Abstract: A stability device comprising a carrier having a first socket and a second socket; a first circuit board inserted into the first socket; a second circuit board inserted into the second socket, wherein an inside surface of the second circuit board is facing an inside surface of the first circuit board; a center structure positioned between the inside surface of the first circuit board and the inside surface of the second circuit board, wherein the center structure is fixed to the carrier via a stability bar fixed to the carrier; a spring loaded outer structure at least partially surrounding an outside surface of the first circuit board and an outside surface of the second circuit board and to fix the center structure between the inside surface of the first circuit board and the inside surface of the second circuit board, wherein the center structure and outer structure dissipate heat.

Abstract: An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Abstract: An energy storage unit mounting facility, having a basic body, which defines multiple mounting regions arranged vertically on top of one another for at least one electric energy storage unit. The electric energy storage unit is introducible into the mounting region in the horizontal direction and removable from the mounting region in the horizontal direction. Securing devices are provided to secure the electric energy storage unit in the mounting region.

Abstract: A method for determining the wear on a linkage of a ground drilling device includes detecting a bending load of the linkage. The bending load is used to carry out a service life calculation.

Abstract: A cooling module for a parallel type power module of an inverter may include parallel type power modules configured to be disposed in three or more columns and rows, wherein three parallel type power modules are disposed to correspond to U, V, and W phases of the inverter in the three or more rows in each of the three or more columns, a first cooling water passage having a passage through which cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a first row, and a second cooling water passage having a passage through which the cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a third row.

Abstract: An electronic board includes a board, and includes on the board: a power input part inputting power output from an in-vehicle power supply; a drive circuit driving a drive source; a controller controlling driving of the drive source performed by the drive circuit; and a drive command signal input part inputting a drive command signal transmitted from outside. The electronic board further includes on the board: a drive command signal detection circuit capable of detecting the drive command signal, and controlling whether to supply the power input to the power input part to the controller based on whether the drive command signal is detected; and a voltage varying part varying a voltage from the power input part and outputting a varied voltage to the drive command signal detection circuit.

Abstract: A semiconductor module, including a laminated substrate that has an insulating plate, a circuit board disposed on a top surface of the insulating plate, and a heat dissipation plate disposed on a bottom surface of the insulating plate. The semiconductor module further has a semiconductor element disposed on a top surface of the circuit board, a metal wiring board disposed on a top surface of the semiconductor element, and a temperature sensor that detects a temperature of the semiconductor element, and that is disposed on a top surface of the metal wiring board. The metal wiring board includes a heat blocking part that blocks heat of the semiconductor element.

Abstract: Provided is an adapter for rack-mounted computing equipment, the adapter including: a chassis; two mounts coupled to the chassis, each of the two mounts having a respective hole shaped to receive and support rack-mountable computing equipment, wherein centers of the holes are between 460 and 470 mm (millimeters) apart from one another in a side-to-side direction of the chassis; two members extending from front of the chassis, the two members being less than 18 mm tall and being between 530 and 550 mm apart in the side-to-side direction; a channel extending at least half a distance along the chassis in a front-to-back direction, the channel defining a volume configured to hold cables extending from a back side of the chassis to a front side of the chassis; and a bus-bar connector mount configured to position a bus-bar connector extending from a back of the chassis.

Abstract: An integrated power module includes a base case defining an internal manifold, and an interface surface comprising a plurality of inlet apertures and outlet apertures each in fluid communication with the internal manifold. The integrated power module also includes a plurality of power cards fastened to the base case and in direct contact with the interface surface. Each of the power cards has a bottom cover defining an inner surface and an outer surface, a base plate sealed with the bottom cover, a substrate secured on the base plate such that the base plate is between the substrate and bottom cover, and an integrated circuit disposed on the substrate. The inner surface and the base plate define a cooling channel configured to direct coolant from one of the inlet apertures, through the power card, and to one of the outlet apertures.

