Thermally And Electrically Conductive Patents (Class 361/712)
  • Patent number: 10177542
    Abstract: A contactor arrangement includes a post, a fastener and a temperature sensor. The post defines a post axis. The fastener is fixed to the post along the post axis. The temperature sensor is in thermal communication with the contactor conductor and post through the fastener and is electrically insulated from the post for monitoring resistive heat generation in a contactor fixed to the post by the fastener.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: January 8, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Ashutosh Joshi, Debabrata Pal
  • Patent number: 10115878
    Abstract: An optical sensor includes a flexible substrate, a light emitting element, and a light receiving element. The light emitting element and the light receiving element are mounted on element mounting portions and connected to element connection portions by wires. The optical sensor also includes through wirings extending through the substrate. Each through wiring is bonded to the element mounting portion or the element connection portion. The through wirings include a heat radiation through wiring that is located immediately below the light emitting element and bonded to the element mounting portion on which the light emitting element is mounted. The optical sensor further includes light shielding materials and encapsulation resins for surrounding and encapsulating the light emitting element and the light receiving element, respectively.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: October 30, 2018
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Yasuyoshi Horikawa
  • Patent number: 9966869
    Abstract: A modular high voltage supply system has a mobile adapter transformer with a high-voltage output side and a low-voltage input side, electrical connecting input-terminals being foreseen at the mobile adapter transformer outer surface, a mobile container with a low voltage supply system, mounted stationarily therein, having a high current busbar and at least one electrical frequency converter connected thereto, electrical connecting output-terminals for the high current busbar being foreseen at an accessible the mobile container edge; and a modular interim busbar system, for temporary electrical connection of input- and output-terminals, having at least one interim busbar with at least one elongated busbar basic module mounted on a frame structure and respective resilient electrical connections on both busbar basic module ends forming an electrical connection to the input- and/or output-terminals and arranged such that a transmission of vibrations from the mobile adapter transformer to the mobile container is s
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 8, 2018
    Assignee: ABB Schweiz AG
    Inventors: Matthias Steiger, Janusz Szczechowski, Bernhard Wanzek
  • Patent number: 9855903
    Abstract: An electrical contactor assembly includes an electrical contactor, a post in electrical communication with the electrical contactor, an insulator body, and a heat sink. The insulator body is in intimate mechanical contact with the post. The heat sink is in intimate mechanical contact with the insulator body and is in thermal communication with the electrical contactor through the post and the insulator body such that heat flowing between contactor and the heat sink flows through the post and the insulator body.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: January 2, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Debabrata Pal
  • Patent number: 9312245
    Abstract: One exemplary disclosed embodiment comprises a three-terminal stacked-die package including a field effect transistor (PET), such as a silicon PET, stacked atop a III-nitride transistor, such that a drain of the PET resides on and is electrically coupled to a source of the III-nitride transistor. A first terminal of the package is coupled to a gate of the FET, a second terminal of the package is coupled to a drain of the III-nitride transistor. A third terminal of the package is coupled to a source of the FET. In this manner, devices such as cascoded switches may be packaged in a stacked-die form, resulting in reduced parasitic inductance and resistance, improved thermal dissipation, smaller form factor, and lower manufacturing cost compared to conventional packages.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: April 12, 2016
    Assignee: Infineon Technologies Americas Corp.
    Inventors: Heny Lin, Jason Zhang, Alberto Guerra
  • Publication number: 20150118391
    Abstract: A thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Inventor: Brett W. Kilhenny
  • Patent number: 8964392
    Abstract: A device for screening an electronic module which has electronic components fixed to a printed circuit board and which is connected to a heat sink. The heat sink comprises an electrically conductive material. The printed circuit board has at least one layer composed of electrically conductive material. The heat sink and the printed circuit board serve as screening elements.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: February 24, 2015
    Assignee: Continental Automotive GmbH
    Inventors: Emil Kovatchev, Michael Maryschka
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8929078
    Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: January 6, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Volker Weeber, Heinrich Barth, Ralph Schertlen
  • Patent number: 8917511
    Abstract: A wireless power transfer system and power transmitting/receiving device according to the present invention include an antenna (resonator) 109 and a heat dissipation structure 111 with an electrically conductive thermal conductor 11, a portion of which makes thermal contact with the inductor 13 of the antenna 109 with an electrical insulator 12 interposed between them. The thermal conductor 11 is arranged to form no electrically closed loop.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 23, 2014
    Assignee: Panasonic Corporation
    Inventors: Hiroshi Yamamoto, Hiroshi Kanno
  • Publication number: 20140369006
    Abstract: A power supply device including a capacitance partition, a control partition, a power switching partition, a thermal conduction partition, a magnetic partition. The thermal conduction partition includes electrical connections to connect other partitions. The thermal conduction partition provides for magnetic shielding of the magnetic partition and thermal dissipation in a substantially orthogonal direction to the electrical connections. The layering arrangement allows automated production and/or testing.
