Plural Patents (Class 361/716)
  • Patent number: 10136564
    Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: November 20, 2018
    Assignee: DENSO CORPORATION
    Inventors: Kazuya Takeuchi, Naoki Hirasawa, Hiromi Ichijo, Shingo Oono, Takuya Oizumi
  • Patent number: 9472792
    Abstract: A vehicle traction battery cell retainer includes a sidewall defining a plurality of windows each surrounded by a window flange extending therefrom, a top channel extending from the sidewall and terminating in a top flange, and a bottom channel extending from the retainer sidewall, defining a plurality of air bypass windows, and terminating in a bottom flange, the top and bottom flanges arranged for interlocking with an adjacent retainer of the traction battery. A vehicle traction battery assembly includes first and second adjacent battery cell arrays each having associated first and second retainers having a sidewall defining air flow windows and integrated top and bottom channels formed of unitary construction with interlocking flanges to couple the first and second arrays.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: October 18, 2016
    Assignee: Ford Global Technologies, LLC
    Inventors: Rajaram Subramanian, Brian Utley, Yongcai Wang, LeeAnn Wang
  • Patent number: 9318840
    Abstract: An assembly for use in a system comprising a plurality of pairs of conductors, and a plug/receptacle for terminating the cable at a rear end thereof, a plurality of evenly spaced terminal contacts/tines respectively exposed along a front of the plug body/within the receptacle, arranged in parallel, and a printed circuit board assembly comprising a plurality of pairs of traces interconnecting each conductor of the pairs of conductors with respective ones of the terminal contacts/tines. A center pair of the conductors is attached to a first pair of the terminal contacts/tines and a second pair of conductors is attached to a second pair of the terminal contacts/tines. The center pair of terminal contacts/tines is positioned between the second pair of contacts/tines wherein in operation a current flow in the center pair of terminal contacts/tines is in a direction substantially away from the second pair of terminal contacts/tines.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: April 19, 2016
    Assignee: BELDEN CANADA INC.
    Inventors: Virak Siev, Francois Beauregard, Marc Fontaine
  • Patent number: 9219425
    Abstract: An electric power converter includes a semiconductor module that has a semiconductor element therein, a cooler that cools the semiconductor module, a circuit board provided with a semiconductor control circuit that controls the semiconductor module, a capacitor electrically connected to the semiconductor module, and a quick discharge resistor for discharging an electric charge accumulated in the capacitor. The circuit board is provided with a discharge control circuit that controls a current that flows into the quick discharge resistor. The semiconductor module, the cooler, the capacitor, and the quick discharge resistor are disposed on one major surface of the circuit board.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 22, 2015
    Assignee: DENSO CORPORATION
    Inventors: Tomohisa Sano, Takahisa Kaneko, Kenshiro Hida, Kenji Funahashi
  • Patent number: 9189058
    Abstract: A storage system that functions as one or more logical volumes includes a control unit and a plurality of storage units connected to the control unit, wherein the control unit includes a memory that stores allocation status information that indicates status of allocation of the plurality of storage units to a logical volume; an access request responding unit that controls at least one storage unit among the plurality of storage units in response to a request for access to each logical volume from a host device; and a power saving controller that identifies an unused storage unit not allocated to any logical volume among the plurality of storage units on the basis of the allocation status information and performs power saving control on the identified unused storage unit.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: November 17, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Omar Hame Thielo, Yuichi Sakagami, Yukihiro Yoshiya, Atsuhiro Otaka, Kazuma Takatsu
  • Patent number: 9144178
    Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 22, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr., Randall G. Kemink, Eric J. McKeever
  • Publication number: 20150138732
    Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Inventors: Keiji Okumura, Takukazu Otsuka, Masao Saito
  • Patent number: 8982552
    Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: March 17, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arlen L. Roesner, Brandon Rubenstein, John F. Hutton, Richard Stanton Self
  • Publication number: 20150062824
    Abstract: A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoelectric modules are formed to have opposite polarities, and the heat spreader heated by the first thermoelectric module is cooled due to activation of the second thermoelectric module.
