Abstract: A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device and ambient air. The inner surface defines a cavity within the heat dissipation device that also enables housing of the electrical components.

Abstract: A liquid crystal display (LCD) is fixed to an upper housing half by an LCD fixing frame made of a material having a high thermal conductivity. The LCD fixing frame is attached to the upper housing half in contact with a lower surface of the LCD on the opposite side of a display panel which defines an image display plane. A substrate mounted with high heat generating parts such as a CPU is attached to the LCD fixing frame such that the high heat generating parts face the lower surface of the LCD fixing frame. A thermally conductive member is disposed between the high heat generating parts and the LCD fixing frame in contact with the high heat generating parts and LCD fixing frame.

Abstract: An exterior structure of an apparatus for covering the outside of an apparatus main body with a multiple number of panel elements uses shielding panels, heat-radiating panels and machine-interior anti-scatter panels as the multiple number of panel elements. The apparatus has a framework to which shielding panels, heat-radiating panels and machine-interior anti-scatter panels are appropriately arranged in combination to cover the apparatus in conformity with the functional configuration of the apparatus.

Abstract: A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.

Abstract: A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electronics board is mounted to one side of the frame, and a power board is mounted to an opposite side of the frame. The electronics board carries a plurality of electronic components, and the power board carries a plurality of replaceable power elements. Each power element is a fuse, relay and/or circuit breaker. A housing encloses the electronics board and the power board. The housing includes an access cover to the power board.

Abstract: A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.

Abstract: The present invention is to provide a housing structure of an electronic device, which comprises a housing including a slot on a top surface; a plate member mounted in the slot and including a plurality of first ventilation holes formed along a periphery, the first ventilation holes being in communication with inside of the housing; and a cap mounted on the plate member and spaced from the top surface of the housing by a peripheral gap formed between the cap and the plate member; wherein the first ventilation holes are concealed by the cap. By utilizing the present invention, hot air inside the housing can be quickly removed via the first ventilation holes and the gap so as to achieve the purpose of heat dissipation, and the housing's appearance can be preserved since the first ventilation holes are concealed by the cap.

Abstract: A shell body assembly structure includes a first shell body, a second shell body and a frame. A plurality of fixing portions is projectively disposed at the peripheral edge of the first shell body. A locking point is formed on each of the fixing portions. The second shell body has a plurality of holes corresponding to the locking points to lock the locking points so that the first shell body and the second shell body can be locked together. A plurality of openings corresponding to the fixing portions is disposed at the peripheral edge of the frame. A locking hook is formed on each of the opening. When the locking point is pressed down, the fixing portion can be pushed away and then locked with the locking hook, thereby separating the first shell body and the second shell body.

Abstract: An industrial light fixture of the type including a housing with a base member and a top member and containing power-related components includes a spring-bracket secured to bracket-securement point(s), extending along the capacitor to hold the capacitor in place and biasing the capacitor into heat-exchange engagement against one surface of the top member to facilitate heat transfer from the capacitor to the top member and dissipation therefrom to the atmosphere. The base member and top member are preferably formed of die-cast metal and a variety of preferred features are disclosed.

Abstract: A heat dissipation structure for a display panel efficiently dissipates heat generated during operation of the display panel, and a display module including the heat dissipation structure is also so characterized. The heat dissipation structure is capable of preventing electromagnetic waves generated during the operation of the display panel operation from adversely influencing a driving circuit. The heat dissipation structure comprises: a display panel; a heat dissipating sheet contacting a rear surface of the display panel; and a chassis base disposed on a rear side of the heat dissipating sheet and connected to the display panel via a double-sided adhesive element. The heat dissipating sheet includes two heat dissipating layers and a metal sheet layer interposed between the two heat dissipating layers.

Abstract: A system for mounting a hard disk drive inside an electronic apparatus in such a way that the hard disk drive is isolated from vibration and noise and heat generated by the hard disk dive is radiated to a cover of the electronic apparatus to prevent overheating. A foam heat transmission sheet is placed between the hard disk drive cover and an outer casing that is mounted to the electronic apparatus and far-infrared ray transmitting and receiving sheets are attached to the outside of the outer casing and to the inside of the cover of the electronic apparatus to transmit heat from the hard disk drive to the exterior of the apparatus.

Abstract: An optical disk device of the present invention has a main PC board carrying a semiconductor element and attached at the rear of a drawer to efficiently dissipate a heat generated from the semiconductor element. The drawer is formed of a material having good thermal conductivity. A thermal conductive member having good thermal conductivity is interposed between the IC desired to be dissipate heat and the drawer.

