Circuit Board Mounted Patents (Class 361/719)
  • Patent number: 10986722
    Abstract: A system for transferring heat from printed circuit boards (PCBs) with light emitting diodes (LEDs) includes a PCB having a first side and a second side and configured to be coupled to an exterior portion of an aircraft. The system further includes a LED located on the first side of the PCB. The system further includes a first metal strip located on the second side of the PCB. The system further includes a heat sink configured to contact the first metal strip to dissipate heat from the PCB.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: April 20, 2021
    Assignee: GOODRICH CORPORATION
    Inventors: Philippe Lapujade, Anthony Bartels, Andre Hessling von Heimendahl
  • Patent number: 10957620
    Abstract: An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Ho Chung, Soo Ho Noh, Jin Seok Yoon Park, Se Young Jang
  • Patent number: 10939766
    Abstract: A cooler mounting system is provided. The cooler mounting system includes at least one front bracket system and at least on rear bracket system. Each bracket system includes at least one arm portion and a base portion. The mounting system also includes a cooler that includes a front rail portion located on a front face of the cooler and a rear rail portion located on a rear face of the cooler.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: March 9, 2021
    Assignee: The Wise Company
    Inventors: Frans Weterrings, Bruce Whitmer, Rocky Martini, Michael Monroe, Butch Dingler
  • Patent number: 10939585
    Abstract: An electronic component unit includes a heatsink, a substrate on which electronic component is installed, a fixing metal fitting that fixes the electronic component and the substrate to the heatsink, and a fastening member that fixes the fixing metal fitting to the heatsink, and the heatsink includes a body portion, and a fixing portion that is projecting from the body portion toward the substrate side and to which the fixing metal fitting is fixed, and the substrate includes a through-hole that the fixing portion penetrates through, and the fixing metal fitting includes a base portion that contacts the fixing portion and is fixed to the fixing portion by the fastening member, and a pressing portion that extends from one end of the base portion, elastically deforms with respect to the base portion, and presses the electronic component toward the substrate side.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: March 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Chiaki Chida, Michito Enomoto
  • Patent number: 10897809
    Abstract: To achieve heat dissipation of a wiring pattern inexpensively with a simple configuration, a printed circuit board includes an insulating substrate having a plurality of wiring patterns on a main surface thereof, and an electronic component mounted on the main surface and connected to the wiring patterns. Further, the printed circuit board includes a heat-dissipating surface mount component that is a surface mount component. The heat-dissipating surface mount component is joined via a solder to each of the wiring patterns on the main surface to dissipate heat of the wiring pattern.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: January 19, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tsuyoshi Miura, Masahiro Koyama
  • Patent number: 10892205
    Abstract: A package structure includes a first insulation layer, a first redistribution structure, at least one electronic component, a second redistribution structure, a second insulation layer, a first heat spreader, a heat dissipation substrate, a second heat spreader and plural thermal conduction structures. A part of the second redistribution structure is disposed on a part of a top surface of the first insulation layer, and the other part of the second redistribution is located in the first insulation layer. At least one of the conducting terminals is connected with the second redistribution structure. At least one of the thermal conduction structures is connected with at least one of the first redistribution structure and the second redistribution structure, and the thermal conduction structures are respectively extended outwardly from the opposite sides of the first insulation layer to form pins.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: January 12, 2021
    Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
    Inventor: Beng Beng Lim
  • Patent number: 10890954
    Abstract: A computing device includes a support structure with at least one edge. The computing device includes a cover connected to the support structure. The cover extends to or beyond the at least one edge of the support structure by no more than between 0 and 100 microns over an edge length of at least 100 mm. A fabric cover includes a cover edge and a cover surface. The cover edge and/or the cover surface include an edge feature. A method of manufacturing a computing device is described. The method includes determining an edge of a computing device and based on the edge that was determined, cutting the fabric cover between 0 and 100 microns of the edge of the computing device over an edge length of the computing device of at least 100 mm.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: January 12, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ryan Travis Evans, John Charles Meyer, Jason Edward Tripard, Matthew Thomas Condon, Ian Howe Lewis, Bernard Maurice Schultz, III
