For Active Solid State Devices Patents (Class 361/717)
  • Patent number: 11817749
    Abstract: The purpose of the invention is to achieve a miniaturized power tool. Provided is a hammer drill (1A) that includes: a brushless motor (10) that is a drive source for a tip tool (20); a control unit for controlling the driving of the brushless motor (10); a motor housing (33) to which the brushless motor (10) is attached; and a handle housing (34) provided with a grip (2). The control unit includes: a switching board (12) and a Hall element board (13); and a converter board (11) on which an electrolytic capacitor (11a) is installed. The brushless motor (10) is disposed to be sandwiched between the electrolytic capacitor (11a), and the switching board (12) and the Hall element board (13), along the axial direction (M) of a drive shaft (16) that drives the tip tool (20).
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: November 14, 2023
    Assignee: Koki Holdings Co., Ltd.
    Inventors: Yuta Noguchi, Hideyuki Hashimoto, Yuki Takahashi
  • Patent number: 11800689
    Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: October 24, 2023
    Assignee: Teknologian tutkimuskeskus VTT Oy
    Inventors: Mika Prunnila, Alberto Ronzani, Emma Mykkänen, Antti Kemppinen, Janne Lehtinen
  • Patent number: 11784614
    Abstract: Radio frequency amplifier (200) assembly with effective prevention of RF interference.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: October 10, 2023
    Assignee: Koninklijke Philips N.V.
    Inventors: Keqiu Zeng, Cong Zhou, Yuanxu Ding, Jungyang Zhang, Jun Ma
  • Patent number: 11784156
    Abstract: A semiconductor device includes: an insulating substrate; a first semiconductor element connected to the insulating substrate; a conductive member disposed on the insulating substrate, and including a first opposing portion and a second opposing portion located opposite each other with respect to the first semiconductor element in plan view; a first wire connected to the first semiconductor element and the first opposing portion; and a second wire connected to the first semiconductor element and the second opposing portion, and located opposite the first wire with respect to a connection point where the first wire and the first semiconductor element are connected to each other in plan view.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: October 10, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Kitabayashi, Hiroyuki Masumoto
  • Patent number: 11777188
    Abstract: The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 3, 2023
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Anatoli Deleniv, Per Ingelhag, Peter Melin
  • Patent number: 11670561
    Abstract: Embodiments include semiconductor packages and a method to form such packages. A semiconductor package includes first, second, and third microelectronic devices on a package substrate. The first microelectronic device has a top surface substantially coplanar to a top surface of the second microelectronic device. The third microelectronic device has a top surface above the top surfaces of the first and second microelectronic devices. The semiconductor package includes a first conductive layer on the first and second microelectronic devices, and a second conductive layer on the third microelectronic device. The second conductive layer has a thickness less than a thickness of the first conductive layer, and a top surface substantially coplanar to a top surface of the first conductive layer. The semiconductor includes thermal interface materials on the first and second conductive layers. The first and second conductive layers are comprised of copper, silver, boron nitride, or graphene.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: June 6, 2023
    Assignee: Intel Corporation
    Inventors: Zhimin Wan, Chandra Mohan Jha, Je-Young Chang, Chia-Pin Chiu, Liwei Wang
  • Patent number: 11502059
    Abstract: A semiconductor package includes: a first thermal pillar disposed on a package substrate, and having an opening; a first chip stack disposed on the package substrate and in the opening of the first thermal pillar, and including a first lateral surface; a semiconductor chip disposed on the package substrate and in the opening, wherein the semiconductor chip is spaced apart from the first chip stack; and a first heat transfer film disposed between the first thermal pillar and the first lateral surface of the first chip stack.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heejung Hwang, Jae Choon Kim, Yun Seok Choi
  • Patent number: 11439042
    Abstract: A heat exchange assembly includes a thermal bridge including upper and lower bridge elements including upper and lower plates arranged in plate stacks. The lower plates include lower fin plates and lower spacer plates with lower ends configured to be mechanically and thermally coupled to the electrical component. The upper plates include upper fin plates and upper spacer plates with upper ends configured to be mechanically and thermally coupled to a heat exchanger. The upper and lower fin plates are interleaved. The heat exchange assembly includes installation spring elements coupled between the upper and lower plates and biased against the upper and lower plates during installation. The installation spring elements are removable after the upper and lower plates are coupled to the electrical component and the heat exchanger to remove the biasing force between the upper and lower plates.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: September 6, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventor: Alan Weir Bucher
  • Patent number: 11202369
    Abstract: A nano graphene platelet-based conductive ink comprising: (a) nano graphene platelets (preferably un-oxidized or pristine graphene), and (b) a liquid medium in which the nano graphene platelets are dispersed, wherein the nano graphene platelets occupy a proportion of at least 0.001% by volume based on the total ink volume and a process using the same. The ink can also contain a binder or matrix material and/or a surfactant. The ink may further comprise other fillers, such as carbon nanotubes, carbon nano-fibers, metal nano particles, carbon black, conductive organic species, etc. The graphene platelets preferably have an average thickness no greater than 10 nm and more preferably no greater than 1 nm. These inks can be printed to form a range of electrically or thermally conductive components or printed electronic components.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: December 14, 2021
    Assignee: Global Graphene Group, Inc.
