Abstract: Grid array device packages are mounted on a circuit board or other substrate with a socket having a base member, a retaining member and an array of bent contact pins. The ends of the contact pins are displaced by insertion of a device package and then respond with a small spring force to hold the device package in place against ledges on the retaining member. The contact ends of the pins make electrical connection with terminals on the device package. A sufficient portion of each pin is implanted within the base member to prevent stress from passing through the base member. The retaining member leaves a significant portion of the upper surface of the device package exposed so that packages with attached heat sinks may be mounted therein.

Abstract: A method and encapsulation material for encapsulating the solder joints of an IC device mounted on the substrate of an electronic circuit assembly. The encapsulation material is formulated to be sufficiently opaque to x-radiation to enable the use of x-radiation imaging techniques to detect air pockets and voids in the encapsulation material that might degrade the fatigue life properties of the solder joints encapsulated by the encapsulation material. For the purpose of enhancing the fatigue life properties of the solder joints, the encapsulation material contains a filler material dispersed in a polymeric material, such as an epoxy, such that the encapsulation material is characterized by a coefficient of thermal expansion approximately equal to that of the solder joints. The filler material contains a sufficient amount of an element to render the encapsulation material opaque to x-radiation.

Abstract: A VLSI IC's signals as they appear at the signal via pads on the back side of a mother board may be probed with the aid of a backing plate that is a piece of multi-layer printed circuit board material thick enough to be sufficiently stiff for the purpose. The multi-layer PCB backing plate has front side pads and vias in at least those locations in the LGA (of signal via pads) corresponding physically to signals that are of interest for probing, and if such a subset is unknown ahead of time, the entire LGA of signal vias pads may be represented in the vias. An LGA socket connects the front side vias of the backing plate to the LGA of signal vias on the back side of the mother board carrying the gate array or other IC. Thus, those signals that, in the absence of a backing plate, could be probed on the back side of the mother board can now still be probed at back side pads on the back side of the PCB backing plate, just as if that were the back side of the mother board.

Abstract: An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the first surface capable of being electrically interconnected to a distribution circuit, a base adapted to support the microelectronic device in a predetermined operative relationship to a distribution circuit, and a first layer of elastomer gel sandwiched between the first surface and the base. The first surface of the microelectronic device overlays the base so as to allow an electrical interconnection through the base between the microelectronic device and a distribution circuit.

Abstract: A system for mounting a hybrid electronic component to a PC board is disclosed. The system includes a set of brackets for mutually engaging a first surface of the PC board and a cover surface of the hybrid electronic component, wherein the cover surface has an arcuate shape when in a vacuum environment. The brackets are designed with legs having lengths and thicknesses for providing clearance between the cover surface of the hybrid and the first surface of the PC board for use when the hybrid electronic component is in a vacuum environment.

Abstract: In an information processing system having a portable terminal unit, such as a hand-held computer, driven by a rechargeable battery and a data communication adaptor for enabling communication between the portable terminal unit and a host computer of the system, the terminal unit and the data communication adaptor are designed to minimize the size by having an auxiliary connector for an optional device extend a function of the portable terminal unit. This is provided in the opening of the casing of the portable terminal unit movable in three dimensions mounted on a printed circuit board.

Abstract: The invention relates to Electromagnetic Interference ("EMI") shielding of electrical components mounted on circuit boards. An EMI shielded assembly is provided, comprising a circuit board having at least one electrical contact distributed around the perimeter of an area within which EMI shielding is desired, an EMI shielding cover encircling the area over the contact and covering the area, and a ring-like EMI shielding gasket encircling the area and compressed between the contact and the cover, the gasket in an uncompressed state having low portions alternated with high portions spaced around the gasket. The high portions are spaced away from the at least one electrical contact above the low portions, and the high portions are displaceable toward the low portions upon compression of the gasket. A method for EMI shielding is also provided.

Abstract: A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract: A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

Abstract: The present invention relates generally to an apparatus for securely retaining a small battery or electric cell on a printed circuit board, and for providing electrical contacts which engage the battery for use in an electronic circuit. The present invention provides an improved mechanical attachment of the battery retention apparatus to the circuit board by means of a plurality of tabs which extend through and engage the printed circuit board. These tabs are separate and apart from the electrical connections to the circuit board.The apparatus of the present invention provides a lightweight, low-profile, rugged battery retention mechanism capable of withstanding impulse forces. The apparatus is low-cost, easily manufactured, and facilitates easy installation, and is particularly well suited for remote control devices and other hand-held or portable units.

Abstract: First and second electronic devices interconnected by a nonconductive nanoporous film, said film having metal-filled pores extending through the thickness of the film, such that each of said devices is contacted by the metal in at least several pores, wherein said film comprises a silicone polymer.