  • Patent number: 10861772
    Abstract: A clamping mechanism adapted to clamp a heat sink on a housing of an electronic device comprises a frame, a plurality of mounting legs connected on the frame, and a plurality of elastic tabs obliquely extending from the frame towards the heat sink. The frame has a rectangular shape and includes a first arm adapted to be connected to a front end of the housing, a second arm adapted to be connected to a rear end of the housing, and a pair of third arms connected between the first arm and the second arm. The mounting legs are configured to mount the frame on the housing. The elastic tabs press the heat sink against the housing. Each of the third arms has at least one of the elastic tabs.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: December 8, 2020
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: WenYu Liu, Hongqiang Han, Hongwen Yang, Lizhou Li, Youwei Pan
  • Patent number: 10856441
    Abstract: An information handling system includes a first device including a first heat generating region, a second device including a second heat generating region, and a cooling device. The cooling device has a first hot surface on a first side of the cooling device, a first cold surface on a second side of the cooling device, a second hot surface on the second side of the cooling device, and a second cold surface on the first side of the cooling device. The first heat generating region is thermally attached to the first hot surface. First heat from the first heat generating region is transmitted to the first cold surface. The second heat generating region is thermally attached to the second hot surface. Second heat from the second heat generating region is transmitted to the second cold surface.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: December 1, 2020
    Assignee: Dell Products, L.P.
    Inventors: Iris Huang, Sean Hu
  • Patent number: 10827616
    Abstract: A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: November 3, 2020
    Assignee: KYOCERA CORPORATION
    Inventor: Seiji Hattori
  • Patent number: 10811391
    Abstract: A semiconductor device includes a base, a first semiconductor chip mounted on the base, and a second semiconductor chip provided above the first semiconductor chip. The second semiconductor chip includes a first portion, a second portion including a region directly above a center of the first semiconductor chip, and a third portion including part of a portion of the second semiconductor chip other than a region directly above the first semiconductor chip. The second portion is thicker than the first portion. The third portion is thicker than the second portion and is disposed at a position sandwiching the first semiconductor chip.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: October 20, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MEMORY CORPORATION
    Inventors: Akira Tojo, Kazuo Shimokawa, Masayuki Uchida, Takashi Ito, Masatoshi Tanabe
  • Patent number: 10765038
    Abstract: A system may include a component cage to house a heat-generating component, a cold plate assembly, and a mounting mechanism. The cold plate assembly may include a cold plate having a mating surface and a non-mating surface, the mating surface to contact a thermal transfer device of a heat-generating component installed in the component cage. The mounting mechanism movably mounts the cold plate to the component cage with the non-mating surface facing a surface of the component cage located in a first plane. The mounting mechanism allows the cold plate to move from a first orientation to a second orientation as the heat-generating component is being installed in the component cage. In the first orientation, the mating surface is inclined relative to the first plane. In the second orientation, the mating surface is parallel to the first plane when the heat-generating component is installed in the component cage.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: September 1, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, John Norton, Everett Salinas
  • Patent number: 10707964
    Abstract: An optical transceiver includes a housing and an optical transceiving module. The housing includes a main body and a heat conductive component. The heat conductive component is disposed on the main body, and a thermal conductivity of the heat conductive component is larger than a thermal conductivity of the main body. The optical transceiving module is disposed in an accommodation space of the main body of the housing.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: July 7, 2020
    Assignee: Prime World International Holdings Ltd.
    Inventors: Ming-You Lai, Chien-Te Lin, Ming-Hsing Chung
  • Patent number: 10707768
    Abstract: A power module for medium and high-voltage frequency converter and a frequency converter comprising same. The power module has a three-phase alternating current input and a single-phase alternating current output, and comprises a circuit board (100), a rectifying module (120), a capacitor bank (130), and an inverting module (140), wherein the rectifying module, the capacitor bank and the inverting module are all mounted on the circuit board. The power module has a compact structure and is convenient to cool.