    Type: Application
    Filed: June 11, 2014
    Publication date: March 5, 2015
    Inventors: YOUNG-HOON HYUN, JI-CHUL KIM, YUN-HYEOK IM
  • Patent number: 8971044
    Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: March 3, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Keiji Okumura, Takukazu Otsuka, Masao Saito
  • Patent number: 8953316
    Abstract: A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: February 10, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Paul A. Wormsbecher, Gregory J. McKnight, Michael S. Miller, Howard V. Mahaney
  • Publication number: 20150029667
    Abstract: A receptacle assembly includes a cage having an interior cavity and a divider that divides the interior cavity into first and second ports. The cage has a front end that is open to the first and second ports, which are configured to receive first and second pluggable modules, respectively, therein through the front end. The divider includes an internal compartment that extends between the first and second ports. The receptacle assembly includes a thermal transfer assembly having a base and a spring. The base is received within the internal compartment of the divider and includes a module side that faces the first port. The spring is operatively connected between the divider and the base such that the spring is configured to bias the base toward the first port and thereby press the module side of the base into thermal communication with the first pluggable module.
    Type: Application
    Filed: July 24, 2013
    Publication date: January 29, 2015
    Applicant: Tyco Electronics Corporation
    Inventor: David Stanley Szczesny
  • Publication number: 20140374395
    Abstract: A power conversion assembly for use in a welding power supply includes a power magnetics module and a power electronics module. The power magnetics module includes at least one transformer disposed on a first wind tunnel housing. The power electronics module is separate from and electrically coupled to the power magnetics module. The power electronics module includes switching circuitry and one or more heat sinks to remove heat from the switching circuitry. The switching circuitry and the heat sinks are disposed on a second wind tunnel housing coupled to the first wind tunnel housing.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventors: Jason Alan Dunahoo, Ronald Dewayne Woodward, Benjamin David Romenesko, Chris J. Roehl, Craig Steven Knoener, Joshua Thomas Stiever
  • Publication number: 20140362531
    Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.
    Type: Application
    Filed: August 26, 2014
    Publication date: December 11, 2014
    Inventors: SHIH-CHANG LEE, MING-LEE CHU, CHIH-HSUN LIN
  • Publication number: 20140362537
    Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sang Won Yoon, Yuanbo Guo
  • Patent number: 8879256
    Abstract: An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: November 4, 2014
    Assignee: Denso Corporation
    Inventors: Hiromi Ichijyo, Takahisa Kaneko, Takeshi Fujihara, Kenshiro Hida
  • Patent number: 8879268
    Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: November 4, 2014
    Assignee: Academia Sinica
    Inventors: Shih-Chang Lee, Chi-Hao Jin, Ming-Lee Chu, Chih-Hsun Lin
  • Patent number: 8867204
    Abstract: A datacenter or server farm having servers mounted to blow air at an angle in a hot aisle. The angled air flow can provide a cyclonal effect in the hot aisle, enhancing heat convention in the hot aisle.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: October 21, 2014
    Assignee: Amazon Technologies, Inc.
    Inventor: Brock R. Gardner
  • Patent number: 8848375
    Abstract: An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: September 30, 2014
    Assignee: Lear Corporation
    Inventors: Rutunj Rai, Richard Hampo, John Mills
  • Patent number: 8837148
    Abstract: The present invention relates to a device (1) for supporting, housing and cooling radiant modules (2) of an antenna, comprising a plate (3) for cooling said radiant modules (2) that can be fixed to means for supporting said antenna, said plate (3) having an upper surface and a lower surface; characterized in that it comprises a plurality of projecting guides (5) provided at least on one of said surfaces of said plate (3), so that each pair of said projecting guides (5) adjacent with surface on which are provided realize housing seats (6), in each one of which one of said radiant modules (2) is introduced; and pressing means (7, 15, 16, 17), integrated with said projecting guides (5), apt exerting a pressure on said radiant modules (2) so as to obtain a substantially uniform coupling between each of them and the surface of said plate (3) on which said projecting guides (5) are provided. The invention further relates to an array antenna.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: September 16, 2014
    Assignee: Selex Sistemi Integrati S.p.A. P.A.
