Abstract: The present invention provides a modular circuit card configuration for distributing heat among a plurality of circuit cards. Each circuit card includes a housing adapted to dissipate heat in response to gas flow over the housing. In one aspect, a gas-cooled inverter includes a plurality of inverter circuit cards, and a plurality of circuit card housings, each of which encloses one of the plurality of inverter cards.

Abstract: A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.

Abstract: An electronic control apparatus includes housing members, and a circuit board. At least one of the housing members is opposed to a heat-generating region which is heated by the heat-generating electronic component. A heat radiating portion of the housing member includes a convex portion protruding from an inner wall surface at a location opposed to the heat-generating region, and a concave portion opened to an outer wall surface at a location shifted from the convex portion in a thickness direction. The convex portion is close to the heat-generating region through a clearance. The concave portion has a lateral wall formed in a tapered shape such that an opening area of the concave portion is larger than a bottom area of the concave portion. A thickness of the heat radiating portion is smaller than a thickness of a region peripheral to the heat radiating portion in the housing member.

Abstract: A heat-dissipating casing for a communication apparatus accommodates a circuit board having a power element and includes an insulating case, a lid coupled to the insulating case, and a thermally conductive metal member. The insulating case has a receiving space, a first opening, and a second opening. The first and second openings communicate with the receiving space. The thermally conductive metal member is fixed to the inside of the insulating case, seals the second opening, and dissipates heat generated by the power element. The heat-dissipating casing is effective in dissipating heat, characterized by its low weight and low production costs, and conducive to protection and dust prevention.

Abstract: A liquid crystal display module for preventing noise caused by friction between a support main and a light guide plate is provided. In the module, a hole is defined at a support main having at least one of a polygonal shape or a circular shape. A light guide plate is disposed on the support main. A protrusion which protrudes from a side surface of the light guide plate is inserted into the hole. The protrusion has at least one of said polygonal shapes and said circular shape.

Abstract: A heat-dissipation structure for a motor controller. The heat-dissipation structure includes a control box, a circuit board, a plurality of radiators, and IGBT modules. The circuit board is installed in the control box. Each radiator includes a side plate and a heat dissipation block protruding from the side plate. The side plate is attached to an inner wall surface of the control box. The IGBT modules are installed on the heat dissipation block, and the pin terminals protruding from the IGBT modules are in electric or electronic connection with the circuit board.

Abstract: The disclosure relates to an electronic device comprising an insertion housing produced from a profile element having a closed cross-section and including a first opening and a second opening, a circuit board having at least one electronic component, and a first closure element. The first closure element is disposed at the first opening, and the first opening lies in a plane at an angle to a direction of insertion of the circuit board.

Abstract: Systems and methods are provided for controlling output energy levels in wireless communications devices, such as wireless USB modems, while optimizing performance of the wireless communications devices. Controlling output energy levels includes controlling specific absorption rate (SAR) levels and heat levels generated by one or more radiating elements in a wireless communications device. Controlling output energy levels is achieved by integrating one or more radiating elements in a movable device, such a fan and/or by incorporating a moving reflector element, such as a fan, proximate to one or more radiating elements. Integrating the one or more radiating elements in, e.g., a fan, or by using a fan near the one or more radiating elements, the radiation pattern resulting from the output energy may be spatially averaged and/or dithered, reducing SAR levels and allowing for excessive output heat energy to be vented and/or one or more radiating elements to be cooled.

Abstract: An image pickup apparatus that does not give a user, who grips an apparatus body with his/her hand when he/she uses the imaging apparatus or the electronic device, a sense of discomfort due to a heat, and that can efficiently diffuse heat generated from a heat source inside the apparatus body to suppress a local temperature rise inside the apparatus body. An image pickup apparatus comprises an outer cover that forms an exterior of a device body, the device body having a grip at one end thereof and having a heat source therein. A first thermal conductive path from a first circuit unit to a first heat storage member via a first heat conductive member and a second thermal conductive path from a second circuit unit to a second heat storage member via the second heat conductive member are separated from each other.

Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.

Abstract: Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface of a support plate, each of the first electronic board and the second electronic board having an increased mounting area on which circuit components are mounted. A first electronic board (30A) and a second electronic board (40A) respectively bonded onto an upper surface and a lower surface of a support plate (20A) include outer circuit components (31, 41) and inner circuit components (33, 43) respectively mounted on outer surfaces and inner surfaces thereof. The inner circuit components (33, 43) are fitted into a window hole portion (21) of the support plate (20A) and are sealed with a filler (25).

Abstract: An arrangement for mounting at least one electrical component to a portion of an aftertreatment module, the arrangement including; at least one standoff member coupled between the electrical component and the portion of the aftertreatment module, and an enclosure substantially surrounding at least three sides of the electrical component.