    Type: Grant
    Filed: October 12, 2013
    Date of Patent: July 7, 2020
    Assignee: ABB Schweiz AG
    Inventors: Andreas Voegeli, Shen Luo
  • Patent number: 10698443
    Abstract: A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 30, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ryan Travis Evans, Bernard Maurice Schultz, III, Jason Edward Tripard, Ketan R. Shah
  • Patent number: 10643948
    Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: May 5, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Min Jung, JiAh Min
  • Patent number: 10645840
    Abstract: A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: May 5, 2020
    Assignee: AvL Technologies, Inc.
    Inventors: Ian J. Timmins, Wayne Holt, Alan Ellis, Adam C. Gropp, Keith Edenfield, Bruce Barratt
  • Patent number: 10602039
    Abstract: This document describes techniques and apparatuses that implement an ultra-compact image sensor assembly. In some embodiments, a printed circuit board assembly comprises a multilayer printed circuit board (PCB) having an asymmetric core structure. A cavity extends from an exterior layer of the multilayer PCB to an exposed portion of an interior layer of the multilayer PCB. The interior layer can be formed on the asymmetric core structure or another PCB layer above the asymmetric core structure. An image sensor is mounted at least partially in the cavity and electrically connected to conductive pads embodied on the exposed portion of the interior layer of the multilayer PCB. By mounting the image sensor in the cavity, height and planar dimensions of the image sensor assembly can be reduced, thereby enabling thinner profile imaging devices.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: March 24, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ravi Kiran Nalla, Raymond Kirk Price
  • Patent number: 10595413
    Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: March 17, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Jong Kim, Won Gi Kim, Thomas A Kim, Jeong Hae Kim
  • Patent number: 10541156
    Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 21, 2020
    Assignee: International Business Machines Corporation
    Inventors: Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz
  • Patent number: 10375833
    Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: August 6, 2019
    Assignee: NXP USA, Inc.
    Inventors: Lakshminarayan Viswanathan, Audel A. Sanchez, Fernando A. Santos, Jerry L. White
  • Patent number: 10334716
    Abstract: Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: June 25, 2019
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Eugene Anthony Pruss
  • Patent number: 10253966
    Abstract: The LED construction of the invention simplifies the thermal path for heat by directly connecting the LED and the heatsink, removing the circuit board from the thermal path. This is accomplished by a heatsink boss that protrudes from the heat sink, through an opening in the circuit board, and contacting the LED.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: April 9, 2019
    Assignee: Aluminis, LLC
    Inventors: Glen Hanington, James Grady
  • Patent number: 10237943
    Abstract: A ring-shaped light-emitting heat-dissipating fan comprises a base having a ring-shaped frame and a pivot portion; a fan pivotally disposed at the pivot portion; a ring-shaped light guide having an upper top surface, a lower top surface, an inner lateral surface, and an outer lateral surface; a lid disposed on the ring-shaped frame, with the ring-shaped light guide disposed between the base and the lid, and a receiving space formed between the lid and the ring-shaped light guide; and a ring-shaped circuit board disposed on an upper top surface of the ring-shaped light guide in the receiving space and having thereon a plurality of light-emitting elements arranged annularly. Therefore, the ring-shaped flat region dispenses with any receiving recesses for receiving the light-emitting elements. The ring-shaped circuit board controls color of light emitted from the light-emitting elements and their light emission cycles.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: March 19, 2019
    Assignee: THERMALTAKE TECHNOLOGY CO., LTD.
