Abstract: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.

Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

Abstract: A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.

Abstract: The exemplary embodiments disclosed herein provide a heat exchanger assembly for cooling power module bricks, having a plurality of heat exchanger layers where a top layer is in conductive thermal communication with the power module brick. A series of metallic plates are preferably positioned within each heat exchanger layer and are preferably aligned with the power module brick. A circulating fan may be positioned to force circulating gas across the power module brick and through the heat exchanger. An external air fan may be positioned to force external air through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

Abstract: An electronic mobile device includes a base supporting an input panel. A cover pivotally connects to the base and is pivotable from a closed position to an open position and vice versa relative to the base. In the closed position the cover covers the input panel, and in the open position the cover is disposed away from the base. A base magnet is supported within the base and has a first magnetic axis. A cover magnet is supported within the cover so as to move with the cover relative to the base. The cover magnet has a second magnetic axis that tends to align with the first magnetic axis to thereby bias the cover towards at least one of the closed position and the open position.

Abstract: An electronic control unit is configured in such a way that the groove-shaped concave portion of the second case member includes a first concave portion, in which a groove width at a bottom surface side is narrow, and a second concave portion, in which a groove width at an aperture surface side is wide, and the first concave portion and the second concave portion are linked by an inclined step portion in such a way that a groove width at the step portion is increased in a direction from the bottom surface side to the aperture surface side, and moreover, a tip of the rail-shaped convex portion of the first case member is fitted into the first concave portion at the bottom surface side of the second case member.

Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

Abstract: A ternary particle size filler composition with addition of nano particles is provided to formulate thermally conductive interface materials such as soft gel having a high thermal conductivity, a relative low viscosity, and a low complex storage modulus. The thermally conductive material containing thermal particle composition and polymer matrix is used to create a thermal transfer path between the electronic component and the heat dissipation member. The composition is a mixture of a ternary particle size fillers constituted of the same or different chemical compounds in a predefined size ranges and volume ratios in terms of low viscosity and thermal interface nominal size. A silicone based polymer used as filler bonding matrix contains base resin, dispersant, cross-linker and polymerization catalyst. Thermal conductivity of the soft gel varied according to the change of volume percentage, particle size, and chemical compound of individual thermal particles.

Abstract: A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.

Abstract: An electric power semiconductor device includes a power module and a heat dissipating member connected to the power module through a heat-conductive insulating resin sheet in which a mold resin part included in the power module has a protruding part in its peripheral part to prevent the heat-conductive insulating resin sheet from expanding in a planar direction. The heat-conductive insulating resin sheet is slightly thicker than the protruding part and has a resin exuding part exuded from a small gap between the protruding part and the heat dissipating member while the power module and the heat dissipating member are heated and pressurized to be bonded.

Abstract: An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: A line replaceable unit includes a universal heat sink receptacle formed in an inner surface of a wall of an enclosure. The universal heat sink receptacle is configured to receive a heat spreader for any standard or custom COM Express module so that the line replaceable unit may be efficiently reconfigured with different COM Express modules if needed.

Abstract: A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load spring passing through the heat sink, the load spring having a latch arm at a first end and a load screw at a second end actuating the load spring, the load spring when actuated is configured to bear against the raised points to equalize pressure distribution over one or more semiconductor chips on the electronic module.

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

Abstract: The present invention relates to an electronic device for switching currents and a method for producing such a device that is reliable and durable. Such an electronic device comprises a power semiconductor that can be actuated for switching between at least two states; a substrate having thermomechanical properties compatible with the power semiconductor on which the power semiconductor is disposed on one side; a bus bar disposed on the other side of the substrate for conducting the current, wherein the substrate and the bus bar are coupled to each other such that a heat-conductive connection is provided so that heat can be dissipated from the power semiconductor to the bus bar.

Abstract: An electronic module including a supporting frame, a handle, an electronic device, and a heat dissipating member is provided. The handle assembled to the supporting frame is open or closed relative to the supporting frame. The electronic device is detachably assembled on the supporting frame. The heat dissipating member detachably assembled to the handle moves relative to the supporting frame with the handle. When the handle is closed relative to the supporting frame, the electronic device is fixed on the supporting frame by the handle, and the heat dissipating member leans against the electronic device. When the handle is opened relative to the supporting frame, the heat dissipating member is far away from the electronic device.

Abstract: An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.

Abstract: A receptacle including a shield housing and a heat sink. The shield housing has a first side configured to be connected to a printed circuit board. The housing has an aperture for insertion of a plug of a cable assembly. The heat sink is connected to the first side or an opposite second side of the shield housing. The heat sink has a lateral end section which extends along an exterior of a least one lateral side of the shield housing.