Abstract: First and second electronic parts interconnected by a nonconductive nanoporous film having first and second parallel surfaces, said film having metal-filled pores extending through the thickness of the film, such that each of said parts is contacted by the metal in at least several pores, a number of the pores being perpendicular to the surfaces of the film, and other pores being oblique to the surfaces of the film, whereby thermal dissipation is enhanced in the plane of the film.

Abstract: An electrical device has at least one electrical power component, a housing including a plurality of housing parts, and a spring element arranged to provide a mechanical and thermal contact of the at least one electrical power component with the housing. The housing parts including a lower housing part which is formed as a metal cover moveable within a predetermined range and the spring element presses the at least one power component in an interior of the housing against the metal cover.

Abstract: A technique for applying uniform force to an IC chip module, urging the module into electrical contact with one face of a circuit board, is provided. One face of the board has contact pads, and the module has contact members on one surface corresponding to the contact pads. A first clamping member is provided having a pressure applying section and a reaction section mounted for movement toward and away from each other. A second clamping member having a pressure applying section is provided. The module is interposed between the pressure applying element of one of the clamping members and the substrate with the contact members on the module in electrical contact with the pads on the board. Several pins interconnect the reaction section of the first clamping member and the second clamping member to restrain movement of the reaction section of the first clamping member away from the second clamping member.

Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a retainer for releasably securing the electrical component to the PGA socket.

Abstract: The present invention relates to a circuitized board having removable flexible modules disposed thereon. The flexible modules are mechanically and electrically connected to the board to provide an apertured connect, yet may be easily removed without using heat. The invention also relates to a circuit package including a substrate and a flexible module. The substrate includes a circuit board, a plurality of pads affixed to the circuit board, and a plurality of gold plated metal balls affixed atop the pads. The flexible module includes a flexible dielectric member and gold plated vias disposed in the flexible dielectric member wherein at least some of the vias are positioned over the metal balls so that a line contact is made between the vias and the metal balls.

Abstract: Proposed is a connecting socket used for electric connection between electrode terminals of a semiconductor package and electrode terminals of a circuit board by being interposed therebetween. The socket is an assembly consisting of a base body in the form of a frame made from an insulating material, in which a semiconductor package is put and secured in the position, and an anisotropically electroconductive elastic sheet member bonded to the bottom surface of the base body. When the socket holding the semiconductor package is mounted on a circuit board, electric conduction is established between the electrode terminals of the semiconductor package and the electrode terminals of the circuit board through the anisotropically electroconductive elastic sheet member.

Abstract: A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the overall printed circuit assembly.

Abstract: A spring button assembly is integrally formed with a casing for an electronic device. The spring button assembly includes a press button disposed facing an exterior of the casing, the PCB contact extension disposed facing an interior of the casing, and a resilient connector connecting the press button and the PCB contact extension to the casing. The casing can be molded with many different configurations of the spring button assembly, enabling the button to be placed far from its corresponding PCB contact including around complex geometry. The PCB contact extension may be configured to actuate a contact switch on the PCB or may be provided with a conductive surface to connect conductive traces on the PCB. In one arrangement, the PCB contact extension includes a cam surface adapted to engage a contact block for activating the PCB contact. In yet another arrangement, the button assembly includes components to be an LED indicator.

Abstract: A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the interposer in turn are bonded to the contact pads on the substrate. Flexibility of the leads permits relative movement of the contacts on the chip relative to the terminals and the contact pads of the substrate and hence relieves the stresses caused by differential thermal expansion. The arrangement provides a compact structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage.

Abstract: A surface mount electronic device, attachable to a circuit board, comprises an insulating substrate having a top surface and a bottom surface; a plurality of metallized terminal pads on the bottom surface; and a plurality of leads, each attached to one of the terminal pads by a solder column. Each of the leads comprises a first substantially horizontal lead portion attached to one of the terminal pads by the solder column. A plurality of upturned prongs on the first substantially horizontal lead portion forms a pronged area configured to hold the solder column. A second substantially horizontal lead portion terminates in a free end for attachment to the circuit board. An upwardly curved intermediate lead portion connects the first and second substantially horizontal portions and underlies the bottom surface of the substrate.

Abstract: A semiconductor device comprising a semiconductor chip substrate, an integrated circuit formed on a surface of the semiconductor chip substrate, and metal electrodes extending from the integrated circuit to at least one of the side surfaces of the semiconductor chip substrate. Occupation area on a wiring circuit board can be reduced. Damaged chips can be exchanged easily. When it is set vertically, heat radiation efficiency can be improved.

