Selective Connections Patents (Class 361/733)
  • Patent number: 7242590
    Abstract: An electronic instrument system uses a “DualPlay” concept comprising first and second mutually-exclusive modes of operation. The system includes an instrument module having first and second communications channels, each for linking the instrument module to one or more processors. The first communications channel comprises a first connector attached to the instrument module for mating to a backplane connector electrically connected to traces. The system operates in the first mode when the instrument module communicates through the first communications channel. Additionally, the system operates in the second mode when the instrument module communicates through the second communications channel, the first connector is disengaged from the backplane connector and the electronic instrument is not communicating through the first communications channel.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: July 10, 2007
    Assignee: Agilent Technologies, Inc.
    Inventors: Boon Leong Yeap, Shiew Foe Foo, Cheo Bong Lim, Eng Su Tay
  • Patent number: 7203068
    Abstract: An electronic apparatus according to the present invention includes two modules which decode high frequency analog signals. Furthermore, each of the modules is provided with an RF section at a position away from the center of the module in either longitudinal direction to carry out radio communications using high frequencies. In this electronic apparatus, the two modules are arranged so that their longitudinal sides extend parallel with each other in opposite directions. The two modules are also misaligned with each other in the longitudinal direction so that the RF sections lie away from each other and so that connectors to which signals subject to noise interference are inputted lie away from each other.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: April 10, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hironori Motoe
  • Patent number: 6999322
    Abstract: A memory stick includes a plastic shell, an elongated metal casing mounted in the plastic shell and having a front extension exposed to the outside of the plastic shell for insertion into a USB socket of a computer, a circuit board mounted inside the elongated metal casing and having a USB connector suspended in the front extension of the elongated metal casing, a locating frame mounted inside the metal casing to support the circuit board, and an end cap capped on the rear end of the circuit board and inserted with the circuit board into the rear end of the hollow plastic shell.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: February 14, 2006
    Assignee: Chant Sincere Co., Ltd.
    Inventor: Chih-Chien Lin
  • Patent number: 6927974
    Abstract: The present invention provides chassis for housing at least one processor, the chassis includes at least one compartment adapted to receive a processor, a connector for coupling the at least one processor to the chassis when the processor is installed in the at least one compartment. The connector includes a first component attached to the processor and a second component attached to the chassis and adapted to be mated with the first component, the connector may also be adapted to provide data and power connections between the chassis and the processor when coupled. Additionally, the first component aligns and mates with the second component during the insertion of the processor into the compartment without any visual alignment of the first and second components of the connector.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: August 9, 2005
    Assignee: Egenera, Inc.
    Inventors: David Robillard, Daniel Busby, Otto DeRuntz, Mike Degerstrom, Richard M. Haney
  • Patent number: 6847528
    Abstract: Methods, systems and devices are described relating to a chassis for front and back inserted modules. An apparatus includes a chassis including a first module bay and a second module bay, the first module bay and the second module bay together composing both a forward section and rearward section.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: January 25, 2005
    Assignee: Aurora Networks, Inc.
    Inventors: Guy Sucharczuk, Krzysztof Pradzynski, Artie Avlonitis, Jose Salinas
  • Patent number: 6816386
    Abstract: A compact card connector having reduced width and thickness is provided for receiving an information card whereby the information card has a narrow step-like recess along one of its side edges and a sliding identifier mechanism provided in a concave cut in the step. The card connector includes a frame that receives the information card, and an identifier detecting means for detecting a sliding position of the identifier. The identifier detecting means includes a suitably placed fixed contact member and a movable contact member which are mounted on the frame, with part of the movable contact member forming a projection for detecting the sliding position of the identifier, whereby the projection lies in an area within the housing space through which the step-like recess of the card is to pass. As the information card is inserted into the housing space, the projection touches an upper surface of the step-like recess and/or that of the identifier and works in the concave cut in the step.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: November 9, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventors: Wataru Oguchi, Toru Wagatsuma, Yoshimasa Kuroda
  • Patent number: 6812596
    Abstract: The invention relates to a module arrangement of safety switching devices. The arrangement comprises a plurality of input modules each for processing input signals from a safety transmitter and each for generating output signals. It further comprises at least two output modules each for driving an actuator responsive to the output signals. The input modules and the output modules are arranged in a series forming a series of modules. The input modules each are associated to one output module. According to one aspect of the invention, the association of the input modules to the first, the second or both output modules is achieved on the basis of the position of the input module within the series of modules.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: November 2, 2004
    Assignee: Pilz GmbH & Co.
