, in particular of the electrical device.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: February 2, 2021
    Assignee: VALEO SIEMENS EAUTOMOTIVE FRANCE SAS
    Inventors: Alwin Moceri, Eloi Mortain, Baptiste Parigot
  • Patent number: 10886191
    Abstract: The invention relates to a method for producing an assembly (1), in particular a power electronics unit, comprising the following steps: providing a component (2) to be cooled having a first surface (4), providing a cooling device (3) having a second surface (5) opposite the first surface (4), arranging a 3-dimensional heat transfer plate (6) between the two surfaces (4, 5), wherein the heat transfer plate (6) extends in a plate plane (11) parallel to the two surfaces (4, 5) and in the initial state a plurality of contact extensions (9) which extend outwards with respect to said plate plane (11), and bracing the component (2) and the cooling device (3) relative to one another, such that the contact extensions (9) are deformed in the direction of the metal sheet.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: January 5, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Reiner Holp, Adolf Dillmann, Stefan Huehner
  • Patent number: 10880986
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: Evan Piotr Kuklinski, Jerrod Peterson, Ruander Cardenas, Patrick Douglas James
  • Patent number: 10627167
    Abstract: A gas turbine engine having a heat absorption device and an associated method are disclosed. The gas turbine engine includes a compressor, a combustor, a turbine, a bleed fluid cavity, and the heat absorption device. The combustor is coupled to the compressor. The turbine is coupled to the compressor and the combustor. The bleed fluid cavity is formed at a first predefined location in the compressor. The heat absorption device is disposed in the bleed fluid cavity and includes a casing, a flow path, and a phase change material. The casing includes an inlet and an outlet. The flow path is within the casing, extends between the inlet and the outlet, and directs an input bleed fluid separated from a fluid stream discharged from the compressor. The phase change material is filled in the casing, separated from the flow path.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: April 21, 2020
    Assignee: General Electric Company
    Inventors: Karthikeyan Sampath, Atanu Saha, Bhaskar Nanda Mondal, Sanjeev Sai Kumar Manepalli
  • Patent number: 10383237
    Abstract: A display apparatus is provided. The display apparatus includes a display which is curved such that opposite lateral ends thereof protrude forward relative to a central portion thereof. A support frame having a lower end supported on a horizontal surface and allowing the display to be disposed inside thereof is provided; wherein the support frame is curved such that opposite lateral ends thereof protrude forward relative to the central portion thereof.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: August 13, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Soon Park, Bo La Park, Hae Sung Park, Sung Il Bang, Jun Young Choi
  • Patent number: 10370576
    Abstract: A biaxially stretched thermally conductive and electrically insulating film comprising a polyester forming a matrix and a plurality of anisotropic thermally conductive particles dispersed within the matrix and A process for manufacturing said biaxially stretched polyester film in which the dimension of the anisotropic filler particles with the highest thermal conductivity is oriented out of the film plane, thus conferring on said film improved thermal conductivity properties in the direction perpendicular to the film plane.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: August 6, 2019
    Assignee: DUPONT TEIJIN FILMS U.S. LIMITED PARTNERSHIP
    Inventors: Anna Ellett, Marianne Bausch-Koenig
  • Patent number: 9894331
    Abstract: A projector device and a heat dissipation system thereof are provided. The heat dissipation system includes a heat dissipating target chip and a heat dissipating module. The heat dissipating target chip has a bottom surface having a heat dissipating area. The heat dissipating module has a heat dissipating body and a heat passage. The heat dissipating body includes a connection end facing the bottom surface, and the heat passage extends out from the connection end and is heat exchange connected to the heat dissipating area. The heat passage has a first cross-section and a second cross-section, wherein the second cross-section is farther away to the heat dissipating area than the first cross-section. The second cross-section area is larger than the first cross-section area.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 13, 2018
    Assignee: Qisda Corporation
    Inventor: Chi-Cheng Lin
  • Patent number: 9730352
    Abstract: A system includes (i) a module configured to be mounted on a panel and (ii) a clamp. The clamp includes a retaining section configured to receive and retain a threaded structure. The retaining section is also configured to be connected to and apply force against the module. The clamp also includes a contact section configured to contact the panel and apply force against the panel. The clamp further includes a connecting portion connecting the retaining section and the contact section. The connecting portion is configured to allow part of the threaded structure to contact the contact section in order to create the forces applied against the panel and the module. The connecting portion can be elastic such that a separation of the retaining section and the contact section changes as the threaded structure pushes against the contact section.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: August 8, 2017
    Assignee: Honeywell International Inc.
