Abstract: A motor drive device provided to a control panel to drive a plurality of motors includes a plate-shaped fin base that includes a first plate surface and a second plate surface, and a plate-shaped heat radiator that is thermally connected to the first plate surface and is provided with a first normal to its plate surface intersecting a second normal to the first plate surface. The motor drive device also includes a semiconductor device that drives a first motor and is thermally connected to the heat radiator, a semiconductor device that drives a second motor and is thermally connected to the first plate surface, and fins that are thermally connected to the second plate surface opposite from the first plate surface of the fin base and are provided in an air passage formed in the control panel.

Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

Abstract: A housing member includes a case member and a cover member having an insertion portion inserted into a seal groove. The case member and the cover member assembled together provide a housing space for housing a protective component inside. A housing space side inner groove surface of a peripheral wall portion and an external space side inner groove surface of the peripheral wall portion extend along an insertion direction of the insertion portion into the seal groove. A first distance between the external space side peripheral surface and the external space side inner groove surface opposite to the external space side peripheral surface is larger than a second distance between a housing space side peripheral surface extending along the insertion direction on the housing space side of the insertion portion and the housing space side inner groove surface opposite to the housing space side peripheral surface.

Abstract: A plug assembly includes an upper cover, a heat-conducting element, a heat-conducting pipe, a circuit board and a lower cover. A rear end of a top of the upper cover is equipped with a plurality of heat dissipation fins. The heat-conducting element includes a first heat-conducting element equipped on a bottom surface of the upper cover, and a second heat-conducting element fastened to a bottom surface of the first heat-conducting element. A top of the first heat-conducting element opens a receiving space. The heat-conducting pipe is received in the receiving space. The heat-conducting pipe extends rearward through a rear end of the receiving space. The circuit board is mounted in the upper cover and contacts with the second heat-conducting element. The lower cover is mounted to the upper cover.

Abstract: A storage module structure of a storage assembly includes an upper shielding component, a lower shielding component and a memory component. An outer surface of the upper shielding component has a plurality of heat-conducting units. The lower shielding component is located above the upper shielding component, and an accommodating space is defined between the upper shielding component and the lower shielding component. The memory component is located in the accommodating space. The heat-conducting units contact an external structure, and a thermal energy generated by the memory component is conducted to the external structure through the plurality of heat-conducting units.

Abstract: A printed circuit board includes: a board body including one or more wiring layers; a control chip and a target electronic component arranged on one of the one or more the wiring layers on a surface of the board body; a target wiring layer where the target electronic component is placed including a copper absent area around the target electronic component, and a ground backflow connection arranged around the target electronic component to electrically connect a copper area which is formed by the copper absent area with a primary copper area on the target wiring layer.

Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate.

Abstract: In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Abstract: A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.

Abstract: A matching transformation is determined for matching a patient image set of images of an anatomical body structure of a patient with an atlas image set of images of a general anatomical structure including anatomical atlas elements. Atlas spatial information containing spatial information on the general anatomical structure, and element representation information are obtained. The element representation information describes representation data sets which contain information on representations of the plurality of atlas elements in the atlas images to be determined are obtained, and also describes a determination rule for determining respective representation data sets for respective atlas elements in accordance with different respective parameter sets. Patient data is acquired by acquiring the patient image set and the parameter sets which are respectively associated with the images of the patient image set.

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

Abstract: An information processing apparatus includes a control unit that creates a plurality of learning information items including an input image and a teacher image as an expected value by image-processing the input image in accordance with a scenario described with a program code, and supplies the created plurality of learning information items to a machine learning module that composes an image processing algorithm by machine learning.

Abstract: A nucleation device for causing phase change in a heat storage material from a liquid state to a solid state, the nucleation device including: an elastic member including a plurality of annular portions with a ring shape wound in substantially close contact with one another, the elastic member being elastically displaceable such that adjacent pairs of the plurality of annular portions in substantially close contact with one another separate from one another; wherein the heat storage material is caused to phase change by the elastic member elastically displacing while disposed in the heat storage material.

Abstract: A rack storage unit for use in an automation system for a storage of work pieces and/or work piece pallets and/or tools, which includes a base frame with a rack stand and two rack side parts arranged at a distance from one another, wherein facing surfaces of the rack side parts are provided with interfaces for mounting placement devices. It is provided that the base frame is produced as a one-piece cast body from artificial stone, and that the interfaces are held by adhesive force as separately formed insert parts in the facing surfaces of the rack side parts.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.