Abstract: An electronics rack comprising a first cage, a first heat sink positioned at a rear and in thermal communication with the first cage, a second cage positioned above the first cage, and a second heat sink in thermal communication with the second cage. In another aspect, the present invention provides an electronics rack comprising a frame, a cage, a heat sink positioned at a rear of the frame, and a compliant thermal collector operatively positioned between the cage and the heat sink. The compliant thermal collector can comprise a heat pipe having a non-linear shape that facilitates flexing of the heat pipe to change the length of the thermal collector. The thermal collector advantageously includes a plurality of heat pipes and a contact bar coupling the plurality of heat pipes. Preferably, the rack further includes an adjusting mechanism (e.g., threaded rods) for adjusting a position of the contact bar.

Abstract: A battery cell tray includes a bottom plate, a top plate opposite the bottom plate, at least one partition plate between the bottom plate and the top plate, a pressing plate between the partition plate and the bottom plate, and a transmission device between the pressing plate and the bottom plate and on the bottom plate. The transmission device includes moving members, a spiral rod, and supporting arms. The moving members respectively have a first threaded hole and a second threaded hole. The spiral rod has a first screw thread and a second screw thread that are arranged in reverse rotation directions and respectively engaged with the first threaded hole and the second threaded hole. Two top ends of the supporting arms are pivoted to the pressing plate, and two bottom ends of the supporting arms are respectively pivoted to the moving members.

Abstract: Provided is an adapter for rack-mounted computing equipment, the adapter including: a chassis; two mounts coupled to the chassis, each of the two mounts having a respective hole shaped to receive and support rack-mountable computing equipment, wherein centers of the holes are between 460 and 470 mm (millimeters) apart from one another in a side-to-side direction of the chassis; two members extending from front of the chassis, the two members being less than 18 mm tall and being between 530 and 550 mm apart in the side-to-side direction; a channel extending at least half a distance along the chassis in a front-to-back direction, the channel defining a volume configured to hold cables extending from a back side of the chassis to a front side of the chassis; and a bus-bar connector mount configured to position a bus-bar connector extending from a back of the chassis.

Abstract: Embodiments of the present invention relate to the field of telecommunication, and more specifically, to communication connectors such as, for example, shielded plug and jack connectors. In an embodiment, the present invention is a communication jack that includes a housing and a front sled assembly having a plurality of plug interface contacts (PICs), the front sled assembly being moveable along a horizontal plane of the communication jack between a first position and a second position, the first position being different from the second position.

Abstract: A high-frequency connecting device includes a housing, a sandwiched member, an inner heat sink, a rear heat sink, a heat pipe, a upper heat sink and a connector. The inner heat sink is disposed inside the sandwiched member. The top and the bottom of the inner heat sink respectively have a first contact portion and a second contact portion. The upper heat sink has a third contact portion. A fourth contact portion is elastically disposed on the lower cover. The first and the second optical modules are respectively inserted into the upper and the lower spaces. The top and the bottom of the first optical module are in direct contact respectively with the third contact portion and the first contact portion, while the top and the bottom of the second optical module are in direct contact respectively with the second contact portion and the fourth contact portion.

Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.

Abstract: A vehicle traction battery cell retainer includes a sidewall defining a plurality of windows each surrounded by a window flange extending therefrom, a top channel extending from the sidewall and terminating in a top flange, and a bottom channel extending from the retainer sidewall, defining a plurality of air bypass windows, and terminating in a bottom flange, the top and bottom flanges arranged for interlocking with an adjacent retainer of the traction battery. A vehicle traction battery assembly includes first and second adjacent battery cell arrays each having associated first and second retainers having a sidewall defining air flow windows and integrated top and bottom channels formed of unitary construction with interlocking flanges to couple the first and second arrays.

Abstract: An assembly for use in a system comprising a plurality of pairs of conductors, and a plug/receptacle for terminating the cable at a rear end thereof, a plurality of evenly spaced terminal contacts/tines respectively exposed along a front of the plug body/within the receptacle, arranged in parallel, and a printed circuit board assembly comprising a plurality of pairs of traces interconnecting each conductor of the pairs of conductors with respective ones of the terminal contacts/tines. A center pair of the conductors is attached to a first pair of the terminal contacts/tines and a second pair of conductors is attached to a second pair of the terminal contacts/tines. The center pair of terminal contacts/tines is positioned between the second pair of contacts/tines wherein in operation a current flow in the center pair of terminal contacts/tines is in a direction substantially away from the second pair of terminal contacts/tines.