    Inventors: Wen Peng, Lei Jiang, Chaohong Liu, Qiankun Jiang
  • Patent number: 9565722
    Abstract: This invention is a device or module with a LED-type lamp of compact dimensions in order to be used in different illumination industries, such as the automobile, signaling or architectonic industries. The module includes elements for its easy and fast attachment, an efficient manufacturing as from a single plate and structures for the structural support and for heat diffusion. It can be directly attached in an application or in an insulation material support. Likewise, it has two different types of connections that may be used independently or jointly depending on the application.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: February 7, 2017
    Assignee: CEMM MEX, S.A. DE C.V.
    Inventors: Néstor Talavera González, Arturo Ángel Barrios Muñoz, Oscar René Cavazos Ramos, Luis Rebolledo Salazar
  • Patent number: 9560775
    Abstract: A display apparatus is provided. The display apparatus includes a display which is curved such that opposite lateral ends thereof protrude forward relative to a central portion thereof. A support frame having a lower end supported on a horizontal surface and allowing the display to be disposed inside thereof is provided; wherein the support frame is curved such that opposite lateral ends thereof protrude forward relative to the central portion thereof.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: January 31, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Soon Park, Bo La Park, Hae Sung Park, Sung Il Bang, Jun Young Choi
  • Patent number: 9357678
    Abstract: A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: May 31, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Leijie Zhou, Hiroyuki Okabe
  • Patent number: 9146062
    Abstract: An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 29, 2015
    Assignee: Radian Thermal Products, Inc.
    Inventors: Thierry Sin Yan Too, Mong Hu
  • Patent number: 9123686
    Abstract: An electronic device including a printed circuit board (PCB) including a thermal conduction plane and at least one heat generating component mounted on the PCB and connected to the thermal conduction plane. A frame is connected to the PCB so as to define a first thermally conductive path between at least a portion of the frame and the at least one heat generating component. The electronic device further includes at least one thermally conductive layer between the frame and the at least one heat generating component so as to define a second thermally conductive path between at least a portion of the frame and the at least one heat generating component.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: September 1, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Richard A. Mataya, Tegan Campbell
  • Patent number: 9042100
    Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 26, 2015
    Assignee: Aavid Thermalloy, LLC
    Inventor: Sukhvinder S. Kang
  • Patent number: 9042424
    Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 26, 2015
    Inventors: Gerald Ho Kim, Jay Eunjae Kim
  • Publication number: 20150138731
    Abstract: A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to facilitate heat transfer away from the heat producing units. The cooling apparatus may also have multiple heat sink columns located above, and designed to conduct heat away from, corresponding heat producing units, through thermally conductive contact with corresponding portions of the TIM layer. The cooling apparatus may also have a load plate located above the heat sink columns, designed to hold the heat sink columns in a relatively fixed position above the heat producing units. The TIM layer may have an initial compressed state between the heat sink columns and the corresponding heat producing units. Each of the heat sink columns may be designed so that, in operation, the corresponding portion of the TIM layer may have a further compressed state.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 21, 2015
    Applicant: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha
  • Patent number: 9036352
    Abstract: A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: May 19, 2015
    Assignee: GE Aviation Systems, LLC
    Inventors: Michel Engelhardt, Paul Otto Stehlik, Lawrence Joseph Hannaford, Jr.
  • Patent number: 9013874
    Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: April 21, 2015
    Assignee: SK hynix memory solutions inc.
