Abstract: An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

Abstract: A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module (“DIMM”) installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

Abstract: A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

Abstract: A system may include a plurality of rack-mountable, ruggedized drawers, each comprising a main body, a set of fans, a power supply, and a card connector. Connections may be provided, via a backplane of each of the card connectors, to a set of plugin cards each installed in the respective main body. A processor of the card connector of one of the drawers may represent the drawers by communicating information with an external third party.

Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: An aerosol generating device includes: a holder configured to generate aerosols; and a cradle which displays, on the display, data obtained from the sensor and an indicator for activating a user interface, outputs through the user interface a plurality of pre-stored temperature profiles in response to a first user input of selecting the indicator, and in response to a second user input of selecting any one of the plurality of the pre-stored temperature profiles, transmits the selected temperature profile to the holder such that the holder controls a temperature profile used to heat an aerosol generating material based on the selected temperature profile.

Abstract: An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.

Abstract: A semiconductor device has a package substrate, a system-on-chip (SoC) die, and a power management integrated circuit (PMIC) die, arranged in a vertical stack. The SoC die is disposed on a first surface of the package substrate, and the PMIC die is mechanically coupled to a second surface of the package substrate. The PMIC die is electrically coupled to the SOC die via first via connectors of the package substrate and configured to provide DC power to the SOC die via DC connectors electrically coupled to the via connectors of the package substrate. The PMIC die includes thin film inductors, corresponding to the DC connectors, on a surface of the PMIC die and located adjacent to the second surface of the package substrate.

Abstract: Aspects of the present invention relate to providing see-through computer display optics.

Abstract: Semiconductor device has a regulator circuit having an even number of switching regulators that generate output power from an input power supply and a power management IC that controls the output potential generated by the switching regulator. semiconductor device is characterized in that a group of half of the even number of switching regulators is arranged on a first surface of semiconductor device system board, and a group of switching regulators, which is the remaining half, is arranged on a second surface that is in front-back relation with the first surface. This semiconductor device reduces semiconductor device board-area (pattern-resource).

Abstract: An integrated circuit assembly may be formed having a substrate core, wherein the substrate core includes at least one heat transfer fluid channel formed therein, a first build-up layer formed on a first surface of the substrate core, and a second build-up layer formed on a second surface of the substrate core, and methods of fabricating the same. In embodiments of the present description, the integrated circuit structure may include at least one integrated circuit device formed within at least one of the first build-up layer and the second build-up layer. The embodiments of the present description allow for cooling within the substrate, which may significantly reduce thermal damage to the components of the substrate and/or integrated circuit devices within the substrate.

Abstract: A housing includes a tubular housing and a first lid section. The first lid section is fitted to one end portion of the tubular housing. The tubular housing includes a first protruding section protruding toward a first lid section from a joint surface in contact with the first lid section. The first protruding section has a configuration allowing the tubular housing and a heat conductive member, to conduct heat from a heat generating body disposed inside the tubular housing, to be fixed together.

Abstract: Embodiments include an electronics package and methods of forming such packages. In an embodiment, the electronics package comprises a first package substrate. In an embodiment, the first package substrate comprises, a die embedded in a mold layer, a thermal interface pad over a surface of the die, and a plurality of solder balls over the thermal interface pad. In an embodiment, the thermal interface pad and the solder balls are electrically isolated from circuitry of the electronics package. In an embodiment, the electronics package further comprises a second package substrate over the first package substrate.

Abstract: Systems and methods for cooling a vehicle computing system are provided. A computing system can include a cooling baseplate including a first planar cooling surface and a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.

Abstract: Aspects of the present invention relate to providing see-through computer display optics.

Abstract: A first lateral surface, a second lateral surface, an upper surface, and a bottom surface of a housing of an imaging device is formed of metal and at least two surfaces among the first lateral surface, the second lateral surface, the upper surface, and the bottom surface include a groove region formed of a plurality of grooves.

