For Printed Circuit Board Patents (Class 361/720)
  • Patent number: 10374490
    Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: August 6, 2019
    Assignee: DENSO CORPORATION
    Inventors: Toshihisa Yamamoto, Hideki Kabune, Yuuta Kadoike
  • Patent number: 10360515
    Abstract: An information processing apparatus includes a control unit that creates a plurality of learning information items including an input image and a teacher image as an expected value by image-processing the input image in accordance with a scenario described with a program code, and supplies the created plurality of learning information items to a machine learning module that composes an image processing algorithm by machine learning.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: July 23, 2019
    Assignee: SONY CORPORATION
    Inventor: Hiroshi Arai
  • Patent number: 10352627
    Abstract: A nucleation device for causing phase change in a heat storage material from a liquid state to a solid state, the nucleation device including: an elastic member including a plurality of annular portions with a ring shape wound in substantially close contact with one another, the elastic member being elastically displaceable such that adjacent pairs of the plurality of annular portions in substantially close contact with one another separate from one another; wherein the heat storage material is caused to phase change by the elastic member elastically displacing while disposed in the heat storage material.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 16, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Teruaki Yuoka, Jian Guang Li, Hiroto Yoshino
  • Patent number: 10334722
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Phillip Duane Isaacs, David C. Long
  • Patent number: 10331106
    Abstract: A rack storage unit for use in an automation system for a storage of work pieces and/or work piece pallets and/or tools, which includes a base frame with a rack stand and two rack side parts arranged at a distance from one another, wherein facing surfaces of the rack side parts are provided with interfaces for mounting placement devices. It is provided that the base frame is produced as a one-piece cast body from artificial stone, and that the interfaces are held by adhesive force as separately formed insert parts in the facing surfaces of the rack side parts.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: June 25, 2019
    Assignee: MASCHINENFABRIK BERTHOLD HERMLE AG
    Inventors: Franz-Xaver Bernhard, Tobias Schworer, Michael Dietmann, Frank Bille
  • Patent number: 10321555
    Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: June 11, 2019
    Assignee: Raytheon Company
    Inventors: Susan C. Trulli, Christopher M. Laighton, Elicia K. Harper
  • Patent number: 10292254
    Abstract: A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: May 14, 2019
    Assignee: Tesat-Spacecom GmbH & Co. KG
    Inventors: Hanspeter Katz, Jochen Artmann, Eric Wolf, Christian Rapp, Ulrich Koeger
  • Patent number: 10251262
    Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: April 2, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Patent number: 10206288
    Abstract: A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: February 12, 2019
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Ping Mei, Gregory L. Whiting, Brent S. Krusor
  • Patent number: 10201118
    Abstract: The electric power converter has a transformer having a primary coil and a secondary coil, a first circuit section connected to the primary coil side of the transformer, a second circuit section connected to the secondary coil side of the transformer, and a case that accommodates the transformer, the first circuit section, and the second circuit section inside and has a lower opening and an upper opening. An air passage communicated with an exterior of the case is formed inside the case in a vertical direction between the lower opening and the upper opening. At least one of the transformer, the first circuit section, or the second circuit sections is disposed in the air passage.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: February 5, 2019
    Assignee: DENSO CORPORATION
    Inventor: Hisato Tagei
  • Patent number: 10121727
    Abstract: The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: November 6, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Michael E. Lucas, Nikola Ikonomov, John I. Kull
  • Patent number: 10030863
    Abstract: In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: July 24, 2018
    Assignee: Cree, Inc.