    Inventors: Aruna Zhamu, Bor Z. Jang
  • Patent number: 11152279
    Abstract: A Monolithic Integrated Circuit (MMIC) cooling structure having a heat spreader thermally comprising a anisotropic material, such material having anisotropic heat conducting properties for conducing heat therethrough along a preferred plane, a surface of the MMIC being thermally coupled to the heat spreader, the preferred plane intersecting the surface of the MMIC; and, a thermally conductive base having a side portion thermally coupled to the heat spreader, the side portion being disposed in a plane intersecting the preferred plane.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 19, 2021
    Assignee: RAYTHEON COMPANY
    Inventors: Susan C. Trulli, Anurag Gupta
  • Patent number: 11127650
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 21, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien Lin Chang Chien, Chiu-Wen Lee, Hung-Jung Tu, Chang Chi Lee, Chin-Li Kao
  • Patent number: 11062975
    Abstract: Package structures and methods of forming the same are disclosed. The package structure includes a package, a device and a screw. The package includes a plurality of dies, an encapsulant encapsulating the plurality of dies, and a redistribution structure over the plurality of dies and the encapsulant. The device is disposed over the package, wherein the dies and the encapsulant are disposed between the device and the redistribution structure. The screw penetrates through the package and the device.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: July 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo
  • Patent number: 11004837
    Abstract: A semiconductor device includes a substrate, a semiconductor device module, and a heat conductor. The semiconductor device module is on the substrate. The semiconductor device module includes an interposer substrate, one or more semiconductor device chips, a covering resin, and a metal film. The one or more semiconductor device chips are on a first surface of the interposer substrate. The covering resin is in contact with the first surface of the interposer substrate and the one or more semiconductor device chips and encloses the one or more semiconductor device chips. The metal film is in contact with the covering resin and covers the covering resin. The heat conductor is in thermal contact with the substrate and the metal film, and has a higher thermal conductivity than the covering resin.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: May 11, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Akiko Fujimaki
  • Patent number: 10991638
    Abstract: A semiconductor package system includes a substrate, a first and a second semiconductor package, a first thermal conductive layer, a first passive device, and a heat radiation structure. The first and second semiconductor package and first passive device may be mounted on a top surface of the substrate. The first semiconductor package may include a first semiconductor chip that includes a plurality of logic circuits. The first thermal conductive layer may be on the first semiconductor package. The heat radiation structure may be on the first thermal conductive layer, the second semiconductor package, and the first passive device. The heat radiation structure may include a first bottom surface physically contacting the first thermal conductive layer, and a second bottom surface at a higher level than that of the first bottom surface. The second bottom surface may be on the second semiconductor package and/or the first passive device.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: April 27, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Heungkyu Kwon
  • Patent number: 10879225
    Abstract: A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: December 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-Keun Kim, Kyung-Suk Oh, Hwa-Il Jin, Dong-Kwan Kim, Yeong-Seok Kim, Jae-Choon Kim, Seung-Tae Hwang
  • Patent number: 10827638
    Abstract: A motor driving device includes a printed board on which a pattern is printed, and a resin board which is formed by molding a resin and on which no pattern is printed, and the printed board is provided on the resin board.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: November 3, 2020
    Assignee: FANUC CORPORATION
    Inventors: Shinichi Horikoshi, Yuuya Nakagawa
  • Patent number: 10818572
    Abstract: An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: October 27, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Young Hoon Kwark
  • Patent number: 10658263
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: May 19, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Patent number: 10652992
    Abstract: The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 12, 2020
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventors: Zhanhao Xie, Hua Miao, Chuanzhi Li, Xudong Chen
  • Patent number: 10453821
    Abstract: A connection system of semiconductor packages includes: a printed circuit board having a first surface, and a second surface, opposing the first surface; a first semiconductor package disposed on the first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; and a second semiconductor package disposed on the second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures. The first semiconductor package includes an application processor (AP) and a power management integrated circuit (PMIC) disposed side by side, and the second semiconductor package includes a memory.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Tae Lee, Han Kim, Hyung Joon Kim
