For Printed Circuit Board Patents (Class 361/720)
  • Patent number: 11224140
    Abstract: Embodiments of the present disclosure provide a top cover arrangement for a storage and the corresponding storage. The storage comprises a drawer chassis which accommodates disks that are organized among a plurality of rows. The top cover arrangement covers the disks in a foldable manner and comprises: a substrate covering the disks and being flexible; and a plurality of folding parts mounted on the substrate and corresponding to the plurality of the rows; the folding parts being adapted to be at least partially folded to expose at least one row of disks in response to the disks being pulled out of the drawer chassis.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: January 11, 2022
    Assignee: EMC IP HOLDING COMPANY, LLC
    Inventors: Haifang Zhai, Yujie Zhou, Qingqiang Guo, Weidong Zuo, Wenjin Seraph Xu
  • Patent number: 11114372
    Abstract: An integrated circuit includes a main body having a top and a bottom; and upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body, in which each of the upper pins has a first protruding portion protruding toward outside from a side or the top of the main body, and each of the lower pins has a second protruding portion protruding toward outside from the side or the bottom of the main body.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: September 7, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jungjae Kim, Heejung Hong, Soondong Cho, Hyungjin Choe
  • Patent number: 11092515
    Abstract: The present invention relates to a platform for testing collisions or near-collision situations between a collision body, in particular a vehicle, and a test object. The platform has a base body, which has a bottom surface and an attachment surface formed opposite to the bottom surface, wherein an attachment device is formed on the attachment surface for attaching the test object. Furthermore, the platform has at least one roller element, which is arranged at the bottom surface, wherein the roller element configured such that the base body is displaceable along a ground by the roller element. An installation box having an installation volume is arranged in a receiving opening of the base body, wherein the installation box is conceived in the receiving opening of the base body such that a temperature control region of the installation box is in contact with a surroundings of the base body.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 17, 2021
    Assignee: 4ACTIVESYSTEMS GMBH
    Inventors: Reinhard Hafellner, Martin Fritz
  • Patent number: 11058005
    Abstract: An electronic component (E), including at least one circuit carrier (1), which is populated with a number of mechanical and/or electronic component parts (2 to 4) and has at least one contact opening (1.3) for forming a mechanical and/or electrical contact-connection point (KS) to at least one of the component parts (2 to 4), wherein at least one of the component parts (4) is at a distance from the circuit carrier (1), includes at least one electrically conductive housing (4.1) and at least one electrical contact element (4.2) projecting out of the housing (4.1), the contact element being insulated from the housing (4.1) and being connected at least in a materially bonded manner to the contact opening (1.3) of the circuit carrier (1), wherein at least one seal element (5) is arranged in the region of the contact-connection point (KS), in particular between the circuit carrier (1) and the housing (4) of the component part (4).
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 6, 2021
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Helmut Karrer, Peter Volkert, Michael Taufer, Konrad Härder
  • Patent number: 11051392
    Abstract: The present invention relates to a heat dissipating device disposed on a circuit board. The heat dissipating device is provided with a first glue layer, a first graphene composite heat dissipating layer, a second glue layer, a second graphene composite heat dissipating layer, and a resin layer in this order from bottom to top. Furthermore, the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are doped with a plurality of metal particles, and the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are respectively covered by a metal layer. The above structure is simple, space-saving, and has good thermal conductivity.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: June 29, 2021
    Assignee: Team Group Inc.
    Inventor: Chin Feng Chang
  • Patent number: 11037857
    Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: June 15, 2021
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Tzu-Hsuan Wang, Tze-Yang Yeh, Chun-Lung Wu
  • Patent number: 11005155
    Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: May 11, 2021
    Assignee: SONY CORPORATION
    Inventors: Wasif Tanveer Khan, Mudassar Nauman, Arndt Thomas Ott, Ramona Hotopan
  • Patent number: 10901266
    Abstract: According to one embodiment, a display device includes a first substrate with a first alignment film, a second substrate with a second alignment film, and a liquid crystal layer interposed therebetween. The first substrate has first and second electrodes. An initial alignment direction of liquid crystal molecules of the liquid crystal layer is parallel to a first direction or a direction orthogonal to the first direction. The second electrode includes comblike electrodes extending parallel to the first direction and a connecting portion which connects the comblike electrodes. The connecting portion includes a projection which projects in a second direction more than an outermost comblike electrode.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: January 26, 2021
    Assignee: Japan Display Inc.