    Inventors: Paul Kenneth Pickard, Curt Progl, Joshua N. Gray
  • Patent number: 10028413
    Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate. The plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount and a temperature sensitive component mount in electrical continuity with the heat generating component mount, where a shielding path projection extends from the heat generating component mount towards the temperature sensitive component mount, and at least one of the thermal conductor traces is transverse to the shielding path projection between the heat generating component mount and the temperature sensitive component mount to steer heat flux away from the temperature sensitive component mount.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: July 17, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan Mehmet Dede, Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg
  • Patent number: 9989234
    Abstract: An interior aircraft LED light unit includes at least one printed circuit board, on which a plurality of LEDs are connected to a power source, each one of the plurality of LEDs having a predetermined distance to the power source, and each one of the plurality of LEDs being associated with a respective thermal transfer member having a predetermined size, for transferring heat away from the respective LED, wherein, for at least some of the plurality of LEDs the predetermined size of the respective thermal transfer member varies with the predetermined distance of the LED to the power source.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 5, 2018
    Assignee: GOODRICH LIGHTING SYSTEMS GMBH
    Inventors: Robert Trinschek, Elmar Schrewe, Tomasz Kordecki
  • Patent number: 9978138
    Abstract: An image comparison device includes: a storage in which a model image is stored, the model image including a position of a feature point of a comparison object and a luminance gradient direction at the position of the feature point; a feature amount acquisition unit configured to acquire the position of the feature point and the luminance gradient direction at the position of the feature point from an input image; and an image comparison unit configured to compare the model image and the input image. The image comparison unit performs image comparison by providing an allowable range in both the position of the feature point and the luminance gradient direction at the position of the feature point position.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: May 22, 2018
    Assignee: OMRON Corporation
    Inventor: Yoshinori Konishi
  • Patent number: 9904103
    Abstract: The disclosure provides an ultra thin display module, comprising a LED substrate, a plurality of LED lamp beads, a secondary lens and a display panel. The plurality of LED lamp beads is disposed on the array of the LED substrate, the secondary lens is disposed on the LED substrate, the secondary lens is encapsuled inside the top surface of the LED lamp beads, and the display panel is disposed on the top surface of the secondary lens. The ultra thin display module and method for assembling the same of the disclosure use a brand new structure of ultra thin display module, such that the thickness of the module is greatly decreased as compared with the present techniques.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: February 27, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Yanxue Zhang
  • Patent number: 9869520
    Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: January 16, 2018
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Ercan Mehmet Dede, Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg
  • Patent number: 9872380
    Abstract: [Problem] To obtain a ceramic circuit board having superior crack-resistance with respect to ultrasonic bonding. [Solution] The abovementioned problem is solved by a ceramic circuit board characterized in that a metal circuit board is bonded to one surface of a ceramic substrate and a metal heat radiation plate is bonded to the other surface of the ceramic substrate, wherein the crystal grain size in the metal circuit board is at least 20 ?m and at most 70 ?m. This ceramic circuit board can be manufactured by arranging the metal circuit board on one surface of the ceramic substrate and arranging the metal heat radiation plate on the other surface of the ceramic substrate, and bonding in a vacuum of at most 1×10?3 Pa, at a bonding temperature of at least 780° C. and at most 850° C., for a retention time of at least 10 minutes and at most 60 minutes.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: January 16, 2018
    Assignee: Denka Company Limited
    Inventors: Ryota Aono, Akimasa Yuasa, Takeshi Miyakawa
  • Patent number: 9854710
    Abstract: An information processing device includes: one or more information processing device main bodies; a first heat exchanger configured to cool air to be introduced into the one or more information processing device main bodies; an air blower configured to introduce the air into the one or more information processing device main bodies; an evaporator through which discharged air discharged from the one or more information processing device main bodies passes; a receiving pan configured to receive water generated by dew condensation in the first heat exchanger; and a water supply member configured to supply the water in the receiving pan to the evaporator.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: December 26, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Keita Hirai, Tsuyoshi So, Naofumi Kosugi
  • Patent number: 9769916
    Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: September 19, 2017
    Assignees: OMRON AUTOMOTIVE ELECTRONICS CO., LTD., AIKOKIKI MANUFACTURING CO., LTD.
    Inventors: Tomoyoshi Kobayashi, Masato Kasashima, Koichi Suzuki
  • Patent number: 9713287
    Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: July 18, 2017
    Assignee: Artesyn Embedded Computing, Inc.
