Abstract: A transport vehicle control system restricts a travel speed of an article transport vehicle to less than or equal to a restrictive speed prescribed in advance, in a case where a temperature sensor detects that the temperature of a regenerative resistor is greater than or equal to a first temperature set to a higher temperature than a steady temperature range which is a temperature range of a steady state prescribed in advance, and disconnects the connection between a power supply unit and a travel motor with a switch, in a case where the temperature sensor detects that the temperature of the regenerative resistor is greater than or equal to a second temperature set to a higher temperature than the first temperature.

Abstract: A display module and display device that may suppress a greenish defect and reduce a bezel area while improving a heat-dissipation performance and a shock absorption function include an integral cushion plate including at least one protrusion protruding from and extending along an edge portion of a body with the cushion plate placed on a lower surface of a display panel, and the protrusion brought into contact with a cover member. Further, the protrusion of the cushion plate is bent to have an inclined part so that the protrusion does not contact the side surface of the display panel and contacts the cover member.

Abstract: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.

Abstract: The present disclosure provide an electrical connector module and a heat dissipation housing. The electrical connector module comprises a heat dissipation housing and a plurality of electrical connectors. The heat dissipation housing comprises a metal housing, a positioning component, a plurality of heat dissipating members, and a plurality of buckling members. The metal housing comprises a housing body, which comprises a disposing surface, an accommodating space, and a plurality of first openings. The plurality of first openings is disposed on the disposing surface and is in communicating with the accommodating space. The positioning component comprises a component body and a plurality of positioning members. The component body is disposed on the disposing surface and comprises a plurality of second openings corresponding to the plurality of first openings respectively. Two opposite side edges of each of the second openings are respectively connected with at least one of the positioning members.

Abstract: A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.

Abstract: A packaged electronic device includes a package structure with opposite first and second sides spaced apart from one another along a first direction, and opposite third and fourth sides spaced apart from one another along a second direction, as well as first and second leads. The first lead includes a first portion that extends outward from the third side of the package structure and extends downward toward a plane of the first side and away from a plane of the second side. The second lead includes a first portion that extends outward from the third side of the package structure, and the second lead extends upward toward the plane of the second side and away from the plane of the first side to allow connection to another circuit or component, such as a second packaged electronic device, a passive circuit component, a printed circuit board, etc.

Abstract: A connector assembly includes a receptacle connector, a shielding cage, a heat sink and a clip. The shielding cage covers the receptacle connector. The clip assembles the heat sink to the shielding cage, is integrally formed by a metal sheet and includes a fixed plate, a movable plate and a plate spring. The fixed plate is provided to the shielding cage, and the movable plate is provided to a side surface of the heat sink. Two ends of the plate spring are respectively connected to the fixed plate and the movable plate, and the movable plate is capable of moving relative to the fixed plate by means of the plate spring.

Abstract: In a described example, an electrical apparatus includes: a metal layer formed over a non-device side of a semiconductor device die, the semiconductor device die having devices formed on a device side of the semiconductor device die opposite the non-device side; a first side of the metal layer bonded to a die mount pad on a package substrate; a second side of the metal layer formed over a roughened surface on the non-device side of the semiconductor device die, the roughened surface having an average surface roughness (Ra) between 40 nm and 500 nm; bond pads on the semiconductor device die electrically coupled to conductive leads on the package substrate; and mold compound covering at least a portion of the semiconductor device die and at least a portion of the conductive leads.

Abstract: Provided is a circuit board structure including a first circuit board having bus bars and a second circuit board arranged spaced apart from the first circuit board, multiple FET being arranged on the bus bars, and terminals of the multiple FETs being connected to the bus bars. The circuit board structure includes a conducting wire group sheet that covers a portion of the bus bar and is provided with multiple conducting wires that allow electricity to flow between gate terminals of the FETs and the second circuit board. The semiconductor element FETs, which are arranged side by side, are provided such that the gates terminals are arranged in the same direction with respect to the direction in which the semiconductor element FETs are arranged side by side.

Abstract: A cooling apparatus for a pluggable module comprises a pluggable module cage to house the pluggable module and a heat pipe coupled with a hot interface at one end and a cold interface at another end. The cooling apparatus further comprises an attachment mechanism for attaching the hot interface and the heat pipe to the pluggable module. The attachment mechanism permits mobility required to insert and secure the pluggable module in place inside the pluggable module cage to allow a good thermal coupling between the hot interface and the pluggable module.

