Through Component Housing Patents (Class 361/714)
  • Patent number: 11096268
    Abstract: A motor electronics unit includes a printed circuit board having a first side and a second side with electronic components connected to the printed circuit board. An electrical conductor is connected to the printed circuit board. A heat sink is connected to the printed circuit board. A pre-molded electrical connector shroud has a portion of the electrical conductor positioned within the electrical connector shroud. A housing has an endcap, both co-molded in a low pressure injection molding process of a thermally conductive polymeric material. The endcap encapsulates the printed circuit board including the electronic components connected to the printed circuit board and covers a first portion of the heat sink, with a second portion of the heat sink uncovered by the polymeric material of the endcap to permit heat transfer away from the printed circuit board. The endcap also encapsulates a portion of the electrical connector shroud.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: August 17, 2021
    Inventors: Michael Goatley, Brian Howe
  • Patent number: 11079813
    Abstract: A computer case configured to dispose a motherboard and a graphics card therein is provided. The computer case includes an outer frame and a motherboard carrier. The outer frame includes a side surface. The motherboard carrier is connected to the outer frame and configured to dispose the motherboard thereon. A body of the motherboard carrier and the side surface form a predetermined angle of greater than 0°.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 3, 2021
    Assignee: Asustek Computer Inc.
    Inventor: Ming-I Chuang
  • Patent number: 11045800
    Abstract: A breathing air laboratory on location gas sample test and data collecting system and method, at a remote breathing air provider's facility, that includes an air compressor, for remotely testing, collecting, and monitoring the quality and purity of the breathing air being produced at the provider's facility, that allows an accredited independent monitoring, testing, and analyzing facility to provide breathing air validation and certification to a cloud-based air quality test and analysis account belonging to the breathing air provider facility at any time. The system includes redundant gas sample air sensors for O2 and CO to ensure quality and accuracy in the breathing air test and data collection, and analysis and a “canary” gas sample test module securely mounted in a laboratory chassis, but manually swappable, to ensure credibility and accuracy of the sensors being used to test gas/air samples.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 29, 2021
    Inventors: Lawrence Kaplan, Liev Aleman
  • Patent number: 11016045
    Abstract: According to one embodiment, an inverter device configured to be capable of switching an on or off state of each of a plurality of switching elements, on the basis of a control command signal, and operable as a single-phase inverter, includes: a pulse width modulator configured to set a voltage value at a time when one of the switching elements is set to the on state to a first voltage, and set a voltage value at a time when the other three of the switching elements are set to the on state to a second voltage larger than the first voltage, in operation as the single-phase inverter; and a detection unit configured to detect the control command signal in operation as the single-phase inverter.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: May 25, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shinji Takakura, Shigen Yasunaka
  • Patent number: 10959345
    Abstract: A closure (100/200) protects telecommunications circuitry from water and dust. The closure (100/200) includes a base (128) that has a sidewall (134) that extends upwardly from a bottom (118), and the sidewall (134) has at least one cable port (122/222). The closure (100/200) also includes a cover (126) that attaches to the base (128) to close an interior (130) of the closure (100/200). Further, a galvanic anode (124) is removably secured to the sidewall (134) of the base (128) of the closure (100/200) and electronic circuitry (132) is disposed within the interior (130) of the closure (100/200). The electronic circuitry (132) is active electronic circuitry.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: March 23, 2021
    Inventors: Nicolas De Jaegere, Eddy Luc Cams, Christiaan Radelet
  • Patent number: 10767848
    Abstract: An article of manufacture comprising a heat sink to be attached a heat source, being coupled thermally and directly for conductive flow of heat from the heat source to the heat sink. The heat sink is formed via extrusion of material of suitable density and mass to absorb heat from the heat source based on design requirements. The extruded heat sink is configured with specially oriented extruded fins and machined cross cuts to increase surface area available to air flow, and arranged for efficient passage of air around the extruded heat sink, thus effecting efficient convection of heat into the air ambient. Cross cuts and fin are specifically arranged to enhance the “stack effect,” or “chimney effect,” associated with air flow. An objective is to maximize air flow across available surface area, and thus to enhance removal of heat into the air ambient.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: September 8, 2020
    Inventors: Bret E. Kline, Randy Goodman
  • Patent number: 10593913
    Abstract: An electricity storage device (1) which is provided with an electricity storage element (40) and an outer case (10). This electricity storage device (1) is also provided with: a measurement substrate (81) which is connected to the electricity storage element (40), and through which a first electric current passes; and a main circuit substrate (82) through which a second electric current that is larger than the first electric current passes. The main circuit substrate (82) is arranged so as to face a part of a container (410) of the electricity storage element (40), said part being different from a long lateral surface (411) of the container (410).