Abstract: A power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a substantially closed receptacle and made of a material having a thermal conductivity in a range of from 2.0 to 10.0 W/mK. The printed circuit board is accommodated within the receptacle of the insulating housing. The electronic component is mounted on the printed circuit board.

Abstract: A packaged electronic component includes a body and a thermally conductive clip. The body is made of a molding material and accommodates at least one magnetic element therein. The thermally conductive clip securely mounts on the circumference of body, and covers a top surface and a side surface of the body. The packaged electronic component is a surface mounted device (SMD).

Abstract: An inverter assembly including a storage compartment for multiple cables adapted to be releasably connected to the inverter. A body of the inverter assembly includes interior and exterior fins for the dissipation of heat energy.

Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

Abstract: An electronic device includes a housing, a spacing structure, a printed circuit board and a fan. The housing has first and second openings. The spacing structure is arranged within the housing for partitioning a space within the housing into an air channel and a receptacle. The air channel is in communication with the first and second openings. The printed circuit board is disposed within the receptacle. The fan is disposed within the air channel for inhaling ambient air via the first opening and exhausting the air via the second opening so as to dissipate heat outside the electronic device.

Abstract: A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.

Abstract: A computer casing has a frame, two fixing panels arranged inside the frame, and two side panels assembled on opposing sides of the frame. The frame, the fixing panels and the side panels are all made of aluminum. The frame includes a top panel, a bottom panel, a front panel and a rear panel fixed together by means of soldering. The computer casing is secured in entirety and has large dissipation area. Additionally, the computer casing is easily classified and recycled in the case of expiration.

Abstract: Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or more heat-dissipating plates separated from the case by a predetermined distance and facing the case; wherein the heat-generating components include a central processing unit and a power supply, and the central processing unit and the power supply are each thermally connected to the heat-dissipating plates so that heat generated by the central processing unit and the power supply can be dissipated to the outside of the case via the heat-dissipating plates. Accordingly, the heat-generating components installed in the case can be noiselessly and efficiently cooled without using cooling fans.

Abstract: A power conversion device is downsized by integrally constructing a power conversion module and a control circuit board. The power conversion device includes a power conversion module 11, a control circuit board 21, and a heat sink 12. A case is divided into a module case 13 and a control circuit case 23. In a power conversion module section 10, the power conversion module 11 is thermally coupled to the heat sink 12 and contained in the module case 13 with a radiator fin 12a exposed to outside, one side of the case 13 being open. In a control circuit section 20, the control circuit board 21 is contained in the control circuit case 23, one side of the case 23 being open. Opening sides of the module section 10 and the circuit section 20 are opposite each other, and between which a heat insulating partition wall 30 is inserted.

Abstract: A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a plurality of microchannels attached to the interior surface of the housing, and an inlet port and an outlet port extending through the housing in fluid communication with the microchannels. Alternatively, the microchannels may also extend into the interior surface of the housing. The cap is preferably thermally attached to a heat producing device by a thermal interface layer. Thermally managed coolant enters the inlet port passing through the microchannels conducting heat transferred to the cap by the heat producing device and exits through the outlet port.

Abstract: A device for dissipating a heat from addressing integrated circuits (addressing ICs) of a plasma display panel that uses a back plate which has a greater surface area, to dissipate the heat from the addressing integrated circuits directly. For embodiment of the device thereof, it provides a heat-conducting sheet attached on the addressing ICs to conduct the heat from the addressing ICs to the back plate rapidly, therefore increase the efficiency of the dissipation without add the volume of the plasma display panel.

Abstract: A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components (50) disposed on them. The housing has a cap (14) and at least one framelike housing part (12) forming the side walls thereof. This housing part (12) includes a main frame (120) and at least one locking frame (130). The main frame (120) has guides (122, 128) for receiving connection elements (30, 32). The locking frame (130) is disposed relative to the main frame (120) such that it rests at least in part on the connection tabs (310, 320) of the connection elements (30, 32), in order to prevent movemnt of the connection elements toward the substrate (40).

Abstract: A heat dissipating clamp for an electrical device with a chip group has a station bracket and a holding bracket. The station bracket and the holding bracket are combined together as clamp and both are made of metal with a high dissipating efficiency. The station bracket has an inner surface and a recess. The recess is formed in the inner surface of the station bracket and has multiple holes. The holes separately formed through the station bracket. The electrical device is clamped between the station bracket and the holding bracket. The chip group abuts against the station bracket and the holding bracket. Accordingly, the heat generated by the chip group will be transmitted to the heat dissipating clamp and be dissipated efficiently, so that the chip group can keep at certain working temperature.

