Abstract: An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: A chip card holder for holding at least one chip card is disclosed. The chip card holder includes a base, a drawer slidably attached to the base and a cover. The drawer defines at least one receiving space, each receiving space for receiving a chip card. The cover is detachably latched to the base to retain the drawer in the base or allow the drawer to be slid out of the base. After the cover is detached from the base, the drawer can automatically partially or completely slide out of the cabinet to expose it from the base, thereby facilitating grasping chip cards out of the receiving spaces or putting the chip cards in the receiving spaces.

Abstract: A chip card holder for holding at least two chip cards is disclosed. The chip card holder includes a base, a drawer slidably attached to the base. The drawer includes at least two receiving spaces, each receiving space for receiving a chip card. The drawer moves relative to the base to make the at least two receiving spaces be exposed out of the base or be received in the base.

Abstract: A shielded microphone, and method for shielding a microphone, are provided for use in a communications device having a circuit board and a microphone. The microphone is provided in an electromagnetic shield and a resilient separator is provided over the shield. The device housing is stacked over the separator and shield, while the latter are stacked over the circuit board so that the separator and shield, with microphone there under, are sandwiched between the housing and the circuit board. By this sandwiching the separator is loaded onto the shield to drive the shield directly against the circuit board to make an electrical ground connection therewith, the microphone also being electrically connected to the printed circuit board. The resilience of the separator accommodates the variation in the stacking of the components.

Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

Abstract: A circuit board system according to the invention comprises a circuit board (101), at least one element (102) mechanically supported with respect to the circuit board, and a spring-fastener (106) arranged to mechanically support the at least one element with respect to the circuit board. The spring-fastener comprises a pressing portion (107) pressing the at least one element and a latching portion (108) extending from an end of the pressing portion and being shape-locked in one or more apertures (109-110) of the circuit board. The latching portion and the one or more apertures of the circuit board are shaped to provide shape-locking whose opening requires at least a first movement of the latching portion in a first direction against the spring-force of the spring fastener and, subsequently, a second movement of the latching portion in a second direction against the spring-force of the spring fastener.

Abstract: An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components.

Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.

Abstract: A chip card holding mechanism includes a bracket, an unlock assembly and a tray. The bracket defines a receiving chamber. The unlock assembly is assembled adjacent to the opening of the bracket. The movable tray is assembled to and received within the receiving chamber of the bracket via the unlock assembly, for receiving a chip card. The unlock assembly includes an ejecting member and an unlock member, the ejecting member is slidably assembled to the opening of the bracket and pushes against the tray. The unlock member is an included accessory for driving the ejecting member to slide, thereby ejecting the tray. An electronic device using the chip card holding mechanism is also provided.

Abstract: A chip card holding mechanism includes a bracket, an unlock member and a tray. The bracket defines a receiving chamber. The unlock member is assembled adjacent to the opening of the bracket. The movable tray is assembled to and received within the receiving chamber of the bracket by the unlock member. The tray includes a supporting portion for receiving a chip card, a draw-off portion formed on a first end of the supporting portion, and a resisting block formed on the draw-off portion. The unlock member includes a main portion and an ejecting portion formed on the main portion, the ejecting portion slidably resists against the corresponding resisting block of the tray, for providing an ejecting force to eject the tray away from the bracket. An electronic device using the chip card holding mechanism is also provided.

Abstract: An improved MEMS transducer apparatus and method is provided. The apparatus includes a movable base structure having a base surface region. An anchor structure is disposed within a substantially circular portion of the surface region typically at or near the center of the surface region. A spring structure is coupled to the anchor structure and at least one portion of the base surface region. A capacitor, having a fixed capacitor element and a movable capacitor element, are disposed near the base surface region. The fixed capacitor element can be coupled to the anchor structure and the movable capacitor element can be spatially disposed on a portion of the base surface region near the anchor structure.

Abstract: A processor module socket accommodates processor modules of different sizes with adapters that align smaller-sized modules so that module pins align with desired contact points. The largest supported processor module engages with the socket in a conventional manner without the use of an adapter. Smaller processor modules engage within an adapter that in turn engages in the socket in a manner similar to the largest supported processor module. The contact points of the socket support different sized processor modules by keying logical functions based upon the type of processor module installed in the socket.

Abstract: An improved MEMS transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region. At least one intermediate anchor structure is disposed within the inner surface region. The apparatus includes an intermediate spring structure operably coupled to the central anchor structure, and at least one portion of the inner surface region. A capacitor element is disposed within the inner surface region.