    Inventor: Richard Veil
  • Patent number: 6795885
    Abstract: Apparatus for connecting a plurality of electronic devices with corresponding backplanes to improve reliability of accessing the devices are described. In one embodiment, the apparatus includes first and second backplanes having connectors for at least one device. A device having a plurality of data paths has a first data path coupled to a data path connector of the first backplane. A second data path of the device is coupled to a data path connector of the second backplane. Alternatively, a Y-adapter is used to connect a single data path device to data path connectors of distinct backplanes. In various embodiments, the backplanes lie in a common plane. Alternatively, the backplanes lie in distinct parallel planes.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: September 21, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James J. deBlanc, David M. Dickey, James L. White
  • Patent number: 6795318
    Abstract: A portable modular electronic system comprises a controller module, at least one memory module; and at least one application module that are mechanically connectable and disconnectable with respect to each other and include mating electrical connectors for communicating electrical signals between modules when the modules are mechanically connected.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: September 21, 2004
    Assignee: Hewlett-Packard Development Company, LP.
    Inventors: William R. Haas, Kirk S. Tecu
  • Patent number: 6787915
    Abstract: There are provided a semiconductor device construction having more degrees of design freedom of the semiconductor element than prior arts, and a method of manufacturing such device easily and at low cost. For this purpose, a rearrangement sheet is employed provided with an insulating sheet and conductive metallic patterns formed on this insulating sheet.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: September 7, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Yasufumi Uchida, Yoshihiro Saeki
  • Publication number: 20040114334
    Abstract: A connector assembly (1) used to interconnect a primary circuit board (4) to an intermediate circuit board (5) includes a one-piece insulated housing (2) and an outer shell (3) partially enclosing outside of the housing (2). The housing (2) has a space (20) formed from a mounting side of the housing (2) to the primary circuit board (4) and a face (22) formed at another mounting side of the housing (2) to the intermediate circuit board (5). A plurality of conductors (25) is retained in the housing and extends from the space (20) to the face (22) and each conductor (25) has one tail portion (251) to be press-fit on the intermediate circuit board (5) and another tail portion to be engaged with a corresponding hole (41) on the primary circuit board (4). The one-piece housing and fewer interfaces are used, and the mounting method and mechanism of the conductors is simplified to reduce the cost of manufacturing.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventors: Iosif R. Korsunsky, Joanne E. Shipe, James H. Hyland, Peter T. Graustein, Robert W. Brown
  • Publication number: 20040100772
    Abstract: Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a non-leaded first package, a second package, and a plurality of electrical junctions. The first package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces. The second package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces of a number of leads. Each of the junctions couples one of the contacts to the contact surface of one of the leads. The electrical junctions may also physically support the packages with their respective confronting surfaces juxtaposed with but spaced from one another, defining a peripherally open fluid passage and enhancing thermal performance.