  • Patent number: 10349533
    Abstract: A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: July 9, 2019
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Li-Kun Liu, Yan-Lu Li
  • Patent number: 10250233
    Abstract: A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 2, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Giuseppe Scilla
  • Patent number: 10079191
    Abstract: In embodiments described herein, an integrated circuit (IC) package is provided. The IC package may include a substrate, an IC die, and a heat spreader. The IC die may have opposing first and second surfaces, where the first surface of the IC die is coupled to a surface of the substrate. The heat spreader may have a surface coupled to the second surface of the IC die by a thermal interface (TI) material. The surface of the heat spreader may have a micro-recess which may include a micro-channel or a micro-dent to direct a flow of TI material towards or away from a predetermined area of the second surface of the IC die based on temperatures of the substrate, the IC die, and/or the heat spreader.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: September 18, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Sam Ziqun Zhao, Rezaur Rahman Khan
  • Patent number: 9691515
    Abstract: A power distribution system element formed via an additive manufacturing technique, such as applying a conductive material to a memory metal substrate, are discussed herein. In operation (e.g. in response to delivering current through the distribution system), the memory metal contracts while the conductive material expands. The result is distribution system element having reduced thermal expansion, which can be net zero coefficient of thermal expansion.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 27, 2017
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Eric Karlen, John Horowy
  • Patent number: 9622385
    Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: April 11, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Wei Hsu, Hung-Chuan Chen
  • Patent number: 9353755
    Abstract: A turbomolecular pump device includes: a turbomolecular pump main body; a power unit that drives the turbomolecular pump main body; and a water cooling unit that is provided between the turbomolecular pump main body and the power unit, wherein components provided in a casing of the power unit are classified into an intensive cooling required component that requires intensive cooling, a moderate cooling required component that requires moderate cooling, and a no cooling required component that requires substantially no cooling, the intensive cooling required component is mounted on a first high-conductivity substrate contacting to the water cooling unit, the moderate cooling required component is mounted on a second high heat-conductive substrate contacting to an inner surface of the casing, and the no cooling required component is mounted on a substrate arranged in a space between the first high heat-conductive substrate and the second high heat-conductive substrate.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: May 31, 2016
    Assignee: SHIMADZU CORPORATION
    Inventors: Yoshihiro Nagano, Masaki Ohfuji, Junichiro Kozaki
  • Patent number: 9331027
    Abstract: An integrated circuit includes active circuitry disposed at a surface of a semiconductor body and an interconnect region disposed above the semiconductor body. A thermoelectric material is disposed in an upper portion of the interconnect region away from the semiconductor body. The thermoelectric material is configured to deliver electrical energy when exposed to a temperature gradient. This material can be used, for example, in a method for detecting the repackaging of the integrated circuit after it has been originally packaged.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: May 3, 2016
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Pascal Fornara, Christian Rivero
  • Patent number: 9257360
    Abstract: A backplane for a display device and the display device are disclosed. In one aspect, the backplane includes a substrate, an active layer formed over the substrate including a channel region, a source region contacting a first side of the channel region, and a drain region contacting a second side of the channel region. The backplane further includes a gate electrode formed adjacent to the channel region, a source electrode electrically connected to the source region, and a drain electrode electrically connected to the drain region. The active layer includes a plurality of heat radiation pins that extend in a direction of the thickness of the active layer.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: February 9, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young-Jun Shin, Se-Hun Park, Jae-Hwan Oh, Young-Jin Chang
  • Patent number: 9171768
    Abstract: A semiconductor device includes an insulating substrate joined with a semiconductor chip, a case covering a surface of the insulating substrate where the semiconductor chip is joined, and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case. A portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal. The blocking section contacts the case from the outside of the case and blocks a movement of the control terminal.