Abstract: A circuit substrate includes protruding terminals and has a structure that ensures an excellent connection with an electronic component, such as an IC. The circuit substrate on which an IC is to be mounted includes terminals that are to be electrically connected to solder bumps located on the IC. The terminals protrude from the mounting surface of a substrate body on which the IC is to be mounted. The sectional area of the top surface of each of the terminals is about 1.2 times the sectional area of each of the terminals on the mounting surface.

Abstract: A portable electronic device includes a housing, a printed circuit board, a flexible printed circuit board, and a clip. The printed circuit board is attached to one side of the housing. The flexible printed circuit board is attached to another side of the housing. The clip is attached to the housing. The clip includes at least one arcuate portion, and the arcuate portion elastically presses the flexible printed circuit board to the printed circuit board.

Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Abstract: A method of testing integrated circuit chips. The method includes: attaching integrated circuit chips to an interposer of a temporary carrier, the carrier comprising: a substrate, a first interconnects on a bottom surface and a second array of interconnects on a top surface of the substrate, corresponding first and second interconnects electrically connected by wires in the substrate; the interposer, first pads on a top surface and a second pads on a bottom surface of the interposer, corresponding first and second pads electrically connected by wires in the interposer, and the second pads in physical and electrical contact with corresponding second interconnects; and the interposer including an interposer substrate comprising a same material as a substrate of the integrated circuit chip; connecting interconnects of the first array of interconnects to a tester; and testing the one or more integrated circuit chips.

Abstract: The invention relates to an electronics card (1) comprising a printed circuit board (2) and a piece of equipment (3) such as a motor or a loudspeaker fastened to said printed circuit board (2). The piece of equipment (3) is fastened to a face (4) of the printed circuit board (2) by snap-fastening in metal clips (6, 7) that project from said face (4), each clip (6, 7) having a first end (8, 9) fastened to said face (4) of the printed circuit board (2) by soldering, and a second end (11, 12) bearing resiliently on a corresponding portion of the piece of equipment (3) for holding it pressed against said face (4) of the printed circuit board (2). The invention applies in particular to electronics cards for motor vehicles.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.

Abstract: To provide an electronic apparatus that can prevent electronic components from being separated from a circuit board. The electronic apparatus 10 includes a circuit board 25, an electronic component 28 mounted on the circuit board 25 via solder balls 26, a cover member 30 mounted on the circuit board 25 so as to surround and cover the electronic component 28 and a convex portion 34 provided at the top plate portion 32 of the cover member 30. The convex portion 34 is deformable to a second state protruding on the circuit board 25 side from a first state protruding in the direction opposite to the circuit board 25 side. When the convex portion 34 is deformed in the second state, the convex portion 34 thus deformed can be made in contact with the top portion 28a of the electronic component 28.

Abstract: A portable electronic device includes a case, a circuit board in the case, an electronic component in the case. The electronic component includes a connection terminal and a portion facing a side surface of the circuit board. The portable electronic device also includes a terminal member for connecting the circuit board and the connection terminal of the electronic component.

Abstract: A clip for coupling a first board and second board, the first board having plurality of first post coupled thereto, the second board having a plurality of second posts coupled thereto, each second post being a cylinder for receiving a first post, the first and second boards having a predetermined relative position when the second posts fully engage the first posts, each second post having an aperture in a side exposing the interior of the cylinder, each first post having a tapered end and a notch around the posts. The clip includes a base member, the base member being coupled to the second board, a top member, the top member having an aperture therein, and a side member connecting the top member and the base member, the side member fabricated so that an edge of the aperture is forced through the aperture into the interior of the second post, edge being forced into the notch when the first and the second posts are engaged and the first and second boards are in the predetermined relationship.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.

Abstract: A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

Abstract: An assembly comprises a sub-assembly including a semiconductor package coupled to a printed circuit board (PCB). The assembly also comprises multiple rigid connectors that couple the sub-assembly to a support structure. The assembly further comprises a spring, coupled to the support structure and positioned between the multiple rigid connectors, that supports at least some of the sub-assembly.

Abstract: A light-emitting module for a lighting apparatus comprises at least two substrates, each provided with a printed circuit having an LED, and plural matching terminal blocks and buckles so that the substrates can be structured into a planar light-emitting module having a relatively large area by assembly of the terminal blocks and the buckles. The light-emitting module is adaptive to be used in a billboard, a traffic sign, a three-dimensional lighting apparatus or a lighting display screen.