    Type: Application
    Filed: December 18, 2002
    Publication date: May 27, 2004
    Inventors: Lim Thiam Chye, Setho Sing Fee, Eric Tan Swee Seng
  • Patent number: 6741477
    Abstract: A rack-mount apparatus for mounting printed circuit boards and other types of electronic components is provided. A five-sided enclosure is provided for mounting one of several different types of electronic components. The enclosure includes a bottom panel having countersunk holes for mounting electronic component. The countersunk holes are arranged according to two or more mounting patterns. Mounting hardware is also provided for mounting the printed circuit board or other type of electronic component to the bottom panel without protruding from the bottom surface of the bottom panel and also providing a gap between the printed circuit board and the bottom panel as specified by the type of printed circuit board or other electronic component. The rack-mount apparatus allows many different types of printed circuit boards or electronic components to be mounted in a standard rack-mount chassis.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: May 25, 2004
    Inventor: Clas Gerhard Sivertsen
  • Patent number: 6731507
    Abstract: A power supply unit includes a housing in which one or more power supply modules can be inserted and a modular AC input section. The modular AC input section preferably attaches to the distal end of the housing from where the power supply modules are inserted. The AC input section includes one or more circuit breakers, connectors and wiring connecting the breakers to the connectors. The connectors preferably comprise blind mating connectors that mate with corresponding connectors on the rear surface of the power supply modules. The AC input section is screwed to the power supply housing or attached through some other suitable means. The AC input section is modular in the sense that it can be easily and quickly removed from the power supply unit and replaced with another section. This permits upgrades and repairs to be made in a quick, cost effective manner.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: May 4, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Paily T. Varghese, Robert J. Hastings
  • Patent number: 6724636
    Abstract: Disclosed herein is an electronic device including a cabinet and a shelf accommodated in the cabinet. The shelf has a floating mechanism and a plurality of guide rails for guiding a plurality of printed circuit board units. The floating mechanism includes a plurality of holes formed through the shelf, each of the holes having a first diameter; a plurality of tapped holes formed through the cabinet so as to respectively correspond to the holes of the shelf; and a plurality of screws inserted through the holes of the shelf and threadedly engaged with the tapped holes of the cabinet, respectively, each of the screws having a second diameter smaller than the first diameter. The cabinet has a plurality of first guide pins, and the shelf has a plurality of second guide pins each having a diameter smaller than that of each first guide pin.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: April 20, 2004
    Assignee: Fujitsu Limited
    Inventors: Michiyuki Yamamoto, Masaki Yoshimaru
  • Patent number: 6625000
    Abstract: Improved modular transient voltage surge suppressor apparatus are disclosed that equalize transient current sharing between multiple modules. In general, such apparatus includes first and second transient voltage surge suppression modules, each module having a non-conductive housing with a surge suppression circuit contained therein, and first and second electrically-conductive buses mechanically coupled to the non-conductive housing and electrically coupled to first and second terminals of the surge suppression circuit, respectively. A first bus coupler couples the first electrically-conductive buses of the first and second transient voltage surge suppression modules and a second bus coupler couples the second electrically-conductive buses of the first and second transient voltage surge suppression modules, whereby the surge suppression circuits in each of the first and second modules are electrically coupled in parallel.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: September 23, 2003
    Assignee: Current Technology, Inc.
    Inventors: Asif Y. Jakwani, Paul Jeffries, Fyodor M. Shterenberg, Getzel Gonzalez Garcia
  • Publication number: 20030103335
    Abstract: A telecommunications equipment mounting assembly is disclosed herein. The assembly includes a housing adapted for holding telecommunications equipment such as an optical-to-electrical and electrical-to-optical converter modules. The telecommunications equipment mounting assembly also includes an adapter plate removably connected to the housing. The adapted plate includes structure for managing both fiber optic and copper cable.
    Type: Application
    Filed: December 4, 2001
    Publication date: June 5, 2003
    Inventors: Steven W. Skradde, Robin L. Berg, Timothy J. Kjolsing
  • Patent number: 6532156
    Abstract: The present invention describes a portable radiotelephone (100) equipped with a connector having an ejection mechanism and a detect switch for an insertable module. The connector (500) is simple in design and may be constructed from a single piece of metal sheet. A module (102), which adds functionality to the portable radiotelephone, is inserted into a module slot (104) of the portable radiotelephone. When the module is fully inserted, the connector detects its presence. The connector also ejects the fully inserted module when a user desires to remove or change the module and lifts a retaining clip (502).
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: March 11, 2003
    Assignee: Motorola, Inc.