Abstract: An electric power converter includes a semiconductor module that has a semiconductor element therein, a cooler that cools the semiconductor module, a circuit board provided with a semiconductor control circuit that controls the semiconductor module, a capacitor electrically connected to the semiconductor module, and a quick discharge resistor for discharging an electric charge accumulated in the capacitor. The circuit board is provided with a discharge control circuit that controls a current that flows into the quick discharge resistor. The semiconductor module, the cooler, the capacitor, and the quick discharge resistor are disposed on one major surface of the circuit board.

Abstract: A storage system that functions as one or more logical volumes includes a control unit and a plurality of storage units connected to the control unit, wherein the control unit includes a memory that stores allocation status information that indicates status of allocation of the plurality of storage units to a logical volume; an access request responding unit that controls at least one storage unit among the plurality of storage units in response to a request for access to each logical volume from a host device; and a power saving controller that identifies an unused storage unit not allocated to any logical volume among the plurality of storage units on the basis of the allocation status information and performs power saving control on the identified unused storage unit.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.

Abstract: A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoelectric modules are formed to have opposite polarities, and the heat spreader heated by the first thermoelectric module is cooled due to activation of the second thermoelectric module.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.

Abstract: A receptacle assembly includes a cage having an interior cavity and a divider that divides the interior cavity into first and second ports. The cage has a front end that is open to the first and second ports, which are configured to receive first and second pluggable modules, respectively, therein through the front end. The divider includes an internal compartment that extends between the first and second ports. The receptacle assembly includes a thermal transfer assembly having a base and a spring. The base is received within the internal compartment of the divider and includes a module side that faces the first port. The spring is operatively connected between the divider and the base such that the spring is configured to bias the base toward the first port and thereby press the module side of the base into thermal communication with the first pluggable module.

Abstract: A power conversion assembly for use in a welding power supply includes a power magnetics module and a power electronics module. The power magnetics module includes at least one transformer disposed on a first wind tunnel housing. The power electronics module is separate from and electrically coupled to the power magnetics module. The power electronics module includes switching circuitry and one or more heat sinks to remove heat from the switching circuitry. The switching circuitry and the heat sinks are disposed on a second wind tunnel housing coupled to the first wind tunnel housing.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.

Abstract: An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.

Abstract: A datacenter or server farm having servers mounted to blow air at an angle in a hot aisle. The angled air flow can provide a cyclonal effect in the hot aisle, enhancing heat convention in the hot aisle.

Abstract: An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

Abstract: The present invention relates to a device (1) for supporting, housing and cooling radiant modules (2) of an antenna, comprising a plate (3) for cooling said radiant modules (2) that can be fixed to means for supporting said antenna, said plate (3) having an upper surface and a lower surface; characterized in that it comprises a plurality of projecting guides (5) provided at least on one of said surfaces of said plate (3), so that each pair of said projecting guides (5) adjacent with surface on which are provided realize housing seats (6), in each one of which one of said radiant modules (2) is introduced; and pressing means (7, 15, 16, 17), integrated with said projecting guides (5), apt exerting a pressure on said radiant modules (2) so as to obtain a substantially uniform coupling between each of them and the surface of said plate (3) on which said projecting guides (5) are provided. The invention further relates to an array antenna.

Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

Abstract: An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.

Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.

Abstract: A portable electronic device includes a main body, a motherboard, at least one connector, and at least one external graphics card module. The motherboard is disposed within the main body and equipped without a built-in graphics chip. The connector is disposed on the motherboard. The main body has at least one slot, and the slot is disposed at a position corresponding to the position of the connector. The external graphics card module includes a circuit board, and a graphic processing unit and a first connecting interface are electrically disposed on the circuit board. The external graphics card module is removable and selectively inserts into the slot, and the external graphics card module electrically connects to the motherboard via the first connecting interface.

Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Abstract: A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract: A voltage supply apparatus for a motor vehicle, especially a passenger car, truck or a motorcycle, includes a storage cell arrangement having one or more electrochemical storage cells and/or double layer capacitors that are mounted on top of each other. The storage cell arrangement is releasably connected in a form-fitting way to a heat-conducting cooling device that removes heat from the storage cells and/or double layer capacitors such that at least some of the storage cells and/or double layer capacitors of a respective storage cell group can each be thermally connected with the heat-conducting cooling device.

Abstract: A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.

Abstract: A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.