For Printed Circuit Board Patents (Class 361/720)
  • Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Patent number: 11558956
    Abstract: A generator control unit (GCU) having thermal control includes a GCU housing having a first side and a second side. A printed wiring board (PWB) is within the GCU housing between the first side and the second side. The PWB includes a component side that faces a first side of the GCU housing. At least one through via is positioned through a thickness of the PWB. At least one boss is positioned on the component side of the PWB. The at least one boss extends from a component of the PWB to the first side of the GCU housing.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: January 17, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Steven E. Larson, Eric A. Carter, Ethan Johnson
  • Patent number: 11535783
    Abstract: A fusible, phase-change powder composition includes a plurality of powder particles comprising a polymer composition, an unencapsulated phase-change material, and optionally, an additive composition; wherein the powder composition is fusible at a temperature of 25 to 105° C., or 28 to 60° C., or 45 to 85° C., or 60 to 80° C., or 80 to 100° C.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: December 27, 2022
    Assignee: ROGERS CORPORATION
    Inventors: Ming Wei, Sharon Soong, Ian Smith
  • Patent number: 11523542
    Abstract: An information handling system may include a circuit board that includes a plurality of memory module sockets; a plurality of memory modules received in the plurality of memory module sockets; a plurality of heatsinks disposed between adjacent ones of the plurality of memory modules; and a cold plate having projections that extend into regions between adjacent ones of the plurality of heatsinks.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: December 6, 2022
    Assignee: Dell Products L.P.
    Inventor: Travis Gaskill
  • Patent number: 11512711
    Abstract: A centrifugal fan frame body structure includes a lower case body and a cover body. The lower case body has a bottom section and an outer wall section. The outer wall section is formed with a wind outlet. The cover body and the lower case body are correspondingly mated with each other to form a space. In the space, the lower case body and the cover body define therebetween a first height. The lower case body and the cover body define therebetween a second height at the wind outlet. The second height is larger than the first height. The height of the wind outlet is enlarged, whereby the wind outlet will not be blocked by the cooperative heat dissipation component (module) so that the flow field efficiency is enhanced and the noise is lowered.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11503701
    Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 15, 2022
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Marcus Ni, Voi Nguyen
  • Patent number: 11499080
    Abstract: This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: November 15, 2022
    Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING CHINESE ACADEMY OF SCIENCES
    Inventors: Wen Dai, Zhengde Lin, Nan Jiang, Jinhong Yu, Dan Dai, Hao Hou
  • Patent number: 11497118
    Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: November 8, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: Channing Paige Favreau, James E. Benedict, Mikhail Pevzner, Thomas V. Sikina
  • Patent number: 11495908
    Abstract: An electrical connector assembly includes a connector housing and a busbar having a rectangular cross section defining two opposed major surfaces and two opposed minor surfaces disposed within the connector housing. A planar surface is defined by one of the two opposed major surfaces of the busbar. The electrical connector assembly further includes a cooling plate that is sized, shaped, and arranged to be in conductive thermal contact with the planar surface of the busbar. The cooling plate is configured to reduce a temperature of the busbar.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: November 8, 2022
    Inventors: Thomas Mathews, Don E. Bizon, William C. Lovitz, Nicholas A. Durse
  • Patent number: 11474576
    Abstract: An electrical device with thermally controlled performance is disclosed. The electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. The electrical device further includes a plurality of signal paths interconnecting the plurality of device components. The electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. The electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 18, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Alan P. Boone, Brandon C. Hamilton, Kyle B. Snyder, Bryan M. Jefferson
  • Patent number: 11469155
    Abstract: A device in a utility distribution system may comprise a housing, a heat source, a first heat sink, a second heat sink, a heat pipe, and a flexible directional thermal interface material (“DTIM”) with a high-conductivity orientation. The first heat sink may be thermally coupled to the heat source. The second heat sink may be attached to the first heat sink, and the flexible DTIM and the heat pipe may be arranged between the first and second heat sinks. The flexible DTIM may be thermally coupled with the first heat sink and the heat pipe. The heat pipe may be capable of movements with respect to the flexible DTIM. During the movements, the heat pipe may maintain the thermal coupling with the flexible DTIM, such that heat present in the first heat sink may be transferred to the heat pipe via the high-conductivity orientation of the flexible DTIM.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: October 11, 2022
    Assignee: LANDIS+GYR INNOVATIONS, INC.