Abstract: A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.

Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.

Abstract: A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship.

Abstract: The electric power converter has a transformer having a primary coil and a secondary coil, a first circuit section connected to the primary coil side of the transformer, a second circuit section connected to the secondary coil side of the transformer, and a case that accommodates the transformer, the first circuit section, and the second circuit section inside and has a lower opening and an upper opening. An air passage communicated with an exterior of the case is formed inside the case in a vertical direction between the lower opening and the upper opening. At least one of the transformer, the first circuit section, or the second circuit sections is disposed in the air passage.

Abstract: The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.

Abstract: In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.

Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate. The plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount and a temperature sensitive component mount in electrical continuity with the heat generating component mount, where a shielding path projection extends from the heat generating component mount towards the temperature sensitive component mount, and at least one of the thermal conductor traces is transverse to the shielding path projection between the heat generating component mount and the temperature sensitive component mount to steer heat flux away from the temperature sensitive component mount.

Abstract: An interior aircraft LED light unit includes at least one printed circuit board, on which a plurality of LEDs are connected to a power source, each one of the plurality of LEDs having a predetermined distance to the power source, and each one of the plurality of LEDs being associated with a respective thermal transfer member having a predetermined size, for transferring heat away from the respective LED, wherein, for at least some of the plurality of LEDs the predetermined size of the respective thermal transfer member varies with the predetermined distance of the LED to the power source.

Abstract: An image comparison device includes: a storage in which a model image is stored, the model image including a position of a feature point of a comparison object and a luminance gradient direction at the position of the feature point; a feature amount acquisition unit configured to acquire the position of the feature point and the luminance gradient direction at the position of the feature point from an input image; and an image comparison unit configured to compare the model image and the input image. The image comparison unit performs image comparison by providing an allowable range in both the position of the feature point and the luminance gradient direction at the position of the feature point position.

Abstract: The disclosure provides an ultra thin display module, comprising a LED substrate, a plurality of LED lamp beads, a secondary lens and a display panel. The plurality of LED lamp beads is disposed on the array of the LED substrate, the secondary lens is disposed on the LED substrate, the secondary lens is encapsuled inside the top surface of the LED lamp beads, and the display panel is disposed on the top surface of the secondary lens. The ultra thin display module and method for assembling the same of the disclosure use a brand new structure of ultra thin display module, such that the thickness of the module is greatly decreased as compared with the present techniques.

Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount.

Abstract: [Problem] To obtain a ceramic circuit board having superior crack-resistance with respect to ultrasonic bonding. [Solution] The abovementioned problem is solved by a ceramic circuit board characterized in that a metal circuit board is bonded to one surface of a ceramic substrate and a metal heat radiation plate is bonded to the other surface of the ceramic substrate, wherein the crystal grain size in the metal circuit board is at least 20 ?m and at most 70 ?m. This ceramic circuit board can be manufactured by arranging the metal circuit board on one surface of the ceramic substrate and arranging the metal heat radiation plate on the other surface of the ceramic substrate, and bonding in a vacuum of at most 1×10?3 Pa, at a bonding temperature of at least 780° C. and at most 850° C., for a retention time of at least 10 minutes and at most 60 minutes.

Abstract: An information processing device includes: one or more information processing device main bodies; a first heat exchanger configured to cool air to be introduced into the one or more information processing device main bodies; an air blower configured to introduce the air into the one or more information processing device main bodies; an evaporator through which discharged air discharged from the one or more information processing device main bodies passes; a receiving pan configured to receive water generated by dew condensation in the first heat exchanger; and a water supply member configured to supply the water in the receiving pan to the evaporator.

Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.

Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

Abstract: A method of encapsulating a thermoelectric device and its associated thermoelectric elements in an inert atmosphere and a thermoelectric device fabricated by such method are described. These thermoelectric devices may be intended for use under conditions which would otherwise promote oxidation of the thermoelectric elements. The capsule is formed by securing a suitably-sized thin-walled strip of oxidation-resistant metal to the ceramic substrates which support the thermoelectric elements. The thin-walled metal strip is positioned to enclose the edges of the thermoelectric device and is secured to the substrates using gap-filling materials. The strip, substrates and gap-filling materials cooperatively encapsulate the thermoelectric elements and exclude oxygen and water vapor from atmospheric air so that the elements may be maintained in an inert, non-oxidizing environment.