    Inventors: Andrea Giovannelli, Francesca Masala
  • Patent number: 8824138
    Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: September 2, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Patent number: 8824137
    Abstract: An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: September 2, 2014
    Assignee: Fujitsu Limited
    Inventor: Takaya Nakayama
  • Patent number: 8804352
    Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: August 12, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Ming-Hsien Hsieh, Kuo-Hua Lin, Yi-Min Chen
  • Publication number: 20140211420
    Abstract: A portable electronic device includes a main body, a motherboard, at least one connector, and at least one external graphics card module. The motherboard is disposed within the main body and equipped without a built-in graphics chip. The connector is disposed on the motherboard. The main body has at least one slot, and the slot is disposed at a position corresponding to the position of the connector. The external graphics card module includes a circuit board, and a graphic processing unit and a first connecting interface are electrically disposed on the circuit board. The external graphics card module is removable and selectively inserts into the slot, and the external graphics card module electrically connects to the motherboard via the first connecting interface.
    Type: Application
    Filed: January 30, 2013
    Publication date: July 31, 2014
    Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Ting Kang Ou, Yi Yuan Liu, Mou Ming Ma
  • Patent number: 8760855
    Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 24, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Jeremy Charles Howes, David Levett
  • Patent number: 8743548
    Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 3, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Atushi Kawabata
  • Patent number: 8730676
    Abstract: A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: May 20, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Michele Hirsch, Michael Guenther
  • Publication number: 20140104790
    Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.
    Type: Application
    Filed: October 15, 2012
    Publication date: April 17, 2014
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sang Won Yoon, Yuanbo Guo
  • Patent number: 8699225
    Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: April 15, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Scott D. Brandenburg, Richard D. Parker, Erich W. Gerbsch, Gary L. Eesley, Carl W. Berlin
  • Patent number: 8687366
    Abstract: A voltage supply apparatus for a motor vehicle, especially a passenger car, truck or a motorcycle, includes a storage cell arrangement having one or more electrochemical storage cells and/or double layer capacitors that are mounted on top of each other. The storage cell arrangement is releasably connected in a form-fitting way to a heat-conducting cooling device that removes heat from the storage cells and/or double layer capacitors such that at least some of the storage cells and/or double layer capacitors of a respective storage cell group can each be thermally connected with the heat-conducting cooling device.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: April 1, 2014
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Frank Eckstein, Bjoern Lath, Hubertus Goesmann, Micha Dirmeier, Alexander Meijering, Philipp Petz, Nicolas Flahaut
  • Patent number: 8670238
    Abstract: A guide rail system is provided that allows multiple optical communications modules to be mounted in close proximity to one another on a host circuit board. A first portion of the guide rail system is secured to a bottom surface of the host circuit board at locations on the bottom surface of the circuit board adjacent an opening formed in the circuit board. A second portion of the guide rail system is disposed on bottom surfaces of the optical communications modules. The first portion includes one or more pairs of rails and the second portion includes one or more guide blocks configured to slidingly engage the rails. The opening formed in the circuit board allows the rails to be accessed and also allows heat from the module to be dissipated down into the first portion and then into a heat dissipation structure secured to the first portion.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: March 11, 2014
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Fang Wang, David J. K. Meadowcroft
  • Publication number: 20140063740
    Abstract: A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.
    Type: Application
    Filed: July 17, 2013
    Publication date: March 6, 2014
    Inventors: Yoshinori SUNAGA, Yoshiaki ISHIGAMI, Kinya YAMAZAKI, Hidenori YONEZAWA
  • Patent number: 8654529
    Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: February 18, 2014
    Assignee: LiquidCool Solutions, Inc.
    Inventor: Chad D. Attlesey
  • Patent number: 8599539
    Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: December 3, 2013
    Assignees: Joinset Co., Ltd.
    Inventors: Sun-Ki Kim, Seong-Jin Lee, Ki-Han Park
  • Patent number: 8587943
    Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: November 19, 2013
    Assignee: International Business Machines Corporation
    Inventors: Richard M. Barina, Vinod Kamath, Chunjian Ni, Derek I. Schmidt, Mark E. Steinke, James S. Womble
  • Publication number: 20130301223
    Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.