    Inventors: Suzanne Marye Wong, Martin Peter John Cornes, Robert Charles Tufford
  • Patent number: 9705062
    Abstract: A method of encapsulating a thermoelectric device and its associated thermoelectric elements in an inert atmosphere and a thermoelectric device fabricated by such method are described. These thermoelectric devices may be intended for use under conditions which would otherwise promote oxidation of the thermoelectric elements. The capsule is formed by securing a suitably-sized thin-walled strip of oxidation-resistant metal to the ceramic substrates which support the thermoelectric elements. The thin-walled metal strip is positioned to enclose the edges of the thermoelectric device and is secured to the substrates using gap-filling materials. The strip, substrates and gap-filling materials cooperatively encapsulate the thermoelectric elements and exclude oxygen and water vapor from atmospheric air so that the elements may be maintained in an inert, non-oxidizing environment.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: July 11, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: James R. Salvador, Jeffrey Sakamoto, Youngsam Park
  • Patent number: 9693444
    Abstract: A mobile terminal is disclosed. A mobile terminal according to the present invention comprises a housing; PCB installed inside the housing; and a battery pack disposed at least one side of the PCB and including at least one heat conductive layer radiating heat generated from the PCB. According to the present invention, a mobile terminal is capable of radiating heat generated from PCB by disposing part of a battery pack on one side of the PCB and of increasing capacity of the battery pack by utilizing a housing for the battery pack.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: June 27, 2017
    Assignee: LG Electronics Inc.
    Inventors: Sungjin Kim, Seongcheol Lee
  • Patent number: 9640467
    Abstract: An electronic chip is disclosed, including at least one electronic circuit and two or more contact-making pins, wherein the chip additionally has at least one fixing pin. A sensor arrangement is also disclosed for detecting at least one physical or chemical variable relating to a carrier. The sensor arrangement has at least one sensor element which is directly or indirectly coupled to the carrier, and also has an electronic interface arrangement with at least one leadframe, at least one electronic circuit connected to the leadframe, and also at least one electrically insulating housing part which is embodied in such a way that it performs at least one of the functions of (i) at least partly enclosing the at least one electronic circuit, and (ii) mechanically supporting at least parts of the leadframe to one another.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: May 2, 2017
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Jakob Schillinger, Stephan Risch, Dietmar Huber, Günther Romhart, Andreas Döring
  • Patent number: 9559047
    Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: January 31, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Milko Paolucci
  • Patent number: 9549470
    Abstract: There is provided an adapter device for connecting and interfacing a transceiver module in conformance with first mechanical specifications and first connector specifications into a host socket adapted to receive transceiver modules in conformance with second mechanical specifications and second connector specifications.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: January 17, 2017
    Assignee: EXFO Inc.
    Inventors: Michel Blier, Patrick Begin, Sergio Prestipino
  • Patent number: 9516790
    Abstract: A circuit board is provided that includes at least one Peltier heat pump device with at least one pair of semiconductor members arranged thermally in parallel and electrically in series. The at least one pair of semiconductor members is at least partially embedded in the circuit board.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: December 6, 2016
    Assignee: Harman Becker Automotive Systems GmbH
    Inventor: Valod Noshadi
  • Patent number: 9507108
    Abstract: An optical module includes: a flexible board having a first surface on which a component is mounted and a second surface opposite to the first surface; a bottom electrode part having a bottom surface on which a heat release electrode is provided, the bottom electrode part mounted on the first surface of the flexible board; and a heat release member configured to absorb heat from the bottom electrode part and release the heat to outside. The heat release member is arranged close to said second surface of the flexible board at a position where the bottom electrode part is mounted.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: November 29, 2016
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Shinichi Aoki
  • Patent number: 9468119
    Abstract: A housing element for a control unit housing has one or more first edge sections for contact with a second edge section of a second housing element allocated to the control unit housing an intermediate layer of sealant is able to be hardened with the assistance of air moisture, whereas at least one of the first edge sections features at least one recess for the communication of the sealant in the state of contact of the housing elements with air containing the air moisture.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: October 11, 2016
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventor: Werner Beck
  • Patent number: 9460981