Abstract: A mobile terminal is disclosed. A mobile terminal according to the present invention comprises a housing; PCB installed inside the housing; and a battery pack disposed at least one side of the PCB and including at least one heat conductive layer radiating heat generated from the PCB. According to the present invention, a mobile terminal is capable of radiating heat generated from PCB by disposing part of a battery pack on one side of the PCB and of increasing capacity of the battery pack by utilizing a housing for the battery pack.

Abstract: An electronic chip is disclosed, including at least one electronic circuit and two or more contact-making pins, wherein the chip additionally has at least one fixing pin. A sensor arrangement is also disclosed for detecting at least one physical or chemical variable relating to a carrier. The sensor arrangement has at least one sensor element which is directly or indirectly coupled to the carrier, and also has an electronic interface arrangement with at least one leadframe, at least one electronic circuit connected to the leadframe, and also at least one electrically insulating housing part which is embodied in such a way that it performs at least one of the functions of (i) at least partly enclosing the at least one electronic circuit, and (ii) mechanically supporting at least parts of the leadframe to one another.

Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

Abstract: There is provided an adapter device for connecting and interfacing a transceiver module in conformance with first mechanical specifications and first connector specifications into a host socket adapted to receive transceiver modules in conformance with second mechanical specifications and second connector specifications.

Abstract: A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.

Abstract: An optical module includes: a flexible board having a first surface on which a component is mounted and a second surface opposite to the first surface; a bottom electrode part having a bottom surface on which a heat release electrode is provided, the bottom electrode part mounted on the first surface of the flexible board; and a heat release member configured to absorb heat from the bottom electrode part and release the heat to outside. The heat release member is arranged close to said second surface of the flexible board at a position where the bottom electrode part is mounted.

Abstract: A housing element for a control unit housing has one or more first edge sections for contact with a second edge section of a second housing element allocated to the control unit housing an intermediate layer of sealant is able to be hardened with the assistance of air moisture, whereas at least one of the first edge sections features at least one recess for the communication of the sealant in the state of contact of the housing elements with air containing the air moisture.

Abstract: A semiconductor module uses pin bonding and improves cooling capacity. The semiconductor module includes a semiconductor element; a pin electrically and thermally connected to an upper surface of the semiconductor element; a pin wiring substrate having a first metal film and a second metal film respectively provided on the rear and front surfaces of a pin wiring insulating substrate, the first metal film being bonded to the pin; a first DCB substrate having a third metal film and a fourth metal film respectively provided on the rear and front surfaces of a first ceramic insulating substrate, the third metal film being bonded to a lower surface of the semiconductor element; a first cooler thermally connected to the fourth metal film; and a second cooler that thermally connected to the second metal film.

Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

Abstract: An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion on a side surface different from a side surface on which the hollow portion is formed for allowing observation of a connection portion between the bottom face of the hollow portion and the electronic component from an outer periphery side of the three-dimensional substrate.

Abstract: A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

Abstract: A connection device is provided connecting an electronic component that is arranged on a carrier to a housing part. The connection device has a first bush for receiving a first fastening unit which is used to fasten the connection device to the carrier and a second bush for receiving a second fastening unit for fastening the connection device to the housing part. The first bush is thermally insulated from the second bush. A controller has an electronic component which is arranged on the carrier and which is connected or can be connected to the housing part by use of such a connection device.

Abstract: A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.

Abstract: Aspects of state estimation for cooperative electrical grids are disclosed. State estimation of a local electrical grid can be based on a local grid model and local electrical grid information. The local state estimation can reflect interactions and interconnections with other electrical grids by determining state estimation solution information based on the local grid model, local electrical grid information, and remote state estimator solution information associated with the other electrical grid. As such, a local state estimator can be configured to receive and employ remote state estimator solution information. This can be in addition to the more conventional technique or receiving a remote grid model and remote electrical grid information to estimate the conditions of the remote electrical grid. Further, state estimation solution information can be incremental to further reduce the amount of information to be transferred and the time needed to accomplish transmission of the information.