    Inventor: Pei-Hsi Lin
  • Patent number: 10199365
    Abstract: According to one embodiment, a semiconductor module includes a first circuit component, a first connection member, and a first wire. The first circuit component includes a first substrate, a first conductive layer, a first switching device, and a first diode. The first substrate has an insulation property. The first connection member is provided on a first electrode of the first switching device and the fourth electrode of the first diode, and has a conductive property. The first wire connects the first conductive layer and the first connection member.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 5, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akiya Kimura, Tomohiro Iguchi, Akihiro Sasaki
  • Patent number: 10194563
    Abstract: An object of the present invention is to provide a power conversion device that suppresses a bypass flow and has superior heat dissipation performance. The power conversion device according to the present invention includes a power semiconductor module 300 and a flow channel formation body 1000 on which the power semiconductor module 300 is disposed. The power semiconductor module 300 has a high thermal conductor 920 which is disposed at a position between a semiconductor chip and the flow channel formation body 1000 and a sealing material that seals a power semiconductor element and the high thermal conductor 920. The high thermal conductor 920 has a fin protruding to the flow channel formation body 1000 at the side of the flow channel formation body 1000 and a part of the sealing material surrounding the fin and a leading edge of the fin are on almost the same plane.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: January 29, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD
    Inventors: Nobutake Tsuyuno, Eiichi Ide, Takeshi Tokuyama
  • Patent number: 10178757
    Abstract: A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package and a substantially horizontal conductive structure that is coupled to the conductive fence. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: January 8, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Ah Ron Lee, Deog Soon Choi, Young Ho Lee, Boon Keat Tan, Jin Ho Choi
  • Patent number: 10109591
    Abstract: An integrated shield electronic component package includes a substrate having an upper surface, a lower surface, and sides extending between the upper surface and the lower surface. An electronic component is mounted to the upper surface of the substrate. An integrated shield is mounted to the upper surface of the substrate and includes a side shielding portion directly adjacent to and covering the sides of the substrate. The integrated shield covers and provides an electromagnetic interference (EMI) shield for the electronic component, the upper surface and sides of substrate. Further, the integrated shield is integrated within the integrated shield electronic package. Thus, separate operations of mounting an electronic component package and then mounting a shield are avoided thus simplifying manufacturing and reducing overall assembly costs.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: October 23, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Paul Mescher, Danny Brady
  • Patent number: 10090279
    Abstract: In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: October 2, 2018
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Seungwon Im, Mankyo Jong, ByoungOk Lee, Joonseo Son, Oseob Jeon
  • Patent number: 10090234
    Abstract: Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. Methods and systems for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: October 2, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Michael G. Kelly, Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner
  • Patent number: 10074586
    Abstract: A thermal dissipation device includes a main body and a support member. The main body has an upper surface, a lower surface opposite to the upper surface, and a lateral surface. The main body defines an injection hole extending through the main body, and includes an inner ring protruding from the upper surface and adjacent to the injection hole and an outer ring protruding from the upper surface and adjacent to the lateral surface. The support member connects to the lateral surface of the main body. An upper surface of the inner ring is higher than an upper surface of the outer ring. A first intersection point between the inner ring and the upper surface of the main body is higher than a second intersection point between the outer ring and the upper surface of the main body.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: September 11, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Pin Hung Chiu, Yu Li Chung, Shu Ling Su, Yi Tzu Lin
  • Patent number: 10034379
    Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 24, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen
  • Patent number: 9936600
    Abstract: Disclosed herein is a motor drive unit. The motor drive unit includes a base part; a middle base part disposed above the base part; a heat discharging part mounted on the base part and disposed under the middle base part to slide on the middle base part, wherein an area in which the heat discharging part is installed is smaller than an area of the middle base part; and a power PCB part disposed above the middle base part, an EMC PCB part disposed above the power PCB part with a spacing; a control PCB part coupled with a side portion of the power PCB part; and a condenser unit penetrating the middle base part to be fixed to it, wherein a lower end of the condenser unit is disposed on a side of the heat discharging part.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: April 3, 2018
    Assignee: LSIS CO., LTD.
    Inventors: Dong-Sik Kim, Chun-Suk Yang
  • Patent number: 9917034
    Abstract: A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: March 13, 2018
    Assignee: SEMICAPS PTE LTD
    Inventors: Choon Meng Chua, Lian Ser Koh, Sze Wei Choong
  • Patent number: 9907215
    Abstract: A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: February 27, 2018
    Assignee: Semikron GmbH & Co., KG
    Inventors: Klaus Backhaus, Roland Bittner, Marco Lederer, Rainer Popp
  • Patent number: 9848512
    Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: December 19, 2017
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: David A. Wright, David Dean, Robert W. Ellis
  • Patent number: 9839116
    Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: December 5, 2017
    Assignee: Abaco Systems, Inc.