    Type: Application
    Filed: September 16, 2011
    Publication date: December 18, 2014
    Applicant: INTERVENTION TECHNOLOGY, PTY, LTD
    Inventor: Donald Victor Williams
  • Patent number: 8913388
    Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: December 16, 2014
    Assignee: Finisar Corporation
    Inventors: Tat Ming Teo, Troy Wy Piew Chiang, JianBing Zhao
  • Patent number: 8913383
    Abstract: An apparatus includes an electrically-powered component, a hermetically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermetically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: December 16, 2014
    Assignee: Heatmine LLC
    Inventors: Wendi Goldsmith, James M. Kramer
  • Patent number: 8872600
    Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: October 28, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Hiroshi Nakamura, Tomohiro Igarashi
  • Patent number: 8867212
    Abstract: To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: October 21, 2014
    Assignee: Yazaki Corporation
    Inventors: Hiroki Shiraiwa, Kazuomi Kiyosue, Akinori Nakashima, Tomohiro Sugiura, Noriyoshi Yamazaki, Minoru Umezaki
  • Patent number: 8854820
    Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: October 7, 2014
    Assignee: Omron Corporation
    Inventors: Shingo Yamamoto, Akio Sumiya, Yasuo Matsuda, Naoto Inoue, Makoto Tami, Ryo Sugihara, Fumiaki Tanaka, Shintaro Hara, Shota Akinaga
  • Publication number: 20140268574
    Abstract: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.
    Type: Application
    Filed: May 29, 2014
    Publication date: September 18, 2014
    Applicant: FUJIKURA LTD.
    Inventors: Kazuhisa Itoi, Masahiro Okamoto
  • Publication number: 20140254101
    Abstract: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components may be embedded into a copper core. In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate may be layered above and below the copper core. A copper ground plane may be fixed underneath the layer of PCB laminate below, and furthest from, the copper core. One or more additional components may be surface mounted on top of the PCB laminate layers above the copper core. A conformal coating may be applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating may include trenching and a copper sputter coating finish.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Mark A. CARTER, Yang ZHANG, Yongsheng PENG, Jack B. STEENSTRA, Michael G. BARRETT
  • Patent number: 8830010
    Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: September 9, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Hiroshi Nakamura, Tomohiro Igarashi
  • Patent number: 8780576
    Abstract: An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: July 15, 2014
    Assignee: Invensas Corporation
    Inventors: Belgacem Haba, Kishor Desai
  • Patent number: 8760855
    Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Jeremy Charles Howes, David Levett
  • Patent number: 8760871
    Abstract: A display device having a thinner shape and a uniform luminance includes a display panel that displays images. The display device has upper and lower peripheral regions. A printed circuit board (PCB) is positioned at the back of the display panel to control and drive the display panel and to provide power to the display panel. A thermal conductive sheet is attached to the back of the display panel. In the display device, the thermal conductive sheet includes a base film that is attached to the back of the display panel and is formed of an electrical insulating material. A power supply pattern is formed on the base film to provide power to the display panel. A ground pattern is formed to be spaced apart and electrically insulated from the power supply pattern.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: June 24, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventor: Min-Cheol Kim
  • Patent number: 8746308
    Abstract: In a manufacturing method of a package carrier, a substrate including a first metal layer, a second metal layer having a top surface and a bottom surface opposite to each other, and an insulating layer between the first and second metal layers is provided. The second metal layer has a greater thickness than the first metal layer. A first opening passing through the first metal layer and the insulating layer and exposing a portion of the top surface of the second metal layer is formed. The first metal layer is patterned to form a patterned conductive layer. Second openings are formed on the bottom surface of the second metal layer. The second metal layer is divided into thermal conductive blocks by the second openings that do not connect the first opening. A surface passivation layer is formed on the patterned conductive layer and the exposed portion of the top surface.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: June 10, 2014
    Assignee: Subtron Technology Co., Ltd.