Abstract: A module including a substrate; a cooling unit that cools a heat-generating component provided on the substrate; a connection terminal portion provided on the substrate; and a connection pipe that is connected to the cooling unit and that extends in a direction different from a direction of at least one of insertion and withdrawal of the connection terminal portion, wherein the connection pipe extends from a side towards the connection terminal portion.

Abstract: The disclosure provides an electronic device that includes a first circuit board, a second circuit board, a charge pump chipset, a battery, and a control component. The charge pump chipset can be coupled to the battery, and include at least two charge pump chips provided on the first circuit board and at least two charge pump chips provided on the second circuit board. The control component is configured to control one charge pump chip on the first circuit board and at least one charge pump chip on the second circuit board to be in a working state at the same time and, in response to a temperature of the charge pump chip on the first circuit board in the working state being higher than a set threshold, to switch any charge pump chip on the first circuit board with the temperature lower than the set threshold to the working state.

Abstract: The first board section comprises a switching module with heat-generating semiconductor switches associated with a first operational temperature range. The first board section has a first conductive layer of a first thickness. The second board section comprises a plurality of capacitors mounted on a second circuit board. The second board section has conductive traces for interconnecting the capacitors as a network. The capacitors are associated with a second operational temperature range that is lower than the first operational temperature range. A thermal isolation intermediary forms a barrier between, or adjoining, the first board section and the second board section, where the first board section and the second board section are spaced part from each other by the thermal isolation intermediary.

Abstract: A field device for automation technology is accommodated in a housing which is produced from a polygonal profile and, for its part, is closed by a base plate and a cover plate. A base module is connected to the base plate, the base module being provided in a manner designed in the same way in all devices of a field bus, in order to manage the tasks of voltage supply and network connection. A functional module, which is optionally connected to the cover plate, provides the field device with one or more specific functionalities, and therefore configures the field device in a specific direction. This results in a unit of modular construction which, together with other identical field devices of different configuration, can be joined in accordance with the construction kit principle to form an automation system.

Abstract: An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.

Abstract: An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

Abstract: A video-wall module is disclosed. In an embodiment a video-wall module includes a printed-circuit board, a plurality of light-emitting diode chips arranged at the printed-circuit board, a circuit chip fixed to the printed-circuit board, wherein the circuit chip is connected with electrical connections of the light-emitting diode chips in order to electrically actuate the light-emitting diode chips and a housing for the circuit chip at least partially formed by the printed circuit board, wherein the light-emitting diode chips are divided into a first area and a first edge area surrounding the first area, and wherein the light-emitting diode chips in the first area comprise a smaller radiation wavelength than the light-emitting diode chips in the first edge area on average at the same temperature.

Abstract: An avionics power management panel and power panel controller assembly where the panel includes a cabinet including a set of walls at least partially defining an interior with a printed circuit board. The power panel controller assembly can be provided in the interior and can include a chassis housing one or more power panel control modules adapted to couple to the printed circuit board via one or more complementary PCB connectors.

Abstract: The invention relates to a piece of furniture (30), comprising at least one support rod (10) and at least one first plate (20), on which the support rod or support rods (10) can be installed. The first plate (20) has one or more first openings (21). Into each of said first openings (21), a support rod (10) can be inserted at one end (11) thereof, and each of the support rods (10) can be mounted perpendicular on the first plate (20). The support rod (10) has a star-shaped axially symmetric cross-section (13), which is tapered at the one end (11) facing the first plate (20). The shape of the first openings (21) is adapted to the star-shaped cross-section (13) of the support rod (10), preferably in such a way that the shape of the first openings is designed similarly to the star-shaped cross-section (13) of the support rod (10).

Abstract: An enclosure has one or more panels produced by extruding and cut to desired length. An extruded panel of the enclosure may integrate heat sinks, threaded rod locations, and internal grooves to attach adjacent panels. Top and bottom plates may be joined to the panels by threaded rods passing from the top plate through to the bottom plate via the threaded rod locations engineered into the extrusion, enabling the panels and plates to be pulled together by turning the threaded rods. Once assembled, the enclosure may accommodate a variety of electrical equipment at time of assembly and/or at the enclosure installation site. The enclosure has applicability in electrical power distribution, for example as a combiner box in a solar power distribution system.

Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.

Abstract: Described herein is a first system that includes sleds each having sidewalls, a mounting plate, and a first cover. The first cover is movable relative to the sidewalls between a closed position and an open position. The first cover includes at least one first opening. The system additionally includes at least one data storage device fixed to each mounting plate. A first air gap is defined between the at least one data storage device and the mounting plate, and a second air gap is defined between the at least one data storage device and the at least one first opening of the first cover. The sleds are stacked together such that the first covers of adjacent sleds are directly adjacent each other, and the at least one first opening of the first cover of one sled at least partially overlaps the at least one first opening of an adjacent sled.

Abstract: Disclosed herein are unmanned aerial vehicles (UAVs). Some UAVs include a vertically-mounted printed circuit board (PCB). The UAVs have yaw, pitch, and roll axes. The UAVs comprise a plurality of propellers, each of the plurality of propellers configured to rotate about a respective one of a plurality of axes of rotation; a base assembly coupled to each of the plurality of propellers; and a PCB coupled to the base assembly. A surface of the PCB lies in a plane defined by the yaw axis and the roll axis, and no portion of the PCB intersects any axis of rotation of any propeller of the unmanned aerial vehicle. The PCB may have a non-rectangular shape, such as the shape of a shark. Some UAVs include a PCB comprising a mechanical feature configured to engage with a peripheral or a peripheral subassembly.

Abstract: A computing device caddy for housing a computing device is provided. The caddy includes a first caddy component. The first caddy component includes a first end wall including a first plurality of fins coupled to an outer surface of the first end wall. The first plurality of fins are configured relative to each other to create eddies within a flow. The caddy also includes a second caddy component. The second caddy component includes a second end wall. The second end wall is opposite the first end wall. The second caddy component is coupled to the first caddy component, thereby defining a cavity for housing the computing device.

Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.

Abstract: This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.

Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.

Abstract: A rack for supporting a sleds includes a pair of elongated support posts and pairs of elongated support arms that extend from the elongated support posts. Each pair of the elongated support arms defines a sled slot to receive a corresponding sled. To do so, each elongated support arm includes a circuit board guide to receive a chassis-less circuit board substrate of the corresponding sled. The rack may include a cross-member arm associated with each sled slot and an optical connector mounted to each cross-member arm. Additional elongated support posts may be used to provide additional sled slots.

Abstract: Described herein is a first system that includes sleds each having sidewalls, a mounting plate, and a first cover. The first cover is movable relative to the sidewalls between a closed position and an open position. The first cover includes at least one first opening. The system additionally includes at least one data storage device fixed to each mounting plate. A first air gap is defined between the at least one data storage device and the mounting plate, and a second air gap is defined between the at least one data storage device and the at least one first opening of the first cover. The sleds are stacked together such that the first covers of adjacent sleds are directly adjacent each other, and the at least one first opening of the first cover of one sled at least partially overlaps the at least one first opening of an adjacent sled.

Abstract: An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Abstract: An optical connector includes an optical transceiver having an optical element, a case that covers the optical element, and a plurality of terminals that are externally protruded from a terminal projecting surface of the case, and a connector housing having a housing chamber that houses the optical transceiver. The terminal projecting surface of the case is formed as a flat reference plane. A surface which forms the housing chamber and to which the terminal projecting surface of the case abuts is formed as a flat position-correction surface. A pair of projections are formed on a surface which forms the housing chamber and which is opposite to the position-correction surface.

Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.

Abstract: An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.

Abstract: A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.

Abstract: An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: An electronic device includes a heat-dissipating base, a first printed wiring board assembly, and a second printed wiring board assembly. The first printed wiring board assembly is disposed on the heat-dissipating base. The first printed wiring board assembly includes a first printed wiring board and at least one first electronic component. The first electronic component is disposed on the first printed wiring board, such that the first printed wiring board assembly has a raised portion and a concave portion relative to the raised portion. The second printed wiring board assembly is at least partially disposed in the concave portion.

Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.

Abstract: A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.

Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.

Abstract: Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.