Abstract: An electrical connector assembly includes a housing having an upper housing half removably assembled to a lower housing half via a plurality of fasteners. A circuit board is at least partially disposed in a housing cavity formed by the upper and lower housing halves. The circuit board includes a plurality of conductive front and rear pads electrically connected to each other. Flat cables terminate at the conductive rear pads disposed on upper and lower major surfaces of the circuit board. A plurality of alternating ridges and channels is disposed on a top side of the upper housing half, extending along a length of the housing. Bottom surfaces of the channels along a length of the channels are at a same height or higher than uppermost surfaces of the fasteners in the plurality of fasteners. The channels are configured to transfer heat generated by the connector assembly.

Abstract: A power unit of an electric vehicle may be connected to a main battery, an AC inlet, and a DC inlet. The power unit may include a battery connector to which a battery power cable is connected, an AC inlet connector to which an AC inlet power cable is connected, and a DC inlet connector to which a DC inlet power cable is connected. The battery connector may be closer to the main battery than a center of the power unit is to the main battery. The AC inlet connector may be closer to the AC inlet than the center of the power unit is to the AC inlet. The DC inlet connector may be closer to the DC inlet than the center of the power unit is to the DC inlet.

Abstract: An electronic module (1) includes a first electronic submodule (2) and at least one further electronic submodule (3, 4). The first electronic submodule (2) and the at least one further electronic submodule (3, 4) are electrically conductively connected to each other with an electrical conductor (5, 6), which is reversibly deformable, at least in sections. The first electronic submodule (2), the at least one further electronic submodule (3, 4), and the electrical conductor (5, 6) are encased in a fluid-tight manner with a casing (15), which is reversibly deformable, at least in sections. An actuator device includes at least one mechanical module and the electronic module (1). A method for manufacturing such an actuator device is also provided.

Abstract: A semiconductor device includes circuit substrates 3 and 9 including circuit pattern layers 3c/9b, a semiconductor element 5 mounted to the circuit pattern layer 3c, a connecting pin 7 connecting the semiconductor element 5 to the circuit pattern layer 9b, a pin-shaped terminal 17 connected to the circuit pattern layer 9b, a sealing member 2 sealing the circuit substrates 3 and 9, the semiconductor element 5, and the connecting pin 7, and an external terminal 27 including a flat plate portion 27s and an extending portion 27t bent from the flat plate portion 27s and extends away from the circuit substrate 9, in which the flat plate portion 27s is connected to the pin-shaped terminal 17 and arranged in parallel with the circuit pattern layer 9b, and the extending portion 27t is provided in a range of a width in a transverse direction of the sealing member 2.

Abstract: Provided is an electrical junction box that enables suppression of entry of water even when the electrical junction box is installed in a vehicle in different orientations. Disclosed is an electrical junction box including a first case having an opening, a second case configured to cover the opening, and an accommodated component that includes a circuit assembly and is housed between the first case and the second case. The second case includes a peripheral wall formed by connecting a plurality of flat faces in a polygonal shape to cover an outer periphery of the first case adjacent to the opening. The first case includes water guard walls extending along at least two of the flat faces to cover a region not covered with the peripheral wall.

Abstract: The present disclosure provides an electrical connector comprising an electrical connector housing, a partition part, a partition heat sink, a heat pipe, and a cooling module. The electrical connector housing comprised an upper surface, a lower surface, and two opposite sidewalls. The partition part is disposed in the electrical connector housing. The partition heat sink is disposed on the partition part and is disposed in the electrical connector housing. One end of the heat pipe is connected to the partition part. The cooling module is disposed at the outside the electrical connector housing and is connected to the other end of the heat pipe. The cooling efficiency is enhanced by conducting the heat of the partition heat sink to the outside of the electrical connector through a heat pipe to avoid heat accumulating in the electrical connector housing.

Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.