Abstract: An object is to achieve a compact design by using a dead space in an inverter box effectively, to improve cooling properties of heat-generating electrical components disposed on a control circuit board of an inverter, and to increase flexibility of wiring layout. In an inverter box provided at a periphery of a housing, a heat-dissipating flat portion that is parallel to a control circuit board of an inverter is formed, and electrical components are disposed in a space between the heat-dissipating flat portion and the control circuit board. Preferably, the electrical components are installed so that the back faces thereof abut against the heat-dissipating flat portion either directly or via a heat-conducting member. More preferably, faces of the electrical components on the board side abut against the control circuit board.

Abstract: An enclosure of an electronic device includes a number of thin film solar cells formed on the exterior, and a power module connected to the thin film solar cells. The thin film solar cells convert light impinging on the enclosure into electrical energy. The power module stores and distributes the electrical energy converted by the thin film solar cells to the electronic device.

Abstract: The disclosed embodiments relate to techniques for facilitating thermal transfer in a portable electronic device. This portable electronic device may include a battery pack, which includes a battery cell and enclosure material for enclosing the battery cell. This enclosure material extends beyond the enclosure for the battery cell to facilitate thermal transfer within the portable electronic device.

Abstract: A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other.

Abstract: Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through the solder part, and has a separation part which is open or closed only in one direction along with the through hole. The upper reinforcing plate supports the upper portion of the separation part. The lower reinforcing plate supports the lower portion of the solder part, and has an elliptical through hole which partially overlaps with the through hole so that the coil passes through the lower reinforcing plate. The soldering part is formed to enable the coil to be secured to the solder part.

Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.

Abstract: A power converter including a switching element, a switching power module containing a driving circuit for driving the switching element, a smoothing capacitor module for smoothing an input to the switching power module, and a heat sink for cooling the switching power module, wherein the switching power module is mounted on the heat sink, and the smoothing capacitor module is provided on a side surface of the heat sink.

Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.

Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.

Abstract: An electronic control unit includes a casing, a circuit board, and a thermally conductive member. The circuit board is housed in and fixed to the casing. A heating element is mounted on the circuit board. The thermally conductive member is arranged between the casing and heating element for thermal conduction therebetween. The casing includes an internal surface including a contact section in intimate contact with the thermally conductive member. The contact section includes a projecting portion projecting toward the thermally conductive member. The projecting portion is located out of an area of the circuit board, wherein the heating element is located in the area. The heating element is mounted on one side of the circuit board. The thermally conductive member is fixed to another side of the circuit board, and located to face the heating element via the circuit board.

Abstract: An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.

Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.

Abstract: A mechanical arrangement for use in implementing a galvanically-isolated, low-profile micro-inverter primarily, though not exclusively, intended for use with solar panels. The micro-inverter contains a circuitry assembly having a planar transformer formed of two abutting E-shaped core halves, and a chopper device assembly with all chopper devices mounted to a common thermally-conductive plate. To provide passive cooling, heat conduction paths are established, via separate compressive thermally-conductive pads, from a top surface of a top core half of the transformer and from a bottom surface of the conductive plate to large-area portions of opposing internal surfaces of top and base portions, respectively, of an enclosure.

Abstract: Embodiments of an apparatus and system are described for a thermally radiating mobile computing device and case. An apparatus may comprise, for example, a thermally radiating case for a mobile computing device having a first portion arranged to receive the mobile computing device, a thermally conductive coupling arranged to removably couple the case to one or more internal heat generating components of the mobile computing device, and a second portion thermally coupled to the first portion and the thermally conductive coupling, the second portion comprising one or more thermally conductive materials arranged to radiate thermal energy away from the one or more heat generating components. Other embodiments are described and claimed.

Abstract: A thermally efficient electrical enclosure includes a busbar, a metallic heat sink, and an electrical insulator. The busbar is positioned entirely within the enclosure and electrically insulated from the enclosure. The metallic heat sink is attached to a wall of the enclosure. The electrical insulator physically contacts the busbar and is at least partially wrapped around at least two non-parallel surfaces of a portion of the metallic heat sink such that the metallic heat sink is electrically insulated from the busbar. The metallic heat sink is configured to transfer thermal energy or heat from the busbar to the enclosure such that the thermal energy is lost or transferred to the surrounding environment, which reduces the temperature of the busbar and the amount of copper needed for the busbar without reducing the rating of the enclosure.

Abstract: An electronic device able to stably disperse heat generated by an electronic component is provided. By providing a heat dissipating metal plate having a high heat conductivity between a TV tuner and a battery, heat generated by the TV tuner is dispersed to the battery having a large heat capacity and further dissipated to the outside of a case through a battery lid.