Abstract: A portable electronic device includes a housing, a circuit board received in the housing, and a memory card retaining mechanism received in the housing. The memory card retaining mechanism includes a plurality of conductive parts. The plurality of conductive parts cooperatively form an antenna integrated with the memory card retaining mechanism and connected to the circuit board.

Abstract: A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, each semiconductor chip has a heat sink spring-loaded against the semiconductor chip. Posts coupled to one board engage posts located on the other board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate.

Abstract: A method for improving load balance involves obtaining a graphical representation of a load distribution for contacts in an integrated circuit stack, analyzing the graphical representation of the load distribution to determine contact loads, where a contact load corresponds to a contact, and designing at least one component of the integrated circuit stack, based on the contact loads.

Abstract: A mounting structure includes a base member and an electronic component having a protruded electrode which is formed on a transparent substrate. The electrode includes pads and elastic projections that are covered with a conductive film. On the transparent substrate, terminals connected to the conductive film are formed. Dummy projections are provided on the surface of the base member. When mounting the electronic component, the electrodes are deformed by the pressure for the mounting. The dummy projections formed on the base member are also deformed. A pattern, for visually inspecting the deformation volume of dummy projections, is marked on the transparent substrate.

Abstract: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.

Abstract: A telecommunications module includes a housing, a plurality of contacts, which are exposed to allow the connection of wires herewith, and a connecting device for connecting at least some of the contacts with other contacts of the telecommunications module, wherein the connecting device is partially accommodated in the housing an d partially extends outside the housing.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupled on the circuit board with the distal end surface in parallel with the other end surface of the strut, and the other distal end surface is parallel with a holding section of a fastening element which fastens the coupling member, the circuit board and the strut in this order, to make the circuit board in parallel with a mounting surface, which an electronic device may be held on, of the case. The circuit board is easy to be fastened even if the circuit board is not vertical to the molding direction of the fastening structure. Assembly costs also are lower.

Abstract: A system may include a plurality of pliant conductive elements, a first end of one of the plurality of pliant conductive elements to be electrically coupled to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality of pliant conductive elements to be electrically coupled to a second electrical contact of an integrated circuit die.

Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

Abstract: A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive features are formed in proximity to the vias, as by selectively depositing a metal on the metal layers or selectively etching the metal layers. The top and bottom conductive features are connected to one another by depositing a conductive material into the vias, most preferably without seeding the vias as, for example, by depositing solder in the vias.

Abstract: A method and structures are provided for implementing enhanced reliability for printed circuit board high power dissipation applications. An external return current member provides a return current path outside of the printed circuit board, thereby minimizing power dissipation within the printed circuit board. The external return current member can be implemented with an associated stiffener formed of electrically conductive material. Alternatively, the external return current member can be implemented with a sheet of electrically conductive material with an insulator provided between the sheet and the associated stiffener.

Abstract: An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

Abstract: A memory device is provided with a memory chip and a controller, which can be connected to a computer via a USB connector. The memory device is implemented in the form of a flat memory card, wherein the USB connector is movable between a position of rest, in which the connector is accommodated in an opening of the memory card, and an operative position, in which the connector projects beyond the perimeter of the memory card. The opening is a rectangular opening lying entirely within the perimeter of the memory card, wherein in the position of rest the USB connector is positioned entirely within the confines of the memory card.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

Abstract: An electronic assembly apparatus is provided which has a chassis for housing at least one circuit board. The circuit board has at least one major surface. The chassis has at least one wall juxtapositioned along at least a portion of the major surface of the circuit board. The assembly also has at least one circuit board support member. The support member has a first end mechanically coupled to the major circuit board surface at an area between the first and second ends of the circuit board. The support member also has a second end mechanically coupled to the wall of the chassis. Another support member can be mechanically coupled between another major surface of the circuit board and another wall of the chassis. The support member or members provides support to the circuit board at an area between the first and second ends of the circuit board.

Abstract: An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one example, the compliant component, upon relative movement between the die and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus in another example includes a compliant component for supporting an electrical interface component that serves to create an electrical connection between a die and a separate layer. The compliant component, upon relative movement between the die and the separate layer, serves to promote maintenance of the electrical connection.

Abstract: For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.