    Inventor: Givargis George Kaldani
  • Patent number: 9007772
    Abstract: An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base. A slot is defined in each retaining portion. Each fin includes a main plate and a pivoting portion formed at a bottom the main plate. The pivoting portions are respectively and pivotably received in the slots of the base.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: April 14, 2015
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Lei Liu, Guo-Yi Chen
  • Patent number: 8995132
    Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: March 31, 2015
    Inventors: Tetsuji Kataoka, Taijirou Kataoka
  • Patent number: 8976529
    Abstract: In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: March 10, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Yi Lin, Po-Yao Lin, Tsung-Shu Lin, Kuo-Chin Chang, Shou-Yi Wang
  • Patent number: 8967586
    Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 3, 2015
    Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chao-Jun Zhu, Jin-Biao Ji, Zhi-Jiang Yao
  • Patent number: 8964393
    Abstract: The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected with the driving chip to dissipate the heat generated by the driving chip. Through the said method, the display device according to the present invention is provided with the heatsink connected with the driving chip to dissipate the heat generated by the driving chip, which improves the stability and reliability of the driving chip.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 24, 2015
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Yu-chun Hsiao, Quan Li
  • Patent number: 8964395
    Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: February 24, 2015
    Assignee: Dell Products L.P.
    Inventors: Darren B. Pav, David McKinney
  • Patent number: 8958208
    Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: February 17, 2015
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Shogo Mori, Shinobu Tamura, Shinobu Yamauchi, Taizo Kuribayashi
  • Patent number: 8958207
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: February 17, 2015
    Assignee: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8953322
    Abstract: An electronic control unit for a motor of an electric fan, has a support casing including a metal body adapted to act as a heat dissipator, a shell of an electrically insulating material coupled with the metal body, and a circuit board, mounted in contact with the dissipator body. The circuit board has a conductive connection member in the form of a flexible metal blade, electrically connected to the dissipator body, to provide an earth connection for the circuit board. The blade has a portion that projects beyond the edge of the board. The insulating shell has an internal formation which, upon coupling the shell with the dissipator body, interacts with the projecting portion of the blade, deforming it so as to bring it and thereafter maintain it in contact with the dissipator body in a resiliently loaded manner.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: February 10, 2015
    Assignee: Johnson Electric S.A.
    Inventors: Marco Bussa, Franco Quagliata
  • Patent number: 8952523
    Abstract: An integrated circuit package apparatus includes a packaging substrate, an integrated circuit coupled to an upper side of the packaging substrate, an array of contacts coupled to an underside of the packaging substrate for electrically coupling the integrated circuit to a circuit board, and a lid coupled to the upper side of the packaging substrate. In one form, the lid includes a central portion lying on a first plane, corner areas lying on a second plane, and arcuate wall portions disposed between and interconnecting the corner areas and the central portion. Other forms of the lid are provided.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: February 10, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Mudasir Ahmad, Mohan R. Nagar, Weidong Xie
  • Patent number: 8947881
    Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 3, 2015
    Assignee: European Aeronautic Defence and Space Company EADS France
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Emile Colongo, Sylvain Bourdou
  • Patent number: 8941996
    Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: January 27, 2015
    Assignee: Wistron Corporation
    Inventors: Yu-Feng Chiang, Cheng-Hao Lee, Chun-Lin Wang, Tung-Huang Kuo
  • Patent number: 8934248
    Abstract: A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides that is substantially greater than the thermal conductivity of the member in a second plane transverse to the first plane. A transverse heat sink structure contacts at least one side of the thermal transfer member along the length thereof, and extends from the thermal transfer member in a direction parallel to the first plane. A compression device compresses the thermal transfer member and the heat sink structure together to establish intimate thermal contact therebetween. Solid state lighting apparatus incorporating the dissipator is also disclosed.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: January 13, 2015
    Inventor: John E. Thrailkill
  • Patent number: 8929073
    Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: January 6, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Kazuaki Suzuki, Shigemasa Sato, Akio Idei
  • Patent number: 8929072
    Abstract: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: January 6, 2015
    Assignee: Inventec Corporation
    Inventors: Wei-Yi Lin, Ting-Chiang Huang, Li-Ting Wang, Sung Nien Du
  • Patent number: 8929077
    Abstract: A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.
    Type: Grant
    Filed: October 3, 2012
    Date of Patent: January 6, 2015
    Assignee: TEM Products Inc.