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: March 17, 2020
    Assignee: GS Yuasa International Ltd.
    Inventor: Yasutaka Miyawaki
  • Patent number: 10076062
    Abstract: A amplifier with improved space efficiency includes a housing that dissipates heat having an upper wall and two side walls and having an interior with upper and lower portions. The amplifier further includes an upper circuit board in the upper portion and a lower circuit board in a lower portion. The amplifier further includes a connector that electrically connects the upper and lower circuit boards.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: September 11, 2018
    Inventor: Nicholas Heath Wright
  • Patent number: 9629274
    Abstract: A plurality of parts built in an electronic apparatus are attached to a frame. Further, the frame has a peripheral wall portion formed along an outer peripheral face of the electronic apparatus. An upper cover has a rear face portion attached to a rear wall portion of the frame by a screw. Further, a lower cover has a rear face portion attached to the rear wall portion of the frame by a screw. With the structure, insertion locations of the fixtures such as screws can be suppressed from standing out.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: April 18, 2017
    Assignees: SONY CORPORATION, Sony Interactive Entertainment Inc.
    Inventors: Inoue Yukito, Ootori Yasuhiro
  • Patent number: 9320174
    Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: April 19, 2016
    Assignee: Elwha LLC
    Inventors: Philip Lionel Barnes, Hon Wah Chin, Howard Lee Davidson, Kimberly D. A. Hallman, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Brian Lee, Richard T. Lord, Robert W. Lord, Craig J. Mundie, Nathan P. Myhrvold, Nicholas F. Pasch, Eric D. Rudder, Clarence T. Tegreene, Marc Tremblay, David B. Tuckerman, Charles Whitmer, Lowell L. Wood, Jr.
  • Patent number: 9247676
    Abstract: An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: January 26, 2016
    Assignee: The DIRECTV Group, Inc.
    Inventors: Henry Derovanessian, Robin M. Mathews
  • Patent number: 9210991
    Abstract: An apparatus and method for keeping mobile devices warm in cold climates are disclosed. A particular embodiment includes: a frame structure wherein a first portion of the frame structure being in proximity to the body of a user to receive body heat from the user, the frame structure including a second portion to support electronic components of the apparatus; and a thermal conduit thermally coupled between the first and second portions of the frame structure, the thermal conduit transferring body heat received at the first portion to the electronic components of the apparatus at the second portion.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: December 15, 2015
    Assignee: Intel Corporation
    Inventors: Yoshifumi Nishi, Douglas Heymann
  • Patent number: 9197002
    Abstract: A connector supporting structure includes a substrate, a connector mounted on the substrate, and a casing covering at least a portion of the substrate and supporting the connector. The casing includes an opening to expose a part of the connector from an inside of the casing to an outside. Side surfaces of the connector are pressed by inner surfaces of the opening.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: November 24, 2015
    Assignee: HITACHI METALS, LTD.
    Inventors: Masataka Satoh, Kouki Hirano, Hitoshi Horita, Masanobu Ito
  • Patent number: 9007773
    Abstract: Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: April 14, 2015
    Assignee: Flextronics AP, LLC
    Inventors: Gary Warren, Darren Van Roon, Steve Steane, Reginald C. Grills
  • Publication number: 20150098192
    Abstract: An illustrative example motor control device includes a printed circuit board including electronics for motor control. At least one connector is associated with the electronics. The connector is configured for communicating at least one of control signals or power to a motor. A housing includes a first portion configured to receive the printed circuit board and cover over a first side of the printed circuit board. A second portion of the housing is configured to provide access to the at least one connector from outside of the housing. The second portion of the housing inhibits exposure of the printed circuit board to outside contaminants. A third portion of the housing is configured to cover over a second side of the printed circuit board. At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 9, 2015
    Applicant: USSI, LLC d/b/a NARTRON
    Inventors: John Washeleski, Edward Cox, Curtis M. Lizotte
  • Publication number: 20150092336
    Abstract: An apparatus or method for providing thermal energy transfer comprising; a circuit board, a housing connected to the circuit board, at least one electronic component contained within said housing, said housing comprising a aperture, wherein said housing is configured to receive a thermally conductive material through the aperture and said thermally conductive material couples thermal energy from said at least one electronic component.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 2, 2015
    Applicant: Nokia Corporation
    Inventors: Mezhgan SAMADY, Mikko Juhani TIMPERI, Romeo DUMPIT, Vincent PHAN, Cachaulo VAN LAANEN
  • Patent number: 8988880
    Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: March 24, 2015
    Assignee: GE Intelligent Platforms, Inc.