Abstract: The invention relates to a power module. The power module has at least one power semiconductor and at least one further electronic component. The power module has a housing which is formed by a shaped body and is formed by an encapsulation compound. According to the invention, the housing is formed in at least two levels. At least one power semiconductor component is arranged in a first level and the at least one further electronic component is arranged in the second level. At least one electrically conductive layer, which forms an electrically conductive connecting structure, is formed on a surface of an inner boundary of the power module which extends between the levels. The connecting structure is applied directly to the surface. The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: An electronic apparatus includes a top plate, a bottom plate provided under the top plate, a circuit board provided between the top plate and the bottom plate, an electronic component disposed on the circuit board, and an intermediate plate provided between the top plate and the circuit board. The intermediate plate is configured to provide a clearance between the top plate and intermediate plate, or between the circuit board and the intermediate plate. The intermediate plate is further configured to allow an air flow from a first end portion to a second end portion of the top plate.

Abstract: A circuit structure includes a circuit board having a connection opening. An electronic component is mounted on a top surface side of the circuit board, and a plurality of bus bars are disposed on a bottom surface side thereof, the electronic component includes a plurality of connection terminals, and a connection terminal of the plurality of connection terminals is connected to a bus bar on the bottom surface side of the circuit board via the connection opening. The circuit structure includes a heat dissipation member provided on a side of the plurality of bus bars opposite to a surface on which the electronic component is connected, an insulating heat-transfer material having insulating properties and heat transferring properties, and a restricting member is provided between the plurality of bus bars and the heat dissipation member, and restricts movement of the insulating heat-transfer material caused by an increase in temperature.

Abstract: Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

Abstract: Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.

Abstract: The present invention relates to a powder composed of spherical noble-metal particles having a particle size distribution with a d10 value of ?10.0 ?m and a d90 value of ?80.0 ?m.

Abstract: An optical transceiver module is disclosed having a housing that includes at least a first housing portion and a second housing portion, each of the first and second housing portions including a base portion having at least one sidewall extending therefrom that defines a compartment. The first housing portion is configured to couple to the second housing portion to form a cavity therebetween. A transmitter optical subassembly (TOSA) arrangement coupled to the base portion of the first housing portion and is electrically coupled to a first flexible printed circuit (FPC). A receiver optical subassembly (ROSA) arrangement is coupled to the base portion of the second housing portion and is electrically coupled to a second FPC. A first shield coupled to at least one of the first housing portion or the second housing portion to reduce electromagnetic interference between the TOSA arrangement and the ROSA arrangement.

Abstract: A rotatable antenna apparatus has a fixed unit for attachment of the apparatus to an external structure, and a rotatable unit mounted on the fixed unit for rotation relative to the fixed unit. The rotatable unit comprises both an antenna assembly and processing circuitry coupled to the antenna assembly for performing signal processing operations. The apparatus further includes a thermally conductive shaft connected to the rotatable unit and located for rotation within the fixed unit, and a thermally conductive coupling structure to conduct heat from one or more heat generating components of the processing circuitry into the thermally conductive shaft. A heat sink within the fixed unit is thermally coupled to the thermally conductive shaft to draw heat away from the thermally conductive shaft. This provides an efficient mechanism for removing heat from the rotatable unit, whilst still allowing the rotatable unit to be sealed against external environmental conditions.

Abstract: The present invention provides a flexible device which is free of twist and distortion at a bent part of a flexible module, and has excellent display quality and a high level of reliability. The flexible device (1) includes a first housing (31), a second housing (41), a third housing (61), and a plurality of turning bodies (80) each of which is fixed to the first housing (31) or the second housing (41) and rolls on the third housing (61) so that a turning axis (80a) of the each of the plurality of turning bodies (80) horizontally moves.

Abstract: An information handling system may include a removable non-volatile memory module, including a non-volatile memory drive and a guide rail, and a module cage configured to receive the removable module. The module cage may include a thermal pad and a guide rail mating feature into which the guide rail of the removable module is inserted during installation to maneuver the removable module into an operating position. The guide rail mating feature may prevent the removable module from contacting the thermal pad until the removable module reaches, or nears, its operating position, at which point a wedge feature of the guide rail mating feature may press the removable module downward to contact the thermal pad. The thermal pad may include an abrasion resistance overlay. The module cage may include a metal plate below the thermal pad coupled to a heat pipe that directs heat toward a fan housing.