    Inventor: Shih-Hao Sun
  • Patent number: 8730672
    Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.
    Type: Grant
    Filed: November 6, 2011
    Date of Patent: May 20, 2014
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Frank Ebersberger, Peter Beckedahl, Hartmut Kulas
  • Publication number: 20140133103
    Abstract: The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 15, 2014
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Hiroshi NAKAMURA, Tomohiro IGARASHI
  • Publication number: 20140063743
    Abstract: Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 6, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd
    Inventors: Seng-Kum Chan, David J.K. Meadowcroft
  • Publication number: 20140055956
    Abstract: A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC.
    Type: Application
    Filed: July 26, 2013
    Publication date: February 27, 2014
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Hiroshi Nakamura, Tomohiro Igarashi
  • Patent number: 8649179
    Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
    Type: Grant
    Filed: February 5, 2011
    Date of Patent: February 11, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
  • Patent number: 8634195
    Abstract: A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: January 21, 2014
    Assignee: International Business Machines Corporation
    Inventor: Don A. Gilliland
  • Patent number: 8630092
    Abstract: A cooling box for electric or electronic components, consisting of a material, wherein the cooling box is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity that is enclosed by the material, wherein cavity being closed or provided with at least one opening.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: January 14, 2014
    Assignee: CeramTec GmbH
    Inventor: Claus Peter Kluge
  • Patent number: 8624122
    Abstract: To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: January 7, 2014
    Assignee: Yazaki Corporation
    Inventors: Hiroki Shiraiwa, Kazuomi Kiyosue, Akinori Nakashima, Tomohiro Sugiura, Noriyoshi Yamazaki, Minoru Umezaki
  • Publication number: 20140002995
    Abstract: An electrical contactor assembly is provided including an electrical contactor, an electrical bus bar, and a single panel formed of one more layers of an electrically insulating, thermally conductive material. A plurality of posts protrude through and directly contact the panel. Each of the posts is constructed from an electrically and thermally conductive material. Each post has a first end configured to electrically and thermally connect to the electrical contactor and a second end configured to electrically and thermally connect to the bus bar.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Debabrata Pal
  • Patent number: 8619428
    Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: December 31, 2013
    Assignee: Cyntec Co., Ltd.
    Inventors: Han-Hsiang Lee, Yi-Cheng Lin, Pei-Chun Hung, Bau-Ru Lu, Da-Jung Chen, Jeng-Jen Li
  • Patent number: 8599560
    Abstract: A heat dissipating system includes a shell, a main circuit board, at least two heat generating elements, and at least one fan. The shell includes a first sidewall, a second sidewall facing the first sidewall, and a third sidewall connected to the first sidewall and the second sidewall. The at least one fan are arranged on the first sidewall. The second sidewall defines a number of vents. The main circuit board is positioned between the at least one fan and the vents. The heat dissipating system further includes a connection assembly positioned between the first and second circuit boards. The main circuit board includes a first circuit board and a second circuit board. The first circuit board is electrically connected to the second circuit board through the connection assembly. The at least two heat generating elements are respectively positioned on the first circuit board and the second circuit board.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: December 3, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Kang Wu, Bo Tian
  • Publication number: 20130314875
    Abstract: Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Inventors: Daniel W. Jarvis, Richard Hung Minh Dinh
  • Patent number: 8591066
    Abstract: A lamp module for use in non-destructive testing and inspection. The module including a module body with a front and rear end, and a side wall. The module body includes a mounting chamber located within the side walls. A plurality of LEDs are mounted within the chamber and oriented to so as to emit light out of the front end of the body. At least one LED emits light having a wavelength selected to produce fluorescence of an illuminated material. A fan is mounted to the body to dissipate heat generated by the LEDs when the fan is activated. Electrical connectors extend out of the body and are electrically connected to the LEDs and the fan for supplying current. The module can be installed in various structures or systems, including in a luminaire, an overhead light housing or a track light system.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: November 26, 2013
    Assignee: Spectronics Corporation
    Inventors: Gustavo Garcia, John Duerr, Chih-Tsung Su
  • Patent number: 8564956
    Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: October 22, 2013
    Assignee: Nexxus Lighting, Incorporated
    Inventor: Zdenko Grajcar
  • Patent number: 8545987
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: October 1, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jason Strader, Mark Wisniewski
  • Patent number: 8537553
    Abstract: In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: September 17, 2013
    Assignee: Futurewei Technologies, Inc.