    Inventor: Laith Anthony Vincent
  • Patent number: 8982557
    Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: March 17, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideki Watanabe, Shigeo Hayashi
  • Patent number: 8971042
    Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: March 3, 2015
    Assignee: Wistron Corp.
    Inventor: Sheng-Fu Liu
  • Publication number: 20150055297
    Abstract: Modules, systems, and methods are provided for cooling components of an inspection or testing apparatus, such as a borescope. In some exemplary embodiments, the modules include two heat sinks, with the top-most heat sink having a fan assembly approximately centrally disposed therein. The fan assembly can be operated to draw air into the top-most heat sink, and then exhaust airflow out of the top-most heat sink such that the exhaust air passes across at least a portion of the second heat sink to help cool both the first and second heat sinks, and components of the apparatus associated therewith, using the same fan assembly. As a result, the components of the apparatus can be cooled more easily, and the performance and efficiency of these components is improved, all while reducing the overall size and weight of the inspection apparatus.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Applicant: General Electric Company
    Inventors: Theodore Chilek, Nicholas Stancato
  • Patent number: 8964401
    Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: February 24, 2015
    Assignee: SunPower Corporation
    Inventors: Eduardo Escamilla, Marco Marroquin, William John Morris, John Trevor Morrison, Thomas Paul Parker, Stephen Wurmlinger
  • Publication number: 20150049438
    Abstract: An electronic device includes: a housing having one or more interior surfaces; an electronic circuit that is disposed within the housing, that does not directly contact any of the one or more interior surfaces of the housing, and that includes at least one electrical component that consumes electrical power; and a thermally conductive material that surrounds the electronic circuit within the housing, that directly contacts both the at least one electrical component and the one or more interior surfaces of the housing, that absorbs heat from the at least one electrical component, and that transfers heat to the housing.
    Type: Application
    Filed: August 14, 2013
    Publication date: February 19, 2015
    Applicant: The DIRECTV Group, Inc
    Inventors: Henry Derovanessian, Robin M. Mathews
  • Patent number: 8953324
    Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: February 10, 2015
    Assignee: Eldon Technology Limited
    Inventors: David Robert Burton, Trevor Hardaker, Matthew Stephens, Greg Blythe, Chris Lockwood
  • Patent number: 8953322
    Abstract: An electronic control unit for a motor of an electric fan, has a support casing including a metal body adapted to act as a heat dissipator, a shell of an electrically insulating material coupled with the metal body, and a circuit board, mounted in contact with the dissipator body. The circuit board has a conductive connection member in the form of a flexible metal blade, electrically connected to the dissipator body, to provide an earth connection for the circuit board. The blade has a portion that projects beyond the edge of the board. The insulating shell has an internal formation which, upon coupling the shell with the dissipator body, interacts with the projecting portion of the blade, deforming it so as to bring it and thereafter maintain it in contact with the dissipator body in a resiliently loaded manner.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: February 10, 2015
    Assignee: Johnson Electric S.A.
    Inventors: Marco Bussa, Franco Quagliata
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Publication number: 20150036295
    Abstract: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 5, 2015
    Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU
  • Patent number: 8947881
    Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 3, 2015
    Assignee: European Aeronautic Defence and Space Company EADS France
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Emile Colongo, Sylvain Bourdou
  • Publication number: 20150029670
    Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.
    Type: Application
    Filed: December 25, 2012
    Publication date: January 29, 2015
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Seiko Ishibashi, Rei Fujimaki
  • Publication number: 20150016063
    Abstract: Reliability of power semiconductor modules that excel in cooling performance is to be improved. To achieve the above object, each power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.
    Type: Application
    Filed: February 8, 2013
    Publication date: January 15, 2015
    Inventors: Masato Higuma, Toshifumi Sagawa, Takahiro Shimura, Hideto Yoshinari
  • Publication number: 20150009626
    Abstract: An electric equipment includes: an electric component box; a control board accommodated in the electric component box and provided thereon with a heat-generating electric component; a heat sink thermally connected with the electric component; and a sheet material provided between the electric component box and the control board, wherein the sheet material is made of an elastic material and provided with an opening section through which the heat sink projects outward, the opening section is provided with a convex section formed integrally with the sheet material and configured to be elastically deformed to engage the sheet material with the heat sink, and the electric component box is provided with a heat sink hole through which the heat sink and the convex section project outward of the electric component box. An air conditioner is provided with such electric equipment.