    Abstract: A semiconductor module uses pin bonding and improves cooling capacity. The semiconductor module includes a semiconductor element; a pin electrically and thermally connected to an upper surface of the semiconductor element; a pin wiring substrate having a first metal film and a second metal film respectively provided on the rear and front surfaces of a pin wiring insulating substrate, the first metal film being bonded to the pin; a first DCB substrate having a third metal film and a fourth metal film respectively provided on the rear and front surfaces of a first ceramic insulating substrate, the third metal film being bonded to a lower surface of the semiconductor element; a first cooler thermally connected to the fourth metal film; and a second cooler that thermally connected to the second metal film.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: October 4, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Takafumi Yamada
  • Patent number: 9443798
    Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: September 13, 2016
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Milko Paolucci
  • Patent number: 9408309
    Abstract: An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion on a side surface different from a side surface on which the hollow portion is formed for allowing observation of a connection portion between the bottom face of the hollow portion and the electronic component from an outer periphery side of the three-dimensional substrate.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: August 2, 2016
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Patent number: 9408301
    Abstract: A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: August 2, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yusheng Lin, Sadamichi Takakusaki
  • Patent number: 9370124
    Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: June 14, 2016
    Assignee: Thales
    Inventors: Christian Tantolin, Claude Sarno
  • Patent number: 9355962
    Abstract: A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: May 31, 2016
    Assignee: STATS ChipPAC Ltd.
    Inventors: SeongMin Lee, Sungmin Song, Jong-Woo Ha
  • Patent number: 9357665
    Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: May 31, 2016
    Assignee: APPLE INC.
    Inventors: Scott A. Myers, Matthew Theobald, Richard Heley, Adam Stagnaro, Richard Hung Minh Dinh, David A. Pakula, Tang Yew Tan
  • Patent number: 9345139
    Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: May 17, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
  • Patent number: 9326411
    Abstract: A connection device is provided connecting an electronic component that is arranged on a carrier to a housing part. The connection device has a first bush for receiving a first fastening unit which is used to fasten the connection device to the carrier and a second bush for receiving a second fastening unit for fastening the connection device to the housing part. The first bush is thermally insulated from the second bush. A controller has an electronic component which is arranged on the carrier and which is connected or can be connected to the housing part by use of such a connection device.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: April 26, 2016
    Assignee: KNORR-BREMSE Systeme fuer Nutzfahrzeuge GmbH
    Inventors: Markus Eichner, Thomas Uhland
  • Patent number: 9313877
    Abstract: A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: April 12, 2016
    Assignee: NEC Corporation
    Inventor: Hisashi Ishida
  • Patent number: 9281686
    Abstract: Aspects of state estimation for cooperative electrical grids are disclosed. State estimation of a local electrical grid can be based on a local grid model and local electrical grid information. The local state estimation can reflect interactions and interconnections with other electrical grids by determining state estimation solution information based on the local grid model, local electrical grid information, and remote state estimator solution information associated with the other electrical grid. As such, a local state estimator can be configured to receive and employ remote state estimator solution information. This can be in addition to the more conventional technique or receiving a remote grid model and remote electrical grid information to estimate the conditions of the remote electrical grid. Further, state estimation solution information can be incremental to further reduce the amount of information to be transferred and the time needed to accomplish transmission of the information.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: March 8, 2016
    Assignee: General Electric Technology GmbH
    Inventor: Jay Payne Britton
  • Patent number: 9271386
    Abstract: Regarding an electrical apparatus, in an opposing part facing a board, the opposing part being on a surface of in a heat dissipator, a contact part which is brought into contact with a first region of a second main surface corresponding to an electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to a fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part. The degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: February 23, 2016
    Assignee: STUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuki Ada
  • Patent number: 9258897
    Abstract: A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: February 9, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hidetoshi Noguchi, Hirofumi Futamura
  • Patent number: 9253925
    Abstract: An electronic assembly can include a support structure, a circuit substrate coupled to a first portion of the support structure, and a composite material panel coupled to a second portion of the support structure. An electronic device can be coupled to a mounting surface of the circuit substrate and disposed within a space enclosed by walls of the support structure. The panel can include contiguous sections inner surfaces of which can be oriented within twenty-five degrees of parallel to said mounting surface. Each section can be significantly more thermally conductive generally parallel to the inner surface of the section than generally perpendicular to the inner surface.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: February 2, 2016
    Assignee: L-3 Communications Corp.