    Inventor: Damian Bonicatto
  • Patent number: 11452231
    Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: September 20, 2022
    Assignee: National Instruments Corporation
    Inventors: Richard G. Baldwin, Jr., Michael H. Singerman
  • Patent number: 11435148
    Abstract: An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: September 6, 2022
    Assignee: Raytheon Company
    Inventors: Tuan L. Duong, Eric Swanson, Michael Hulse, William Francis
  • Patent number: 11430713
    Abstract: A member to be fastened on one side of which a member to be fixed is placed; a plate-shaped holding spring member which is disposed on the member to be fixed on one side thereof opposite to the member to be fastened; a support which extends outward of an end part of a longitudinal central part of the plate-shaped holding spring member and which has a through hole formed therein; a supporting column which is provided on the support and bends toward the member to be fastened; a fixing screw hole which is provided in the member to be fastened and disposed at a position corresponding to the through hole of the support so as to have the same axial center as the through hole; and a fixing screw which is inserted into the through hole of the support and screwed to the fixing screw hole.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: August 30, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Niki Kitahama, Ryohei Hayashi, Hirofumi Miyoshi
  • Patent number: 11417963
    Abstract: A radio frequency (RF) system includes an RF integrated circuit (IC) die, and an antenna coupled to the RF IC die. The RF system further includes a reflector layer over the RF IC die, the reflector layer extending over at least a portion of the antenna, a combination of the antenna and the reflector layer having a radiation pattern that comprises a main lobe in a first direction parallel to a top surface of the reflector layer.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 16, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Ashutosh Baheti
  • Patent number: 11379022
    Abstract: The present invention relates to a mobile terminal comprising: a terminal body; a circuit board mounted inside the terminal body; an electronic device mounted on one surface of the circuit board; a shield can provided on the circuit board so as to surround the electronic device and shielding electromagnetic waves generated from the electronic device; a metal plate coupled to the shield can and made of a material having high thermal conductivity; and a heat pipe which is positioned to face the shield can with the metal plate interposed therebetween and has a flow path to accommodate a fluid at a center portion thereof, wherein the metal plate and the heat pipe are integrally formed, and heat generated in the electronic device can be transmitted to the heat pipe through the metal plate.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: July 5, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Kyungui Park, Byungsun Kim, Wook Kim, Joseph Lee
  • Patent number: 11335642
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a first die comprising a first face and a second face; and a second die, the second die comprising a first face and a second face, wherein the second die further comprises a plurality of first conductive contacts at the first face and a plurality of second conductive contacts at the second face, and the second die is between first-level interconnect contacts of the microelectronic assembly and the first die.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: May 17, 2022
    Assignee: Intel Corporation
    Inventors: Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan
  • Patent number: 11333686
    Abstract: An in-line suspended non-directional power sensor coupling configuration situated within a high frequency transmission line housing that allows non-directional current and sampling voltage elements to all be produced simultaneously on one or more double sided printed circuit boards (PCB). The power sensor coupling allows for repeatable calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: May 17, 2022
    Inventor: Jefferson D. Lexa
  • Patent number: 11224140
    Abstract: Embodiments of the present disclosure provide a top cover arrangement for a storage and the corresponding storage. The storage comprises a drawer chassis which accommodates disks that are organized among a plurality of rows. The top cover arrangement covers the disks in a foldable manner and comprises: a substrate covering the disks and being flexible; and a plurality of folding parts mounted on the substrate and corresponding to the plurality of the rows; the folding parts being adapted to be at least partially folded to expose at least one row of disks in response to the disks being pulled out of the drawer chassis.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: January 11, 2022
    Assignee: EMC IP HOLDING COMPANY, LLC