    Type: Grant
    Filed: September 3, 2012
    Date of Patent: October 27, 2015
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yoshikazu Takamiya, Yoshihiro Kodaira, Kazunaga Onishi
  • Patent number: 9147634
    Abstract: Provided is a semiconductor device capable of improving heat-radiating performance of a heating element. The semiconductor device of the present invention includes: a heating element (1); a heat-radiating member (2) including an element contact portion (2a) which is held surface contact with a mounting surface (1e); a first pressing member (3) and a second pressing member (4) held in contact with the heating element (1); and a fixation screw (6) for fixing the first pressing member (3) to the heat-radiating member (2) through a through hole (3c) formed through the first pressing member (3). The first pressing member (3) and the second pressing member (4) each include an inclined surface formed so that a component force of an axial force of a tightening force of the fixation screw (6) is generated in a vertical direction with respect to the mounting surface (1e).
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 29, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventor: Katsuhisa Kodama
  • Patent number: 9144149
    Abstract: Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: September 22, 2015
    Assignee: Micron Technology, Inc.
    Inventor: Rodney L. Kirstine
  • Patent number: 9072199
    Abstract: A thermal transfer component, a thermal transfer apparatus and a method for cooling a heat generating component located upon a substrate each include a thermally conductive frame having an aperture formed completely through the thermally conductive frame within which aperture is located a thermally conductive plug. The thermally conductive plug aligns with and contacts the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. A spring may further compress the thermally conductive plug against the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. The thermally conductive plug comprises an isotropic thermal transfer material and the thermally conductive frame comprises an anisotropic thermal conductive material to provide for enhanced thermal transfer from the heat generating component to a chassis.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: June 30, 2015
    Assignee: SRC, Inc.
    Inventors: Michael Lee Fowler, Andrew Jonathan Brindle
  • Patent number: 9036349
    Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: May 19, 2015
    Assignee: Hydac Cooling GmbH
    Inventors: Roland Herber, Claudia Wetzstein
  • Publication number: 20150109738
    Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 23, 2015
    Inventors: Takafumi YAMADA, Tetsuya INABA, Yoshinari IKEDA, Katsuhiko YANAGAWA, Yoshikazu TAKAHASHI
  • Patent number: 9009956
    Abstract: Systems and methods are described that provide multilevel inverters having a plurality of levels using a simplified topology. For single phase systems, embodiments provide a full-bridge topology using bidirectional switching interconnections.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: April 21, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventors: Yaosuo Xue, Madhav Manjrekar
  • Patent number: 9001513
    Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Lifeng Pan, Hongming Li
  • Patent number: 8988861
    Abstract: The power converter includes a power conversion section which configures a circuit for power conversion, a power bus bar extending from the power conversion section, a terminal block, and a current sensor measuring current flowing in the power bus bar. The terminal block includes a mounting surface to which a terminal portion of the power bus bar is mounted. The mounting surface faces a direction substantially perpendicular to an arrangement direction in which the power conversion section and the terminal block are arranged. The current sensor is located at a side of a bottom surface on the opposite side of the mounting surface in the terminal block. The power bus bar includes: a sensor-surrounded portion surrounded by the current sensor; and an outer surface faced portion located between the sensor-surrounded portion and the terminal portion along an outer surface on the opposite side of the power conversion section.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Denso Corporation
    Inventor: Akio Yokota
  • Publication number: 20150070847
    Abstract: A power converter is provided. The power converter includes a heat sink provided with a holding unit, a plurality of semiconductor devices disposed on the heat sink, and a fixing assembly pressing each of the semiconductor devices toward the heat sink to fix the semiconductor device. The fixing assembly includes a lower push unit disposed on the semiconductor device, and an upper push unit disposed on the lower push unit to press the lower push unit downward, the upper push unit being coupled to the holding unit. The upper push unit includes a central bent part that partially protrudes downward, an insertion part disposed on each of both ends of the central bent part in a left/right direction, the insertion part having a left/right distance therebetween that gradually increases upward, and a fixing bar inserted into the insertion part.
    Type: Application
    Filed: April 29, 2014
    Publication date: March 12, 2015
    Applicant: LSIS CO., LTD.
    Inventor: JUN SEOK EOM
  • Patent number: 8937807
    Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: January 20, 2015
    Assignee: Emerson Network Power—Embedded Computing, Inc.