    Inventor: Robert H. Smith
  • Patent number: 9235078
    Abstract: The present invention provides a curvature adjustment structure of a curved liquid crystal display device, which includes: a backplane (1) and at least one bracing assembly (3) fixedly mounted to the backplane (1). Each bracing assembly (3) includes a first bracing member (31) in contact engagement with the backplane (1), a second bracing member (33) opposite to the first bracing member (31) and distant from the backplane (1), and a cooling chip array (35) arranged between the first and second bracing members (31, 33). The cooling chip array (35) includes a plurality of cooling chips (2). Each of the cooling chips (2) includes a heat absorption surface (22) and an opposite heat dissipation surface (24).
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: January 12, 2016
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Gang Yu, Yuchun Hsiao, Dehua Li
  • Patent number: 9223339
    Abstract: A portable terminal is provided. The portable terminal includes a mounting member configured to be capable of being attached to/detached from a housing of the portable terminal, a connection member configured to extend from the mounting member and to selectively enclose at least a part of the housing, and a cover element connected to an end of the connection member to open/close a display device installed on the front surface of the housing. The portable terminal provided with the protection cover has an advantage in that the increase of the thickness of the terminal can be minimized because the protection cover may be disposed on a side surface or an edge of the rear surface of the housing by the mounting member.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: December 29, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Jin Yim, Young-Wook Sohn, Byoung-Uk Yoon, Sang-Hyuck Jung
  • Patent number: 9181971
    Abstract: A bus bar includes a bus bar body and a spacer provided on the bus bar body, the spacer being an insulator. The bus bar body includes a through hole portion that allows a part of a fixing member for fixing the bus bar body to be inserted therethrough. The spacer includes a head portion and a body portion extending therefrom. When the spacer is provided on the bus bar body, the head portion covers at least part of a peripheral edge region of an end opening of the through hole and the body portion covers an inner peripheral surface of the through hole portion. An outer peripheral surface of the body portion of the spacer is fixedly adhered to the inner peripheral surface of the through hole portion so that resistance occurs when the spacer moves toward the head portion side relative to the bus bar body.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: November 10, 2015
    Assignee: TDK Corporation
    Inventors: Akira Ikezawa, Masaki Kan
  • Patent number: 9129929
    Abstract: A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: September 8, 2015
    Assignees: Sony Corporation, Sony Mobile Communications AB
    Inventor: Nils Lundberg
  • Patent number: 9057811
    Abstract: A cooling structure for light emitting elements for a liquid crystal panel according to the present invention includes: a long-shaped substrate that is disposed so as to extend along an edge of a light guide plate provided on a rear surface of a liquid crystal panel, and in which a plurality of through-holes are formed; a plurality of light emitting elements that are disposed on a front surface of the substrate so as to face the light guide plate; and a chassis that is provided at a rear surface side of the substrate, and the through-holes are arranged at a higher density at a center portion of the substrate in a long direction than at end portions of the substrate in the long direction.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: June 16, 2015
    Assignee: NEC DISPLAY SOLUTIONS, LTD.
    Inventor: Hiroyuki Kasuga
  • Patent number: 9041181
    Abstract: A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee-chul Lee, Myung-kee Chung, Kun-dae Yeom
  • Patent number: 9042102
    Abstract: A waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: May 26, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: An-Jun Zhang