    Inventors: Shoichiro Masui, Lee Hunter
  • Patent number: 6532155
    Abstract: An ejection system for engaging a transceiver to a host circuit board in a guide rail having a front and back orientation and for ejecting said transceiver from said guide rail, said system comprising: (a) a latching mechanism within said guide rail adapted for latching to a projection extending from a housing of a transceiver when said transceiver is moved backward on said guide rail to an engaging position, thereby preventing said transceiver from moving forward; (b) resilient means within said guide rail adapted for urging said transceiver forward when said transceiver is in said engaging position; and (c) a release mechanism within said card guide and adapted for disengaging said latching mechanism from said projection when said release mechanism is actuated to a releasing position, thereby allowing said resilient means to move said transceiver forward.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: March 11, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Eric T. Green, John R. Rowlette, Sr.
  • Patent number: 6515849
    Abstract: A small control device can be efficiently assembled. The control device includes a door for releasing a control unit when a general user connects wiring, and a door for releasing a power supply unit for maintenance service. The control device may further include a door locking mechanism, a partition wall for separating the control unit and power supply unit, and a mechanism for mounting components on both sides of the wall in three-dimensional space. A notch may be formed in the wall. Moreover, the control device may include a mechanism for releasing a rear side of a case from the top, and a mechanism for releasing at least one side of the case.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: February 4, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazunori Matsumoto, Yasushi Mukai
  • Patent number: 6501659
    Abstract: A system and method for identifying a match between an industrial PC to a slot in a rack which uses a blind mating keying and locking plates, so that when the mechanical keying plate and locking plate do match, then full insertion of the PC into the slot is permitted. When a mis-match occurs, then full insertion is prohibited.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: December 31, 2002
    Assignee: Crystal Group Inc.
    Inventors: John R. Bodensteiner, Craig J. Jensen
  • Patent number: 6498732
    Abstract: Methods, systems and devices are described relating to a chassis for front and back inserted modules. An apparatus includes a chassis including a first module bay and a second module bay, the first module bay and the second module bay together composing both a forward section and rearward section.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: December 24, 2002
    Assignee: Aurora Networks, Inc.
    Inventors: Guy Sucharczuk, Krzysztof Pradzynski, Artie Avlonitis, Jose Salinas
  • Patent number: 6486528
    Abstract: The present invention is a method and apparatus for programming a stack of segments wherein each segment includes a plurality of die which are interconnected through metal interconnects patterned on the surface of each segment. Once the segments are arranged into a stack, the stack is connected to external circuits and each segment is addressed through control lines. Electrically conductive fuses on the segments are used as an interface between the control lines and the die. Segment level programming is performed on each segment by opening the conductive fuses on the segments in a predetermined pattern in order to route the control lines to each segment such that segments are uniquely addressed. After segment level programming, circuit board programming is performed so that any defective die found in the stack is logically replaced with replacement die in the stack.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: November 26, 2002
    Assignee: Vertical Circuits, Inc.
    Inventors: David V. Pedersen, Michael G. Finley, Kenneth M. Sautter
  • Patent number: 6469901
    Abstract: A scalable electronic system is disclosed, comprised of multiple modular electronics clusters. Each modular electronics cluster comprises a receptacle for routing signals, and multiple resource cartridges for performing electronic functions. The resource cartridges are capable of being aligned in close proximity to the receptacle for communicating signals to and from the receptacle. In addition, the resource cartridges aligned with the receptacle are also capable of communicating with each other. The resource cartridges can be aligned or removed from alignment with the receptacle, without the need for additional electrical connection hardware. The receptacle includes at least one vertical transport channel for communicating with other modular electronics clusters.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: October 22, 2002
    Assignee: 3C Interactive, Inc.