Abstract: A display is provided. The display includes a metal back plate, a plastic frame, a backlight optical module and a liquid-crystal module. The metal back plate includes a plurality of metal wedging portions and a first side. The plastic frame is combined with the metal back plate by injection molding. The plastic frame includes a plurality of plastic wedging portions. The plastic wedging portions wedge the metal wedging portions. The plastic frame defines a recess on the first side of the metal back plate. The backlight optical module is disposed in the recess. The liquid-crystal module covers the backlight optical module and is connected to the plastic frame.

Abstract: A switching device has a substrate, a power semiconductor component arranged thereon, a connection device and a pressure device. The substrate has conductor tracks electrically insulated from each another. A power semiconductor component is arranged on one of the conductor tracks. The connection device is embodied as a film composite having an electrically conductive film and an electrically insulating film and forming a first and a second main surface. The switching device is connected in a circuit-conforming manner by the connection device, and a contact area of the first main surface of the power semiconductor component is connected to a first contact area of an assigned conductor track of the substrate in a force-locking and electrically conductive manner.

Abstract: The invention concerns a function component upper part (500) for placing on a function component lower part (401) of a function component (400), having a first interface for electrically connecting the function component lower part (401) of the function component (400), and a second interface for electrically 409 connecting a housing upper part (403) of the function component (400).

Abstract: A switching device has a substrate, a connection device and a pressure device, wherein the substrate has electrically insulated conductor tracks, and a power semiconductor component is on one of the conductor tracks with a first main surface and is conductively connected thereto. The connection device is a film composite with conductive film and an insulating film and forms a first and a second main surface. The switching device is connected by the connection device and a contact area of the second main surface of the power semiconductor component is connected to a first contact area of the first main surface of the connection device in a force-locking and electrically conductive manner with a pressure body and a pressure element projecting toward the power semiconductor component.

Abstract: A power module capable of increasing structural stability and reliability at high temperatures includes: an upper substrate having a metal layer; a lower substrate spaced apart from the upper substrate and having a metal layer facing the metal layer of the upper substrate; a semiconductor element configured to be disposed between the upper substrate and the lower substrate; and at least one leg portion formed on at least one of the metal layer of the upper substrate and the metal layer of the lower substrate to make the upper substrate and the lower substrate be spaced apart from each other at a predetermined interval, in which the leg portion may be electrically connect the semiconductor element to the metal layer of the upper substrate or the metal layer of the lower substrate.

Abstract: An electrical connector includes: a contact module including an insulative housing and an upper and lower rows of contacts, the insulative housing having a rear base and a front tongue, the base having a pair of side latching walls; and a shielding shell enclosing the contact module, the shielding shell having a main part and a pair of side arms extending rearwardly from the main part, each side arm having an inserting portion and a soldering leg; wherein each inserting piece engages a corresponding side latching wall to prevent an associated soldering leg from moving outwardly.

Abstract: An electronic device comprises a metal casing, a circuit board and a heating assembly. The metal casing has a storage space. The circuit board is located in the storage space. The heating assembly comprises a first heating part and a second heating part. The first heating part is in thermal contact with the circuit board, and the second heating part is in thermal contact with the metal casing.

Abstract: A power conversion device possesses a capacitor module, a power module, a circuit board on which a control circuit is mounted and which has a ground layer formed in a control circuit mounting region, a noise shielding plate, and a metal housing. The circuit board is above the capacitor module, and the noise shielding plate faces the control circuit mounting region between the circuit board and the capacitor module, in which the noise shielding plate has a plurality of connection parts to be electrically connected to the metal housing. A first end part on the power module side of the noise shielding plate is on the power module side more than a second end part on the power module side of the ground layer, and the connection part which is the closest to the first end part is provided on the power module side more than the second end part.

Abstract: An electrical power distribution system for a mobile platform, and a method for making such, includes a forming a substrate having a first panel connected to a second panel. The first panel resides in a first plane that differs from a second plan in which the second panel resides. One or more bus bars are arranged on the first panel, with one or more power electronic devices arranged on the first panel and connected to the one or more bus bars. One or more connectors are arranged on the second panel and electrically connected to the one or more bus bars. Finally, one or more thermal relief devices are arranged in contact with the substrate.