    Type: Application
    Filed: February 25, 2013
    Publication date: January 8, 2015
    Inventors: Tian Lan, Kenji Gajina
  • Publication number: 20150009630
    Abstract: An electronic signal transmitting device is disposed in a housing of an integrated circuit. The integrated circuit includes at least one first signal end and at least one second signal end. The electronic signal transmitting device includes at least one electromagnetic transmitting unit, coupled between the first signal end and the second signal end for transmitting an electronic signal between the first signal end and the second signal end; and an electromagnetic insulating layer covering the electromagnetic transmitting unit for protecting the integrated circuit from electromagnetic interference.
    Type: Application
    Filed: September 11, 2013
    Publication date: January 8, 2015
    Applicant: Wistron Corporation
    Inventors: Lung-Fai Tuen, Chi-Fang Weng, Wei-Cheng Lin, Hong-Kuei Lee, Wei-Shuen Chang, Wei-Shen Chu
  • Patent number: 8929079
    Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: January 6, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hirofumi Watanabe, Kazuhiko Nakano, Daisuke Yasukawa
  • Patent number: 8929078
    Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: January 6, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Volker Weeber, Heinrich Barth, Ralph Schertlen
  • Patent number: 8929069
    Abstract: An electric vehicle supply equipment may include a first cover element including a well portion to accommodate a first circuitry, wherein the first circuitry includes a chimney stack that couples to a venting hole. Also, the electric vehicle supply equipment may include a second cover element including a recess portion to accommodate a second circuitry, wherein the second circuitry includes a charcoal filter that couples to the chimney stack to absorb impurities generated by the first circuitry and the second circuitry. Further, the electric vehicle supply equipment includes a universal/serial connection port configured to couple to peripheral devices, wherein the universal/serial connection port is an optical coupled connection.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: January 6, 2015
    Assignee: Bosch Automotive Service Solutions LLC
    Inventors: Michael Muller, Charles K. Yankitis, David P. Futkos, Charles E. Phillips, III, Matthew C. Schuping, Jeff Hudnut
  • Patent number: 8913390
    Abstract: An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Michael B. Wittenberg, Miguel C. Christophy
  • Patent number: 8913209
    Abstract: The present invention provides a flat panel display device, which includes a backlight system and a display panel. The backlight system includes a light source, a light homogenization mechanism, and a back frame. The back frame carries the light source and the light homogenization mechanism, and the light homogenization mechanism guides light from the light source into the display panel. The back frame includes primary assembling pieces, secondary assembling pieces, and an adjustable bracing piece. Through the arrangement of a reinforcement structure on a joint section of the primary assembling piece, the strength of the back frame is improved. Available mounting points between the bracing piece and the primary assembling pieces or the secondary assembling pieces are of a number of at least two so that the bracing piece is selectively mounted to the back frame at different positions. The present invention also provides a stereoscopic display device and a plasma display device.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: December 16, 2014
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yi-Cheng Kuo, Yu-Chun Hsiao, Chong Huang, Jia-He Cheng, Cheng-Wen Que, Quan Li, Liu-Yang Yang
  • Publication number: 20140347819
    Abstract: An electronics module for a vehicle includes a plate element, a circuit carrier element, and a cover element. The electronics module further includes an inner region and an outer region. The plate element is configured to provide at least one conductive connection between the inner region and the outer region in order to electrically connect the circuit carrier element. The circuit carrier element is positioned on the cover element, and at least one electrical connection element is positioned between the circuit carrier element and the plate element. The at least one electrical connection element is an automatic connection element which is configured to automatically provide an electrically conductive connection between the circuit carrier element and the conductive connection of the plate element when the cover element and the plate element are fitted.
    Type: Application
    Filed: October 23, 2012
    Publication date: November 27, 2014
    Inventor: Harald Ott
  • Publication number: 20140334105
    Abstract: An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.
    Type: Application
    Filed: May 9, 2013
    Publication date: November 13, 2014
    Applicant: Ford Global Technologies, LLC
    Inventors: Lihua Chen, Chingchi Chen, Shahram Zarei
  • Patent number: 8885340
    Abstract: A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: November 11, 2014
    Assignee: Callisto France
    Inventors: Stephen Rawson, Benoit Fauroux, Remi Rayet, Thomas Bonhoure, Cedric Chambon
  • Patent number: 8879266
    Abstract: Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: November 4, 2014
    Assignee: Apple Inc.