    Inventor: Gary S. Costner
  • Patent number: 6418027
    Abstract: A system of interlocking modules for use with a programmable logic controller. The system utilizes a plurality of modules, e.g. input/output modules, that are mechanically and electrically interlinked. Modules are electrically connected to adjacent modules by plug portions The mechanical interlocking features and the plug portions are designed to permit insertion and removal of individual modules disposed between adjacent modules, without moving either of the adjacent modules. Also, the plug portions are designed to isolate the electrical connections from vibration.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: July 9, 2002
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Takao Suzuki, Yasuyuki Nakanishi, Michael S. Baran, Dennis G. Schneider, Anthony G. Gibart, Joel C. Clemente, Kevin G. Hughes, Paul J. Grosskreuz
  • Patent number: 6381141
    Abstract: An integrated device includes a package having first and second sides, first package terminal disposed on the first side of the package, and a second package terminal disposed on the second side of the package in alignment with the first package terminal. An integrated circuit is mounted to the package and has an input terminal coupled to the first package terminal and an output terminal coupled to the second package terminal. In operation, the first package terminal receives a signal and couples the signal to the input terminal of the integrated circuit, the integrated circuit couples the signal from its input terminal to its output terminal, and the signal leaves the device via the second package terminal.
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: April 30, 2002
    Assignee: Micron Technology, Inc.
    Inventors: David J. Corisis, Fonda R. Victory
  • Patent number: 6381128
    Abstract: A portable computer having a main computer body and a keyboard unit slidably attached to the main computer body and movable to various positions in front of the main computer body. A display unit is also slidably attached to the main computer body and movable to various positions up and away from the computer main body.
    Type: Grant
    Filed: July 17, 2000
    Date of Patent: April 30, 2002
    Inventor: Russel G. Kramer
  • Patent number: 6359786
    Abstract: In a preferred embodiment, a multiconfigurable communication terminal, including: a terminal housing; electronic circuitry disposed within the housing; at least one selected functional electronic module removably disposed in the housing and releasably attached to the electronic circuitry.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: March 19, 2002
    Inventor: James S. Bianco
  • Patent number: 6351376
    Abstract: A mounting apparatus for mounting a data storage device in a computer housing includes a bracket, a securing means and a flexible plate. The bracket has a first face for supporting a data storage device, a second face opposite the first face and locking holes in its front portion. The securing means is mounted to a bottom of the data storage device and is moveable with the data storage device to be slid into the corresponding locking hole of the bracket. The flexible plate has a rear end securely fixed to the second face and a front end that has an operating portion extending out of the housing for being operable to move the front end away from the front portion of the bracket. The flexible plate further defines through holes for engaging with the locking holes to releasably block the sliding movement of the data storage device.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: February 26, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Pouch Liang, Hsuan-Tsung Chen
  • Patent number: 6349036
    Abstract: A computer functional card adapting seat comprises a base and at least one computer functional card. The base has a circuit substrate therein; At least one terminal slot is formed in the circuit substrate. Each terminal slot is connected to a circuit control unit of the circuit substrate. At least one universal serial bus inserting hole, a first inserting hole for being supplied with DC power, and a second inserting hole for being connected to a computer are installed on the base. The universal serial bus inserting hole, and first and second inserting holes are connected to the circuit control unit. Thereby, the computer functional card is formed on the base for being communicated to a computer without needing to detach the case of the computer mainframe.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: February 19, 2002
    Assignee: Jess-Link Products Co., Ltd.
    Inventors: Jessica Chang, Chao Jen Wang
  • Publication number: 20020012218
    Abstract: A grounding device includes flexible, insulative left and right sliding bodies and a conductive strip. Each sliding body has inner and outer abutment walls, and includes an urging tongue portion which has a distal end flush with the inner abutment wall when the latter abuts against an outer wall of an electric component module accommodated within a housing. The conductive strip has a contact end portion anchored on the urging tongue portion and clamped between the module and the urging tongue portion, a middle portion extending from the contact end portion into a mounting slot formed in a respective one of the sliding bodies, and a contact juncture protruding beyond the outer abutment wall to abut against an inner wall of the housing to thereby establish electrical contact between the module and the housing.
    Type: Application
    Filed: May 11, 2001
    Publication date: January 31, 2002
    Applicant: Compucase Enterprise Co., Ltd.