    Inventor: Toshiharu Matsushima
  • Patent number: 10881029
    Abstract: Provided is a power relay assembly. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate equipped with at least one electrical element on one surface thereof and comprising a plastic material having heat dissipation and insulation properties; and at least one bus bar which comprises a contact part which is electrically connected to the electrical element and directly contacts one surface of the support plate, wherein the contact part of the bus bar is fixed to one surface of the support plate.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: December 29, 2020
    Inventors: Min Ho Won, Seung Jae Hwang
  • Patent number: 10813255
    Abstract: A motor drive device provided to a control panel to drive a plurality of motors includes a plate-shaped fin base that includes a first plate surface and a second plate surface, and a plate-shaped heat radiator that is thermally connected to the first plate surface and is provided with a first normal to its plate surface intersecting a second normal to the first plate surface. The motor drive device also includes a semiconductor device that drives a first motor and is thermally connected to the heat radiator, a semiconductor device that drives a second motor and is thermally connected to the first plate surface, and fins that are thermally connected to the second plate surface opposite from the first plate surface of the fin base and are provided in an air passage formed in the control panel.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: October 20, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshitomo Hayashi, Satoru Kozuka, Yasuhiro Takadera, Takeshi Obara
  • Patent number: 10763218
    Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Sruti Chigullapalli, Leslie Fitch, Boping Wu
  • Patent number: 10630150
    Abstract: A housing member includes a case member and a cover member having an insertion portion inserted into a seal groove. The case member and the cover member assembled together provide a housing space for housing a protective component inside. A housing space side inner groove surface of a peripheral wall portion and an external space side inner groove surface of the peripheral wall portion extend along an insertion direction of the insertion portion into the seal groove. A first distance between the external space side peripheral surface and the external space side inner groove surface opposite to the external space side peripheral surface is larger than a second distance between a housing space side peripheral surface extending along the insertion direction on the housing space side of the insertion portion and the housing space side inner groove surface opposite to the housing space side peripheral surface.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: April 21, 2020
    Assignee: DENSO CORPORATION
    Inventors: Takashi Tsuboi, Koji Matsuo
  • Patent number: 10617037
    Abstract: A plug assembly includes an upper cover, a heat-conducting element, a heat-conducting pipe, a circuit board and a lower cover. A rear end of a top of the upper cover is equipped with a plurality of heat dissipation fins. The heat-conducting element includes a first heat-conducting element equipped on a bottom surface of the upper cover, and a second heat-conducting element fastened to a bottom surface of the first heat-conducting element. A top of the first heat-conducting element opens a receiving space. The heat-conducting pipe is received in the receiving space. The heat-conducting pipe extends rearward through a rear end of the receiving space. The circuit board is mounted in the upper cover and contacts with the second heat-conducting element. The lower cover is mounted to the upper cover.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 7, 2020
    Assignee: NANO SHIELD TECHNOLOGY CO., LTD.
    Inventor: James Cheng Lee
  • Patent number: 10609842
    Abstract: A storage module structure of a storage assembly includes an upper shielding component, a lower shielding component and a memory component. An outer surface of the upper shielding component has a plurality of heat-conducting units. The lower shielding component is located above the upper shielding component, and an accommodating space is defined between the upper shielding component and the lower shielding component. The memory component is located in the accommodating space. The heat-conducting units contact an external structure, and a thermal energy generated by the memory component is conducted to the external structure through the plurality of heat-conducting units.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 31, 2020
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventors: Yung-Hsing Yin, Jen-Chieh Pan
  • Patent number: 10582613
    Abstract: A printed circuit board includes: a board body including one or more wiring layers; a control chip and a target electronic component arranged on one of the one or more the wiring layers on a surface of the board body; a target wiring layer where the target electronic component is placed including a copper absent area around the target electronic component, and a ground backflow connection arranged around the target electronic component to electrically connect a copper area which is formed by the copper absent area with a primary copper area on the target wiring layer.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: March 3, 2020
    Assignee: Hisense Mobile Communications Technology Co., Ltd
    Inventor: Qingyi Zhao
  • Patent number: 10530038
    Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: January 7, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shao-En Hsu, Huei-Shyong Cho, Shih-Wen Lu
  • Patent number: 10420223
    Abstract: In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 17, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Wataru Iwazaki, Masahito Komasaki