Abstract: A lighting apparatus includes a light source, a power supply circuit supplying power to the light source, a heat radiating section made of electrical insulating material and radiating heat from the power supply circuit to outside air, and a heat conducting section conducting heat from the power supply circuit to the heat radiating section, and the heat radiating section and the heat conducting section are thermally connected. A weight reduction of the lighting apparatus is realized and a heat conduction from the heat conducting section to the heat radiating section is improved.

Abstract: A heat-dissipating casing for a communication apparatus accommodates a circuit board having a power element and includes an insulating case, a lid coupled to the insulating case, and a thermally conductive metal member. The insulating case has a receiving space, a first opening, and a second opening. The first and second openings communicate with the receiving space. The thermally conductive metal member is fixed to the inside of the insulating case, seals the second opening, and dissipates heat generated by the power element. The heat-dissipating casing is effective in dissipating heat, characterized by its low weight and low production costs, and conducive to protection and dust prevention.

Abstract: A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.

Abstract: A mechanical and thermal assembly adapted to absorb heat from a delicate, heat-producing structure having a planar surface includes a slide plate in thermal contact to said planar surface, and being held in place by a resilient system that permits, but gently resists, movement perpendicular to said planar surface and a thermal mass, suspended over said slide plate, but in thermal contact to said slide plate, so that said delicate, heat-producing structure is not damaged due to force applied from said thermal mass through said slide plate to said structure.

Abstract: To provide a structure to dissipate heat from an internal heating component efficiently for a miniaturized, thin portable electronic apparatus. The portable electronic apparatus comprises a housing 1, a circuit board 7 accommodated in the housing and mounted with an electronic component on a surface on one side of the circuit board, a thermally conductive member 6 arranged opposite to the surface on one side of the circuit board and having thermal conductive property, and a battery accommodated in a battery chamber 8 formed in the housing. The thermally conductive member 6 forms at least a part of the battery chamber 8.

Abstract: The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.

Abstract: A LCD device includes color LEDs, a light-mixing optical guide plate and a main optical guide plate for guiding lights from the color LEDs, a LCD panel for receiving lights from the main optical guide plate, a housing for supporting the LCD panel, light-mixing optical guide plate and main optical guide plate in block, and a heat sink for dissipating the heat transferred from the LEDs. On the rear surface side of the light-mixing optical guide plate, a heat receiving member is provided having a higher heat receiving capability than the rest of the housing.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body.

Abstract: A power conversion apparatus includes a casing and an inverter unit housed in the casing. The inverter unit includes a unit case, a capacitor block removably provided at a position on an inner side of a detachable side plate of the unit case, and a fan block placed in the unit case in such a manner as to be removable from a front side. The capacitor block includes a capacitor case having a plurality of capacitor insertion holes, a plurality of electrolytic capacitors placed in the capacitor insertion holes, respectively, and a laminated bus bar connected to the electrolytic capacitors. The fan block includes a fan case and a cooling fan provided in the fan case.

Abstract: A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and a plurality of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.

Abstract: A housing comprising at least one electrical connection through a housing wall that is particularly inexpensive to produce and allows the electronic components located on the internal face and the external face of the housing to be attached in a particularly variable manner. The electrical connection is directly surrounded by housing material while being additionally sealed by means of sealing material. The inventive housing seal is provided with a profiled seal encompassing at least two sealing lips. The sealing material is additionally used for sealing the cover and/or the bottom relative to the housing wall. The arrangement is also particularly well protected against oil and other aggressive media as a combination of housing material and sealing material is used for surrounding the electrical connection.

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.

Abstract: The invention relates to a portable electronic device, e.g. a mobile phone, comprising a shell, a display, a battery, a processor and a receiver. In the portable electronic device is at least one of the components configured to heat exchange with a phase changing material which is arranged within the portable electronic device.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: This invention relates to the use of system thermal energy generated by equipment, such as an ultrasound sensing device, to transfer heat to the peripherals/sensors/probes under user control. This is accomplished by recycling the heat generated by the system and used that to keep the peripheral/sensor/probe warm.

Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.

Abstract: Cooling systems for computers are disclosed. In particular, embodiment of such cooling solutions may effectively be used in conjunction with mobile computers that have a polymer (or other type of) chassis. More specifically, embodiments of the present invention use micro vapor plates to conduct the heat generated by one or more electronic components of a mobile computer to the chassis of the mobile computer such that the heat from the electronic components is conducted into, and spread over, at least a portion of the surface of the chassis. The mobile computer can then be cooled by convection or radiation.

Abstract: An electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled.

Abstract: According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Abstract: The disclosed embodiments relate to techniques for facilitating thermal transfer in a portable electronic device. This portable electronic device may include a battery pack, which includes a battery cell and enclosure material for enclosing the battery cell. This enclosure material extends beyond the enclosure for the battery cell to facilitate thermal transfer within the portable electronic device.