For Printed Circuit Board Patents (Class 361/720)
  • Patent number: 11956888
    Abstract: An electronic device includes a casing, a circuit board and a grounding assembly. The circuit board has a first surface and a second surface, wherein an input terminal and an output terminal are disposed on the second surface. The grounding assembly comprises a conducting terminal, a first grounding element and a second grounding element. The conducting terminal is disposed on the first surface of the circuit board, and the first grounding element is disposed adjacent to the conducting terminal. The first grounding element penetrates the circuit board and electrically couples with the conducting terminal and the casing, and the second grounding element correspondingly penetrates the circuit board and the conducting element, so that a first portion of the second grounding element electrically couples with the input terminal and the output terminal of the circuit board, and a second portion of the second grounding element electrically couples with the conducting terminal.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 9, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chia-Hsien Chu, Yi-Hua Chang
  • Patent number: 11950395
    Abstract: A heat dissipating mechanism is used to dissipate heat generated by a heat generation component of an electronic device. The heat generation component is disposed on a circuit board. The heat dissipating mechanism includes a rotation component and a heat dissipation component. The rotation component is disposed on the circuit board. The heat dissipation component is rotatably disposed on the rotation component. The heat dissipation component includes a contacting surface and a fin body. The contacting surface is a bottom surface of the fin body and configured to contact against the heat generation component.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: April 2, 2024
    Assignee: Wistron Corporation
    Inventor: Yu-Chuan Wu
  • Patent number: 11934237
    Abstract: A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 19, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ruslan Nagimov, Eric Clarence Peterson, Winston Allen Saunders
  • Patent number: 11925007
    Abstract: The heat dissipation assembly structure of a power includes a housing having an open upper portion, a power part having one surface supported by the housing, a printed circuit board disposed above the power part and electrically connected to the power part, and a cover member covering the upper portion of the housing and being coupled to the housing, wherein an inner surface of the cover member presses the other surface of the power part in a direction toward the housing to fixedly press the power part between the housing and the cover member.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: March 5, 2024
    Assignee: HYUNDAI MOBIS Co., Ltd.
    Inventor: Ji Min Jung
  • Patent number: 11917784
    Abstract: A fixing device includes a circuit board, an insertion slot, and a fixing bracket. The circuit board has a peripheral recess, and the insertion slot is disposed on the circuit board. The fixing bracket is fixed in the peripheral recess, and the fixing bracket has a board, two lateral arms, and two guiding rails. The two lateral arms are connected to two corresponding sides of the board, and the two lateral arms are integrally formed from the board. In addition, the two guiding rails are respectively disposed at the two lateral arms, in which the two guiding rails extend towards the insertion slot.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: February 27, 2024
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Chi-Yu Huang, Hsu-Kai Tsai
  • Patent number: 11916365
    Abstract: A wiring substrate includes a first conductive plate, a second conductive plate, and a first insulator. A first end of an element is connected to a first main surface of the first conductive plate, and a second end of the element is connected to a first main surface of the second conductive plate. The first insulator includes a first portion and a second portion. The first portion separates the first conductive plate and the second conductive plate from each other. The second portion is continuous with the first portion, and covers at least a portion of the first main surface. The first portion includes an end portion. The end portion protrudes from the second main surface to the opposite of the first main surface or from the second main surface to the opposite of the first main surface.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: February 27, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Arinobu Nakamura
  • Patent number: 11908495
    Abstract: Disclosed herein is an electronic device that includes a pedestal that extends from a mounting surface of a base of the electronic device. The electronic device also includes a thermal interface material that is interposed between an interface surface of the pedestal and a data processing component, is in direct contact with the data processing component, and is in direct contact with a first portion and a second portion of the interface surface. The first portion of the interface surface of the pedestal has a first height, relative to the mounting surface of the base, and the second portion of the interface surface of the pedestal has a second height, relative to the mounting surface of the base and different than the first height.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 20, 2024
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Bo Yang, Yuhang Yang, Ning Ye
  • Patent number: 11897379
    Abstract: A vehicle seat can be configured to provide support to a vehicle occupant in conditions when lateral acceleration is experienced. Shape memory material members can be operatively positioned with respect to a seat portion of the vehicle seat. The shape memory material members can be selectively activated by an activation input. When activated, the shape memory material members can engage a seat pan so as to cause the seat pan to tilt in a respective lateral direction. As a result, a seat cushion supported by the seat pan can also tilt in the respective lateral direction. The seat cushion can be tilted in a lateral direction that is opposite to the direction of the lateral acceleration. Thus, the effects of lateral acceleration felt by a seat occupant can be reduced. The shape memory material members can be selectively activated based on vehicle speed, steering angle, and/or lateral acceleration.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: February 13, 2024
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ryohei Tsuruta, Brian J. Pinkelman, Umesh N. Gandhi, Paul A. Gilmore
  • Patent number: 11885690
    Abstract: A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: January 30, 2024
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Shiang-Feng Tang, Shun-Lung Yen, Kun-Chi Lo, Wen-Jen Lin
  • Patent number: 11864316
    Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, and a plurality of filled vias. The first insulating layer has a first surface and a second surface positioned on a side opposite to the first surface. The first conductor layer is formed on the first surface of the first insulating layer. The plurality of filled vias are formed inside the first insulating layer. The plurality of filled vias each have a structure in which a via hole penetrating the first insulating layer is filled with a metal. The first conductor layer includes a pad. The pad overlaps the plurality of filled vias in a plan view from a thickness direction of the first insulating layer and is connected to the plurality of filled vias.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: January 2, 2024
    Assignee: FUJIKURA LTD.
    Inventors: Naoki Oyaizu, Yusuke Fujita, Toshiaki Inoue, Shinya Kashima
  • Patent number: 11825594
    Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a surface conductor pattern arranged in a first circuit layer located on the second surface. Also included is a first internal conductor pattern and a second internal conductor pattern arranged in a second circuit layer located between the electric component and the second surface, and insulated from each other. Also, at least one first heat conductor via extends from the electric component to the first internal conductor pattern; and at least one second heat conductor via extends from the surface conductor pattern to the second internal conductor pattern.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: November 21, 2023
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, MIRISE Technologies Corporation
    Inventor: Shohei Nagai
  • Patent number: 11810832
    Abstract: A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: November 7, 2023
    Assignee: Marvell Asia Pte Ltd
    Inventors: Janak Patel, Richard Graf, Manish Nayini, Nazmul Habib
  • Patent number: 11800634
    Abstract: A heat sink fastening structure includes a push pin to fasten a heat sink to a printed circuit board (PCB) and including a head portion formed at an end thereof, a bracket mounted on the PCB and including a through hole formed at a central portion thereof to allow the head portion to penetrate, and an accommodating hole included in the PCB to accommodate the head portion therein, and the head portion is configured to penetrate the through hole and thereafter be accommodated in the accommodating hole, to thereby be fixed to the bracket.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juhyeok Kim, Boik Cho, Jieun Ha, Sangeun Lee
  • Patent number: 11792912
    Abstract: A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: October 17, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventor: Bo-Yen Chen
  • Patent number: 11785743
    Abstract: A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: October 10, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Ernesto Ferrer
  • Patent number: 11785703
    Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 10, 2023
    Assignee: Kioxia Corporation
    Inventors: Kazuya Nagasawa, Tomoaki Morita, Takahisa Funayama, Norihiro Ishii, Hidenori Tanaka
  • Patent number: 11776890
    Abstract: A power semiconductor device includes: a power semiconductor; a base metal sheet; and a flexible printed circuit board (PCB) between the base metal sheet and the power semiconductor. The power semiconductor includes a first power pad on a side facing the flexible PCB, and the flexible PCB includes a conductive pad, one side of which is electrically connected to the first power pad of the power semiconductor and the opposite side of which is electrically connected to the base metal sheet.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: October 3, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Florian Maxl, Markus Pretschuh, Maximilian Hofer, Peter Kurcik
  • Patent number: 11778729
    Abstract: A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: October 3, 2023
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yasuhiro Tsuyuki, Toshiaki Ishii, Yoshio Kawai
  • Patent number: 11751357
    Abstract: An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: September 5, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Suresh Reddy Yarragunta, Deepu Narasimiah Subhash
  • Patent number: 11737242
    Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: August 22, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lei Cao, Shoubiao Xu, Shanjiu Chi
  • Patent number: 11728713
    Abstract: A power conversion device comprises a power conversion circuit, and a multilayer substrate that includes the power conversion circuit, and has a wiring pattern. The wiring pattern of the multilayer substrate includes a power supply pattern, and a ground pattern. The multilayer substrate includes a first layer and a second layer. The power supply pattern includes a first layer power supply pattern portion in the first layer. The ground pattern includes a second layer ground pattern portion in the second layer. The first layer power supply pattern portion and the second layer ground pattern portion overlap with each other at least in part in a direction perpendicular to a plate surface of the multilayer substrate.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: August 15, 2023
    Assignee: DENSO CORPORATION
    Inventor: Hiroyasu Sugiura
  • Patent number: 11700702
    Abstract: This wireless terminal device includes: an input portion; an output portion; a circuit board module electrically connected to the input portion and the output portion; an external power supply module which is detachably connected to the circuit board module, includes an input terminal for receiving input from an external power supply, converts an input voltage inputted to the input terminal, and outputs an output voltage; and a case for storing the input portion, the output portion, the circuit board module, and the external power supply module. In a storage space, a battery can be stored when the external power supply module is detached from the circuit board module. The circuit board module includes a connector connection portion to which a connector of the external power supply module or a connector of the battery can be selectively connected, and which is provided at a position spatially connected to the storage space.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: July 11, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Masanobu Oe
  • Patent number: 11658090
    Abstract: A semiconductor package system includes a substrate, a first and a second semiconductor package, a first thermal conductive layer, a first passive device, and a heat radiation structure. The first and second semiconductor package and first passive device may be mounted on a top surface of the substrate. The first semiconductor package may include a first semiconductor chip that includes a plurality of logic circuits. The first thermal conductive layer may be on the first semiconductor package. The heat radiation structure may be on the first thermal conductive layer, the second semiconductor package, and the first passive device. The heat radiation structure may include a first bottom surface physically contacting the first thermal conductive layer, and a second bottom surface at a higher level than that of the first bottom surface. The second bottom surface may be on the second semiconductor package and/or the first passive device.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: May 23, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Heungkyu Kwon
  • Patent number: 11658089
    Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: May 23, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuji Wakaiki, Shota Sato, Kenta Fujii, Takashi Kumagai
  • Patent number: 11621547
    Abstract: An electronic component holder for a control box for holding non-passive components, such as capacitors, relays and circuit breaker switches to a surface of the control box. The electronic component holder is welded or secured to an inner surface of the control box. By the structure of the electronic component holder, the need for use of conventional fasteners, such as screws or bolts, to hold the electronic components in place within the control box is eliminated.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: April 4, 2023
    Assignee: Tulsar Canada Ltd
    Inventors: George Micevski, Jim Streeter, Mike Colalillo, Michael Certain, Joe Bonnici
  • Patent number: 11622476
    Abstract: A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 4, 2023
    Assignee: Astec International Limited
    Inventors: Yu-Wei Chen, Cheng-Sheng Chen
  • Patent number: 11592883
    Abstract: Thermal management within an information handling system housing is provided by applying graphene paint to a support structure disposed within the housing, such as a battery casing that supports battery cells, a keyboard lattice that supports keyboard coupling to the housing and screws that attach components to the housing. The graphene paint may have different concentrations of graphene and/or different thicknesses so that the thermal characteristics of the support structure adapt to thermal generation within the housing, such as to keep an even distribution of temperatures within the housing.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Pomin Shih, Travis C. North, Geroncio Tan, Deeder M. Aurongzeb, Salvador D. Jimenez, III
  • Patent number: 11589484
    Abstract: The motor driving device is to be mounted to a control panel, and includes: a motor driving device main body; a radiator disposed to face a rear surface of the motor driving device main body; a fan motor unit being disposed above the radiator and being withdrawable through an area above the motor driving device main body; and a floor sheet member configured to be laid out along a withdrawal route of the fan motor unit in a process of withdrawing the fan motor unit.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: February 21, 2023
    Assignee: FANUC CORPORATION
    Inventor: Kazuhiro Yamamoto
  • Patent number: 11582880
    Abstract: An electrical device includes a housing part and a cover part, the cover part being connected to the housing part, in particular with the aid of screws, the cover part in particular covering an opening of the housing part. A first circuit board is connected to the cover part, and an elastically preloaded sheet-metal part, in particular an elastically preloaded tab section of a sheet-metal part, presses at least one heat-generating component, in particular a controllable semiconductor switch, in the direction of the cover part, in particular for the purpose of dissipating heat from the heat-generating component into the environment via the cover part.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: February 14, 2023
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Thomas Hannich, Jürgen Hans Kollar, Klaus Kneller
  • Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Patent number: 11558956
    Abstract: A generator control unit (GCU) having thermal control includes a GCU housing having a first side and a second side. A printed wiring board (PWB) is within the GCU housing between the first side and the second side. The PWB includes a component side that faces a first side of the GCU housing. At least one through via is positioned through a thickness of the PWB. At least one boss is positioned on the component side of the PWB. The at least one boss extends from a component of the PWB to the first side of the GCU housing.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: January 17, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Steven E. Larson, Eric A. Carter, Ethan Johnson
  • Patent number: 11535783
    Abstract: A fusible, phase-change powder composition includes a plurality of powder particles comprising a polymer composition, an unencapsulated phase-change material, and optionally, an additive composition; wherein the powder composition is fusible at a temperature of 25 to 105° C., or 28 to 60° C., or 45 to 85° C., or 60 to 80° C., or 80 to 100° C.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: December 27, 2022
    Assignee: ROGERS CORPORATION
    Inventors: Ming Wei, Sharon Soong, Ian Smith
  • Patent number: 11523542
    Abstract: An information handling system may include a circuit board that includes a plurality of memory module sockets; a plurality of memory modules received in the plurality of memory module sockets; a plurality of heatsinks disposed between adjacent ones of the plurality of memory modules; and a cold plate having projections that extend into regions between adjacent ones of the plurality of heatsinks.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: December 6, 2022
    Assignee: Dell Products L.P.
    Inventor: Travis Gaskill
  • Patent number: 11512711
    Abstract: A centrifugal fan frame body structure includes a lower case body and a cover body. The lower case body has a bottom section and an outer wall section. The outer wall section is formed with a wind outlet. The cover body and the lower case body are correspondingly mated with each other to form a space. In the space, the lower case body and the cover body define therebetween a first height. The lower case body and the cover body define therebetween a second height at the wind outlet. The second height is larger than the first height. The height of the wind outlet is enlarged, whereby the wind outlet will not be blocked by the cooperative heat dissipation component (module) so that the flow field efficiency is enhanced and the noise is lowered.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11499080
    Abstract: This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: November 15, 2022
    Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING CHINESE ACADEMY OF SCIENCES
    Inventors: Wen Dai, Zhengde Lin, Nan Jiang, Jinhong Yu, Dan Dai, Hao Hou
  • Patent number: 11503701
    Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 15, 2022
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Marcus Ni, Voi Nguyen
  • Patent number: 11495908
    Abstract: An electrical connector assembly includes a connector housing and a busbar having a rectangular cross section defining two opposed major surfaces and two opposed minor surfaces disposed within the connector housing. A planar surface is defined by one of the two opposed major surfaces of the busbar. The electrical connector assembly further includes a cooling plate that is sized, shaped, and arranged to be in conductive thermal contact with the planar surface of the busbar. The cooling plate is configured to reduce a temperature of the busbar.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: November 8, 2022
    Inventors: Thomas Mathews, Don E. Bizon, William C. Lovitz, Nicholas A. Durse
  • Patent number: 11497118
    Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: November 8, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: Channing Paige Favreau, James E. Benedict, Mikhail Pevzner, Thomas V. Sikina
  • Patent number: 11474576
    Abstract: An electrical device with thermally controlled performance is disclosed. The electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. The electrical device further includes a plurality of signal paths interconnecting the plurality of device components. The electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. The electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 18, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Alan P. Boone, Brandon C. Hamilton, Kyle B. Snyder, Bryan M. Jefferson
  • Patent number: 11469155
    Abstract: A device in a utility distribution system may comprise a housing, a heat source, a first heat sink, a second heat sink, a heat pipe, and a flexible directional thermal interface material (“DTIM”) with a high-conductivity orientation. The first heat sink may be thermally coupled to the heat source. The second heat sink may be attached to the first heat sink, and the flexible DTIM and the heat pipe may be arranged between the first and second heat sinks. The flexible DTIM may be thermally coupled with the first heat sink and the heat pipe. The heat pipe may be capable of movements with respect to the flexible DTIM. During the movements, the heat pipe may maintain the thermal coupling with the flexible DTIM, such that heat present in the first heat sink may be transferred to the heat pipe via the high-conductivity orientation of the flexible DTIM.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: October 11, 2022
    Assignee: LANDIS+GYR INNOVATIONS, INC.
    Inventor: Damian Bonicatto
  • Patent number: 11452231
    Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: September 20, 2022
    Assignee: National Instruments Corporation
    Inventors: Richard G. Baldwin, Jr., Michael H. Singerman
  • Patent number: 11435148
    Abstract: An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: September 6, 2022
    Assignee: Raytheon Company
    Inventors: Tuan L. Duong, Eric Swanson, Michael Hulse, William Francis
  • Patent number: 11430713
    Abstract: A member to be fastened on one side of which a member to be fixed is placed; a plate-shaped holding spring member which is disposed on the member to be fixed on one side thereof opposite to the member to be fastened; a support which extends outward of an end part of a longitudinal central part of the plate-shaped holding spring member and which has a through hole formed therein; a supporting column which is provided on the support and bends toward the member to be fastened; a fixing screw hole which is provided in the member to be fastened and disposed at a position corresponding to the through hole of the support so as to have the same axial center as the through hole; and a fixing screw which is inserted into the through hole of the support and screwed to the fixing screw hole.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: August 30, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Niki Kitahama, Ryohei Hayashi, Hirofumi Miyoshi
  • Patent number: 11417963
    Abstract: A radio frequency (RF) system includes an RF integrated circuit (IC) die, and an antenna coupled to the RF IC die. The RF system further includes a reflector layer over the RF IC die, the reflector layer extending over at least a portion of the antenna, a combination of the antenna and the reflector layer having a radiation pattern that comprises a main lobe in a first direction parallel to a top surface of the reflector layer.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 16, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Ashutosh Baheti
  • Patent number: 11379022
    Abstract: The present invention relates to a mobile terminal comprising: a terminal body; a circuit board mounted inside the terminal body; an electronic device mounted on one surface of the circuit board; a shield can provided on the circuit board so as to surround the electronic device and shielding electromagnetic waves generated from the electronic device; a metal plate coupled to the shield can and made of a material having high thermal conductivity; and a heat pipe which is positioned to face the shield can with the metal plate interposed therebetween and has a flow path to accommodate a fluid at a center portion thereof, wherein the metal plate and the heat pipe are integrally formed, and heat generated in the electronic device can be transmitted to the heat pipe through the metal plate.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: July 5, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Kyungui Park, Byungsun Kim, Wook Kim, Joseph Lee
  • Patent number: 11333686
    Abstract: An in-line suspended non-directional power sensor coupling configuration situated within a high frequency transmission line housing that allows non-directional current and sampling voltage elements to all be produced simultaneously on one or more double sided printed circuit boards (PCB). The power sensor coupling allows for repeatable calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: May 17, 2022
    Inventor: Jefferson D. Lexa
  • Patent number: 11335642
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a first die comprising a first face and a second face; and a second die, the second die comprising a first face and a second face, wherein the second die further comprises a plurality of first conductive contacts at the first face and a plurality of second conductive contacts at the second face, and the second die is between first-level interconnect contacts of the microelectronic assembly and the first die.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: May 17, 2022
    Assignee: Intel Corporation
    Inventors: Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan
  • Patent number: 11224140
    Abstract: Embodiments of the present disclosure provide a top cover arrangement for a storage and the corresponding storage. The storage comprises a drawer chassis which accommodates disks that are organized among a plurality of rows. The top cover arrangement covers the disks in a foldable manner and comprises: a substrate covering the disks and being flexible; and a plurality of folding parts mounted on the substrate and corresponding to the plurality of the rows; the folding parts being adapted to be at least partially folded to expose at least one row of disks in response to the disks being pulled out of the drawer chassis.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: January 11, 2022
    Assignee: EMC IP HOLDING COMPANY, LLC
    Inventors: Haifang Zhai, Yujie Zhou, Qingqiang Guo, Weidong Zuo, Wenjin Seraph Xu
  • Patent number: 11114372
    Abstract: An integrated circuit includes a main body having a top and a bottom; and upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body, in which each of the upper pins has a first protruding portion protruding toward outside from a side or the top of the main body, and each of the lower pins has a second protruding portion protruding toward outside from the side or the bottom of the main body.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: September 7, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jungjae Kim, Heejung Hong, Soondong Cho, Hyungjin Choe
  • Patent number: 11092515
    Abstract: The present invention relates to a platform for testing collisions or near-collision situations between a collision body, in particular a vehicle, and a test object. The platform has a base body, which has a bottom surface and an attachment surface formed opposite to the bottom surface, wherein an attachment device is formed on the attachment surface for attaching the test object. Furthermore, the platform has at least one roller element, which is arranged at the bottom surface, wherein the roller element configured such that the base body is displaceable along a ground by the roller element. An installation box having an installation volume is arranged in a receiving opening of the base body, wherein the installation box is conceived in the receiving opening of the base body such that a temperature control region of the installation box is in contact with a surroundings of the base body.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 17, 2021
    Assignee: 4ACTIVESYSTEMS GMBH
    Inventors: Reinhard Hafellner, Martin Fritz