Abstract: A power conversion apparatus 2 has a configuration in which a plate-like bus-bar 80, 80? is disposed vertically so that a width direction thereof is set in a vertical direction, electrically connected to positive electric potential of a battery and fixed to a resin case 50 to include a flat plate-like bus-bar body 81, 82, to which positive electric potential of the battery is applied, and a voltage measuring terminal 82 to 85 branched from the bus-bar body 81, 82. The voltage measuring terminal 82 to 85 includes a projecting portion 83 projecting from the bus-bar body 81, 82, an upright portion 84 extending from the projecting portion 83 upward toward a circuit board 100, and a measuring terminal portion 85 that is an upper part of the upright portion 84 and electrically connected to the circuit board 100.

Abstract: A microelectronic assembly includes a plurality of stacked microelectronic packages, each comprising a dielectric element having a major surface, an interconnect region adjacent an interconnect edge surface which extends away from the major surface, and plurality of package contacts at the interconnect region. A microelectronic element has a front surface with chip contacts thereon coupled to the package contacts, the front surface overlying and parallel to the major surface. The microelectronic packages are stacked with planes defined by the dielectric elements substantially parallel to one another, and the package contacts electrically coupled with panel contacts at a mounting surface of a circuit panel via an electrically conductive material, the planes defined by the dielectric elements being oriented at a substantial angle to the mounting surface.

Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

Abstract: A mobile banking system that uses a cryptographic expansion device attached to a communication component of a mobile device and a secure gateway device to enable end-to-end secure communications between the mobile device and a payment processing network is disclosed. The cryptographic expansion device enables the mobile device to perform cryptographic operations on communications sent to and from the mobile device. The secure gateway device prevents unauthorized accesses to the payment processing network.

Abstract: A control device for a vehicle heater includes a circuit assembly unit (12) with a plurality of external contacts (24), an external receptacle (30) for receiving an external plug (42) for establishing an electrical contact with the external contacts (24) for connecting the control device (10) to a vehicle wiring system, as well as a circuit assembly unit housing (18) surrounding the circuit assembly unit (12) with an external receptacle tunnel (52) surrounding at least partially the external receptacle (30).

Abstract: A cooling device includes: a heat dissipating part disposed at an end of a heat transfer member; a heat-receiving plate disposed at the other end of the heat transfer member, provided opposite to a noise-generating part mounted on a circuit board, and thermally coupled to the noise-generating part; and a shielding unit disposed at the other end of the heat transfer member, the shielding unit covering the noise-generating part.

Abstract: A pluggable module housing assembly comprises a base at least partially surrounding a socket having an entrance sized and dimensioned to receive a pluggable module. At least one guide extends adjacent to the socket. A heat sink assembly includes a riding heat sink having a module-contacting surface facing the socket, and an actuating assembly coupled to the base and to the riding heat sink. The actuating assembly is configured to move the riding heat sink relative to the base between a deployed position a first distance from the at least one guide, and a stowed position a second distance from the at least one guide, the second distance being greater than the first distance.

Abstract: A power supply system has a QFN leadframe with leads and a pad. The pad surface facing a circuit board has a portion recessed with a depth and an outline suitable for attaching side-by-side the sync and the control FET semiconductor chips. The input terminal of the control FET and the grounded output terminal of the sync FET are coplanar with the un-recessed portion of the pad (switch node terminal) so that all terminals can be directly attached to contacts of a circuit board. A driver-and-control chip is vertically stacked to the opposite pad surface and encapsulated in a packaging compound.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

Abstract: A holder for a surface contact card includes a main body, a pivotal shaft, and a cover. The main body has a latching block and defines a receiving groove configured for receiving a surface contact card. The cover includes a hinge portion and a latching tab. The pivotal shaft extends through the hinge portion and rotatably connects to the main body. The cover is pivotally and slidably engaged with the main body for covering the receiving groove, and the latching tab is latched with the block.

Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.

Abstract: Integrated circuit packages with heat dissipation function are disclosed. A disclosed integrated circuit package includes a first die attached on a top surface of a second die. The second die may be coupled to a thermally conductive block. The thermally conductive block may be embedded in a cavity formed in a package substrate. A heat spreading lid may be disposed over the package substrate. The integrated circuit package may be disposed on a printed circuit substrate via solder bumps or balls. The printed circuit substrate may have heat dissipation paths to dissipate heat from the integrated circuit package.