    Inventors: Daniel W. Jarvis, Richard Hung Minh Dinh
  • Patent number: 8879268
    Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: November 4, 2014
    Assignee: Academia Sinica
    Inventors: Shih-Chang Lee, Chi-Hao Jin, Ming-Lee Chu, Chih-Hsun Lin
  • Patent number: 8879265
    Abstract: An electronic circuit storage case includes a housing made of resin and having a case portion storing an electronic circuit board and a connector portion extending in a direction perpendicular to a board attachment surface of the case portion and incorporating a connector. Interior and exterior opening holes communicate at bottoms via a communication hole. A ventilating hole continuing from the interior of the case portion to the exterior of the connector portion is provided in a solid portion of the housing. The interior opening hole and the communication hole are bent in an L shape and provided to a primary resin mold part forming the housing. The exterior opening hole is provided to a secondary resin mold part of the housing enclosing the primary resin mold part and forming the connector and case portions so as to communicate with one end of the L-shaped communication hole substantially perpendicularly.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: November 4, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naoyuki Kishikawa, Hiroyuki Uramachi
  • Patent number: 8859390
    Abstract: A structure to prevent propagation of a crack into the active region of a 3D integrated circuit, such as a crack initiated by a flaw at the periphery of a thinned substrate layer or a bonding layer, and methods of forming the same is disclosed.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: October 14, 2014
    Assignee: International Business Machines Corporation
    Inventors: Mukta G Farooq, John A Griesemer, William F Landers, Ian D Melville, Thomas M Shaw, Huilong Zhu
  • Patent number: 8854827
    Abstract: An electronic control unit is configured in such a way that the groove-shaped concave portion of the second case member includes a first concave portion, in which a groove width at a bottom surface side is narrow, and a second concave portion, in which a groove width at an aperture surface side is wide, and the first concave portion and the second concave portion are linked by an inclined step portion in such a way that a groove width at the step portion is increased in a direction from the bottom surface side to the aperture surface side, and moreover, a tip of the rail-shaped convex portion of the first case member is fitted into the first concave portion at the bottom surface side of the second case member.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: October 7, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takaaki Tanaka, Yasuhiro Takahashi, Toru Kubo, Seiji Kato, Hideki Umemoto
  • Patent number: 8847384
    Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: September 30, 2014
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sang Won Yoon, Yuanbo Guo
  • Publication number: 20140254102
    Abstract: A differential carrier electronic package has a package housing that is made of upper and lower portions that are sealed together, where the upper portion has high thermal conductive properties and the lower portion has low thermal conductive properties. The upper and lower portions are in thermal contact with an environment that is external to a differential carrier housing. The lower portion extends through an opening in the differential housing, thereby further being in thermal contact with a fluid within the differential housing. The package housing further has an electronic circuit that is attached to and in thermal conduction with the upper portion, within the package housing. The lower portion may have a connector portion formed in it for electrically connecting between external electrical devices and sources, the electronic circuit, and control devices within the differential housing.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 11, 2014
    Inventors: Perry M. Paielli, Michael Z. Creech
  • Patent number: 8830025
    Abstract: A circuit breaker can minimize a change in a structure of a case when a material forming a stud is changed. A stud includes a base portion provided in the case and a protruding portion protruding from the case. A cross-sectional area of the protruding portion is more than that of the base portion; thereby a thermal conductivity of the protruding portion increases and the thermal conductivity from the protruding portion to an external conductor connected to the stud increases. In addition, since a surface area of the protruding portion increases, an amount of heat dissipated from the protruding portion increases. In the invention, since dimensions of the base portion inserted into a stud insertion hole of the case are not changed, it is not necessary to change the dimensions of the insertion hole of the case.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: September 9, 2014
    Assignee: Fuji Electronic Fa Components & Systems Co., Ltd.
    Inventors: Masaaki Nakano, Kentaro Toyama, Makoto Osawa
  • Patent number: 8830680
    Abstract: Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: September 9, 2014
    Assignee: Public Wireless, Inc.
    Inventors: Albert Lui, Tom Sidlauskas
  • Patent number: 8830681
    Abstract: A heat dissipation apparatus for an electronic component installed in an enclosure of an electronic device includes a bracket and a heat sink. The bracket includes a supporting plate, an elastic positioning plate extending slantingly up from a side of the supporting plate away from the electronic component, and an installation plate extending from the positioning plate to be attached to the enclosure. The heat sink is fixed to the supporting plate to abut against the electronic component.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: September 9, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Lei Liu
  • Patent number: 8830672
    Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: September 9, 2014
    Assignee: International Business Machines Corporation
    Inventors: Shareef F. Alshinnawi, Gary D. Cudak, Christopher J. Hardee, Randall C. Humes, Adam Roberts, Edward S. Suffern, J. Mark Weber