Abstract: There is provided a display panel assembly structure capable of achieving a highly reliable connection even when fine-pitch electrode terminals are employed. A second electrode terminal is embedded in a flexible printed circuit board, and protrudes slightly from the flexible printed circuit board within a range of 0 to 2.times.10.sup.-3 mm. By embedding the second electrode terminal in the flexible printed circuit board, an apparent thickness of the second electrode terminal is reduced while keeping the rigidity of the second electrode terminal to thereby improve etching accuracy of a top surface thereof. With the reduction of the protrusion amount of the second electrode terminal, a ratio of a thickness of an anisotropic conductive film to a diameter of a conductive particle can be made to be approximately "1".

Abstract: The ball grid array package (10) uses a flexible base (30) having a substantially flat center plate (34) disposed at a first level coupled to a substantially flat base plate (32) disposed at a second level. The center plate (34) is coupled to the base plate (32) by a plurality of flexible narrow straps (36-38) arranged substantially surrounding the center plate (34). The flexible base (30) accommodates the thermal expansion in the pedestal (18) caused by the powered up integrated circuit (16) so that the rest of the package does not expand and induce stress in the solder joint between the ball grid array (12) and the printed circuit board (14).

Abstract: Conductive thermoplastic interconnects (120) for electronic devices are disclosed. The interconnects may take the form of bumps or spheres, and may be used in applications where metal bumps are conventionally used. Bumps (310) may be attached by retaining them in a vacuum fixture (312) and momentarily contacting them with the substrate (316) requiring the bumps (310). The substrate (316) has been heated sufficiently to cause wetting of the conductive thermoplastic bump (310).

Abstract: A flat circuit module assembly includes a circuit board and unpackaged, or housingless, chips mounted on its surface, with an elastic pressure pad between the circuit board and the chips. To achieve an adequate spring characteristic, the elastic pressure pad is dimensioned to be correspondingly thick, the consequence of which is that the Z bend of the terminal legs would be greater than would actually be needed for compensating for the thermal stress. To avoid this disadvantage, the invention provides depressions on the circuit board surface into which the pressure pads are placed. This reduces the tolerance range in the surface soldering area. The invention also provides that the circuit board is a multilayer board that has internal conductors, and further that the depression into with the pressure pad is placed extends to one of the internal conductive layers.

Abstract: The present invention provides an easily reworkable demountable means of electrically interconnecting an integrated circuit die to a substrate. The electrical assembly is comprised of an integrated circuit die having contact areas on a first surface, a substrate having contact areas aligned with the contact areas of the die for providing electrical connection to the integrated circuit die, and a compression means for maintaining the integrated circuit die contacts in electrical communication with the contacts of the substrate. The compression means typically includes a two-part spring system which provides superior electrical contact by causing the curvature of the integrated circuit die to be in the same direction as the curvature of the substrate.

Abstract: An assembly for mounting a plurality of electrical components having terminals with leads onto a surface of a printed circuit board is disclosed. The assembly includes a substantially planar configured electrically insulated body member having top to bottom surfaces. Cavities extend through the body member and are dimensioned for receiving an electrical component and holding the component laterally by the walls defining the cavity. An elastomer element with conductive portions is positioned adjacent to the bottom surface of the cavities and receives the leads of electrical components. A lid is connected to the body member and movable from an open position for allowing insertion and removal of electrical components to and from the cavities, and a closed position where the lid covers the cavities.

Abstract: A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Abstract: A battery powered device (100) utilizing a rechargeable battery (135) comprises a ball bearing (300) having a first diameter for receiving a current and a housing (200) having an opening (405) formed therethrough in which the ball bearing (300) is situated, wherein the opening (405) has a second diameter of less than the first diameter. The battery powered device (100) further comprises a spring (305) situated in the opening (405) in contact with the ball bearing (300) and a spring cap (310) fastened to the housing (200) for forcibly holding the spring (305) in contact with the ball bearing (300). A conductive element is coupled between the spring and the rechargeable battery such that the current received by the ball bearing (300) is supplied to the rechargeable battery (135) via the spring (310).

Abstract: An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of the various integrated circuit chips (20) in the module to circuitry (42) on a thin film multilayer membrane (22). The module assembly includes a heat sink (16) with the back surfaces of the chips (20) in thermal engagement therewith. Contacts (40) of the bond pads of the chips (20) are in electrical engagement with the circuitry (42) on the membrane (22) and are accurately positioned by means of nests (28) formed on the surface of the membrane (22). A contact pressure equalizer (12) engages only selected areas (98) of the membrane (22) opposite the contacts (40) of the chips (20) to urge the contact surfaces (44) on the membrane (22) into electrical engagement with raised contacts (40). The contact pressure equalizer (12) includes a relatively large pressure plate (70) having a layer (74) of relatively soft rubber thereon.

Abstract: An integrated circuit device having an array of flexible leads attached to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.