    Inventors: Graham Charles Kirk, Zeshan Jabar Hussain
  • Patent number: 9793189
    Abstract: A printed wiring board assembly includes a first board including a first surface; a second board including a second surface and facing the first surface; a plurality of first electrodes formed on a bottom surface of a recess formed in one of the first and the second surfaces; a plurality of second electrodes formed on the one of the first surface and the second surface and positioned outside the recess; a plurality of first solders each coupled to a respective one of the plurality of first electrodes; and a plurality of second solders each coupled to a respective one of the plurality of second electrodes, wherein the plurality of first electrodes are formed at a larger pitch than a pitch at which the plurality of second electrodes are formed, and a size of each the plurality of first solders is larger than a size of the plurality of second solders.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: October 17, 2017
    Assignee: FUJITSU LIMITED
    Inventor: Manabu Watanabe
  • Patent number: 9645619
    Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: May 9, 2017
    Assignee: Corsair Memory, Inc.
    Inventor: Robert Michael Kinstle, III
  • Patent number: 9622387
    Abstract: An air directing device includes a rack-coupling portion that couples the air directing device with a rack, and one or more air directing portions. The air directing portions include one or more openings and one or more scoops that direct air from outside the rack into at least one of the openings when the air directing device is coupled to the rack.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: April 11, 2017
    Assignee: Amazon Technologies, Inc.
    Inventor: Michael P. Czamara
  • Patent number: 9614620
    Abstract: A coaxial transmitter optical subassembly (TOSA) including a cuboid type TO laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The cuboid type TO laser package is made of a thermally conductive material and has substantially flat outer surfaces that may be thermally coupled to substantially flat outer surfaces on a transceiver housing and/or on other cuboid type TO laser packages. An optical transceiver may include multiple coaxial TOSAs with the cuboid type TO laser packages stacked in the transceiver housing. The cuboid type TO laser package may thus provide improved thermal characteristics and a reduced size within the optical transceiver.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: April 4, 2017
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Chong Wang, Justin Lii, Zhengyu Miao
  • Patent number: 9609739
    Abstract: According to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: March 28, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Naoya Kamimura
  • Patent number: 9585290
    Abstract: A rack mountable 10U storage unit includes a plurality of memory modules arranged in multiple rows. The storage unit also has control circuitry. Each of the memory modules have multiple heating zones and a heat spreader coupled to it. The memory modules may have heat spreaders having differing thermal dissipation capacity coupled to them. The storage unit can accommodate up to 120 memory modules due to a unique method of placing the individual memory modules.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: February 28, 2017
    Assignee: Skyera, LLC
    Inventors: Pinchas Herman, William Radke, Radoslav Danilak
  • Patent number: 9572244
    Abstract: A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: February 14, 2017
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Sheng-Huang Lin
  • Patent number: 9563238
    Abstract: A fixing member is used for fixing a plate to a frame. The fixing member includes a body and a fixing plate extending from the body. The body can lock with the frame along a first direction substantially parallel to the body. The fixing plate is configured to deform along a second direction substantially perpendicular to the first direction and lock with an aligning portion of the plate. An electronic device is also provided.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: February 7, 2017
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Wei-Yong Ma, Da-Long Sun
  • Patent number: 9553038
    Abstract: An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: January 24, 2017
    Assignee: Raytheon Company
    Inventors: Christopher R. Koontz, Charles Chu, Rosalio S. Vidaurri
  • Patent number: 9520386
    Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: December 13, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventors: Si Joon Song, Hyuk Hwan Kim, Seok Hyun Nam, Byoung Dae Ye, Young Keun Lee
  • Patent number: 9497889
    Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: November 15, 2016
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: David A. Wright, David Dean, Robert W. Ellis
  • Patent number: 9414530
    Abstract: Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: August 9, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: John Avery Howard, David Eric Peters, Ross Kenneth Thayer
  • Patent number: 9385055
    Abstract: A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: July 5, 2016
    Assignees: ATI Technologies ULC, Advanced Micro Devices, Inc.
    Inventors: Gamal Refai-Ahmed, Michael Z. Su, Bryan Black, Maxat Touzelbaev, Yizhang Yang