  • Patent number: 10398021
    Abstract: A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: August 27, 2019
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Hiram Avalos, Jeff Reuter, Mark Ryskamp, Motozo Horikawa
  • Patent number: 10388013
    Abstract: A matching transformation is determined for matching a patient image set of images of an anatomical body structure of a patient with an atlas image set of images of a general anatomical structure including anatomical atlas elements. Atlas spatial information containing spatial information on the general anatomical structure, and element representation information are obtained. The element representation information describes representation data sets which contain information on representations of the plurality of atlas elements in the atlas images to be determined are obtained, and also describes a determination rule for determining respective representation data sets for respective atlas elements in accordance with different respective parameter sets. Patient data is acquired by acquiring the patient image set and the parameter sets which are respectively associated with the images of the patient image set.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: August 20, 2019
    Assignee: Brainlab AG
    Inventor: Andreas Blumhofer
  • Patent number: 10374490
    Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: August 6, 2019
    Assignee: DENSO CORPORATION
    Inventors: Toshihisa Yamamoto, Hideki Kabune, Yuuta Kadoike
  • Patent number: 10360515
    Abstract: An information processing apparatus includes a control unit that creates a plurality of learning information items including an input image and a teacher image as an expected value by image-processing the input image in accordance with a scenario described with a program code, and supplies the created plurality of learning information items to a machine learning module that composes an image processing algorithm by machine learning.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: July 23, 2019
    Assignee: SONY CORPORATION
    Inventor: Hiroshi Arai
  • Patent number: 10352627
    Abstract: A nucleation device for causing phase change in a heat storage material from a liquid state to a solid state, the nucleation device including: an elastic member including a plurality of annular portions with a ring shape wound in substantially close contact with one another, the elastic member being elastically displaceable such that adjacent pairs of the plurality of annular portions in substantially close contact with one another separate from one another; wherein the heat storage material is caused to phase change by the elastic member elastically displacing while disposed in the heat storage material.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 16, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Teruaki Yuoka, Jian Guang Li, Hiroto Yoshino
  • Patent number: 10331106
    Abstract: A rack storage unit for use in an automation system for a storage of work pieces and/or work piece pallets and/or tools, which includes a base frame with a rack stand and two rack side parts arranged at a distance from one another, wherein facing surfaces of the rack side parts are provided with interfaces for mounting placement devices. It is provided that the base frame is produced as a one-piece cast body from artificial stone, and that the interfaces are held by adhesive force as separately formed insert parts in the facing surfaces of the rack side parts.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: June 25, 2019
    Assignee: MASCHINENFABRIK BERTHOLD HERMLE AG
    Inventors: Franz-Xaver Bernhard, Tobias Schworer, Michael Dietmann, Frank Bille
  • Patent number: 10334722
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Phillip Duane Isaacs, David C. Long
  • Patent number: 10321555
    Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: June 11, 2019
    Assignee: Raytheon Company
    Inventors: Susan C. Trulli, Christopher M. Laighton, Elicia K. Harper
  • Patent number: 10292254
    Abstract: A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: May 14, 2019
    Assignee: Tesat-Spacecom GmbH & Co. KG
    Inventors: Hanspeter Katz, Jochen Artmann, Eric Wolf, Christian Rapp, Ulrich Koeger
  • Patent number: 10251262
    Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: April 2, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Patent number: 10206288
    Abstract: A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: February 12, 2019
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Ping Mei, Gregory L. Whiting, Brent S. Krusor
  • Patent number: 10201118
    Abstract: The electric power converter has a transformer having a primary coil and a secondary coil, a first circuit section connected to the primary coil side of the transformer, a second circuit section connected to the secondary coil side of the transformer, and a case that accommodates the transformer, the first circuit section, and the second circuit section inside and has a lower opening and an upper opening. An air passage communicated with an exterior of the case is formed inside the case in a vertical direction between the lower opening and the upper opening. At least one of the transformer, the first circuit section, or the second circuit sections is disposed in the air passage.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: February 5, 2019
    Assignee: DENSO CORPORATION
    Inventor: Hisato Tagei
  • Patent number: 10121727
    Abstract: The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: November 6, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Michael E. Lucas, Nikola Ikonomov, John I. Kull
  • Patent number: 10030863
    Abstract: In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: July 24, 2018
    Assignee: Cree, Inc.