    Inventors: Haifang Zhai, Yujie Zhou, Qingqiang Guo, Weidong Zuo, Wenjin Seraph Xu
  • Patent number: 11114372
    Abstract: An integrated circuit includes a main body having a top and a bottom; and upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body, in which each of the upper pins has a first protruding portion protruding toward outside from a side or the top of the main body, and each of the lower pins has a second protruding portion protruding toward outside from the side or the bottom of the main body.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: September 7, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jungjae Kim, Heejung Hong, Soondong Cho, Hyungjin Choe
  • Patent number: 11092515
    Abstract: The present invention relates to a platform for testing collisions or near-collision situations between a collision body, in particular a vehicle, and a test object. The platform has a base body, which has a bottom surface and an attachment surface formed opposite to the bottom surface, wherein an attachment device is formed on the attachment surface for attaching the test object. Furthermore, the platform has at least one roller element, which is arranged at the bottom surface, wherein the roller element configured such that the base body is displaceable along a ground by the roller element. An installation box having an installation volume is arranged in a receiving opening of the base body, wherein the installation box is conceived in the receiving opening of the base body such that a temperature control region of the installation box is in contact with a surroundings of the base body.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 17, 2021
    Assignee: 4ACTIVESYSTEMS GMBH
    Inventors: Reinhard Hafellner, Martin Fritz
  • Patent number: 11058005
    Abstract: An electronic component (E), including at least one circuit carrier (1), which is populated with a number of mechanical and/or electronic component parts (2 to 4) and has at least one contact opening (1.3) for forming a mechanical and/or electrical contact-connection point (KS) to at least one of the component parts (2 to 4), wherein at least one of the component parts (4) is at a distance from the circuit carrier (1), includes at least one electrically conductive housing (4.1) and at least one electrical contact element (4.2) projecting out of the housing (4.1), the contact element being insulated from the housing (4.1) and being connected at least in a materially bonded manner to the contact opening (1.3) of the circuit carrier (1), wherein at least one seal element (5) is arranged in the region of the contact-connection point (KS), in particular between the circuit carrier (1) and the housing (4) of the component part (4).
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 6, 2021
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Helmut Karrer, Peter Volkert, Michael Taufer, Konrad Härder
  • Patent number: 11051392
    Abstract: The present invention relates to a heat dissipating device disposed on a circuit board. The heat dissipating device is provided with a first glue layer, a first graphene composite heat dissipating layer, a second glue layer, a second graphene composite heat dissipating layer, and a resin layer in this order from bottom to top. Furthermore, the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are doped with a plurality of metal particles, and the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are respectively covered by a metal layer. The above structure is simple, space-saving, and has good thermal conductivity.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: June 29, 2021
    Assignee: Team Group Inc.
    Inventor: Chin Feng Chang
  • Patent number: 11037857
    Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: June 15, 2021
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Tzu-Hsuan Wang, Tze-Yang Yeh, Chun-Lung Wu
  • Patent number: 11005155
    Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: May 11, 2021
    Assignee: SONY CORPORATION
    Inventors: Wasif Tanveer Khan, Mudassar Nauman, Arndt Thomas Ott, Ramona Hotopan
  • Patent number: 10901266
    Abstract: According to one embodiment, a display device includes a first substrate with a first alignment film, a second substrate with a second alignment film, and a liquid crystal layer interposed therebetween. The first substrate has first and second electrodes. An initial alignment direction of liquid crystal molecules of the liquid crystal layer is parallel to a first direction or a direction orthogonal to the first direction. The second electrode includes comblike electrodes extending parallel to the first direction and a connecting portion which connects the comblike electrodes. The connecting portion includes a projection which projects in a second direction more than an outermost comblike electrode.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: January 26, 2021
    Assignee: Japan Display Inc.