Abstract: An electronic device with uniform heat-dissipation is disclosed. The electronic device comprises a housing, a circuit board, and a metal shielding. The housing has concavities at inner sides thereof, and the circuit board is disposed within the housing. The metal shielding is disposed between the housing and the circuit board and has protrusions at outer sides thereof to match up the concavities of the housing. Thereby, the metal shielding substantially stays close to the housing for allowing the electronic device to dissipate heat uniformly.

Abstract: A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. The heat sink is made with a thermally conductive and electrically insulating polymer compound, such as liquid crystalline polymer or polyphenylene sulfide, which is injection molded to surface of the PCB. The heat sink can be formed on a front side and backside of the PCB and may have a plurality of posts for increasing the heat dissipating surface area of the heat sink. By disposing the heat sink over substantially the entire surface of the PCB, the heat sink is able to remove more heat and allow the power supply module to provide more output load current given the same physical size and ambient conditions.

Abstract: A case for a portable terminal using a color liquid crystal uses a Peltier device to vary the color of the case by means of electrical heating and cooling the interior of the case. The case includes a temperature control apparatus for emitting electrical heat, when an electrical current is applied thereto, and simultaneously cooling the opposite side; a liquid crystal application agent positioned on the upper portion of the temperature control apparatus and adapted to vary the color by means of the electrical heat; and a cooling unit positioned opposite to an upper portion of the temperature control apparatus to cool heat-generating devices inside the terminal.

Abstract: A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.

Abstract: A power choke or transformer has an iron core, windings, and a cooling apparatus having a heat exchanger with a heat absorber and a cooling fluid duct operationally connected to the heat absorber, wherein the iron core is operationally connected to the heat absorber to remove heat emitted by the iron core.

Abstract: A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: The present invention relates to a control unit (1), for automotive applications in particular, with: a frame (8) that includes a recess (9) across which electrical conductive tracks (10) extend to supply electrical power; a base plate (11) that is inserted in the frame (8); a circuit carrier (12) on which electronic components are mounted and which is installed on the base plate (11); an electrical connection (14) for connecting the circuit carrier (12) with the conductive tracks (10); and a cover (4) for hermetically sealing the control unit (1), the cover including a shaped section that is insertable in the associated recess (9) in the frame (8); whereby a sealing gel (16) is provided in recess (9) with a viscosity such that the sealing gel (16) can flow around the electrical conductive tracks (10) that extend across the recess (9). The present invention further relates to a manufacturing method for manufacturing a control unit (1) of this type.

Abstract: An electronic assembly includes a semiconductor device mounted on a printed circuit board, a leaf spring and a cooling plate. A plurality of fasteners pass through co-axial apertures of the leaf spring, the printed circuit board and the cooling plate, such that a contact surface of the leaf spring imparts a force on the semiconductor device to retain the semiconductor device in a thermally conductive position with respect to the cooling plate. A positive cooling effect is achieved regardless of mounting conditions including orientation of the electronic assembly, and the position of the semiconductor device on the cooling plate.

Abstract: A plasma display. The plasma display comprises a first circuit board and a second circuit board disposed in a space formed by a base plate and a back cover thereof. The first circuit board is mounted on the base plate and bears a first electronic element, the second circuit board is mounted on the first circuit board and bears a second electronic element requiring heat dissipation different from the first electronic element. A thermal conductive device is disposed between the second electronic element and the back cover to dissipate heat from the second electronic element to the back cover. Thereby, the electronic elements requiring different heat dissipation are positioned in divided areas to enhance heat dissipation efficiency.

Abstract: A heat sink assembly for cooling a DVR enabled set-top box. A heat sink is coupled to a chassis of the set-top box as well as to a storage device within the chassis. Heat is transferred from the storage device to the exterior of the chassis to be vented to the exterior environment surrounding the set-top box.

Abstract: A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.

Abstract: A liquid crystal display module for preventing noise caused by friction between a support main and a light guide plate is provided. In the module, a hole is defined at a support main having at least one of a polygonal shape or a circular shape. A light guide plate is disposed on the support main. A protrusion which protrudes from a side surface of the light guide plate is inserted into the hole. The protrusion has at least one of said polygonal shapes and said circular shape.

Abstract: Disclosed is a display device, elongate mount, and display module for displaying alphanumeric information to passengers of a mass transit vehicle. The display modules are mounted along a single edge to a elongate mount. The elongate mount includes at least one end cap which is made of a vibration dampening material. The louver of the display device includes a substantially continuous pressure member in order to place substantially continuous elongate contact to an area of an LED board that houses at least one heating element. The at least one heating element is covered by a thermally conductive foam that transmits heat from the elements to a heat sink of the display module.