    Inventors: Chun-Liang Li, Ching-Yao Li
  • Patent number: 6331117
    Abstract: A rotatable electrical connector has a pair of wiring boards. Each wiring board supports two (or more) concentric conductors that have substantially smooth coplanar surfaces. The coplanar surfaces of the concentric conductors on each wiring board define a contact plane. To provide electrical contact between the two wiring boards, each wiring board is positioned perpendicular to an axis of rotation and is supported so that the respective contact planes of the first and second wiring boards are parallel. A resilient member, such as a spring, urges the wiring boards together to establish electrical contact between the respective surfaces of corresponding conductors on the two wiring boards. The above-described wiring boards are included in a circuit module that also includes a printed circuit board, or other electrical component, sandwiched between a pair of the wiring boards.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: December 18, 2001
    Inventor: Gary L. Brundage
  • Patent number: 6285551
    Abstract: An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16).
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: September 4, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Scott David Brandenburg, Mark Anthony Koors, Jeffery Ralph Daanen
  • Patent number: 6282098
    Abstract: An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: August 28, 2001
    Assignee: Fujitsu Limited
    Inventors: Makoto Totani, Yasuhide Kuroda, Masaki Ono, Takayoshi Tanemura, Tetsuya Kiyonaga
  • Patent number: 6278605
    Abstract: A modular circuit breaker system includes a plurality of modules mounted side-by-side. The modules include electrical terminals for connection to live and neutral conductors of an electrical supply. Rigid metallic conductors extend between the modules for connecting electrical circuitry of one module to the electrical circuitry of the other module. Each conductor is removably engaged with electrical contacts mounted within the respective modules.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: August 21, 2001
    Assignee: Circuit Breaker Industries Limited
    Inventor: Roland Baridon Hill
  • Patent number: 6239962
    Abstract: An arc fault circuit breaker assembled such that electrical interconnections, i.e., electrical connections between compartments, are made without disassembling any previously assembled compartment. The arc fault circuit breaker comprises housings having compartments within. Electrically connected components having interconnecting components, i.e., components which provide electrical interconnections between compartments, are disposed within the compartments. The housings are assembled together to enclose the compartments. Interconnecting components within an enclosed compartment extend through openings in the housings to provide electrical interconnections to the next compartment to be assembled. Therefore, no disassembly of the enclosed compartment is necessary to make the interconnections.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: May 29, 2001
    Assignee: General Electric Company
    Inventors: Raymond Kelsey Seymour, Murali Magham, Fredic W. Glabau, Kevin Jay Fuhr, Michael Conrad Guerrette
  • Patent number: 6202008
    Abstract: A vehicle computer system has a housing sized to be mounted in a vehicle dashboard or other appropriate location. A computer is mounted within the housing and executes an open platform, multi-tasking operating system. The computer runs multiple applications on the operating system, including both vehicle-related applications (e.g., vehicle security application, vehicle diagnostics application, communications application, etc.) and non-vehicle-related applications (e.g., entertainment application, word processing, etc.). The computer system has an Internet wireless link to provide access to the Internet. One or more of the applications may utilize the link to access content on the Internet.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: March 13, 2001
    Assignee: Microsoft Corporation
    Inventors: Richard D. Beckert, Mark M. Moeller, William S. Wong
  • Patent number: 6175503
    Abstract: An interconnect for engaging a rectifier module with a rectifier cabinet has a first portion which includes AC output contacts, DC input contacts, a cabinet data signal connector and sidewalls which define an enclosed space of the rectifier cabinet. A second portion of the interconnect includes DC output contacts, AC input contacts, a module pin data signal connector and a housing which encloses a rectifier unit. A guide member is mounted to one of the first and second portions of the interconnect. A guide member hole is included with the other of the first and second portions of the interconnect for engaging with the guide member to align the first portion of the interconnect with the second portion of the interconnect. A pair of guide pins are mounted to one of the data signal connectors for engaging within sockets of the other of the data signals connectors for aligning the data signal connectors.
    Type: Grant
    Filed: October 27, 1998
    Date of Patent: January 16, 2001
    Assignee: ADS, The Power Resource, Inc.