    Inventor: Toshiharu Matsushima
  • Patent number: 10881029
    Abstract: Provided is a power relay assembly. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate equipped with at least one electrical element on one surface thereof and comprising a plastic material having heat dissipation and insulation properties; and at least one bus bar which comprises a contact part which is electrically connected to the electrical element and directly contacts one surface of the support plate, wherein the contact part of the bus bar is fixed to one surface of the support plate.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: December 29, 2020
    Inventors: Min Ho Won, Seung Jae Hwang
  • Patent number: 10813255
    Abstract: A motor drive device provided to a control panel to drive a plurality of motors includes a plate-shaped fin base that includes a first plate surface and a second plate surface, and a plate-shaped heat radiator that is thermally connected to the first plate surface and is provided with a first normal to its plate surface intersecting a second normal to the first plate surface. The motor drive device also includes a semiconductor device that drives a first motor and is thermally connected to the heat radiator, a semiconductor device that drives a second motor and is thermally connected to the first plate surface, and fins that are thermally connected to the second plate surface opposite from the first plate surface of the fin base and are provided in an air passage formed in the control panel.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: October 20, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshitomo Hayashi, Satoru Kozuka, Yasuhiro Takadera, Takeshi Obara
  • Patent number: 10763218
    Abstract: An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Sruti Chigullapalli, Leslie Fitch, Boping Wu
  • Patent number: 10630150
    Abstract: A housing member includes a case member and a cover member having an insertion portion inserted into a seal groove. The case member and the cover member assembled together provide a housing space for housing a protective component inside. A housing space side inner groove surface of a peripheral wall portion and an external space side inner groove surface of the peripheral wall portion extend along an insertion direction of the insertion portion into the seal groove. A first distance between the external space side peripheral surface and the external space side inner groove surface opposite to the external space side peripheral surface is larger than a second distance between a housing space side peripheral surface extending along the insertion direction on the housing space side of the insertion portion and the housing space side inner groove surface opposite to the housing space side peripheral surface.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: April 21, 2020
    Assignee: DENSO CORPORATION
    Inventors: Takashi Tsuboi, Koji Matsuo
  • Patent number: 10617037
    Abstract: A plug assembly includes an upper cover, a heat-conducting element, a heat-conducting pipe, a circuit board and a lower cover. A rear end of a top of the upper cover is equipped with a plurality of heat dissipation fins. The heat-conducting element includes a first heat-conducting element equipped on a bottom surface of the upper cover, and a second heat-conducting element fastened to a bottom surface of the first heat-conducting element. A top of the first heat-conducting element opens a receiving space. The heat-conducting pipe is received in the receiving space. The heat-conducting pipe extends rearward through a rear end of the receiving space. The circuit board is mounted in the upper cover and contacts with the second heat-conducting element. The lower cover is mounted to the upper cover.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 7, 2020
    Assignee: NANO SHIELD TECHNOLOGY CO., LTD.
    Inventor: James Cheng Lee
  • Patent number: 10609842
    Abstract: A storage module structure of a storage assembly includes an upper shielding component, a lower shielding component and a memory component. An outer surface of the upper shielding component has a plurality of heat-conducting units. The lower shielding component is located above the upper shielding component, and an accommodating space is defined between the upper shielding component and the lower shielding component. The memory component is located in the accommodating space. The heat-conducting units contact an external structure, and a thermal energy generated by the memory component is conducted to the external structure through the plurality of heat-conducting units.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 31, 2020
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventors: Yung-Hsing Yin, Jen-Chieh Pan
  • Patent number: 10582613
    Abstract: A printed circuit board includes: a board body including one or more wiring layers; a control chip and a target electronic component arranged on one of the one or more the wiring layers on a surface of the board body; a target wiring layer where the target electronic component is placed including a copper absent area around the target electronic component, and a ground backflow connection arranged around the target electronic component to electrically connect a copper area which is formed by the copper absent area with a primary copper area on the target wiring layer.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: March 3, 2020
    Assignee: Hisense Mobile Communications Technology Co., Ltd
    Inventor: Qingyi Zhao
  • Patent number: 10530038
    Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: January 7, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shao-En Hsu, Huei-Shyong Cho, Shih-Wen Lu
  • Patent number: 10420223
    Abstract: In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 17, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Wataru Iwazaki, Masahito Komasaki
  • Patent number: 10398021
    Abstract: A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: August 27, 2019
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Hiram Avalos, Jeff Reuter, Mark Ryskamp, Motozo Horikawa
  • Patent number: 10388013
    Abstract: A matching transformation is determined for matching a patient image set of images of an anatomical body structure of a patient with an atlas image set of images of a general anatomical structure including anatomical atlas elements. Atlas spatial information containing spatial information on the general anatomical structure, and element representation information are obtained. The element representation information describes representation data sets which contain information on representations of the plurality of atlas elements in the atlas images to be determined are obtained, and also describes a determination rule for determining respective representation data sets for respective atlas elements in accordance with different respective parameter sets. Patient data is acquired by acquiring the patient image set and the parameter sets which are respectively associated with the images of the patient image set.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: August 20, 2019