Abstract: The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The object of the invention is to facilitate maintenance, downsize the cabinet, and prevent occurrence of noise. It includes: a cabinet body containing a heat source; a cover member attached to an aperture of the cabinet and having a guide portion guiding, to an exterior of the cabinet, a heat transfer member for transferring therethrough heat from the heat source by use of a hydraulic fluid; and a heat radiation part being a thermal conductor and in contact with the heat transfer member on a face and covering the heat transfer member from the exterior of the cabinet and having a heat radiation member on a face opposite to the face in contact with the heat transfer member.

Abstract: A control device configured for mounting within an enclosure having a thermally conductive surface is disclosed. The control device includes a housing, a heat-generating device disposed within the housing, and a thermal conductor. The thermal conductor has a first portion in thermal communication with the heat-generating device and a second portion configured to be in thermal communication with the thermally conductive surface of the enclosure.

Abstract: An electronic device including: a circuit board with an electronic circuit; a heat conductor to conduct heat generated in the electronic circuit; an electronic element to be used under an ambient temperature lower than a temperature of the heat conductor heated by heat generated in the electronic circuit; and a support to support the circuit board, the heat conductor, and the electronic element, wherein the support is positioned between the heat conductor and the electronic element so that a first plane of projection of the heat conductor on the support and a second plane of projection of the heat conductor on the support do not overlap with each other.

Abstract: A heat dissipating structure for an electronic device includes a heat source and a heat dissipating member. The heat dissipating member has an inner wall, an outer wall, and a plurality of partition walls. The inner wall receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the outer wall, and together with the inner wall and outer wall define a plurality of through-holes which are approximately the same shape and are aligned at roughly regular intervals along the inner wall or the outer wall. The through-holes are arranged along the vertical direction that allows most effective utilization of gravitational influence, and are open to the outside at the upper and lower ends thereof.

Abstract: A switching device for controlling a large amount of current includes a circuit board carrying electronic components thereon, a power-switching element electrically connected to the circuit board, and a housing disposed underneath the circuit board and containing the power-switching element therein. The housing made of a heat-conductive material includes a heat-sink block having a sloped surface on which the power-switching element is mounted. Connecting leads extending from the power-switching element are positioned at an upper portion of the sloped surface which is close to the circuit board. In this manner, the length of connecting leads is shortened and heat and noises generated therein are suppressed.

Abstract: A transmitting and amplifying unit for a wireless communication device. The transmitting and amplifying unit includes a C-shaped frame having an upper plate having a first cutout, a lower plate having a second cutout aligned with the first cutout, and a side plate connecting the upper plate and the lower plate; a main amplifier unit fixed to the lower plate and having a concentrated heating portion; and a subamplifier unit fixed to the upper plate. The transmitting and amplifying unit further includes a radiating fin unit mounted on the concentrated heating portion of the main amplifier unit and extending upward through the first cutout of the lower plate and the second cutout of the upper plate. The radiating fin unit has an upper end fixed to the subamplifier unit.

Abstract: A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 ?g/cm2 per unit surface area. The amount of volatile corrosive gas generated from the sheet is not more than 10 ?g/cm2 per unit surface area. The sheet has a thermal conductivity of 0.5 to 20 W/m·K. This thermally conductive sheet generates fewer volatile substances and can be used even in a closed place.

Abstract: According to a lead wire sealing device of an example of the present invention, a bush 116 is inserted in a housing through hole 113 formed in a bottom plate member 1110 and a lead wire 1343 is inserted in the inside of the bush 116. A first adhesive 117 is loaded in the inside of the bush 116, the first space S1, the second space S2 and the third space S3. A second adhesive 118 covers the first adhesive 117 at the edge where a flange portion 1162 of the bush 116 is provided. The first adhesive 117 having a lower viscosity is easily inserted in the first space S1 by a capillary action to be loaded without a space. As a result, it is possible to certainly seal the first space S1.

Abstract: An electronic apparatus with enhanced natural convection structure. The electronic apparatus with natural convection structure includes a casing structure, a first hole passing through the casing structure from the top surface to the bottom surface of the casing structure, a first printed circuit board disposed adjacent to one side of the first hole in the casing structure and substantially parallel to the first hole, and a supporting device disposed on the bottom surface of the casing structure. Via the specific height of the supporting device, the airflow under and near the bottom surface of the casing can flow through the hole to achieve the purpose of dissipating the heat of the electronic apparatus.

Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).