    Inventors: Gerald Michael Hogan, Steven Jeffery Marzec, Lyle James Ratner
  • Patent number: 6172875
    Abstract: A system of interlocking modules for use with a programmable logic controller. The system utilizes a plurality of modules, e.g. input/output modules, that are mechanically interlinked to obviate the need for a rack or back plane. Each module includes a movable plug portion that selectively may be moved into engagement with a corresponding plug receptacle of the next adjacent module. The mechanical interlocking features and the plug portions are designed to permit insertion and removal of individual modules disposed between adjacent modules, without moving either of the adjacent modules.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: January 9, 2001
    Assignee: Rockwell Technologies, LLC
    Inventors: Takao Suzuki, Yasuyuki Nakanishi, Michael S. Baran, Dennis G. Schneider, Anthony G. Gibart, Joel C. Clemente, Kevin G. Hughes, Paul J. Grosskreuz
  • Patent number: 6169937
    Abstract: A control unit such as a thermostat has a subbase which mounts on the surface holding the control unit and has electrical terminals for connecting to an operating unit. A controller is designed to mechanically attach and electrically interface to the subbase. The subbase has a memory unit which can record a number of different digital values. Each of these digital values corresponds to an operating unit requiring a different configuration of control algorithms. The controller receives the value recorded in the subbase memory unit and configures its control algorithms according to the value provided from the memory unit.
    Type: Grant
    Filed: April 14, 1998
    Date of Patent: January 2, 2001
    Assignee: Honeywell International Inc.
    Inventor: Mark W. Peterson
  • Patent number: 6163464
    Abstract: Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: December 19, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Ishibashi, Takehisa Hayashi, Tsutomu Goto, Akira Yamagiwa, Tsuyoshi Watanabe
  • Patent number: 6154372
    Abstract: A ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board that belongs to a module and has circuit structures is provided. The ceramic substrate is contacted to the circuit structures with bond connections. The terminal elements are formed by approximately spherical accumulations of solder attached on the backside of the printed circuit board, these solder accumulations being connected to the circuit structures on the first side of the printed circuit board via through-contactings.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: November 28, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Vassilios Kalivas, Alois Nitsch, Heinz Peters
  • Patent number: 6097303
    Abstract: A modular input/output (I/O) system for field wiring includes a plurality of base units into which electronics modules providing appropriate signal processing are plugged. A backplane in each base unit provides leads between the electronics module and associated terminals to which the field wiring is connected and also hosts a communications bus through which the electronics modules on serially connected base members communicate with a controller. Switching modules plugged into some of the base members selectively switch field signals applied to terminals for an associated electronics module to another electronics module for redundancy, or switch test signals into the associated electronics module in place of the field wiring signals. The test signals are generated by yet another of the electronics modules while still another electronics module generates control signals for the switching modules.
    Type: Grant
    Filed: April 30, 1997
    Date of Patent: August 1, 2000
    Assignee: Westinghouse Process Control, Inc.
    Inventors: Kenneth G. Lunz, Daniel Louis Simon
  • Patent number: 6081430
    Abstract: A backplane consisting of segmented bus lines on a mother board with loop-through connections to active transceivers mounted on connectors to daughter boards. The transceivers isolate the interconnect to the daughter boards from the bus lines. The loop-through transmission line on the connectors preserves the impedance of the bus lines and allows the interconnect stub to the transceivers to be short, minimizing reflections and enabling high-speed backplane operation. The connectors are removable from the motherboard for repair.
    Type: Grant
    Filed: May 5, 1998
    Date of Patent: June 27, 2000
    Inventor: George Sterling La Rue
  • Patent number: 6075706
    Abstract: A PC card (10) of standard width and thickness (e.g. 54 mm and 5 mm) is constructed to receive a chip card (20) of smaller width and thickness (e.g. 18 mm and 0.8 mm) so the PC card can be used to connect contact pads (60) of the chip card to an electronic device such as a laptop computer into which the PC card is inserted. A frame (22) is mounted in a fixed position on a circuit board of the PC card, the frame having a recess (82) substantially the same width as that of the chip card for closely receiving the chip card to locate it so pads on the chip card engage chip contacts (76) that are also mounted on the circuit board. A planar top portion (86) of a sheet metal cover part has an aperture (24) that communicates with the recess in the frame to permit the insertion of the chip card through the aperture and into the recess of the frame.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: June 13, 2000
    Assignee: ITT Manufacturing Enterprises, Inc.