    Type: Application
    Filed: July 15, 2013
    Publication date: November 14, 2013
    Inventors: Michael J. Nelson, Kevin Thompson
  • Patent number: 8570744
    Abstract: A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: October 29, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Timothy Rau, Glenn C. Simon
  • Patent number: 8547694
    Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: October 1, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xian-Xiu Tang
  • Patent number: 8467189
    Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: June 18, 2013
    Assignee: LiquidCool Solutions, Inc.
    Inventor: Chad Daniel Attlesey
  • Publication number: 20130077255
    Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.
    Type: Application
    Filed: May 24, 2012
    Publication date: March 28, 2013
    Applicant: KEIHIN CORPORATION
    Inventors: Hidefumi Abe, Toshiro Mayumi, Seiichiro Abe
  • Patent number: 8392035
    Abstract: A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: March 5, 2013
    Assignee: Hewlett-Packard Development Company, L. P.
    Inventors: Chandrakant Patel, Cullen E. Bash, Ratnesh K. Sharma
  • Patent number: 8358504
    Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: January 22, 2013
    Assignee: Avago Technologies Enterprise IP (Singapore) Pte. Ltd.
    Inventors: Laurence Ray McColloch, Paul Yu
  • Patent number: 8345426
    Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: January 1, 2013
    Assignee: Tyco Electronics Corporation
    Inventor: Robert Paul Nichols
  • Publication number: 20120327604
    Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.
    Type: Application
    Filed: September 13, 2011
    Publication date: December 27, 2012
    Inventors: Ping-Long YANG, Chia-Hsiang Li
  • Publication number: 20120320523
    Abstract: A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 20, 2012
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Vance B. Murakami, Harold Z. Htutt
  • Patent number: 8305756
    Abstract: The present disclosure relates, in some embodiments, to modular information handling systems configured to automatically adjust coolant flow upon insertion and/or removal of heat-releasing elements (e.g., blades). A system may comprise, for example, a chassis at least partially defining a cavity, at least one fan in fluid communication with the cavity and operable to move coolant through at least a portion of the cavity, and one or more bays. Each of the one or more bays (a) may be at least partially defined by a bay wall, (b) may be configured to receive a heat-releasing element, and/or (c) may comprise an obturator configured to conditionally block fluid communication between the bay and the chassis cavity, the fan, and/or a coolant, wherein the obturator allows fluid communication when a blade is present in the bay and blocks fluid communication when a blade is absent from the bay. A system may further comprise at least one heat-releasing element positioned in at least one of the one or more bays.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: November 6, 2012
    Assignee: Dell Products L.P.
    Inventors: Laurent A. Regimbal, Karl Isaac Hamand, Lawrence Kyle
  • Patent number: 8305757
    Abstract: A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: November 6, 2012
    Assignee: IETIP LLC
    Inventors: Earl Keisling, John Costakis, Gerald McDonnell
  • Publication number: 20120250259
    Abstract: The present creation discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.
    Type: Application
    Filed: February 13, 2012
    Publication date: October 4, 2012
    Applicant: Academia Sinica
    Inventors: Shih-Chang Lee, Chi-Hao Jin, Ming-Lee Chu, Chih-Hsun Lin
  • Publication number: 20120229985
    Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
    Type: Application
    Filed: May 23, 2012
    Publication date: September 13, 2012
    Applicant: ROHM CO., LTD.
    Inventors: Keiji Okumura, Takukazu Otsuka, Masao Saito
  • Patent number: 8254123
    Abstract: A mounting apparatus for mounting an expansion card to a printed circuit board (PCB), includes a connector on the PCB, and a latch member pivotably connected to the connector. The connector defines a slot to receive the expansion card. The latch member is a rectangular wire frame comprising a lock portion, two connection arms extending down from the lock portion, and two pivot portions extending from distal ends of the connection arms toward each other. The pivot portions are pivotably attached to two sidewalls of the connector. After the expansion card is plugged into the slot of the connector, the latch member is pivoted to make the lock portion press against a portion of the expansion card, thereby locking the expansion card to the connector.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Zheng-Heng Sun