    Inventors: Paul Kenneth Pickard, Curt Progl, Joshua N. Gray
  • Patent number: 10028413
    Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate. The plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount and a temperature sensitive component mount in electrical continuity with the heat generating component mount, where a shielding path projection extends from the heat generating component mount towards the temperature sensitive component mount, and at least one of the thermal conductor traces is transverse to the shielding path projection between the heat generating component mount and the temperature sensitive component mount to steer heat flux away from the temperature sensitive component mount.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: July 17, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan Mehmet Dede, Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg
  • Patent number: 9989234
    Abstract: An interior aircraft LED light unit includes at least one printed circuit board, on which a plurality of LEDs are connected to a power source, each one of the plurality of LEDs having a predetermined distance to the power source, and each one of the plurality of LEDs being associated with a respective thermal transfer member having a predetermined size, for transferring heat away from the respective LED, wherein, for at least some of the plurality of LEDs the predetermined size of the respective thermal transfer member varies with the predetermined distance of the LED to the power source.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 5, 2018
    Assignee: GOODRICH LIGHTING SYSTEMS GMBH
    Inventors: Robert Trinschek, Elmar Schrewe, Tomasz Kordecki
  • Patent number: 9978138
    Abstract: An image comparison device includes: a storage in which a model image is stored, the model image including a position of a feature point of a comparison object and a luminance gradient direction at the position of the feature point; a feature amount acquisition unit configured to acquire the position of the feature point and the luminance gradient direction at the position of the feature point from an input image; and an image comparison unit configured to compare the model image and the input image. The image comparison unit performs image comparison by providing an allowable range in both the position of the feature point and the luminance gradient direction at the position of the feature point position.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: May 22, 2018
    Assignee: OMRON Corporation
    Inventor: Yoshinori Konishi
  • Patent number: 9904103
    Abstract: The disclosure provides an ultra thin display module, comprising a LED substrate, a plurality of LED lamp beads, a secondary lens and a display panel. The plurality of LED lamp beads is disposed on the array of the LED substrate, the secondary lens is disposed on the LED substrate, the secondary lens is encapsuled inside the top surface of the LED lamp beads, and the display panel is disposed on the top surface of the secondary lens. The ultra thin display module and method for assembling the same of the disclosure use a brand new structure of ultra thin display module, such that the thickness of the module is greatly decreased as compared with the present techniques.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: February 27, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Yanxue Zhang
  • Patent number: 9872380
    Abstract: [Problem] To obtain a ceramic circuit board having superior crack-resistance with respect to ultrasonic bonding. [Solution] The abovementioned problem is solved by a ceramic circuit board characterized in that a metal circuit board is bonded to one surface of a ceramic substrate and a metal heat radiation plate is bonded to the other surface of the ceramic substrate, wherein the crystal grain size in the metal circuit board is at least 20 ?m and at most 70 ?m. This ceramic circuit board can be manufactured by arranging the metal circuit board on one surface of the ceramic substrate and arranging the metal heat radiation plate on the other surface of the ceramic substrate, and bonding in a vacuum of at most 1×10?3 Pa, at a bonding temperature of at least 780° C. and at most 850° C., for a retention time of at least 10 minutes and at most 60 minutes.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: January 16, 2018
    Assignee: Denka Company Limited
    Inventors: Ryota Aono, Akimasa Yuasa, Takeshi Miyakawa
  • Patent number: 9869520
    Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: January 16, 2018
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Ercan Mehmet Dede, Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg
  • Patent number: 9854710
    Abstract: An information processing device includes: one or more information processing device main bodies; a first heat exchanger configured to cool air to be introduced into the one or more information processing device main bodies; an air blower configured to introduce the air into the one or more information processing device main bodies; an evaporator through which discharged air discharged from the one or more information processing device main bodies passes; a receiving pan configured to receive water generated by dew condensation in the first heat exchanger; and a water supply member configured to supply the water in the receiving pan to the evaporator.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: December 26, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Keita Hirai, Tsuyoshi So, Naofumi Kosugi
  • Patent number: 9769916
    Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: September 19, 2017
    Assignees: OMRON AUTOMOTIVE ELECTRONICS CO., LTD., AIKOKIKI MANUFACTURING CO., LTD.
    Inventors: Tomoyoshi Kobayashi, Masato Kasashima, Koichi Suzuki
  • Patent number: 9713287
    Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: July 18, 2017
    Assignee: Artesyn Embedded Computing, Inc.