    Inventors: Iian Thomas Learmonth, Jan Zeyfang, Martin Gollhofer, Tobias Schimmele-Brell, Andreas Schremmer
  • Patent number: 6043988
    Abstract: When a plurality of hard disks are connected by using a backplane, in order to enable a low-noise installation of the bus and a high-density installation of the hard disk to be simultaneously realized, a signal line of the bus and connectors are installed to the backplane, slots are set to installing regions of the drives, wirings of the signal lines between the connectors are set to, for example, a U-character shape, and a length of signal lines between the connectors is set to be longer than a distance between the connectors adjacent to the bus.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: March 28, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Hiroki Kanai, Mitsuo Ooyama, Yoshifumi Takamoto
  • Patent number: 5966292
    Abstract: In a modular tower building block system for containing computing system devices, a power bus is incorporated into the modular blocks of the building block system by using a printed circuit board to carry the power bus in each modular block. The printed circuit board is mounted and positioned in each modular block to electrically connect with a printed circuit board in a next adjacent modular block when two modular blocks are stacked on each other. Also, there are a plurality of three-phase power buses on the printed circuit boards and only one phase of each power bus is distributed from each modular block. The printed circuit board is precisely located in each modular block at a predetermined position. Alignment pins and receivers provide alignment between stacked modular blocks to precisely position one modular block to the other modular block.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: October 12, 1999
    Assignee: Digital Equipment Corporation
    Inventors: Mark Frederick Amberg, Thomas Alvin McKoon, Dwayne Howard Swanson
  • Patent number: 5954527
    Abstract: A modular system (10) is disclosed for use, e.g. in infusion systems. The system includes a base unit (20) and one or more modules (30). A mechanical/electrical connecting system (21 to 24) is disclosed enabling safe connection of the various units in the system while enabling easy disconnection of any of the modules (30). A signal processing arrangement is also disclosed enabling the number of modules (30) in the system to be sensed by the base unit (20).
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: September 21, 1999
    Assignee: Fresenius AG
    Inventors: Abel Nasser Jhuboo, Jean-Michel Dupouy
  • Patent number: 5903442
    Abstract: When a plurality of hard disks are connected by using a backplane, in order to enable a low-noise installation of the bus and a high-density installation of the hard disk to be simultaneously realized, a signal line of the bus and connectors are installed to the backplane, slots are set to installing regions of the drives, wirings of the signal lines between the connectors are set to, for example, a U-character shape, and a length of signal lines between the connectors is set to be longer than a distance between the connectors adjacent to the bus.
    Type: Grant
    Filed: August 14, 1996
    Date of Patent: May 11, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Hiroki Kanai, Mitsuo Ooyama, Yoshifumi Takamoto
  • Patent number: 5867406
    Abstract: A docking device for a portable computer includes a body adapted to receive a portable computer. The body encloses a number of electronic components adapted to be connected to a portable computer via a number of signal lines. A connector is provided in the body which mechanically connects the number of signal lines within the body to a corresponding number of signal lines within the portable computer. The docking device also includes a signal connection means interposed between the portable computer and the electronic components for selectively electrically interconnecting the particular ones of the signal lines within the body to corresponding signal lines among the number of signal lines within the portable computer in response to an operating state of said portable computer. A preferred embodiment of the docking device further includes a control means for controlling the selective electrical interconnection of the particular ones of the number of signal lines by the signal connection means.
    Type: Grant
    Filed: April 6, 1995
    Date of Patent: February 2, 1999
    Assignee: International Business Machines Corp.
    Inventor: Takashi Yanagisawa