Abstract: A low profile heat dissipator for low power IC packages which is formed of a metal, thermally conductive layer, zero, one or two electrically insulative layers positioned on one or both major surfaces of the metal layer, and an adhesive pad which bonds the dissipator to the surface of the electronic component. The dissipator may have a series of score lines formed in its surfaces which allows portions of the dissipator to be bent or removed so as to conform to the available space.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: In a plastic-packaged semiconductor device molded by a synthetic resin, a heat sink is formed by a sheet which has a thermal expansion coefficient between 9.0.times.10.sup.-6 /K and 23.times.10.sup.-6 /K and a thermal conductivity greater than 200 W/m.multidot.K, which are selected in relation to those of the synthetic resin. The sheet is manufactured by mixing a first metal of a high melting point with a second metal of a low melting point lower than the first metal and by pressing and sintering the mixture. The first and the second metal may be molybdenum and copper, respectively. Alternatively, the sheet may be a composite sheet composed of a molybdenum mesh interposed between a pair of aluminum layers or a stacked sheet composed of a sintered layer of a mixture of molybdenum and copper and a coated layer of either molybdenum or copper.

Abstract: An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.

Abstract: An add-on control circuit device for insertion into electronic apparatus such as a laser printer having a first microprocessor with an address line connected to an add-on card connector, a ROM that stores programs for the microprocessor, and a data converter that provides data in the form of memory addresses. The add-on circuit uses a printed circuit board of mounted inside of an add-on cartridge or casing, made from high thermal transfer material such as aluminum. When the cartridge is inserted into a printer, the processor inside of the printer reads identification data stored on a ROM inside of the cartridge and conducts processing according to a specified processing program in response to the identification data. The microprocessor is located in a mounting area near the rear end of the cartridge, when viewed along the direction of insertion, so that the microprocessor is more effectively cooled by the surrounding air.

Abstract: A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections. The substrate has a heat sink affixed to the bottom and electrical connections are formed on the opposite face of the package from the heat sink so that the encased semiconductor may be mounted on circuit boards in either a vertical position or in a position where the heat sink is horizontal but facing upward.

Abstract: A laminate comprising (a) a carrier having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 .mu.m, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive filler and has a thickness of 5 to 500 .mu.m and a heat conductivity of 1 W/mK. The flexible laminate, or a dielectric and self-supporting adhesive film which contains a heat-conductive filler and has a heat conductivity of at least 1 W/mK, is suitable for removing heat from leadframes which have electrically insulated contact surfaces for electrical and electronic components and which are encapsulated with a synthetic resin moulding material, typically dual-in-line plastic packages, by bonding the rear sides of the contact surfaces to the leads.

Abstract: A junction box (10) defining an enclosed card cage and including a backplane assembly (200) for interconnecting circuits of daughter cards (130) with associated conductors extending thereinto at an input/output interface. The junction box (10) includes a front panel (50) removable from the front face to permit insertion and removal of respective daughter cards, and includes an array of interior fins (58) engaged with the daughter cards at thermal junctions (64) and an array of exterior fins (52) for dissipating the thermal energy. The rear wall (14) includes shield sections (214) surrounding input/output connectors (208) joined to the backplane assembly. The junction box (10) prevents EMI/RFI leakage therethrough.

Abstract: A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally, The circuit board can be formed to be compact, In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner, It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer, Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

Abstract: In a cooling unit for use in combination with a cooling medium supplying unit (37) and for cooling at least one integrated circuit chip (31), a heat transfer tube (47) passes a cooling medium and is supported by a hat (21) with a gap left between the tube and the chip. The tube may be electrically conductive and put in contact with an electric conductor bump attached on the chip. The cooling medium supplying unit may comprise a cooling plate (39) having first and second paths (101, 105) for passing the cooling medium. The cooling unit may comprise first and second heat transfer tubes associated with the first and the second paths. Each of the first and the second tubes is supported with the gap left between each of the first and the second tubes and each of first and second chips. The first and the second tubes may be electrically conductive and put in contact with the bumps. The first chip may have primary first and second bumps. The second chip may have secondary first and second bumps.

Abstract: An electronic circuit mounting arrangement includes heat-conducting, electrically insulating and/or conducting pastes (14, 30) as well as flexible conductor plates (16, 28). The utilization and application of these elements make it possible to increase the packing density of the components (22, 32) also in the field of the high-power circuit arrangements. It further provides for a substantial rationalization in the connection technique for an optimization in the means of the contacting procedure. The economic manufacturing, accompanied by a destruction-free partial demountability, permits based on the use of pastes and foils the further mounting of electronic circuit arrangements resulting in an increased circuit density in one circuit unit.

Abstract: A bypass contactor usable in a solid state motor starter for shunting current around a fully-conducting solid state switching device comprising an electromagnetic contactor housed in a molded insulating enclosure having a plurality of bridging contacts movable into and out of engagement with a pair of stationary contacts to provide plural parallel current paths within the contactor, the stationary contacts having rigid terminal portions projecting externally of the insulating enclosure connectable to the heat sinks of the solid state motor starter in a preferred manner to suspend the contactor above the panel, permitting other components to be mounted below the bypass contacts. Alternate embodiments have the contactor mounted to the same support as the starter power pole component assembly and electrically connected thereto by rigid preformed connectors or flexible braided straps.

Abstract: An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a first power transistor (124, 126) and to provide a highly efficient thermal transfer and dissipating arrangement. The bracket is constructed and arranged to provide for placement of at least a first substrate for a hybrid circuit assembly thereon, and includes at least a first power transistor aperture (120, 122) with at least two bracket projections (146, 148) for permitting placement of said transistor on plural electrical contacts (104, 106). The heat generated by components on the circuit board(s) is transferred and dissipated substantially by biasing at least one bracket projection member resiliently against a heat sink (108, 110, 112, 114, 116, 118).

Abstract: A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.

Abstract: An improved circuit board having a variety of electronic components mounted thereon and having disposed to the autumn side of the circuit board a backing plate having a variety of thicknesses wherein a thicker portion of the backing plate is disposed near portions of the circuit board or components on the circuit board which are of a higher heat generating nature, the circuit board further having a slot extending through the circuit board and inserted in the slot is a metallic shielding cover which contacts the backing plate. Also disclosed is a method for manufacturing the circuit board.

Abstract: The lead-frame in an integrated circuit package, a standard package designated SOT-89, has a plurality of leads of which at least one is an extension of a die-attach pad. At least one ground wing is formed as an extension of a peripheral portion of the die-attach pad and extends upward to approximately the plane of the top of the die. The ground wing has an upstanding portion and a horizontal portion that are at an angle to each other so as to lock the distal end of the wing in the body of encapsulating resin. An integrated circuit die having at least one electrical connection which is grounded electrically via a terminal and wire bonded to the distal part of the ground wing. A contact surface near the distal end of wing is positioned approximately in the plane of the top of the die. This ground circuit can parallel and can be redundant to a ground circuit through the die via the conductive bond that attaches the bottom of the die to the die-attach pad.

Abstract: A heat sink and method for heat sinking a package containing electronic components is described. The heat sinking is accomplished by use of a cooling plate located beneath a circuit board. The package having leads extending from more than one side of the package is positioned on the cooling plate so that the leads from the sides of the package can be electrically coupled to conductors on the circuit board wherein the circuit board is disposed about at least two and preferably three sides of the package. The package is secured to the cooling plate by a spring clip. The spring clip permits flexible positioning of the package relative to the cooling plate including positioning the package in close proximity of the edge of the cooling plate. Thermal conduction between the package and the cooling plate can be enhanced by the presence of a compressible thermally-conducting material.