    Inventors: Suzanne Marye Wong, Martin Peter John Cornes, Robert Charles Tufford
  • Patent number: 9705062
    Abstract: A method of encapsulating a thermoelectric device and its associated thermoelectric elements in an inert atmosphere and a thermoelectric device fabricated by such method are described. These thermoelectric devices may be intended for use under conditions which would otherwise promote oxidation of the thermoelectric elements. The capsule is formed by securing a suitably-sized thin-walled strip of oxidation-resistant metal to the ceramic substrates which support the thermoelectric elements. The thin-walled metal strip is positioned to enclose the edges of the thermoelectric device and is secured to the substrates using gap-filling materials. The strip, substrates and gap-filling materials cooperatively encapsulate the thermoelectric elements and exclude oxygen and water vapor from atmospheric air so that the elements may be maintained in an inert, non-oxidizing environment.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: July 11, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: James R. Salvador, Jeffrey Sakamoto, Youngsam Park
  • Patent number: 9693444
    Abstract: A mobile terminal is disclosed. A mobile terminal according to the present invention comprises a housing; PCB installed inside the housing; and a battery pack disposed at least one side of the PCB and including at least one heat conductive layer radiating heat generated from the PCB. According to the present invention, a mobile terminal is capable of radiating heat generated from PCB by disposing part of a battery pack on one side of the PCB and of increasing capacity of the battery pack by utilizing a housing for the battery pack.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: June 27, 2017
    Assignee: LG Electronics Inc.
    Inventors: Sungjin Kim, Seongcheol Lee
  • Patent number: 9640467
    Abstract: An electronic chip is disclosed, including at least one electronic circuit and two or more contact-making pins, wherein the chip additionally has at least one fixing pin. A sensor arrangement is also disclosed for detecting at least one physical or chemical variable relating to a carrier. The sensor arrangement has at least one sensor element which is directly or indirectly coupled to the carrier, and also has an electronic interface arrangement with at least one leadframe, at least one electronic circuit connected to the leadframe, and also at least one electrically insulating housing part which is embodied in such a way that it performs at least one of the functions of (i) at least partly enclosing the at least one electronic circuit, and (ii) mechanically supporting at least parts of the leadframe to one another.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: May 2, 2017
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Stephan Risch, Dietmar Huber, Günther Romhart, Andreas Döring
  • Patent number: 9559047
    Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: January 31, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Milko Paolucci
  • Patent number: 9549470
    Abstract: There is provided an adapter device for connecting and interfacing a transceiver module in conformance with first mechanical specifications and first connector specifications into a host socket adapted to receive transceiver modules in conformance with second mechanical specifications and second connector specifications.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: January 17, 2017
    Assignee: EXFO Inc.
    Inventors: Michel Blier, Patrick Begin, Sergio Prestipino
  • Patent number: 9516790
    Abstract: A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: December 6, 2016
    Assignee: Harman Becker Automotive Systems GmbH
    Inventor: Valod Noshadi
  • Patent number: 9507108
    Abstract: An optical module includes: a flexible board having a first surface on which a component is mounted and a second surface opposite to the first surface; a bottom electrode part having a bottom surface on which a heat release electrode is provided, the bottom electrode part mounted on the first surface of the flexible board; and a heat release member configured to absorb heat from the bottom electrode part and release the heat to outside. The heat release member is arranged close to said second surface of the flexible board at a position where the bottom electrode part is mounted.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: November 29, 2016
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Shinichi Aoki
  • Patent number: 9468119
    Abstract: A housing element for a control unit housing has one or more first edge sections for contact with a second edge section of a second housing element allocated to the control unit housing an intermediate layer of sealant is able to be hardened with the assistance of air moisture, whereas at least one of the first edge sections features at least one recess for the communication of the sealant in the state of contact of the housing elements with air containing the air moisture.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: October 11, 2016
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventor: Werner Beck
  • Patent number: 9460981
    Abstract: A semiconductor module uses pin bonding and improves cooling capacity. The semiconductor module includes a semiconductor element; a pin electrically and thermally connected to an upper surface of the semiconductor element; a pin wiring substrate having a first metal film and a second metal film respectively provided on the rear and front surfaces of a pin wiring insulating substrate, the first metal film being bonded to the pin; a first DCB substrate having a third metal film and a fourth metal film respectively provided on the rear and front surfaces of a first ceramic insulating substrate, the third metal film being bonded to a lower surface of the semiconductor element; a first cooler thermally connected to the fourth metal film; and a second cooler that thermally connected to the second metal film.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: October 4, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Takafumi Yamada
  • Patent number: 9443798
    Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: September 13, 2016
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Milko Paolucci