    Assignee: Brainlab AG
    Inventor: Andreas Blumhofer
  • Patent number: 10374490
    Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: August 6, 2019
    Assignee: DENSO CORPORATION
    Inventors: Toshihisa Yamamoto, Hideki Kabune, Yuuta Kadoike
  • Patent number: 10360515
    Abstract: An information processing apparatus includes a control unit that creates a plurality of learning information items including an input image and a teacher image as an expected value by image-processing the input image in accordance with a scenario described with a program code, and supplies the created plurality of learning information items to a machine learning module that composes an image processing algorithm by machine learning.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: July 23, 2019
    Assignee: SONY CORPORATION
    Inventor: Hiroshi Arai
  • Patent number: 10352627
    Abstract: A nucleation device for causing phase change in a heat storage material from a liquid state to a solid state, the nucleation device including: an elastic member including a plurality of annular portions with a ring shape wound in substantially close contact with one another, the elastic member being elastically displaceable such that adjacent pairs of the plurality of annular portions in substantially close contact with one another separate from one another; wherein the heat storage material is caused to phase change by the elastic member elastically displacing while disposed in the heat storage material.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 16, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Teruaki Yuoka, Jian Guang Li, Hiroto Yoshino
  • Patent number: 10334722
    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Phillip Duane Isaacs, David C. Long
  • Patent number: 10331106
    Abstract: A rack storage unit for use in an automation system for a storage of work pieces and/or work piece pallets and/or tools, which includes a base frame with a rack stand and two rack side parts arranged at a distance from one another, wherein facing surfaces of the rack side parts are provided with interfaces for mounting placement devices. It is provided that the base frame is produced as a one-piece cast body from artificial stone, and that the interfaces are held by adhesive force as separately formed insert parts in the facing surfaces of the rack side parts.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: June 25, 2019
    Assignee: MASCHINENFABRIK BERTHOLD HERMLE AG
    Inventors: Franz-Xaver Bernhard, Tobias Schworer, Michael Dietmann, Frank Bille
  • Patent number: 10321555
    Abstract: An RF circuit module having RF and DC contacts on a surface of a circuit board. An RF component having RF and DC contacts is disposed in a cavity of the circuit board. Electrical connectors bridge the cavity to connect the RF contacts on the circuit board to the RF contacts on the RE component and the DC, contacts on the circuit board to the DC contacts on the RF component. A plug member is disposed in the cavity which has a dielectric member with an outer portion disposed over the RF and DC contacts on the circuit board and an inner portion elevated above the RF and DC contacts the RF component. The plug member has one portion of electrical conductors disposed on an upper surface of the inner portion and another portion disposed under the outer portion on, and electrically connected to, the DC contacts on the circuit board.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: June 11, 2019
    Assignee: Raytheon Company
    Inventors: Susan C. Trulli, Christopher M. Laighton, Elicia K. Harper
  • Patent number: 10292254
    Abstract: A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: May 14, 2019
    Assignee: Tesat-Spacecom GmbH & Co. KG
    Inventors: Hanspeter Katz, Jochen Artmann, Eric Wolf, Christian Rapp, Ulrich Koeger
  • Patent number: 10251262
    Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: April 2, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Patent number: 10206288
    Abstract: A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: February 12, 2019
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Ping Mei, Gregory L. Whiting, Brent S. Krusor
  • Patent number: 10201118
    Abstract: The electric power converter has a transformer having a primary coil and a secondary coil, a first circuit section connected to the primary coil side of the transformer, a second circuit section connected to the secondary coil side of the transformer, and a case that accommodates the transformer, the first circuit section, and the second circuit section inside and has a lower opening and an upper opening. An air passage communicated with an exterior of the case is formed inside the case in a vertical direction between the lower opening and the upper opening. At least one of the transformer, the first circuit section, or the second circuit sections is disposed in the air passage.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: February 5, 2019
    Assignee: DENSO CORPORATION
    Inventor: Hisato Tagei
  • Patent number: 10121727
    Abstract: The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: November 6, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Michael E. Lucas, Nikola Ikonomov, John I. Kull
  • Patent number: 10030863
    Abstract: In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: July 24, 2018
    Assignee: Cree, Inc.
    Inventors: Paul Kenneth Pickard, Curt Progl, Joshua N. Gray
  • Patent number: 10028413
    Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate. The plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount and a temperature sensitive component mount in electrical continuity with the heat generating component mount, where a shielding path projection extends from the heat generating component mount towards the temperature sensitive component mount, and at least one of the thermal conductor traces is transverse to the shielding path projection between the heat generating component mount and the temperature sensitive component mount to steer heat flux away from the temperature sensitive component mount.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: July 17, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan Mehmet Dede, Tsuyoshi Nomura, Kenan Wang, Paul Donald Schmalenberg