    Inventor: Dean Gouramanis
  • Patent number: 8923012
    Abstract: What is disclosed is a modular visualization display panel. The modular visualization display panel includes a first module having at least one surface and a connection to electrical ground. The modular visualization display panel also includes a second module having at least one surface with a plurality of raised contact nodes arranged on the one surface of the second module such that when in contact with the one surface of the first module electrostatic discharge energy is directed over at least one of the raised contact nodes to the one surface of the first module.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: December 30, 2014
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Andrew P. Kaufman, Keith O. Satula
  • Patent number: 8922999
    Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.
    Type: Grant
    Filed: September 15, 2012
    Date of Patent: December 30, 2014
    Assignee: Wistron Corp.
    Inventors: Jeng-Ming Lai, Sheng-Fu Liu, Tsung-Yu Chiu, Wei-Chung Hsiao
  • Patent number: 8917510
    Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: December 23, 2014
    Assignee: International Business Machines Corporation
    Inventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
  • Patent number: 8913389
    Abstract: Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: December 16, 2014
    Assignee: Panasonic Corporation
    Inventors: Yasuhito Fukui, Takashi Sawa, Shinichi Shinohara
  • Publication number: 20140362536
    Abstract: A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.
    Type: Application
    Filed: July 23, 2014
    Publication date: December 11, 2014
    Inventors: UMESH MISHRA, PRIMIT PARIKH, YIFENG WU
  • Patent number: 8905775
    Abstract: An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first retainer, a fixing lever, and a second retainer. The fixing lever has one end pivotally mounted to the first retainer and another end capable of locked by the first retainer. The second retainer is integral formed with an elastic plate. The first retainer and the second retainer are two separated members, and the fixing lever and the elastic plate are used for pressing two opposite ends of the heat dissipating device.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8908375
    Abstract: A cooler of a power converting device for a railroad vehicle has heat exchanger tubes or heat radiator fins disposed to enhance the cooling performance of semiconductor devices arranged on an upper level of the multiple semiconductor devices arranged in multiple rows. Temperature detecting elements are arranged to detect temperature of the semiconductor devices arranged on a lower level on a windward side and a leeward side with respect to a traveling wind performing heat exchange with the heat radiator fins, and are arranged to detect temperature of the semiconductor devices arranged on the upper level at a center area thereof.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: December 9, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Masaomi Konishide, Yasuhiko Kono, Akihiro Hishida
  • Patent number: 8898892
    Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: December 2, 2014
    Assignee: Tong Hsing Electronic Industries, Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
  • Patent number: 8893770
    Abstract: One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: November 25, 2014
    Assignee: Schneider Electric It Corporation
    Inventor: Gorm Gamborg
  • Patent number: 8891242
    Abstract: A heat sinking device for a component mounted on an electronic circuit board, including: a hollow body, of straight cylindrical or prismatic form, including a first material, arranged vertically on top of the electronic circuit board, the useful volume of the body including at least the component, a resin including a second material, at least partially filling the internal volume of the body so as to contain the component. The heat sinking device can be arranged on an insulating separator element, the resin can be introduced in the liquid state.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: November 18, 2014
    Assignee: Thales
    Inventors: Pierre Borrat-Michaud, Anne-Gaëlle Tallec
  • Patent number: 8879267
    Abstract: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: November 4, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Randall R. Henry, Michael E. Shirk
  • Patent number: 8873237
    Abstract: One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to remove heat generated by the heat-generated device, and a heat pipe disposed within the liquid channel, where the heat pipe increases the heat transfer surface area to which the heat transfer liquid is exposed. Among other things, the heat pipe advantageously increases the heat transfer surface area to which the heat transfer liquid is exposed and efficiently spreads the heat generated by the heat-generating device over that heat transfer surface area. The result is enhanced heat transfer through the liquid channel relative to prior art cooling systems.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: October 28, 2014
    Assignee: NVIDIA Corporation
    Inventor: Zoran Stefanoski
  • Patent number: 8861202
    Abstract: A thermal management component for a Rechargeable Energy Storage Systems (RESS) assembly and a method of managing the temperature of a RESS battery module using the component are disclosed. The thermal management component comprises (i) a frame having a chamber defined therein; and (ii) a heat exchange plate in mechanical communication with at least a portion of the frame. The method comprises (a) providing a thermal management component as described herein; and (b) circulating at least one heat transfer fluid through said component.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: October 14, 2014
    Assignee: GM Global Technology Operations LLC
    Inventor: Mathew L. Nassoiy