Abstract: Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.

Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

Abstract: A system includes a removable module to process data when installed in the system, where the module includes a first surface via which heat, that is generated by the module, is transferred. The system also includes a port into which the module is installed; and a heat sink, associated with the port, to dissipate the heat received from the first surface, where the heat sink includes a second surface on which a material is applied, and where the material makes contact with the first surface when the module is installed that allows the heat to be received from the first surface, conforms to an American Society for Testing Materials (ASTM)-B607-91 standard or a United States military specification-C-26074, and transfers the heat to the second surface that allows the module to operate at a temperature that is less than a threshold.

Abstract: A display apparatus and a multi display apparatus. The display apparatus includes a display module having an opening through which an image is displayed and a non-display area to form around the opening, and a rear cover directly coupled to a side surface of the display module. The multi display apparatus includes the plurality of display apparatuses which are coupled with each other.

Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.

Abstract: According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a top side in contact with a plurality of power device top surfaces and a bottom side in contact with a bottom surface of the power module. The power semiconductor package can include at least one fastening clamp pressing the top side and the bottom side of the double-sided heat sink into the power module. The double-sided heat sink can also include a water-cooling element.

Abstract: To provide electronic equipment having a heat discharging function capable of achieving the maximum in the signal processing capability of a portable terminal by preventing the functional restriction of the portable terminal by effectively discharging exothermic heat from the portable terminal at the time of coupling the portable terminal whose function is restricted by heat generation to an external device, as well as a heat discharging system and a heat discharging method.

Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.

Abstract: A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.

Abstract: A side clip has a clip base attached to a socket connector and a first clip member and a second clip member extending from the clip base. The first clip member has a terminal for attaching to a printed circuit board. The second clip member is spaced in parallel from the first member and connected to the first clip member by a distal segment to form an opening. A side retainer has a retainer base having first and second ends and first, second, third, and fourth retainer members extending vertically from the retainer base. The first retainer member fits a hole on a board held by the side clip. The second retainer member is located at the first end and has an inward hook. The fourth retainer member is located on the second end and has an outward hook.

Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

Abstract: A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.

Abstract: A pluggable module, includes: an insertion gate through which an electronic module is inserted and removed; a guide rail, including a spring support unit provided with a spring unit and a bearing unit located near the insertion gate, to guide the electronic module; and a heat sink plate, including, at one end portion, a fulcrum bar to be inserted into the bearing unit so as to move in a pressing direction of the spring unit, the heat sink plate being pushed up at the other end portion by a leading end of the electronic module so as to be pressed against the electronic module.

Abstract: A power supply converter (100) comprising a first FET (210) connected to ground (230), the first FET coupled to a second FET (220) tied to an input terminal (240), both FETs conductively attached side-by-side to a first surface of a metal carrier (120) and operating as a converter generating heat; and a packaged load inductor (110) tied to the carrier and an output terminal (241), the inductor package wrapped by a metal sleeve (113) in touch with the opposite surface of the metal carrier, the sleeve operable to spread and radiate the heat generated by the converter.

Abstract: An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package.

Abstract: A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.

Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: An electronic device having a heat dissipating component is provided. The electronic device includes a circuit board, a heat pipe which is disposed on a first side of the circuit board, a heat generating device which is disposed on a second side of the circuit board opposite to the first side, a heat sink placed which is disposed on a surface of the heat generating device and absorbs heat of the heat generating device, and a connecting member which penetrates through the circuit board and thermoconductively connects the heat pipe and the heat sink.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: A cardlock clamp is described that is used to secure an electronics module in a channel of a card cage. The cardlock clamp is configured to convert an input compression force into clamping forces in at least two radial directions perpendicular to the input compression force. The described cardlock clamp also provides self-alignment and self-center functions for the electronics module inserted into the channel. Further, variations of the cardlock clamp are described that provide more effective heat transfer from the electronics module to the card cage.

Abstract: A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion.

Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-?m equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder?active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 ?m, d50 of 10 to 35 ?m, and d90 of 30 to 50 ?m, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

Abstract: An electrical connection assembly includes a metal housing and an electrical module having a plurality of electrical components mounted on a component base. The base is supported on the housing. A socket conducts electrical current from a pin of a cable to the electrical components. A heat sink member conducts heat directly from the socket to the metal housing. An electrically insulating thermally conducting pad is positioned between the housing and an end of the heat sink member. A current sensor has a cylindrical body which surrounds a portion of the socket.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.