    Inventors: Anwar Mohammed, Renzhe Zhao
  • Patent number: 8531842
    Abstract: A display module includes a display panel, a unit disposed on an outer side of the display panel, and an adhesive sheet with which the display panel and the unit are stuck together. The adhesive sheet has a first adhesive surface adhering to the display panel and a second adhesive surface adhering to the unit. The edge of the first adhesive surface and the edge of the second adhesive surface are displaced from each other in the adhesive surface direction.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: September 10, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Michiko Johnson, Kiyofumi Sakaguchi, Takanori Suzuki, Masashi Kitani
  • Patent number: 8526185
    Abstract: To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: September 3, 2013
    Assignee: Cisco Technology, Inc.
    Inventors: Eric Heidepriem, Robert Grimes
  • Patent number: 8520391
    Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: August 27, 2013
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Huei-Nuan Huang, Pin-Cheng Huang, Chun-Hung Lu, Chun-Chieh Chao, Chi-Hsin Chiu
  • Patent number: 8520392
    Abstract: An electronic-control unit (7) includes a conductor board (12) made of a flexible substrate and defining at least one conducting path and cut (13) of the board (12). A basic body (11) is made of a thermally and electrically conductive material and thermally and electrically coupled to the board (12) and defines at least one elongated groove (15) that acts as a bending area (15) of the body (11) and expands over substantially an entire width of the body (11) in an aligned area of the cut (13) of the board (12) and a flat projection of the body (11) onto which the substrate is fastened. A basic-body-conductor-board unit is formed before the board (12) is assembled with at least one electronic component (16). The basic-body-conductor-board unit is re-shaped into a desired geometry after the assembly of the board (12) with the component (16). A method produces the basic-body-conductor-board unit.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: August 27, 2013
    Assignee: Automotive Lighting Reutlingen GmbH
    Inventors: Christian Johann, Matthias Roder, Ruediger Laubenstein
  • Patent number: 8519530
    Abstract: Disclosed is a composition, in particular a dispersion, which contains nanofiber material in at least one organic matrix component, said nanofiber material being pre-treated in at least one method step for adjusting the physical properties of the composition.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: August 27, 2013
    Assignee: Curamik Electronics GmbH
    Inventors: Ka Chun Tse, Ben Zhong Tang, Ernst Hammel, Xinhe Tang
  • Publication number: 20130208424
    Abstract: A circuit comprising an integrated circuit disposed on a substrate. A via disposed adjacent to the integrated circuit. A solid metallic pin disposed within the via and configured to conduct heat generated by the integrated circuit to a heat sink.
    Type: Application
    Filed: February 14, 2013
    Publication date: August 15, 2013
    Inventors: Robert W. Warren, Nic Rossi
  • Publication number: 20130114212
    Abstract: An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver (Ag) or copper (Cu) and a second conductive metal consisting of tin (Sn), and a ratio of the atomicity of tin to the atomicity of silver or copper and tin is 27 to 40%, and an electronic device using the same.
    Type: Application
    Filed: November 5, 2012
    Publication date: May 9, 2013
    Applicant: DENSO CORPORATION
    Inventor: DENSO CORPORATION
  • Patent number: 8437136
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: May 7, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Patent number: 8431048
    Abstract: The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: April 30, 2013
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Arvind Kumar Sinha, Kevin Albert Splittstoesser, Timothy Jerome Tofil
  • Patent number: 8411442
    Abstract: With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: April 2, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Walter Meinel, Kalin V. Lazarov
  • Patent number: 8405998
    Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: March 26, 2013
    Assignee: International Business Machines Corporation
    Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper