Plural Patents (Class 361/721)
  • Patent number: 11006513
    Abstract: The first board section comprises a switching module with heat-generating semiconductor switches associated with a first operational temperature range. The first board section has a first conductive layer of a first thickness. The second board section comprises a plurality of capacitors mounted on a second circuit board. The second board section has conductive traces for interconnecting the capacitors as a network. The capacitors are associated with a second operational temperature range that is lower than the first operational temperature range. A thermal isolation intermediary forms a barrier between, or adjoining, the first board section and the second board section, where the first board section and the second board section are spaced part from each other by the thermal isolation intermediary.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 11, 2021
    Assignee: DEERE & COMPANY
    Inventor: Christopher J. Schmit
  • Patent number: 10921867
    Abstract: A field device for automation technology is accommodated in a housing which is produced from a polygonal profile and, for its part, is closed by a base plate and a cover plate. A base module is connected to the base plate, the base module being provided in a manner designed in the same way in all devices of a field bus, in order to manage the tasks of voltage supply and network connection. A functional module, which is optionally connected to the cover plate, provides the field device with one or more specific functionalities, and therefore configures the field device in a specific direction. This results in a unit of modular construction which, together with other identical field devices of different configuration, can be joined in accordance with the construction kit principle to form an automation system.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: February 16, 2021
    Assignee: Robodev GmbH
    Inventors: Andreas Bihlmaier, Julien Mintenbeck, Jens Liedke
  • Patent number: 10888031
    Abstract: An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: January 5, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Vincent W Michna
  • Patent number: 10874032
    Abstract: An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: December 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, John Norton, Sunil Ganta
  • Patent number: 10861837
    Abstract: A video-wall module is disclosed. In an embodiment a video-wall module includes a printed-circuit board, a plurality of light-emitting diode chips arranged at the printed-circuit board, a circuit chip fixed to the printed-circuit board, wherein the circuit chip is connected with electrical connections of the light-emitting diode chips in order to electrically actuate the light-emitting diode chips and a housing for the circuit chip at least partially formed by the printed circuit board, wherein the light-emitting diode chips are divided into a first area and a first edge area surrounding the first area, and wherein the light-emitting diode chips in the first area comprise a smaller radiation wavelength than the light-emitting diode chips in the first edge area on average at the same temperature.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: December 8, 2020
    Assignee: OSRAM OLED GMBH
    Inventor: Thomas Schwarz
  • Patent number: 10840625
    Abstract: An avionics power management panel and power panel controller assembly where the panel includes a cabinet including a set of walls at least partially defining an interior with a printed circuit board. The power panel controller assembly can be provided in the interior and can include a chassis housing one or more power panel control modules adapted to couple to the printed circuit board via one or more complementary PCB connectors.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: November 17, 2020
    Assignee: GE Aviation Systems Limited
    Inventors: Christopher Andrew Leivers, John Michael Brett
  • Patent number: 10568444
    Abstract: The invention relates to a piece of furniture (30), comprising at least one support rod (10) and at least one first plate (20), on which the support rod or support rods (10) can be installed. The first plate (20) has one or more first openings (21). Into each of said first openings (21), a support rod (10) can be inserted at one end (11) thereof, and each of the support rods (10) can be mounted perpendicular on the first plate (20). The support rod (10) has a star-shaped axially symmetric cross-section (13), which is tapered at the one end (11) facing the first plate (20). The shape of the first openings (21) is adapted to the star-shaped cross-section (13) of the support rod (10), preferably in such a way that the shape of the first openings is designed similarly to the star-shaped cross-section (13) of the support rod (10).
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: February 25, 2020
    Assignee: Dula-Werke Dustmann & Co GmbH
    Inventors: Stefan Hoheisel, Alexander Reimer
  • Patent number: 10554029
    Abstract: An enclosure has one or more panels produced by extruding and cut to desired length. An extruded panel of the enclosure may integrate heat sinks, threaded rod locations, and internal grooves to attach adjacent panels. Top and bottom plates may be joined to the panels by threaded rods passing from the top plate through to the bottom plate via the threaded rod locations engineered into the extrusion, enabling the panels and plates to be pulled together by turning the threaded rods. Once assembled, the enclosure may accommodate a variety of electrical equipment at time of assembly and/or at the enclosure installation site. The enclosure has applicability in electrical power distribution, for example as a combiner box in a solar power distribution system.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: February 4, 2020
    Assignee: BENTEK CORPORATION
    Inventors: Robert J. Hannum, Douglas E. McCracken
  • Patent number: 10271456
    Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: April 23, 2019
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Rick Tufty, Steve Shafer
  • Patent number: 10212854
    Abstract: Described herein is a first system that includes sleds each having sidewalls, a mounting plate, and a first cover. The first cover is movable relative to the sidewalls between a closed position and an open position. The first cover includes at least one first opening. The system additionally includes at least one data storage device fixed to each mounting plate. A first air gap is defined between the at least one data storage device and the mounting plate, and a second air gap is defined between the at least one data storage device and the at least one first opening of the first cover. The sleds are stacked together such that the first covers of adjacent sleds are directly adjacent each other, and the at least one first opening of the first cover of one sled at least partially overlaps the at least one first opening of an adjacent sled.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: February 19, 2019
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Hussam Zebian, Thomas Albrecht
  • Patent number: 10179647
    Abstract: Disclosed herein are unmanned aerial vehicles (UAVs). Some UAVs include a vertically-mounted printed circuit board (PCB). The UAVs have yaw, pitch, and roll axes. The UAVs comprise a plurality of propellers, each of the plurality of propellers configured to rotate about a respective one of a plurality of axes of rotation; a base assembly coupled to each of the plurality of propellers; and a PCB coupled to the base assembly. A surface of the PCB lies in a plane defined by the yaw axis and the roll axis, and no portion of the PCB intersects any axis of rotation of any propeller of the unmanned aerial vehicle. The PCB may have a non-rectangular shape, such as the shape of a shark. Some UAVs include a PCB comprising a mechanical feature configured to engage with a peripheral or a peripheral subassembly.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 15, 2019
    Assignee: Fat Shark Technology SEZC
    Inventors: Jerome Meugnier, Gregory French, Allan Evans
  • Patent number: 10127949
    Abstract: A computing device caddy for housing a computing device is provided. The caddy includes a first caddy component. The first caddy component includes a first end wall including a first plurality of fins coupled to an outer surface of the first end wall. The first plurality of fins are configured relative to each other to create eddies within a flow. The caddy also includes a second caddy component. The second caddy component includes a second end wall. The second end wall is opposite the first end wall. The second caddy component is coupled to the first caddy component, thereby defining a cavity for housing the computing device.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: November 13, 2018
    Inventor: Andrew William Mayhall
  • Patent number: 10117357
    Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: October 30, 2018
    Assignee: FUTUREWEI TECHNOLOGIES, INC.
    Inventors: Mo Bai, Vadim Gektin
  • Patent number: 10051723
    Abstract: This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: August 14, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Ravi Kiran Nalla, Raymond Kirk Price
  • Patent number: 9974157
    Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: May 15, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Hendrik Pieter Jacobus de Bock, Brian Magann Rush, Stefano Angelo Mario Lassini
  • Patent number: 9936613
    Abstract: A rack for supporting a sleds includes a pair of elongated support posts and pairs of elongated support arms that extend from the elongated support posts. Each pair of the elongated support arms defines a sled slot to receive a corresponding sled. To do so, each elongated support arm includes a circuit board guide to receive a chassis-less circuit board substrate of the corresponding sled. The rack may include a cross-member arm associated with each sled slot and an optical connector mounted to each cross-member arm. Additional elongated support posts may be used to provide additional sled slots.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: April 3, 2018
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Michael T. Crocker, Myles Wilde
  • Patent number: 9861011
    Abstract: Described herein is a first system that includes sleds each having sidewalls, a mounting plate, and a first cover. The first cover is movable relative to the sidewalls between a closed position and an open position. The first cover includes at least one first opening. The system additionally includes at least one data storage device fixed to each mounting plate. A first air gap is defined between the at least one data storage device and the mounting plate, and a second air gap is defined between the at least one data storage device and the at least one first opening of the first cover. The sleds are stacked together such that the first covers of adjacent sleds are directly adjacent each other, and the at least one first opening of the first cover of one sled at least partially overlaps the at least one first opening of an adjacent sled.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: January 2, 2018
    Assignees: HGST NETHERLANDS B.V., WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Hussam Zebian, Thomas Albrecht
  • Patent number: 9693479
    Abstract: An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: June 27, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, John P Franz, Jon Kolas, David A Moore
  • Patent number: 9655244
    Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: May 16, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen-Chu Tsai, Cheng-Yi Wang, Yuh-Zheng Lee, Ko-Chin Yang, Shi-Chang Chen
  • Patent number: 9594221
    Abstract: An optical connector includes an optical transceiver having an optical element, a case that covers the optical element, and a plurality of terminals that are externally protruded from a terminal projecting surface of the case, and a connector housing having a housing chamber that houses the optical transceiver. The terminal projecting surface of the case is formed as a flat reference plane. A surface which forms the housing chamber and to which the terminal projecting surface of the case abuts is formed as a flat position-correction surface. A pair of projections are formed on a surface which forms the housing chamber and which is opposite to the position-correction surface.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: March 14, 2017
    Assignee: YAZAKI CORPORATION
    Inventor: Tomohiro Hikosaka
  • Patent number: 9591789
    Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: March 7, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Nobutake Tsuyuno, Toshiya Satoh, Masahiko Asano
  • Patent number: 9404357
    Abstract: An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: August 2, 2016
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Ruben Martinez, Adan Diaz
  • Patent number: 9271388
    Abstract: A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: February 23, 2016
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventor: Shih-Ping Hsu
  • Patent number: 9237679
    Abstract: An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: January 12, 2016
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventor: Martin Schoerner
  • Patent number: 9068784
    Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: June 30, 2015
    Assignee: International Business Machines Corporation
    Inventors: Aaron R. Cox, William J. Grady, V, Jason A. Matteson, Jason E. Minyard
  • Publication number: 20150145469
    Abstract: An electronic device includes a heat-dissipating base, a first printed wiring board assembly, and a second printed wiring board assembly. The first printed wiring board assembly is disposed on the heat-dissipating base. The first printed wiring board assembly includes a first printed wiring board and at least one first electronic component. The first electronic component is disposed on the first printed wiring board, such that the first printed wiring board assembly has a raised portion and a concave portion relative to the raised portion. The second printed wiring board assembly is at least partially disposed in the concave portion.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 28, 2015
    Inventors: Pei-Ai YOU, Xing-Xian LU, Gang LIU, Jin-Fa ZHANG
  • Patent number: 8995134
    Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: March 31, 2015
    Assignee: Lear Corporation
    Inventors: Jose Alberto Saez-Zamora, Xavier Jorda-Sanuy, Jordi Suarez-Jimenez, Jose Gabriel Fernandez-Banares, Xavier Perpina-Giribet, Miquel Vellvehi-Hernandez, Laurent Aubouy
  • Patent number: 8982563
    Abstract: A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: March 17, 2015
    Assignee: Oracle International Corporation
    Inventors: Kannan Raj, Ivan Shubin, John E. Cunningham
  • Patent number: 8953312
    Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: February 10, 2015
    Assignee: Fujitsu Limited
    Inventors: Akira Shimasaki, Hideo Kubo
  • Publication number: 20150022974
    Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.
    Type: Application
    Filed: October 2, 2014
    Publication date: January 22, 2015
    Inventors: Kinya NAKATSU, Hideyo SUZUKI, Fusanori NISHIKIMI, Takeshi MATSUO, Toshiya SATOU
  • Patent number: 8913391
    Abstract: An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: December 16, 2014
    Assignee: Alcatel Lucent
    Inventors: Wei Ling, Salvatore Messana, Paul Rominski
  • Patent number: 8913384
    Abstract: Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: December 16, 2014
    Assignee: International Business Machines Corporation
    Inventors: Milnes P. David, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Pritish R. Parida, Roger R. Schmidt, Mark E. Steinke
  • Publication number: 20140362539
    Abstract: A display device comprises a display panel, a carrying member, a plurality of circuit connecting boards, a control circuit board and at least a front frame member. The carrying member carries the display panel. The circuit connecting boards are disposed adjacent to the carrying member and physically and electrically connected to the display panel. The shortest distance between the two adjacent circuit connecting boards is between 0.1 mm and 20 mm. The control circuit board is disposed adjacent to the carrying member and electrically connected to the circuit connecting boards, and electrically connected to the display panel through the circuit connecting boards. The front frame member is disposed at the outer edge of the carrying member and connected to the carrying member, and includes a turning portion and an extending portion. The thickness of the turning portion is greater than that of the extending portion.
    Type: Application
    Filed: May 21, 2014
    Publication date: December 11, 2014
    Applicant: InnoLux Corporation
    Inventors: Wei-Shih HUANG, Kun-Chih AI, Shih-Yuan FENG
  • Patent number: 8902596
    Abstract: A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: December 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Hoon Kim, Dong-Chun Lee, Jae-Hoon Choi, Hyung-Mo Hwang
  • Patent number: 8897013
    Abstract: A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high voltage vehicle battery with AC energy provided from a utility power grid. The housing may include a groove and seal arrangement operable to seal a fluid coolant chamber used to cool the circuitry from leaking fluid during use.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: November 25, 2014
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, John M. Van Dyke, Richard J. Hampo, Slobodan Pavlovic, Rutunj Rai, Reinhard Pusch
  • Publication number: 20140329405
    Abstract: An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.
    Type: Application
    Filed: May 1, 2013
    Publication date: November 6, 2014
    Applicant: FINISAR CORPORATION
    Inventor: Cindy H. Hsieh
  • Patent number: 8867210
    Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: October 21, 2014
    Assignee: Deere & Company
    Inventors: Gregory K. Harmelink, Christopher J. Schmit
  • Patent number: 8854818
    Abstract: A device for selectively clamping an electronic module to a heat sink comprising a frame and a camshaft rotatably attached to the frame. The camshaft comprises at least one cam lobe arranged thereon for selectively applying a clamping force on the electronic module in a direction generally normal to the heat sink.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: October 7, 2014
    Assignee: Lockheed Martin Corporation
    Inventor: Marc T. Angelucci
  • Patent number: 8842431
    Abstract: Provided is an apparatus, a system, and a method for operating the same. The apparatus, in one embodiment, includes a chassis having a front configured to accept one or more circuit boards, a back, and first and second sides. The apparatus, in this embodiment, further includes one or more slots located within the chassis, each slot configured to receive one of the circuit boards at an angle with respect to the first and second sides. The slots, in this embodiment, at least partially define a first plenum opening to the front and a second plenum opening to the back. The apparatus additionally includes a fan assembly coupled to one of the first plenum or the second plenum.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: September 23, 2014
    Assignee: Alcatel Lucent
    Inventor: Charles C. Byers
  • Publication number: 20140268578
    Abstract: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Apple Inc.
    Inventors: Dominic E. Dolci, Phillip S. Satterfield, Vikas K. Sinha
  • Publication number: 20140268581
    Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.
    Type: Application
    Filed: May 28, 2014
    Publication date: September 18, 2014
    Applicant: YAZAKI CORPORATION
    Inventors: Akira HARAO, Mototatsu MATSUNAGA, Yasuhiro SUGIURA, Minoru KUBOTA
  • Patent number: 8824138
    Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: September 2, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Publication number: 20140240930
    Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER, Richard P. SNIDER
  • Publication number: 20140211421
    Abstract: A circuit board assembly includes first and second circuit boards that each have a substrate and a conductive circuit layer positioned on the substrate. The first and second circuit boards are arranged such that the conductive circuit layers face each other across a gap. Thermal conductor pillars extend lengths across the gap between the conductive circuit layers of the first and second circuit boards. The thermal conductor pillars include opposite first and second ends that are engaged in thermal contact with the conductive circuit layers of the first and second circuit boards, respectively. The thermal conductor pillars provide thermal pathways for heat to travel between the first and second circuit boards.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: Matthew D. Mishrikey, James O'Keeffe, Bruce R. Conway, Peter J. Dutton
  • Publication number: 20140198457
    Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.
    Type: Application
    Filed: January 15, 2013
    Publication date: July 17, 2014
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventors: Suzanne Marye WONG, Martin Peter John CORNES, Robert Charles TUFFORD
  • Patent number: 8780554
    Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: July 15, 2014
    Assignee: Fujitsu Limited
    Inventor: Misao Umematsu
  • Patent number: 8780551
    Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: July 15, 2014
    Assignee: Brocade Communications Systems, Inc.
    Inventor: Eric W. Farnholtz
  • Patent number: 8767403
    Abstract: A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: July 1, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Timothy Rau, Glenn C. Simon
  • Patent number: 8749981
    Abstract: Systems, methods, and apparatus are provided for a mounting base for circuit board assemblies that provides both mounting of one or more circuit boards and a pathway including one or more fins to conduct heat away from the one or more circuit boards.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: June 10, 2014
    Assignee: General Electric Company
    Inventors: Christopher Todd Moore, Drew Miller
  • Patent number: 8737067
    Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: May 27, 2014
    Assignee: Juniper Networks, Inc.
    Inventors: Sean Kim, Muhammad Sagarwala, Phu Truong