    Inventors: Carmelo Engracia Baquiano, Carmelo Delovino Cayaban, Paul Francis Brosas Montalbo, Joseph Estorgio Celocia
  • Publication number: 20150009631
    Abstract: Cooling assemblies and power electronics modules having multiple-level porosity structures with both a micro- and macro-level porosity are disclosed. In one embodiment, a cooling assembly includes a jet impingement assembly including a fluid inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heat transfer substrate having a surface. The heat transfer substrate is spaced apart from the jet plate. A first array of metal fibers is bonded to the surface of the heat transfer substrate in a first direction, and a second array of metal fibers is bonded to the first array of metal fibers in a second direction. Each metal fiber of the first array of metal fibers and the second array of metal fibers includes a plurality of metal particles defining a micro-porosity. The first array of metal fibers and the second array of metal fibers define a macro-porosity.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 8, 2015
    Inventor: Shailesh N. Joshi
  • Patent number: 8929078
    Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: January 6, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Volker Weeber, Heinrich Barth, Ralph Schertlen
  • Patent number: 8917511
    Abstract: A wireless power transfer system and power transmitting/receiving device according to the present invention include an antenna (resonator) 109 and a heat dissipation structure 111 with an electrically conductive thermal conductor 11, a portion of which makes thermal contact with the inductor 13 of the antenna 109 with an electrical insulator 12 interposed between them. The thermal conductor 11 is arranged to form no electrically closed loop.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 23, 2014
    Assignee: Panasonic Corporation
    Inventors: Hiroshi Yamamoto, Hiroshi Kanno
  • Publication number: 20140347820
    Abstract: The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.
    Type: Application
    Filed: September 19, 2011
    Publication date: November 27, 2014
    Applicant: Clean Wave Technologies, Inc.
    Inventors: Ruldolph Garriga, Mike Kubic
  • Patent number: 8897016
    Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: November 25, 2014
    Inventors: Brett W. Degner, Peteris K. Augenbergs, Frank Liang, Amaury J. Heresztyn, Dinesh Mathew, Thomas W. Wilson
  • Patent number: 8897015
    Abstract: The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminum, wherein at least two reinforcements are provided in the matrix next to each other, and wherein the reinforcements are spaced apart from each other.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: November 25, 2014
    Assignee: ABB Technology AG
    Inventors: Lydia Feller, Samuel Hartmann
  • Publication number: 20140340849
    Abstract: A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat spreader includes an upper plate and an extension part connected to the upper plate. At least a part of each of the first and second upper packages vertically overlaps the semiconductor chip. The upper plate may be arranged on the first upper package and the second upper package. The extension part may be arranged between the first upper package and the second upper package. The extension part has a vertical height that is greater than its horizontal width.
    Type: Application
    Filed: November 14, 2013
    Publication date: November 20, 2014
    Inventor: HYUN-KI KIM
  • Patent number: 8885343
    Abstract: A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: November 11, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Andre Lischeck, Thomas Wiesa
  • Patent number: 8854820
    Abstract: A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: October 7, 2014
    Assignee: Omron Corporation
    Inventors: Shingo Yamamoto, Akio Sumiya, Yasuo Matsuda, Naoto Inoue, Makoto Tami, Ryo Sugihara, Fumiaki Tanaka, Shintaro Hara, Shota Akinaga
  • Publication number: 20140293541
    Abstract: A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes have an evaporator section arranged substantially vertical and thermally coupled to the cold plate, a condenser section arranged at an incline, and a single bend section coupling the evaporator section and the condenser section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes.
    Type: Application
    Filed: March 7, 2014
    Publication date: October 2, 2014
    Applicant: GE Energy Power Conversion Technology Ltd
    Inventors: Daniel Francis Opila, Stephan Fatschel
  • Publication number: 20140268969
    Abstract: An arm assembly is provided. The arm assembly includes a heat exchanger assembly, a plurality of electrical components thermally coupled to the heat exchanger assembly, and a number of electrical buses. Each electrical component is coupled to, and in electrical communication with, one electrical bus. A sealing compound is then applied to each electrical bus and to a limited number of the electrical components.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: EATON CORPORATION
    Inventors: JONATHAN CROUCH, WESLEY BYRON JOHNSON, IRVING GIBBS, RON SHUENEMAN